Intel confirms that one of its customers' export license was revoked and would impact its second-quarter sales in 2024 to fall to the lower range between its US$12.5-13.5 billion projection for the quarter, according to a document submitted to the US Security Exchange Commission.
Samsung Electronics reportedly plans to dedicate separate development teams for next-generation High Bandwidth Memory (HBM) products, HBM3E and HBM4, to strengthen its competitiveness in the HBM market. Whether this strategic initiative will allow Samsung to outpace competitor SK Hynix in mass production is drawing industry attention.
Toyota Motor reported hefty profit growth for the past fiscal year ending March 2024, thanks to booming hybrid EV sales and a weaker Japanese Yen. The automaker said it plans to invest JPY2 trillion (US$13.79 billion) in its suppliers, growing the EV lineup and developing Software-Defined Vehicles (SDV).
Chinese mature-node foundries collaborate with the country's domestic IC design firms, including MCU businesses, to provide capacity support and offer competitive pricing, according to industry sources.
SoftBank Group Corp. is in talks to acquire Graphcore Ltd., a struggling British semiconductor startup once valued at $2.8 billion, according to people familiar with the deals.
Chinese iPhone shipments jumped about 12% in March after Apple Inc. and its retailers slashed prices, official data showed, suggesting efforts to arrest an accelerating decline in sales are yielding early results.
With the rapid development of intelligent connected vehicles, cars have gradually become important mobile terminals, carrying an increasing number of interconnection needs based on travel requirements. Cars are evolving into another important mobile terminal.
Intel has partnered with 14 Japan-based companies to develop manufacturing technology for IC backend manufacturing automation, which is anticipated to be commercialized by 2028, aiming to reduce reliance on labor-intensive regions in China and Southeast Asia.
Apart from Taiwan and China, Malaysia has emerged as a new semiconductor powerhouse in Southeast Asia, thanks to its competitive production costs and support from global manufacturers.
Samsung Electronics reportedly intends to use metal oxide resist in the Extreme Ultraviolet (EUV) exposure process of new generation DRAM products. Metal oxide resist belongs to the new generation photoresist, with higher resolution than chemically amplified resist and better impedance performance in etching.
Aiming to secure orders for Nvidia's next-generation High Bandwidth Memory (HBM) and regain its market-leading position, Samsung unprecedentedly mobilizes over 400 "semiconductor aces," including top executives and employees,
The first year of the AI PC era saw major Chinese manufacturers like Lenovo and Huawei aggressively positioning themselves in the AI PC market to capture higher market shares. Looking at the Chinese market, the second half of 2024 is expected to see a replacement wave for PCs, driven not only by the advent of AI PCs but also because domestic PC purchases made 2-3 years ago are approaching their replacement cycle.
To catch up with the global image sensor market leader Sony, Samsung Electronics will strengthen cooperation with Taiwan-based pure-play foundry United Microelectronic Corp. (UMC) to adopt the "fab-lite" strategy to outsource partial capacity to UMC and enhance production efficiency while improving price competitiveness.
