Japan's semiconductor foundry startup Rapidus, now on a mission to mass produce 2nm chips by 2027, is developing advanced packaging and chiplet technologies, with a particular focus...
The semiconductor industry is witnessing significant shifts influenced by geopolitical considerations. One recent case exemplifying this trend is King Yuan Electronics's (KYEC) sale...
The potential of advanced packaging technology to upgrade chip performance has attracted many Japanese equipment and material suppliers to allocate their resources in this highly...
Equipment makers have seen the visibility of TSMC's order extended to 2025, and Intel and OSATs have also placed orders, according to industry sources in Taiwan.
ASE Technology Holding (ASEH) may boost its capex in 2024 due to increased spending on advanced packaging and testing capabilities. The Taiwan-based OSAT also does not rule out developing...
At the 2024 North America Technology Symposium, TSMC demonstrated its latest semiconductor process, advanced packaging, and 3D IC technologies, which will drive the next wave of AI...
India-based EMS player Kaynes Semicon believes its OSAT project is expected to be approved and eyes advanced packaging, including Co-Packaged Optics (CPO), to differentiate itself...
Although Samsung has been the subject of market rumors regarding Nvidia's placement of its 2.5D packaging orders, industry sources recently said there is no information regarding...
TSMC's advanced packaging CoWoS capacity continues to have strong demand. Even after doubling its capacity in 2024 and collaborating with OSAT companies, it can still not fully meet...
Taiwan Semiconductor Manufacturing Company (TSMC) has cut its 2024 growth predictions for the foundry and semiconductor industries while keeping the company's growth forecast at 21...
ASE Technology Holding (ASEH) and other Taiwan-based IC backend houses are gearing up for a prosperous second half of 2024, stepping up their capacity expansion pace, according to...
The US Department of Commerce (DOC) and Samsung Electronics signed a non-binding preliminary memorandum of terms (PMT) on April 15 to provide up to US$6.4 billion in direct funding...
Advanced chip manufacturing and advanced packaging have now become the focus of attention in China. SMIC already confirmed that it had adopted deep ultraviolet (DUV) lithography machines...
According to TSMC's announcement of a third fab for 2nm and more advanced chips, as well as Amkor Technology's intentions to develop an advanced packaging fab in Arizona, advanced...
