TSMC has stepped up its pace of orders with backend equipment suppliers, as the foundry commences its chip-on-wafer-on-substrate (CoWoS) packaging capacity expansion plan, according...
European IDMs differ slightly from their US counterparts in terms of manufacturing capacity deployments, focusing more on expanding wafer fab capacity than backend packaging and testing...
Eternal Materials, dedicated to supplying resins, electronics materials including PCB-use dry film photoresists, and specialty materials, plans to expand its production capacity outside...
TSMC has readied plans to build new CoWoS (Chip on Wafer on Substrate) capacity at its manufacturing complex in the Central Taiwan Science Park (CTSP) to meet a rapid surge in demand...
Sino-American Silicon Products (SAS), a professional renewable energy solution provider in the solar industry, will continue to expand its production capacity for solar cells, solar...
United Microelectronics Corp. (UMC) continues to observe customers adjusting inventory levels, albeit at a slower rate than expected, while cyclical shifts in the business climate...
China's tech giant Huawei and top semiconductor foundry SMIC apparently adopt different approaches against US chip curbs. The former has just announced its successful development...
PCB production used to be heavily concentrated in Kunshan, China and Taiwan. However, recent changes in the global economy and politics, as well as growing geopolitical conflicts,...
TSMC disclosed at its annual technology symposium in Taiwan that its overseas sub-28nm process manufacturing capacity in 2024 will be multiple times that of 2020.
ASML reportedly has seen the first cutback in orders for EUV equipment from TSMC, its largest customer, which market insiders speculate is on track to slash such orders by over 40%...
South Korea's March semiconductor exports slipped 34.5% on year amid sluggish market demand, and Taiwan also failed to stay unscathed but with a lower export decline of only 13.4%...
With TSMC also reportedly to slow down capacity expansions in Taiwan, IC design houses will find it even more difficult to expect a downturn in their chips foundry costs, according...
TSMC has revised the company's blueprint for capacity expansion, reducing its scale and slowing down its pace. However, the pure-play foundry is still evaluating the feasibility of...
Winbond Electronics has signed a seven-year syndicated loan agreement for NT$20 billion (US$656.3 million) with 11 local banks in Taiwan, according to the specialty DRAM and flash...
