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Displaying photos tagged JEDEC [back to index]

Winbond W25N01JW

Monday 11 June 2018

Samsung eUFS solution for auto apps

Friday 13 October 2017

Samsung 256GB UFS card

Wednesday 13 July 2016

Samsung 128Mb eMMC devices

Tuesday 25 September 2012

ADATA XPG Gaming DDR3L 1333G

Wednesday 13 July 2011

Samsung 30nm DDR4 DRAM

Wednesday 5 January 2011

Samsung moviNAND using 20nm-class technology

Friday 24 September 2010

Toshiba 128GB embedded NAND flash modules

Wednesday 23 June 2010

Transcend 4GB aXeRam DDR3 modules

Monday 21 December 2009

Transcend DDR3 1333MHz memory kit for Intel Core i5

Thursday 5 November 2009

Hynix 4Gb mobile DRAM for MIDs

Monday 10 August 2009

Transcend thermal sensor-equipped DDR3 modules

Thursday 16 July 2009

Desi Phoden, Inphi's executive vice president and chairman of JEDEC's JC-42 Memory Committee

Tuesday 31 May 2005
Realtime news

Taiwan notebooks - 4Q 2021

Global server revenue forecast, 2022

Global server shipment forecast, 2022

South Korea to build semiconductor ecosystem; Tianma to invest in 8.6-gen panel project; Nissan and Honda unveil EV development plans

Advanced packaging technology outlook, 2020-2026

Smart manufacturing progress of Taiwan, 2021