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    Aug 14, 16:22
    South Korea chip cluster could expand to nine fabs as SK plans new investment
    Aug 14, 15:50
    Alibaba Cloud's 6-year evolution: five super data centers pivoting to AI compute
    Aug 14, 15:27
    South Korea's memory-chip exports surge 277% as system chips slip
    Aug 14, 14:55
    OCP APAC 2026: What if AI's next efficiency breakthrough is simply moving less?
    Aug 14, 14:28
    Insight: Intel raises US$20B, but its 14A ambitions may need twice as much
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    7 days news
    Acer COO Jerry Kao resigns; Chairman Jason Chen to fill role
    Aug 14, 21:58
    Research insight: Delta, Lite-on raise capex to 9% of revenue in AI data center power race
    Aug 14, 18:46
    Memory supply crunch pushes long-term contracts beyond the big three
    Aug 14, 17:55
    AI server tracker: Demand drives July revenue gains across Taiwan infrastructure suppliers
    Aug 14, 17:47
    SK hynix scouts US memory fab sites as customers seek local supply
    China AI chip demand lifts Hygon revenue 67%, Sugon profit 34% as domestic computing expands
    Alibaba Cloud races ahead with Ulanqab AI infrastructure
    SanDisk lays out multiyear NAND roadmap and AI storage targets at investor day
    AMD reportedly to issue up to US$5B in bonds amid tech debt sale wave
    Global PMX sees semiconductor demand driving growth through 2027 as product mix shifts
    Alibaba Cloud cuts AI data center build time to 100 days, triples global modular capacity
    MPI posts record 2Q26 revenue, profit as probe card capacity stays fully loaded
    Compal lifts profit on AI PCs and servers as component costs rise
    Chinese analog chipmaker Novosense returns to profit on AI server, auto demand
    VinSpace signs SpaceX launch deal for first satellites in 2027
    Samsung weighs moving legacy memory backend work to Vietnam to free up capacity for HBM
    Eternal Precision Mechanics accelerates advanced packaging push with wafer lamination
    US report puts China-linked tariff evasion through Asia under the spotlight
    Seoul Semiconductor wins permanent India injunction, completing a three-region patent sweep
    European notebook revenue jumps 14.8% as unit sales fall
    Tungsten prices surge sixfold as US-China restrictions tighten supply for chips, aerospace, defense
    Nvidia Feynman pushes TSMC A16 and CPO ramp
    Intel's US$20B equity raise puts Lip-Bu Tan's turnaround strategy to the test
    IBM and OpenAI partner to accelerate secure enterprise AI deployment
    Apple opens advanced manufacturing center in Houston to expand US smart skills
    Lam Research to spend more than US$3 billion expanding global R&D labs
    Silicon Motion completes US$1.15 billion zero-coupon bond offering
    Analysis: Taiwan Mobile takes control of Systex to close ICT gap with Chunghwa Telecom, Far EasTone
    Dixon Technologies to take 51% stake in new smartphone OEM venture with vivo Mobile India
    SK Hynix looks beyond memory with new global growth team
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    Research_DB
    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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    Jensen Huang in Seoul: Faker, BBQ and one very awkward LG chairman
    OCP APAC Summit 2026
    The OCP APAC Summit 2026 takes place August 11-12 at the TaiNEX2 exhibition hall in Taipei.
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    EV
    Wednesday 29 July 2026
    Chinese brands seize 25% of Europe midsize SUV sales as BEV demand surges
    Chinese automakers gain share in Europe as legacy carmakers partner to cut costs
    Friday 14 August 2026
    Global PMX sees semiconductor demand driving growth through 2027 as product mix shifts
    Friday 14 August 2026
    Porsche exits Volkswagen carbon pool, joins Xpeng
    Friday 14 August 2026
    TECH
    Friday 14 August 2026
    OCP APAC 2026: What if AI's next efficiency breakthrough is simply moving less?
    OCP APAC 2026: Intel sees agentic AI shifting bottlenecks toward CPUs, memory
    Thursday 13 August 2026
    OCP APAC 2026: Microsoft leans on Taiwan supply chain for 'silicon-to-systems' AI buildout
    Wednesday 12 August 2026
    Interview: Nvidia exec on progress of CPO production and pluggable optics
    Friday 7 August 2026
    ASIA
    Thursday 30 July 2026
    China's 28nm DUV lithography enters fab validation, reportedly guided by State Council-level experts
    South Korea's memory-chip exports surge 277% as system chips slip
    Friday 14 August 2026
    VinSpace signs SpaceX launch deal for first satellites in 2027
    Friday 14 August 2026
    DeepSeek raises API prices sharply as V4 Pro targets agentic AI market
    Friday 14 August 2026
    OPINIONS
    Friday 14 August 2026
    Insight: Intel raises US$20B, but its 14A ambitions may need twice as much
    Analysis: Taiwan Mobile takes control of Systex to close ICT gap with Chunghwa Telecom, Far EasTone
    Friday 14 August 2026
    Analysis: Google's Pixel tests Android's competitive balance
    Friday 14 August 2026
    Interview: 'Modern warfare is a battle of PAs'–Transcom targets overseas defense, LEO satellite growth
    Friday 14 August 2026
    TOPICS
    OCP APAC SUMMIT 2026
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    Friday 14 August 2026
    AI infrastructure enters multi-architecture fabric competition; Optical-copper interconnects and supply-chain coordination determine system performance
    AI infrastructure enters multi-architecture fabric competition; Optical-copper interconnects and supply-chain coordination determine system performance
    Thursday 13 August 2026
    Taiwan notebook industry, 2Q 2026
    Taiwan notebook industry, 2Q 2026
    Tuesday 11 August 2026
    AI infrastructure moves toward scale-across; demand for coherent optics supply chain heats up
    AI infrastructure moves toward scale-across; demand for coherent optics supply chain heats up
    Thursday 6 August 2026
    Global smartphone AP industry, 2Q 2026: 2nm and memory costs to weigh on 3Q26 shipments
    Global smartphone AP industry, 2Q 2026: 2nm and memory costs to weigh on 3Q26 shipments