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REALTIME NEWS
Why are China EVs barriers on US market untouched during Trump-Xi talks
Tomorrow's Headlines
11h 10min ago
China car market weakens as Taiwanese suppliers brace for inventory clearance in 2H26
Tomorrow's Headlines
11h 11min ago
TSMC reportedly evaluates Texas for a second US manufacturing hub
Tomorrow's Headlines
11h 11min ago
Analysis: What are the risks facing China DRAM capacity amid a tightening market
Tomorrow's Headlines
11h 11min ago
Mighty Hornet IV drone nears mass production as Taiwan and U.S. sites are readied
Tomorrow's Headlines
11h 11min ago
Sep 29, 23:01
Amazon buys NT$1.59 billion stake in one of its Taiwanese AI server suppliers
Sep 29, 17:25
CXMT to spend US$5.2 billion on R&D and testing as DRAM supply stays tight
Sep 29, 17:29
Anthropic's US$2 trillion IPO bet comes with 80 pages of warnings
Sep 29, 17:00
SoftBank subsidiary Saimemory taps Shinko to bring ZAM closer to commercialization
Sep 29, 16:19
Samsung reshuffles DRAM roadmap, prioritizing B1b hybrid bonding for D0a, HBM5
LATEST STORIES
7 days news
In global semiconductor race, Singapore bets on critical, mature technologies
Sep 29, 16:57
SOUTHEAST ASIA
Column: Why Micron's US$250M venture fund is about more than HBM margins—Taiwan has a stake in it
Sep 29, 14:40
COLUMN
Solidigm weighs US IPO as AI storage demand lifts valuation
Sep 29, 12:46
SEMICONDUCTORS
Beyond 16 layers: HBM stacks test advanced packaging equipment makers
Sep 29, 11:55
SOUTHEAST ASIA
GlobalFoundries eyes GaN expansion to challenge TSMC in AI
SK Hynix tests HBM5 with TSMC as HBM4 enters Nvidia's next platform
Mercedes-Benz and ProLogium expand solid-state battery testing partnership
AIDC sees NT$30 billion military maintenance boost, eyes drones
RoboTechnik completes Hong Kong listing to fund ficonTEC expansion in silicon photonics
Foxtron writes a new chapter in Taiwan auto history
Taiwan breaks ground on aerospace and drone hub, targeting 2028 completion
Cerebras to power Gimlet's push for faster AI inference
South Korea AI compute squeeze hits researchers and startups
AI boom sends China and Taiwan's PCB makers racing to HK for capital
Samsung Foundry nears 60% 2nm yield, shifts focus to power efficiency to win customers
MicroIP unveils AI drone and edge systems at Taiwan Expo USA
Samsung Electro-Mechanics to invest US$5 billion in ABF substrate expansion
US, China eye US$60 billion in tariff relief, but chips stay off the table
Advanced packaging shifts toward system integration as AI renews semiconductor talent appeal
Samsung bonus plan to lift South Korea talent race
GF's MIPS bets on RISC-V physical AI, expands into autos and data centers
Taiwan's Brave Eagle reaches 55% domestic content, bringing 200 suppliers into aerospace
HBM to take nearly 30% of DRAM capacity as Samsung speeds up P5
Exclusive: Inside Tesla's playbook for dodging First Solar's TOPCon patent traps
Chips make up nearly half of South Korea's September exports; China, Hong Kong account for 52% of them
LG expands AI data center cooling ties with Microsoft, SK Enmove
South Korea looks beyond high-nickel NCM in battery push
VSMC Singapore fab fully booked as VIS weighs Fab 2
TSMC helps VSMC build first Singapore fab in 22 months at lower cost than US
Vanguard chairman says AI slowdown won't free up chip capacity
More news
BIZ FOCUS
Sep 29, 08:00
Breaking free from keyword constraints: GeoGraph elevates job matching
Thursday 24 September 2026
FSP Debuts World's First 80 PLUS Ruby ATX PSU
Wednesday 23 September 2026
The Robot in the Supply Chain
Tuesday 22 September 2026
GUC Announces 2nm 16 Gbps HBM4E IP
MOST-READ
Google TPU pays back investment in 1 year, creating upside for MediaTek, Broadcom ASIC revenues
TSMC 3nm, 2nm, and CoWoS stay tight as AWS, MediaTek, TPU shift capacity
ASML lines up Intel, TSMC and Samsung behind 12-inch masks — TSMC alone sets a timeline
Musk's Memphis move puts xAI at the center of his empire
SK Hynix touts up to 5.15x inference gains with custom HBM
TSMC locks in 3-6% wafer out price hikes for 2027
TSMC urges HBM makers to design for X-ray inspection as packaging grows more complex
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
Singapore's chip progress
Singapore's semiconductor sector took a major step this week with the launch of VSMC's first 12-inch wafer fab in Tampines on September 28.
In global semiconductor race, Singapore bets on critical, mature technologies
Advanced packaging shifts toward system integration as AI renews semiconductor talent appeal
Beyond 16 layers: HBM stacks test advanced packaging equipment makers
...More
EV
Wednesday 9 September 2026
Analysis: When 72% of the world's EV batteries are Chinese, one defect travels
Foxtron writes a new chapter in Taiwan auto history
Tuesday 29 September 2026
Mercedes-Benz and ProLogium expand solid-state battery testing partnership
Tuesday 29 September 2026
South Korea looks beyond high-nickel NCM in battery push
Tuesday 29 September 2026
TECH
Tuesday 29 September 2026
Beyond 16 layers: HBM stacks test advanced packaging equipment makers
Commentary: Apple's M8 Ultra AI server plan could pull Apple Silicon into Nvidia's enterprise infrastructure game
Thursday 24 September 2026
Analysis: Foxconn's EV push moves beyond demo and toward scale
Wednesday 23 September 2026
China's memory race turns inward — CXMT, YMTC head toward patent showdown
Tuesday 22 September 2026
ASIA
Thursday 10 September 2026
India's fraud office seeks a Xiaomi probe as the market it once led shrinks around it
Trump-Xi state dinner puts tech titans at the head table, spotlighting Taiwan's quiet supply chain clout
Tuesday 29 September 2026
Chips make up nearly half of South Korea's September exports; China, Hong Kong account for 52% of them
Tuesday 29 September 2026
TSMC helps VSMC build first Singapore fab in 22 months at lower cost than US
Tuesday 29 September 2026
OPINIONS
Tuesday 29 September 2026
Behind CoWoS (part 1)—How a 0% yield crisis led to TSMC's first advanced packaging win
Column: Why Micron's US$250M venture fund is about more than HBM margins—Taiwan has a stake in it
Tuesday 29 September 2026
Column: Beyond Zero Trust – why AI supply chain resilience needs a plan B
Tuesday 29 September 2026
Behind CoWoS (part 2): How TSMC turned a niche packaging experiment into an industry standard
Tuesday 29 September 2026
TOPICS
SINGAPORE'S CHIP PROGRESS
TRUMP-XI WASHINGTON SUMMIT 2026
TRENDS IN INDUSTRIAL COMPUTING
TSMC UPDATES
SPECIAL REPORTS
Thursday 17 September 2026
Physical AI drives autonomous driving upgrade; three efficiency factors lift AI accelerator demand
End-to-end autonomous driving has become the mainstream technology path, and the inference demand created by Physical AI in autonomous driving systems is, in turn, reshaping automotive system-on-chip (SoC) design.
Wednesday 16 September 2026
Global top-3 memory maker status, 3Q 2026: AI servers drive record memory revenue; SSD, LPDDR upgrades ahead
DIGITIMES observes that major memory suppliers posted record-high revenue in the second quarter of 2026, with yearover-year growth remaining in the triple digits. Driven by AI demand, SSDs and LPDDR are emerging as key competitive
battlegrounds.
Tuesday 15 September 2026
AI demand reshapes capital allocation and operating models in telecom sector
Although the global 5G mobile communications market is still growing in 2025, higher 5G user penetration has not necessarily translated into equivalent revenue growth for telecom operators, while annual growth in mobile data traffic has continued to slow.
Monday 14 September 2026
Notebook shipment update, July 2026
DIGITIMES' survey of July 2026 notebook shipments (excluding detachable models) from the world's top five notebook brands (excluding Apple) and the top three notebook ODMs
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