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Oct 2, 17:58
Samsung's Galaxy Tab S12 taps MediaTek Dimensity 9500 as 2nm successor arrives
Oct 2, 17:03
Bull's France factory doubles capacity to capture growing orders as EU pushes AI sovereignty
Oct 2, 17:35
LG Energy Solution and GM bet LMR can bridge the gap between LFP cost and high-nickel range
Oct 2, 16:25
Taiwan pledges to help TSMC expand domestic investment amid Singapore rumors
Oct 2, 14:45
Micron ramps up HBM capacity at Taiwan's four major sites
LATEST STORIES
7 days news
Anthropic aims for mid-November IPO as it juggles relationship with Trump administration
Oct 2, 18:01
ICT
Climax Technology stays cautious on 2H26 as memory costs rise
Oct 2, 17:01
COMMUNICATIONS
Huawei hikes flagship prices up to US$200 as memory shortages hit smartphone margins
Oct 2, 16:45
COMMUNICATIONS
ficonTEC, Hermes Testing target CPO testing scale-up with INS-2 platform
Oct 2, 16:34
SEMICONDUCTORS
Inside Volantis's photonic bid to break AI's memory wall after US$88 million raise
AMD bets on AI demand by buying World Labs
Tesla cuts AI5, AI6 memory specs to protect Optimus
China AI infrastructure spreads to mid-sized firms
China financing chain linked to Nvidia Blackwell chips, 32 Asus servers exposed
TSMC mulls multi-fab Texas campus beyond Arizona, with Singapore also in talks
Taiwan government backs 7 semiconductor schools to upgrade equipment
Meta to add Naver Map navigation to AI glasses in South Korea
iPhone 18 Pro lifts Apple to 33% China share
Apple's Ternus pushes management cuts, faster hardware
OpenAI fires 3 safety researchers for sharing confidential information
BMW to make 20% of senior management redundant with AI
Japanese firms cut China presence 22.4% as trade risks mount
Stellantis to pause four French plants amid EV battery shortages
Hitachi and Fanuc launch Physical AI partnership for factory automation
Amazon weighs US$8B chip sale-leaseback to support credit rating
Nvidia weighs PTFE and HC for glass-free PCBs in Rubin Ultra
Qbic expands edge AI on Arm, lifts smart access control above 60%
Life after Meta: Manus regains independence, debuting Manus 2.0 and 'Cue' AI agent
China turns to 3D packaging to push AI performance beyond front-end scaling limits
Nidec impairment loss far exceeds estimates as auditor withholds opinion
LG Electronics, LS Electric target AI data center bottlenecks with US cooling capacity, 345kV power deals
Hiroca targets Tier 1 shift, global capacity overhaul
California tech exec arrested in US$300M Nvidia AI server smuggling case
ASE stake, expansion open doors for Machvision
Huawei turns to LogicFolding to keep its flagship chip race alive
More news
BIZ FOCUS
Oct 2, 08:00
Digital Divide: Hackathon Team Debuts Senior-Friendly 'AI Butler'
Thursday 1 October 2026
Speed 3D Showcases On-Device AI Generation with Snapdragon X2 Elite
Thursday 1 October 2026
From Excel to Editable Presentations: AI Streamlines Financial Reporting
Wednesday 30 September 2026
AI Memory & Storage: The 5th GMIF2026 Innovation Summit Concludes
MOST-READ
Google TPU pays back investment in 1 year, creating upside for MediaTek, Broadcom ASIC revenues
TSMC 3nm, 2nm, and CoWoS stay tight as AWS, MediaTek, TPU shift capacity
ASML lines up Intel, TSMC and Samsung behind 12-inch masks — TSMC alone sets a timeline
Musk's Memphis move puts xAI at the center of his empire
TSMC locks in 3-6% wafer out price hikes for 2027
TSMC urges HBM makers to design for X-ray inspection as packaging grows more complex
Intel CPU prices reportedly rising 10% again as Qualcomm and MediaTek target IPC and IoT gaps
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
Singapore's chip progress
Singapore's semiconductor sector took a major step this week with the launch of VSMC's first 12-inch wafer fab in Tampines on September 28.
SG Semiconductor builds brand and talent for Singapore chip industry
How a TSMC veteran is steering Singapore's lab-to-fab chip strategy
ASE Technology buys Singapore factory for AI chip testing expansion
...More
EV
Wednesday 9 September 2026
Analysis: When 72% of the world's EV batteries are Chinese, one defect travels
Chinese automakers' shift to the US may reshape supply chains and supplier margins
Friday 2 October 2026
Stellantis to pause four French plants amid EV battery shortages
Friday 2 October 2026
Nidec impairment loss far exceeds estimates as auditor withholds opinion
Friday 2 October 2026
TECH
Friday 2 October 2026
Commentary: Broadcom's US$42 billion Anthropic loan exposes AI's emerging chip-financing loop
DIGITIMES Insight: AI scaling is moving from chip shrinkage to system integration
Thursday 1 October 2026
Commentary: Garmin returns to OLED, putting Micro LED on notice
Wednesday 30 September 2026
Beyond 16 layers: HBM stacks test advanced packaging equipment makers
Tuesday 29 September 2026
ASIA
Thursday 10 September 2026
India's fraud office seeks a Xiaomi probe as the market it once led shrinks around it
China financing chain linked to Nvidia Blackwell chips, 32 Asus servers exposed
Friday 2 October 2026
China turns to 3D packaging to push AI performance beyond front-end scaling limits
Friday 2 October 2026
LG Electronics, LS Electric target AI data center bottlenecks with US cooling capacity, 345kV power deals
Friday 2 October 2026
OPINIONS
Friday 2 October 2026
Commentary: Broadcom's US$42 billion Anthropic loan exposes AI's emerging chip-financing loop
DIGITIMES Insight: Intel, TSMC, Samsung converge on backside power — packaging becomes the next divide
Friday 2 October 2026
Column: AI benchmarks remain lucrative business
Friday 2 October 2026
Commentary: AMD challenges Nvidia in embodied AI as Lisa Su acquires Fei-Fei Li's World Labs
Friday 2 October 2026
TOPICS
SINGAPORE'S CHIP PROGRESS
TRENDS IN INDUSTRIAL COMPUTING
LG ENERGY SOLUTION
HUAWEI
SPECIAL REPORTS
Friday 2 October 2026
Global annual AI server shipments, 2025-2026
Continued advances in top-tier LLM capabilities, coupled with the potential for business automation enabled by agentic AI, are prompting major North American cloud providers, Neo Clouds, and leading AI labs to accelerate AI data center buildouts in 2026.
Thursday 1 October 2026
SiC substrate market shows signs of recovery, driven by demand from vehicles, energy and AI infrastructure
DIGITIMES has observed that since Tesla equipped the Model 3 with a traction inverter integrated with SiC power modules in 2018, the application of SiC power devices in the electric vehicle (EV) sector has gradually expanded, prompting suppliers to aggres 8_s.jpg
Thursday 17 September 2026
Physical AI drives autonomous driving upgrade; three efficiency factors lift AI accelerator demand
End-to-end autonomous driving has become the mainstream technology path, and the inference demand created by Physical AI in autonomous driving systems is, in turn, reshaping automotive system-on-chip (SoC) design.
Wednesday 16 September 2026
Global top-3 memory maker status, 3Q 2026: AI servers drive record memory revenue; SSD, LPDDR upgrades ahead
DIGITIMES observes that major memory suppliers posted record-high revenue in the second quarter of 2026, with yearover-year growth remaining in the triple digits. Driven by AI demand, SSDs and LPDDR are emerging as key competitive
battlegrounds.
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