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REALTIME NEWS
China’s solar overcapacity persists as four majors remain loss-making in 3Q26
Tomorrow's Headlines
1h 26min ago
Micron questions 4F² DRAM as CXMT advances, Samsung and SK hynix hedge
Tomorrow's Headlines
1h 26min ago
Empyrean Technology to acquire Qizhi Technology for AI and 3DIC expansion
Tomorrow's Headlines
1h 26min ago
AI supply chain expansion persists despite concerns over a downturn
Tomorrow's Headlines
1h 26min ago
Weak smartphone sales weigh on SoC shipments
Tomorrow's Headlines
1h 26min ago
Nov 2, 15:39
TEL sees 90% profit surge as AI chip demand stays strong
Nov 2, 18:14
Powerchip Investment Holding files suit over NT$13.6B share-buying bid
Nov 2, 16:31
US backs Anderon, GF quantum foundries as Intel targets QPUs with 18A process
Nov 2, 17:29
China's self-improving AI advances towards AGI, but Z.ai founder warns of limits and risks
Nov 2, 16:47
AI, geopolitics make Taiwan Thailand's third-largest trade partner in 1H26
LATEST STORIES
7 days news
Taiwan aims to train 60,000 IC specialists by 2030
Nov 2, 17:13
SEMICONDUCTORS
Jinpao taps robotics contest to deepen Thailand ties, develop AI talent
Nov 2, 16:12
ELECTRIC VEHICLES
Murata to invest JPY1 trillion in expanding MLCC capacity across Asia plants
Nov 2, 15:55
SEMICONDUCTORS
Denso sees profits hit by memory costs, seeks price pass-through
Nov 2, 15:45
EAST ASIA
BenQ Materials targets premium displays and medical growth, seeks semiconductor materials breakthrough
AI data center demand fuels THEIL's optical communications rebound, 4Q26 to buck seasonal downtrend
AMOLED advances, hitting IT LCD panels
Macronix wins IEEE Milestone — chair reveals how sNOVA transformed Taiwan's chipmaking
AI data center boom in Taiwan faces power, high-voltage line hurdles
Samsung to buy TCL CSOT stake from its own display unit for US$960 million
South Korea builds SMR ecosystem as SK Innovation advances Natrium tech, Samsung C&T pushes modular construction
Iluvatar CoreX Tiangai 300 tops Nvidia H200 in select AI inference tests, with long-context and MoE gains
RichWave sees Wi-Fi 7 reaching 50% share in 2027
Schneider and Foxconn accelerate modular AI factory deployment as token usage surges 60-Fold
Foxconn takes AI beyond clinical software with hospital partnerships and medical robotics
MediaTek pins second ASIC project and customer to 2028
Samsung partners with PXPay to bolster Samsung Wallet in Taiwan
Samsung's Lee bets on Japan for AI chip packaging edge
DIGITIMES chairman: Taiwan-South Korea cooperation beats competition in AI race
Exclusive: How Germany's fast-follower economy reshapes the AI PC race as local AI awaits killer app
Lite-On boosts 2027 capex as AI race raises stakes for CSPs
Sam Altman meets with Samsung, SK as memory crunch deepens
China's Empyrean Tech targets digital EDA gaps with US$32.9 million Easy-Logic acquisition
What CXMT's 3Q26 earnings reveal about DRAM shortages, DDR5 momentum, and 2027 growth strategy
Dixon maps AI hardware expansion through Inventec, Gemtek, prospective packaging partners
Foxconn's FII, FIT join forces to tackle AI data center bottlenecks beyond computing power
Foxconn nears EV JV agreement with Poland's EMP as European expansion gains momentum
Dixon turns to joint ventures, components as price-led growth leaves margins thin
Exclusive: Metal adhesion poses challenge for aluminum nitride in AI optics
Nvidia to become Naver’s third-largest shareholder
More news
BIZ FOCUS
Oct 30, 08:00
Macronix to Showcase Automotive and IoT Memory Solutions at electronica 2026
Thursday 29 October 2026
STMicroelectronics to propose the reappointment of Jean-Marc Chery as President & CEO
Wednesday 28 October 2026
SK hynix Announces 3Q26 Financial Results
Wednesday 28 October 2026
CES Asia Unveiled Expands to Hong Kong for CES 2027
MOST-READ
TSMC, Intel named as Musk's Terafab ambitions face reality check
GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
TSMC breaks silence on Musk's Terafab: Talks underway, but fab control non-negotiable
Nvidia unveils OOI CPO prototype for post-2028 AI needs
TSMC advances CoPoS packaging at Taoyuan Longtan site
Samsung HBM4E wins NVIDIA nod for AI accelerator push
AMD, Nvidia target substrate capacity amid 4x expansion constraints
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
iPhone Duo's launch
Apple's first foldable smartphone, the iPhone Duo, hit store shelves on October 23, 2026, in over 70 countries and regions.
iPhone Duo sales beat expectations as first batch sells out
Fine M-Tec rejects component blame as foldable market outlook remains positive
As iPhone Duo inner screens crack, Samsung capitalizes on foldable surge
...More
EV
Wednesday 9 September 2026
Analysis: When 72% of the world's EV batteries are Chinese, one defect travels
Foxconn nears EV JV agreement with Poland's EMP as European expansion gains momentum
Monday 2 November 2026
Jinpao taps robotics contest to deepen Thailand ties, develop AI talent
Monday 2 November 2026
Denso sees profits hit by memory costs, seeks price pass-through
Monday 2 November 2026
TECH
Monday 2 November 2026
Musk may let TSMC run his Texas chip fab as his do-it-alone plan stalls
Sandisk sees 60–90GB of NAND per CPU in AI agent workloads
Friday 30 October 2026
Nvidia trims HBM4 bandwidth for Rubin platform, sources say
Thursday 29 October 2026
AMD, Nvidia target substrate capacity amid 4x expansion constraints
Tuesday 27 October 2026
ASIA
Thursday 10 September 2026
India's fraud office seeks a Xiaomi probe as the market it once led shrinks around it
Samsung's Lee bets on Japan for AI chip packaging edge
Monday 2 November 2026
China's self-improving AI advances towards AGI, but Z.ai founder warns of limits and risks
Monday 2 November 2026
Samsung to buy TCL CSOT stake from its own display unit for US$960 million
Monday 2 November 2026
OPINIONS
Monday 2 November 2026
Column: Samsung's memory boom reshapes its investment strategy
Commentary: China's Nvidia H200 challengers look beyond GPU power, with Huawei and T-Head targeting system-scale AI
Monday 2 November 2026
Commentary: Why Marvell's rumored Lumentum buy may be hard to pull off but harder to pass up
Friday 30 October 2026
Analysis: Oracle backs Cerebras as AI cloud shifts to multi-architecture compute
Friday 30 October 2026
TOPICS
IPHONE DUO'S LAUNCH
TRENDS IN INDUSTRIAL COMPUTING
TSMC UPDATES
EMS WATCH
SPECIAL REPORTS
Friday 30 October 2026
China smartphone market and industry, 3Q 2026
According to DIGITIMES observations and analysis, smartphone memory contract prices in the first half of 2026 often rose 50% to 80% quarter-over-quarter.
Tuesday 27 October 2026
Server CPU shipments to exceed 50 million units in 2027; AMD's server CPU revenue will surpass Intel
According to DIGITIMES, Agentic AI, AI server expansion, cloud service provider (CSP) in-house CPU ramp-up, and replacement demand for general-purpose servers will lift global server CPU shipments to 52.6 million units in 2027, up 45.7% year-over-year, wi 12_s.jpg
Wednesday 21 October 2026
iPhone Duo finally debuts, but with price increases across models, Apple's 4Q26 shipments will take hit
DIGITIMES says the most closely watched model in Apple's high-end iPhone 18 lineup, launched in September 2026, is the long-anticipated first foldable smartphone, the iPhone Duo.
Monday 19 October 2026
Shipments of high-end cloud AI accelerators, 2027
DIGITIMES observed that cloud service providers (CSPs) such as Google and AWS will sharply ramp up self-developed ASICs in 2027, lifting high-end cloud AI accelerator shipments to 25.951 million units, up 64.5% year-over-year.
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