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CONNECT WITH US
Oct 30, 17:34
Micron says 700-plus Taiwan fab workers earned five years' salary in a single year
Oct 30, 15:00
Nvidia secures substrate capacity as FCBGA market targets US$27.3 billion by 2030
Oct 30, 16:37
Google, Foxconn aims to cut AI infrastructure deployment to six months
Oct 30, 16:20
China's memory module bellwethers post record profits as 3Q26 momentum fades
Oct 30, 16:48
SK Hynix taps HBM veteran to lead new American unit
LATEST STORIES
7 days news
Realtek targets 30% AI revenue share by 2030
Oct 30, 17:29
SEMICONDUCTORS
HHTD 26: Mitsubishi Electric Mobility to join Foxconn in 2027, targeting JPY1T revenue by 2030
Oct 30, 17:25
ELECTRIC VEHICLES
Holtek lands major server cooling contract, AI thermal demand soars
Oct 30, 17:15
SEMICONDUCTORS
HHTD 26: The year robots share the stage with AI infrastructure
Oct 30, 17:05
ICT
Eutelsat eyes EUR10B revenue from IRIS2 as EU seeks homegrown answer to Starlink
HHTD 26: Foxconn unveils three new EVs, expanding Model A and K platforms
Commentary: Why Marvell's rumored Lumentum buy may be hard to pull off but harder to pass up
C Sun Mfg invests in Nemstek to expand advanced packaging equipment
Taiwan's economic indicator signals 'booming' for 10th straight month on AI-driven shipments
Foxconn, TECO showcase factory-built infrastructure for AI data center expansion
Foxconn argues it is more than a box mover in AI hardware
Samsung SDI posts 12-quarter high in 3Q26 operating profit
VinFast aims to make India one of its two largest markets as overseas sales trail target
BYD sees 28% profit growth for 3Q26, but still falls short of forecasts
HHTD 26: Foxconn Chairman highlights processing and vertical integration strengths
Jinpao targets power cabinets, BBUs in AI-related expansion
ASE expects packaging and testing margins to stay above 30%
KLA reportedly weighs India manufacturing entry as Semicon 2.0 opens to equipment makers
HyperAccel, Rebellions look beyond chips to AI data center systems
Nvidia dominates AI robot chips with 69% market share
Amazon 3Q26 earnings call: AWS targets 40%-plus growth through 2028 as satellite costs weigh on near-term profit
Intel tells Taiwan's chip suppliers to build service capacity early
Nvidia weighs credit support for Nscale as data center, IPO face pressure
Jensen Huang calls Megaspeed ties normal amid Washington's spy probe
Sandisk sees 60–90GB of NAND per CPU in AI agent workloads
Yageo plans 10-15% capacity expansion in 2027 as AI demand pushes utilization above 95%
Delta Electronics approves Penang manufacturing base to expand global capacity
Intel's server surge faces a supply setback as PC weakness persists
Analysis: Oracle backs Cerebras as AI cloud shifts to multi-architecture compute
Trump targets foreign robotics imports under Section 232, citing national security risks
More news
BIZ FOCUS
Oct 30, 08:00
Macronix to Showcase Automotive and IoT Memory Solutions at electronica 2026
Thursday 29 October 2026
STMicroelectronics to propose the reappointment of Jean-Marc Chery as President & CEO
Wednesday 28 October 2026
SK hynix Announces 3Q26 Financial Results
Wednesday 28 October 2026
CES Asia Unveiled Expands to Hong Kong for CES 2027
MOST-READ
TSMC, Intel named as Musk's Terafab ambitions face reality check
GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
TSMC breaks silence on Musk's Terafab: Talks underway, but fab control non-negotiable
Nvidia unveils OOI CPO prototype for post-2028 AI needs
TSMC advances CoPoS packaging at Taoyuan Longtan site
Samsung HBM4E wins NVIDIA nod for AI accelerator push
Nvidia rejects near-term memory glut fears, leaves CXMT cooperation open
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
iPhone Duo's launch
Apple's first foldable smartphone, the iPhone Duo, hit store shelves on October 23, 2026, in over 70 countries and regions.
iPhone Duo sales beat expectations as first batch sells out
Fine M-Tec rejects component blame as foldable market outlook remains positive
As iPhone Duo inner screens crack, Samsung capitalizes on foldable surge
...More
EV
Wednesday 9 September 2026
Analysis: When 72% of the world's EV batteries are Chinese, one defect travels
HHTD 26: Foxconn unveils three new EVs, expanding Model A and K platforms
Friday 30 October 2026
Samsung SDI posts 12-quarter high in 3Q26 operating profit
Friday 30 October 2026
VinFast aims to make India one of its two largest markets as overseas sales trail target
Friday 30 October 2026
TECH
Friday 30 October 2026
Sandisk sees 60–90GB of NAND per CPU in AI agent workloads
Nvidia trims HBM4 bandwidth for Rubin platform, sources say
Thursday 29 October 2026
AMD, Nvidia target substrate capacity amid 4x expansion constraints
Tuesday 27 October 2026
Why is TSMC suddenly looking at Texas?
Friday 23 October 2026
ASIA
Thursday 10 September 2026
India's fraud office seeks a Xiaomi probe as the market it once led shrinks around it
Jensen Huang calls Megaspeed ties normal amid Washington's spy probe
Friday 30 October 2026
China's memory module bellwethers post record profits as 3Q26 momentum fades
Friday 30 October 2026
BYD sees 28% profit growth for 3Q26, but still falls short of forecasts
Friday 30 October 2026
OPINIONS
Friday 30 October 2026
Analysis: Can Kazakhstan really be Europe's AI factory?
Commentary: Why Marvell's rumored Lumentum buy may be hard to pull off but harder to pass up
Friday 30 October 2026
Analysis: Oracle backs Cerebras as AI cloud shifts to multi-architecture compute
Friday 30 October 2026
Commentary: China's luxury cars reshapes market, causing global brands to lose ground
Thursday 29 October 2026
TOPICS
IPHONE DUO'S LAUNCH
TRENDS IN INDUSTRIAL COMPUTING
EMS WATCH
GEOWATCH
SPECIAL REPORTS
Friday 30 October 2026
China smartphone market and industry, 3Q 2026
According to DIGITIMES observations and analysis, smartphone memory contract prices in the first half of 2026 often rose 50% to 80% quarter-over-quarter.
Tuesday 27 October 2026
Server CPU shipments to exceed 50 million units in 2027; AMD's server CPU revenue will surpass Intel
According to DIGITIMES, Agentic AI, AI server expansion, cloud service provider (CSP) in-house CPU ramp-up, and replacement demand for general-purpose servers will lift global server CPU shipments to 52.6 million units in 2027, up 45.7% year-over-year, wi 12_s.jpg
Wednesday 21 October 2026
iPhone Duo finally debuts, but with price increases across models, Apple's 4Q26 shipments will take hit
DIGITIMES says the most closely watched model in Apple's high-end iPhone 18 lineup, launched in September 2026, is the long-anticipated first foldable smartphone, the iPhone Duo.
Monday 19 October 2026
Shipments of high-end cloud AI accelerators, 2027
DIGITIMES observed that cloud service providers (CSPs) such as Google and AWS will sharply ramp up self-developed ASICs in 2027, lifting high-end cloud AI accelerator shipments to 25.951 million units, up 64.5% year-over-year.
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