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REALTIME NEWS
China’s IC designers expand AI interconnect efforts as Montage grows in DDR5 and TWSC targets CXL
Tomorrow's Headlines
10h 28min ago
Nvidia emerges as AI industry’s central bank amid cloud startup risks
Tomorrow's Headlines
10h 28min ago
Apple reportedly plans high-end HomeView with robotic arm
Tomorrow's Headlines
10h 28min ago
Rising memory costs push smartphone makers from LTPO to LTPS panels
Tomorrow's Headlines
10h 28min ago
Qiyi Technology’s Arizona fab projects drive order backlog to NT$4.476 billion
Tomorrow's Headlines
10h 28min ago
Oct 21, 19:24
Micron reaches deal with Taiwan union to introduce quarterly profit bonuses in FY27
Oct 21, 17:19
Li Auto chip subsidiary Mahe Xin raises CNY1.6 billion in equity financing as automakers aim to become chipmakers
Oct 21, 16:56
Cloud AI to drive chip growth in 2027 as Taiwan suppliers seek opportunities beyond weak consumer edge AI
Oct 21, 16:18
Infineon, Wolfspeed pivot to 8-inch SiC to cut costs and meet rising AI power demand
Oct 21, 15:57
Samsung, SK Hynix reportedly upgrading China NAND fabs to fend off YMTC amid softening US stance
LATEST STORIES
7 days news
Sony keeps chip unit as imaging sensors, TSMC partnership drive strategy
Oct 21, 16:05
EAST ASIA
Samsung shifts M2800 modem to 2nm, frees 4nm capacity for HBM base dies
Oct 21, 16:04
COMMUNICATIONS
Samsung Display accelerates MPO and inkjet OLED development for laptops and monitors
Oct 21, 16:03
DISPLAYS
HD Hyundai Robotics unveils dual-arm robot as FIX 2026 opens
Oct 21, 15:58
ICT
Micron's Taichung union deal eases Taiwan DRAM strike risk; Taoyuan dispute remains unresolved
Anthropic's IPO spotlight falls on its potential US$750 billion AI compute tab
China launches state-owned data group as market-facing arm of its AI infrastructure push
PCB material shortages persist as capacity expansion extends beyond 2029
Taiwan PCB output set to top NT$1 trillion as VP touts AI opportunity
AMD and Intel align PyTorch CPU optimizations around oneDNN
Qisda integrates four companies to build scalable rack-scale AI solutions
Murata develops world's smallest NTC thermistor, targets 2027 mass production
Qualcomm plans global performance-based layoffs from November
US sanctions five Chinese entities over trade secret theft tied to ex-Google engineer
Micron funds critical minerals processing at Indium Corporation's New York facility
CXMT's next DRAM milestone: 4F² server memory with hybrid bonding by end-2026
CATL's profit growth slows, sharpening focus on 50% energy-storage revenue target
AMD: Physical AI demands more than TOPS
DIGITIMES Insights: AI server PCB upgrades drive explosive demand for advanced backdrilling equipment
AMEC seeks South Korean foothold through MOCVD trials with SK Keyfoundry, Magnachip
Chinese nickel producers weigh coordinated HPAL cuts in Indonesia
TSMC and others turn LCD plants into AI assets as LG Innotek weighs acquisition
Zhen Ding Technology showcases AI infrastructure and terminal PCB lineup
Axcelis plans US$35 million semiconductor facility in South Korea
Analysis: From rockets to fabs, SpaceX's TeraFab bet pushes vertical integration into the semiconductor era
Micron faces potential Taiwan strike, union cites Samsung, SK Hynix profit-sharing benchmark
Sony bets on cinema-grade audio, mobile accessories to counter smartphone sales slump
Apple expands US iPhone supply ties with Perryman and Qnity
SpaceX pushes AI scaling into industrial realm as power equipment becomes limiting factor
How ByteDance, Alibaba, Tencent are testing the boundaries of US AI chip restrictions
More news
BIZ FOCUS
Oct 21, 08:00
Starting with Data Challenges: TS Holdings Explores AI Through Hackathon
Tuesday 20 October 2026
CHT Leverages Hackathon to Cultivate AI Solutions for Urban Governance
Tuesday 20 October 2026
Cincoze's EMC Solution Boosts Equipment Stability and Production Efficiency
Tuesday 20 October 2026
CES 2027 Welcomes First-Ever Chilean Global Pavilion
MOST-READ
TSMC locks in 3-6% wafer out price hikes for 2027
TSMC, Intel named as Musk's Terafab ambitions face reality check
GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
Beyond 16 layers: HBM stacks test advanced packaging equipment makers
TSMC breaks silence on Musk's Terafab: Talks underway, but fab control non-negotiable
Samsung HBM4E wins NVIDIA nod for AI accelerator push
China's memory race turns inward — CXMT, YMTC head toward patent showdown
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
4F2 DRAM development
Memory leaders are making progress with the next-generation 4F2 DRAM designs, a part of the industry's move toward vertically stacked 3D architectures to increase performance.
CXMT's next DRAM milestone: 4F² server memory with hybrid bonding by end-2026
AI dividend drives Taiwan's memory makers from trough to transformation
Elon Musk points to China's 2028 DRAM supply surge to challenge Samsung, SK Hynix pricing power
...More
EV
Wednesday 9 September 2026
Analysis: When 72% of the world's EV batteries are Chinese, one defect travels
Huawei-linked Yinwang gives CATL battery swapping a wider route into smart vehicles
Wednesday 21 October 2026
CATL's profit growth slows, sharpening focus on 50% energy-storage revenue target
Wednesday 21 October 2026
Foxconn and Mitsubishi Electric target SDV with L4 autonomy and EV drive systems
Wednesday 21 October 2026
TECH
Wednesday 21 October 2026
Analysis: From rockets to fabs, SpaceX's TeraFab bet pushes vertical integration into the semiconductor era
Exclusive: Apple's MacBook Neo pressures Microsoft to cut specs for low-cost 12-inch Surface
Tuesday 20 October 2026
AUO, Largan Micro LED debate highlights optical communications uncertainty
Monday 19 October 2026
Charts: YMTC bets on premium eSSDs to take on Samsung
Friday 16 October 2026
ASIA
Thursday 10 September 2026
India's fraud office seeks a Xiaomi probe as the market it once led shrinks around it
US sanctions five Chinese entities over trade secret theft tied to ex-Google engineer
Wednesday 21 October 2026
Li Auto chip subsidiary Mahe Xin raises CNY1.6 billion in equity financing as automakers aim to become chipmakers
Wednesday 21 October 2026
China launches state-owned data group as market-facing arm of its AI infrastructure push
Wednesday 21 October 2026
OPINIONS
Wednesday 21 October 2026
DIGITIMES Insights: AI server PCB upgrades drive explosive demand for advanced backdrilling equipment
Analysis: China's proposed AI export controls reach beyond chips to design IP, computing infrastructure
Tuesday 20 October 2026
Analysis: China's proposed AI export controls target top-ranked foundation models, advanced agents
Tuesday 20 October 2026
DIGITIMES Insight: AI packaging power reaches kilowatt scale as thermal design moves toward the die
Tuesday 20 October 2026
TOPICS
4F2 DRAM DEVELOPMENT
TSMC 3Q26 EARNINGS CALL
TSMC UPDATES
GEOWATCH
SPECIAL REPORTS
Wednesday 21 October 2026
iPhone Duo finally debuts, but with price increases across models, Apple's 4Q26 shipments will take hit
DIGITIMES says the most closely watched model in Apple's high-end iPhone 18 lineup, launched in September 2026, is the long-anticipated first foldable smartphone, the iPhone Duo.
Monday 19 October 2026
Shipments of high-end cloud AI accelerators, 2027
DIGITIMES observed that cloud service providers (CSPs) such as Google and AWS will sharply ramp up self-developed ASICs in 2027, lifting high-end cloud AI accelerator shipments to 25.951 million units, up 64.5% year-over-year.
Monday 12 October 2026
Chinese government and industry make full push into AI glasses development: AR display integration and lightweighting gain traction
DIGITIMES notes that China continued to advance smart glasses policies from the central government to local governments in 2026, driving both enterprise production and consumer purchase subsidies.
Friday 2 October 2026
Global annual AI server shipments, 2025-2026
Continued advances in top-tier LLM capabilities, coupled with the potential for business automation enabled by agentic AI, are prompting major North American cloud providers, Neo Clouds, and leading AI labs to accelerate AI data center buildouts in 2026.
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