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REALTIME NEWS
G20 approves guidelines calling for more business-friendly AI regulation
ICT
22min ago
Hyundai Motor Group expands US research unit ahead of EREV and HEV push
Tomorrow's Headlines
Sep 3, 18:26
Commentary: Apple shifts to smart vehicle software layer as Ternus era arrives
Tomorrow's Headlines
Sep 3, 18:26
Kyocera opens first new Japan plant in 21 years to tap Kyushu chip supply chain
Tomorrow's Headlines
Sep 3, 18:26
Sep 4, 10:12
Silicon photonics testing shift could reshape how CPO suppliers win business
Sep 4, 11:05
Analysis: Physical AI upgrades autonomous driving and lifts Taiwan supply chains
Sep 4, 11:56
CPO high-density optical interconnects drive E&R's submicron 2D FAU breakthrough
Sep 4, 12:15
India tablet market grows as business demand shifts toward premium devices
Sep 4, 12:20
Lite-On makes US$170 million strategic investment in DCX for AI cooling push
LATEST STORIES
7 days news
Chunghwa Precision Test sees ASIC revenue overtaking GPU by 2027
Sep 4, 12:22
SEMICONDUCTORS
K&S targets CPO, CoPoS growth with expanded TCB advanced packaging roadmap
Sep 4, 12:11
SOUTHEAST ASIA
China interconnect chipmaker Montage enters Samsung, SK Hynix CXL 3.2 supply chains and begins DDR6 development
Sep 4, 12:01
SEMICONDUCTORS
Micron reportedly targets 2× HBM capacity by end-2026; Samsung, SK Hynix keep the scale edge
Sep 4, 11:58
SEMICONDUCTORS
Taiwan to expand AI compute capacity as supercomputer at research institute hits full load
Ennostar accelerates AI optical communications with micro LED
Kyocera completes Nagasaki plant for semiconductor ceramics and packages
China's EUV gap may stretch 10–15 years, but DUV gains test Western export controls
Fujitsu says useful quantum computers may need far fewer qubits than expected
Taiwan automation specialist Kenmec targets semiconductor packaging plants with low-clearance OHT, AI digital twins
Taisic unveils p-type SiC substrate for ultra-high-voltage grid, rail applications
China Motor unit Greentrans launches Taiwan-made quadruped robots
Xiaomi Auto maps 2027 Europe entry with German dealer network and four-country vehicle testing
Processor, memory boom could push chip supply chain out of sync, says Yole
Moonshot AI reportedly files for Hong Kong IPO, targets US$3B
AI boom reshapes DRAM market as Samsung regains lead and CXMT gains ground
Silicon Valley overflow fuels semiconductor boom in California's Capital Region
Acer broadens lineup with e-paper displays and scooters, ahead of PC industry headwinds
Sumitomo Chemical starts mass production of 4-inch InP wafers for AI data centers
Chip leaders call for end to 'silo mentality' as AI scale-up demands cross-industry collab
India's refurbished smartphone market gains as prices push buyers toward premium used devices
Acer bets on RTX, GoogleBook as on-site AI demand grows
LB Semicon starts Qualcomm shipments as DDI dependence fades
OpenAI says Astra crosses critical cybersecurity threshold, adding tighter safeguards
Adobe names Anil Chakravarthy as next chief executive
Analysts read Nvidia's Hugging Face deal as a hedge, not a software bet
Nvidia buys the front door to open AI with a US$12.93 billion Hugging Face deal
K-Safety Expo 2026: South Korea's safety AI moves from watching danger to acting on it
Taiwan to expand industrial land for AI hardware boom
AUO speeds up asset sales as Singapore plant nears WD deal
More news
BIZ FOCUS
Sep 2, 08:22
World Diamond Technology accelerates mass production of 300 mm diamond wafers
Wednesday 2 September 2026
Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
Wednesday 2 September 2026
Innovative Solutions for Fabricating High-Performance AI Multichip Packaging Using Glass Substrates
Wednesday 2 September 2026
8 September Hsinchu seminar: Silicon photonics driving AI chains
MOST-READ
Exclusive: Musk pushes US solar supply chain upstream as polysilicon ambitions emerge
Tungsten prices surge sixfold as US-China restrictions tighten supply for chips, aerospace, defense
Interview: Nvidia exec on progress of CPO production and pluggable optics
OCP APAC 2026: TSMC tackles CoWoS material risks while cutting 3DIC development cycle to one year
Google's v10 TPU opens door to AMD without sidelining Broadcom, MediaTek
Nvidia Feynman pushes TSMC A16 and CPO ramp
Update: ABF substrate maker Unimicron searched in origin-labeling probe
MULTIMEDIA
Jensen Huang in Seoul: Faker, BBQ and one very awkward LG chairman
The end of the Tim Cook era at Apple
After a 15-year tenure, Apple CEO Tim Cook is stepping down on September 1, 2026, and handing the reins to hardware veteran John Ternus.
Tim Cook concludes 15-year Apple tenure, John Ternus takes over
Apple reshuffles leadership, shifts Schiller out of App Store
John Ternus takes over an Apple with one growth engine, no obvious second
...More
EV
Wednesday 2 September 2026
China moves to curb overseas price wars as automakers accelerate global expansion
BYD Semiconductor scales 4D radar chip for L2-L4 driving, deepening its in-house automotive sensing stack
Thursday 3 September 2026
Turing Drive highlights overseas expansion, extends invitation to global automakers
Thursday 3 September 2026
VinFast reportedly pauses India manufacturing work on three EVs, a year after opening its Tamil Nadu plant
Thursday 3 September 2026
TECH
Thursday 3 September 2026
Broadcom says CPO fits scale-out better than scale-up
Chinese court freezes US$318M in Nexperia assets, further escalating corp rift
Tuesday 1 September 2026
The architect of Apple's China machine also built its hardest problem
Monday 31 August 2026
Apple is only the test: Chinese memory makers CXMT, YMTC target North American cloud market
Wednesday 26 August 2026
ASIA
Thursday 3 September 2026
CXMT's 'Hefei Project' exposed in Samsung DRAM theft case
Exclusive: China 6-inch SiC substrate supply tightens, prices set to rise
Thursday 3 September 2026
China chip tool makers expand beyond import substitution at CSEAC 2026
Thursday 3 September 2026
SK Hynix weighs Kioxia production tie-up in Japan
Thursday 3 September 2026
OPINIONS
Tuesday 1 September 2026
Commentary: Why America fell behind on Open models — and how Nvidia plans to close the gap
Commentary: DeepSeek out, SMIC in? TIME100 AI maps China's widening AI battleground
Tuesday 1 September 2026
Research insights: AI Fabric optical interconnects move into racks as 400G/lane and CPO maturity emerge as key variables
Tuesday 1 September 2026
Analysis: CXMT's US$11.5B profit surge raises the stakes in China's AI memory race
Tuesday 1 September 2026
TOPICS
THE END OF THE TIM COOK ERA AT APPLE
TRENDS IN INDUSTRIAL COMPUTING
HUAWEI
TSMC UPDATES
SPECIAL REPORTS
Wednesday 2 September 2026
Global smartphone industry, 2Q 2026
According to DIGITIMES, smartphone memory contract prices surged by 50% to 80% in the first half of 2026, prompting most vendors to continue cutting shipments of mid- and low-end models and to raise product prices.
Friday 28 August 2026
AI data center 800VDC power architecture takes shape; future hurdles require balancing multiple key factors
DIGITIMES believes that 2026 will be a pivotal year in the stabilization of 800VDC power architectures for AI data centers.
Wednesday 26 August 2026
Growth in low-Earth-orbit satellite communications accelerates; further boosts demand for GaN components
DIGITIMES has observed that since SpaceX began using reusable rockets for launch missions, its payload capacity has continued to rise.
Tuesday 25 August 2026
Chinese automakers expand to humanoid robotics with technology, supply chain and scenario advantages
DIGITIMES observes that the humanoid robot market is expanding rapidly, supported by global labor shortages and advances in artificial intelligence (AI), and Chinese automakers are also moving aggressively into this emerging field.
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