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REALTIME NEWS
Why Wiwynn chose El Paso for its first US plant
ICT
31min ago
Samsung and Qualcomm jointly developing organic bridges for 2.1D packaging
Semiconductors
34min ago
Sep 16, 11:46
Exclusive: Wiwynn expands US, Mexico plants, aiming to double capacity by 2027
Sep 16, 10:48
Sharp opens orders for Foxconn-built Nvidia AI servers, targeting JPY250 billion by fiscal 2030
Sep 16, 12:19
Apple reportedly accepts Samsung's 1Q27 memory hike, raising the 2027 smartphone cost floor
Sep 16, 12:15
Samsung backs Dutch AI chip startup Euclyd in US$230M funding round
Sep 16, 11:49
Hanmi Semiconductor reportedly lands first back-end foothold at Terafab
LATEST STORIES
7 days news
BizLink's CPO breakthrough hits the hard part: scaling
Sep 16, 15:57
ICT
AI slowdown calls expose the financial strain of the frontier race
Sep 16, 15:45
ICT
EV batteries cannot simply power humanoid robots, with energy density and costs posing key hurdles
Sep 16, 15:43
EAST ASIA
Soaring memory costs threaten Netronix's e-reader growth, even as new display markets stay on track
Sep 16, 15:35
ICT
SK Hynix union approves revised pay deal after 25-vote rejection
TSMC's overseas expansion faces talent management gap, says co-COO Y.J. Mii
SK Hynix, Intel in talks on US production to ease memory crunch
Taiwan CCL makers ride Nvidia's M9 shift as AI servers move to 52-layer PCBs
CPO ramp pushes silicon photonics testing upstream to catch defects early
Geckos sees copper paste as a lower-cost answer to shrinking glass via challenges
Samsung Exynos regains share as Galaxy phones test 2nm
Geopolitical shocks add business pressure as CBAM free carbon quotas extend to 2038
Physical AI could reshape industrial computing as Ennoconn sees a long growth cycle
Samsung reportedly weighs Micron's newest memory for Galaxy S27
Micron unveils 512GB DDR5 RDIMM for next-gen servers
Samsung reportedly pushes conventional memory modules to partners in Vietnam and India as HBM crowds its back end
Glass substrates, TGV set to reshape 2027 advanced packaging race
Apple, Intel links sharpen focus on Lens Technology's next glass growth markets
Advanced processes have no ready-made answers, says TSMC's COO
Commentary: China's US$4.5 trillion electronics target confronts the limits of manufacturing scale
Beyond 2nm: Dimensity 9600 Pro gives MediaTek a bigger role in mobile AI
Samsung reportedly taps TSMC for custom HBM base dies as new foundry dynamics emerge
Meta globally rolls out Meta One subscription, tops 15 million sign-ups
Aleees locks in Tainan plant for 20-year North America order
Kepler bets HBM can scale without EUV — chip giants are buying in
Astera says customers are rethinking HBM needs for AI accelerators
AI efficiency fuels Jevons Paradox debate over HBM demand
Altera confidentially files for US IPO as AI chip demand fuels listing boom
Huawei reportedly scales back AITO role as Seres takes greater control
US-based Teradyne opens Bengaluru office to support India's semiconductor push
More news
BIZ FOCUS
Sep 14, 08:00
Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
Monday 14 September 2026
Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
Friday 11 September 2026
Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
Friday 11 September 2026
DAS Expands in Taiwan and Unveils World First at SEMICON
MOST-READ
Google's v10 TPU opens door to AMD without sidelining Broadcom, MediaTek
Update: ABF substrate maker Unimicron searched in origin-labeling probe
Qualcomm's HBC play pulls Samsung and SK hynix into a new race beyond HBM
SK keyfoundry expands 8-inch capacity as China demand strains supply
Samsung, SK Hynix step up China NAND upgrades as US tool risks grow
ASML lines up Intel, TSMC and Samsung behind 12-inch masks — TSMC alone sets a timeline
Winstar's AI push gains momentum with some orders extending into 2027
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
CIOE 2026
The 27th China International Optoelectronic Exposition (CIOE 2026) took place September 9-11 in Shenzhen, bringing together more than 5,000 exhibitors from over 30 countries and regions.
As AI data centers hit a transmission wall, GlobalFoundries pushes into silicon photonics
AR glasses target 2 billion myopia users as China supply chain eyes doubling shipments
Sivers Semiconductors positions laser arrays as solution to copper's limits
...More
EV
Wednesday 9 September 2026
Analysis: When 72% of the world's EV batteries are Chinese, one defect travels
Wuliangye skips carmaking, turns liquor waste into silicon-carbon anodes
Tuesday 15 September 2026
Tesla's rare-earth-free Cybercab challenges China's grip on EV magnets
Tuesday 15 September 2026
BYD's 2027 triple play could rewrite the EV race
Tuesday 15 September 2026
TECH
Tuesday 15 September 2026
MediaTek unveils first 2nm chip to run 30 billion AI models on phones arriving this quarter
Google TPU pays back investment in 1 year, creating upside for MediaTek, Broadcom ASIC revenues
Monday 14 September 2026
Micron pays Taiwan fab workers up to 68 months' salary in memory upturn
Friday 11 September 2026
Qualcomm's AWS deal raises stakes for MediaTek and Alchip
Thursday 10 September 2026
ASIA
Thursday 10 September 2026
India's fraud office seeks a Xiaomi probe as the market it once led shrinks around it
DIGITIMES Insight: AI sends the semiconductor market toward US$1.6T, with memory doing the heavy lifting
Tuesday 15 September 2026
China elevates HBM and HBF in five-year plan, opening a new front in AI memory
Tuesday 15 September 2026
BIS blocks Polestar authorization, forcing new vehicles out of US market from 2027
Tuesday 15 September 2026
OPINIONS
Tuesday 15 September 2026
Inside CIOE: takeaways from China's biggest optoelectronics show
DIGITIMES Insight: AI sends the semiconductor market toward US$1.6T, with memory doing the heavy lifting
Tuesday 15 September 2026
Column: When digital trust breaks — quantum risk rewrites supply chain resilience
Tuesday 15 September 2026
Robot supply strategies split between US in-house tech and Chinese local ecosystem
Tuesday 15 September 2026
TOPICS
CIOE 2026
TSMC UPDATES
FOXCONN-SHARP PARTNERSHIP
HUAWEI
SPECIAL REPORTS
Wednesday 16 September 2026
Global top-3 memory maker status, 3Q 2026: AI servers drive record memory revenue; SSD, LPDDR upgrades ahead
DIGITIMES observes that major memory suppliers posted record-high revenue in the second quarter of 2026, with yearover-year growth remaining in the triple digits. Driven by AI demand, SSDs and LPDDR are emerging as key competitive
battlegrounds.
Tuesday 15 September 2026
AI demand reshapes capital allocation and operating models in telecom sector
Although the global 5G mobile communications market is still growing in 2025, higher 5G user penetration has not necessarily translated into equivalent revenue growth for telecom operators, while annual growth in mobile data traffic has continued to slow.
Monday 14 September 2026
Notebook shipment update, July 2026
DIGITIMES' survey of July 2026 notebook shipments (excluding detachable models) from the world's top five notebook brands (excluding Apple) and the top three notebook ODMs
Thursday 10 September 2026
From cHBM to 3D Stacked SRAM, AI inference drives AI accelerators toward memory architecture innovation
DIGITIMES identifies three main directions for memory development in cloud AI accelerators: processing near memory, 3D Stacked SRAM, and high-bandwidth flash.
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