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Apr 18, 08:07
Commentary: AI drives CPU crunch, lifting data center demand and pricing
Apr 18, 08:06
Musk lines up chip suppliers, accelerates Terafab AI fab plan
Apr 18, 08:07
Samsung launches voluntary retirement amid chip-device earnings gap
Apr 18, 08:09
Commentary: Humanoid robot marathon highlights four industry benchmarks
Apr 18, 08:28
TSMC's Q1 2026 earnings call: five signals hidden in plain sight
LATEST STORIES
7 days news
The drowning detection startup that never mentions AI
Apr 18, 08:06
ICT
OpenAI's HBM push signals a new AI memory arms race
Apr 17
SEMICONDUCTORS
Taiwan's E-Lead expands beyond head-up displays into full smart cockpit systems
Apr 18, 08:10
ELECTRIC VEHICLES
Defense and trade tensions fuel growth for Taiwan's Parpro
Apr 18, 08:09
AEROSPACE
Taiwan's satellite edge computing tech moves toward global market
Memory price surge hits Xiaomi shipments, forces strategy shift
VLSI TSA 2026 explores quantum architecture and AI healthcare innovations
Securing the supply chain, CATL pushes into global mining assets
bEMC advances Micro LED optical transmission with key POC validation
Honda plans deeper China capacity cuts, targets Guangzhou and Wuhan plants
Lens Technology swings to loss on weak smartphone demand, FX pressure
Commentary: Robots are selling, but profits are not; data is the real prize
Samsung deploys AI across TV lineup to counter Chinese rivals and weather weak demand
C*Core completes internal testing of RISC-V automotive AI MCU with post-quantum security
MLCC, inductor prices climb as AI demand meets cost pressure
Samsung's VD division reviews China strategy as local rivals gain ground
Evalue launches 640kW ultra-fast charger, expanding fast-charging capacity
Samsung accelerates Taylor fab ramp-up amid Tesla AI chip deal
Whetron highlights AI vision and radar safety systems at Taipei AMPA 2026
Memory module maker Apacer beats full-year 2025 profit in first quarter, inventory climbs
Google reportedly in talks with Pentagon over classified use of Gemini AI models
Interview: AI compute startup TBC details biological computing platform linking living neurons and machine learning
Vingroup signs US$6.5 billion India investment framework with Maharashtra
Topoint bond deal signals wider supply risk for global AI hardware makers
Stellantis, Microsoft ink five-year deal to scale AI, cybersecurity
Spanish startup Openchip targets 2028 launch on agentic AI wave
Aurotek launches three AI robots to boost Taiwan's smart automation market
UMC signals 2026 wafer price adjustment amid tightening demand and capacity pressure
OpenAI reportedly to spend over US$20 billion on Cerebras chips, reducing reliance on Nvidia
Foxconn Industrial Internet surpasses Huawei in 2025 revenue, driven by AI servers
BIZ FOCUS
Feb 9, 08:00
iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
Friday 6 February 2026
2026 Market Outlook: Key Opportunities & Risks to Watch
Thursday 5 February 2026
Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
Wednesday 4 February 2026
Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
MOST-READ
TSMC plans 12 fabs in Arizona as supply chain shifts from passive to active
AI compression won't ease memory crunch, NAND shortage set to persist
Samsung reportedly aims to begin silicon photonics mass production in 2028
China's memory capacity surge led by YMTC and CXMT shifts global supply in AI cycle
TSMC eyes SiPh breakthrough as industry consensus forms
Qualcomm moves into custom DRAM with CXMT for smartphones
TSMC hints at next-gen LPU bid, stokes speculation that Samsung's Groq order may not last
MULTIMEDIA
Post Space-Comm 2026: Insights & Takeaways
TSMC 1Q26 earnings call
On April 16, TSMC held its earnings call for the first quarter of 2026.
TSMC revises advanced process and packaging strategy
TSMC chairman C.C. Wei denies customer favoritism regarding tight 1Q26 capacity
TSMC hints at next-gen LPU bid, stokes speculation that Samsung's Groq order may not last
...More
EV
Monday 2 March 2026
Europe's battery industry faces strategic setback as high costs and technology gaps cede ground to Asian rivals
Honda plans deeper China capacity cuts, targets Guangzhou and Wuhan plants
Friday 17 April 2026
Vingroup signs US$6.5 billion India investment framework with Maharashtra
Friday 17 April 2026
Stellantis, Microsoft ink five-year deal to scale AI, cybersecurity
Friday 17 April 2026
TECH
Thursday 26 February 2026
Is Nvidia's GTC mystery chip a 3D IC with memory stacked on the GPU?
Analysis: Intel, Musk advance TeraFab partnership, echoing Apple's TSMC shift
Friday 17 April 2026
Exclusive: Samsung weighs Vietnam semiconductor testing facility
Friday 10 April 2026
ChipX targets AI data center market with photonics, power chips ahead of Malaysia fab
Thursday 9 April 2026
ASIA
Monday 2 March 2026
Renesas names new India president to accelerate growth amid fierce engineering talent competition
Lens Technology swings to loss on weak smartphone demand, FX pressure
Friday 17 April 2026
Commentary: Robots are selling, but profits are not; data is the real prize
Friday 17 April 2026
Samsung's VD division reviews China strategy as local rivals gain ground
Friday 17 April 2026
OPINIONS
Monday 2 March 2026
Insight: Broadcom delivers 2nm 3.5D AI processor, expanding custom chip push against Nvidia
Analysis: Nvidia links RISC-V to NVLink with SiFive investment
Thursday 16 April 2026
Column: How do intelligent robots learn action skills?
Wednesday 15 April 2026
Exclusive: Edge AI inference set for 10x growth; Nokia, Blaize advance hybrid AI compute
Tuesday 14 April 2026
TOPICS
TSMC 1Q26 EARNINGS CALL
TSMC UPDATES
ALTERNATIVES TO LCD
MICRO LED
SPECIAL REPORTS
Friday 17 April 2026
Accelerating enterprise AI: Hardware advancements and compute architecture transformation
According to DIGITIMES, six major AI applications - chatbots, software development, image generation, video generation, enterprise operations automation, and manufacturing process automation - are increasingly being adopted by enterprises. The resulting s 4_s.jpg
Thursday 16 April 2026
Global Expansion of 2.5D/3D Packaging: Strategic Moves in the US, Asia, and Beyond
Major OSAT providers accelerate 2.5D/3D advanced packaging deployments in US, Japan, South Korea, and Malaysia with non-Taiwan capacity footprint to expand.
Wednesday 15 April 2026
Beyond Huawei: China's New H3C Leverages Former HP Roots to Dominate ASEAN Server Markets
Chinese top-3 server exporter, the New H3C, is seeing server export value expand, leveraging two major export routes to target ASEAN and Central Asian markets.
Thursday 9 April 2026
OpenClaw development and market status
OpenClaw craze accelerates personalized edge AI agent applications, driving demand for VPS and personal workstations.
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