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REALTIME NEWS
Global smartphone industry, 2Q 2026
Personal Computing
29min ago
MediaTek pushes advanced packaging and supply chain to keep pace with AI
Semiconductors
30min ago
Meta reportedly taps SeeYA for Phoenix OLEDoS panels as BOE fails to qualify
Displays
42min ago
China's SeeYA wins Meta’s MR panel order as BOE misses certification
Tomorrow's Headlines
Sep 1, 19:00
Qualcomm says HBC memory architecture offers better value than HBM as hyperscalers show interest
Tomorrow's Headlines
Sep 1, 19:00
Huawei lifted R&D spending to push AI chips and semiconductor self-reliance
Tomorrow's Headlines
Sep 1, 19:00
Sep 2, 09:32
TSMC says Europe chip strategy is shifting from plans to demand creation
Sep 2, 08:32
Apple's M6 and M5 Ultra break rule tying process to chip strength
Sep 2, 08:25
How Taiwan is closing its semiconductor materials gap — three shifts to watch
Sep 2, 08:23
AI packaging demand surges, ASE EVP identifies two manufacturing bottlenecks
Sep 2, 08:01
China memory-module makers report surging profits, strained cash flow
LATEST STORIES
7 days news
Marvell sees silicon photonics scaling from late 2027, with Taiwan and TSMC at the center
Sep 2, 11:58
SEMICONDUCTORS
Manus resumes independent operations after Meta deal collapses
Sep 2, 11:55
EAST ASIA
SDC to expand foldable iPhone OLED mass production in September
Sep 2, 11:30
COMMUNICATIONS
European chip ambitions hinge on more than subsidies, says TSMC
Sep 2, 11:26
SEMICONDUCTORS
ByteDance-ZTE Nubia NaviX Ultra clears launch hurdle, takes agentic AI beyond smartphone assistants
Chinese foundry Hua Hong Grace adds 55,000-wpm Wuxi capacity in US$4.17 billion Phase III buildout
China moves to curb overseas price wars as automakers accelerate global expansion
Taiwan doesn't just want a quantum lab — it wants a quantum fab
TCL CSOT bets on InP laser chips as supply tightens
MCU chipmaker Sonix sees supply crunch lasting through 2026, memory shortage hits imaging shipments
GoPro to merge with Starman Optical in US$285 million deal, pivoting deeper into AI and defense markets
AI demand push expands wafer industry's growth outlook
Anthropic launches Claude Fable 5.1 and Mythos 5.1, cuts agentic-task costs by up to 45%
Taiwan materials makers see new opening in chip packaging shift
Dell says enterprise AI customers accelerated even faster than its record orders suggest
UMC targets 12-inch TFLN to break 400G SiPh bottleneck
Commentary: Malaysia wants foreign automotive investment to leave more behind
Nvidia pushes into HBM base dies as NVHBM battle heats up
Gemtek deepens partnership with India's Dixon Technologies to expand optical transceiver, connectivity footprint
Dell's AI server boom lifts profitability across its whole business
Micro LED maker PlayNitride targets Micro LED optical communications within two years
Panasonic reportedly raises CCL and PP prices again as IC substrate costs jump 30%
US solar module capacity to lead by 2027, but cell and wafer shortages pose major hurdles
LG fights Chinese brands with innovation, business model shifts
Chinese MRAM chipmaker ICY Tech rethinks HBM for rack-scale AI inference
Qisda builds physical AI ecosystem from land to space
'Chinamaxxing' fuels China tech tourism as visitors flood Huaqiangbei
Taiwan eyes satellite communications to cut sea cable reliance
Global quantum industry accelerates as Taiwan eyes Asia hub
Tmytek to list on Innovation Board in September on antenna module growth
More news
BIZ FOCUS
Sep 2, 08:22
World Diamond Technology accelerates mass production of 300 mm diamond wafers
Wednesday 2 September 2026
Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
Wednesday 2 September 2026
8 September Hsinchu seminar: Silicon photonics driving AI chains
Wednesday 2 September 2026
Take Control of Your Process: Onto Innovation at SEMICON Taiwan 2026
MOST-READ
Exclusive: Musk pushes US solar supply chain upstream as polysilicon ambitions emerge
2027 memory capacity reportedly sold out as buyers quietly lock in supply
Tungsten prices surge sixfold as US-China restrictions tighten supply for chips, aerospace, defense
Interview: Nvidia exec on progress of CPO production and pluggable optics
OCP APAC 2026: TSMC tackles CoWoS material risks while cutting 3DIC development cycle to one year
Google's v10 TPU opens door to AMD without sidelining Broadcom, MediaTek
Nvidia Feynman pushes TSMC A16 and CPO ramp
MULTIMEDIA
Jensen Huang in Seoul: Faker, BBQ and one very awkward LG chairman
The end of the Tim Cook era at Apple
After a 15-year tenure, Apple CEO Tim Cook is stepping down on September 1, 2026, and handing the reins to hardware veteran John Ternus.
Tim Cook concludes 15-year Apple tenure, John Ternus takes over
Apple reshuffles leadership, shifts Schiller out of App Store
John Ternus takes over an Apple with one growth engine, no obvious second
...More
EV
Wednesday 29 July 2026
Chinese brands seize 25% of Europe midsize SUV sales as BEV demand surges
BYD's overseas business overtakes China for the first time as price war erodes domestic margins
Tuesday 1 September 2026
Autonomous driving expands into Physical AI, creating new openings for Taiwan firms
Tuesday 1 September 2026
BYD widens overseas lead over Geely, but profits still lag
Tuesday 1 September 2026
TECH
Tuesday 1 September 2026
Chinese court freezes US$318M in Nexperia assets, further escalating corp rift
The architect of Apple's China machine also built its hardest problem
Monday 31 August 2026
Apple is only the test: Chinese memory makers CXMT, YMTC target North American cloud market
Wednesday 26 August 2026
Samsung, SK Hynix step up China NAND upgrades as US tool risks grow
Tuesday 25 August 2026
ASIA
Thursday 30 July 2026
China's 28nm DUV lithography enters fab validation, reportedly guided by State Council-level experts
Analysis: CXMT's US$11.5B profit surge raises the stakes in China's AI memory race
Tuesday 1 September 2026
Samsung eyes early 2027 LPDDR5X-PIM production, touts 3.8x performance gain
Tuesday 1 September 2026
Samsung Electro-Mechanics discloses major MLCC supply deal tied to AI server demand
Tuesday 1 September 2026
OPINIONS
Tuesday 1 September 2026
Commentary: Why America fell behind on Open models — and how Nvidia plans to close the gap
Commentary: DeepSeek out, SMIC in? TIME100 AI maps China's widening AI battleground
Tuesday 1 September 2026
Research insights: AI Fabric optical interconnects move into racks as 400G/lane and CPO maturity emerge as key variables
Tuesday 1 September 2026
Analysis: CXMT's US$11.5B profit surge raises the stakes in China's AI memory race
Tuesday 1 September 2026
TOPICS
THE END OF THE TIM COOK ERA AT APPLE
TSMC UPDATES
GEOWATCH
THE RISE OF MALAYSIA
SPECIAL REPORTS
Friday 28 August 2026
AI data center 800VDC power architecture takes shape; future hurdles require balancing multiple key factors
DIGITIMES believes that 2026 will be a pivotal year in the stabilization of 800VDC power architectures for AI data centers.
Wednesday 26 August 2026
Growth in low-Earth-orbit satellite communications accelerates; further boosts demand for GaN components
DIGITIMES has observed that since SpaceX began using reusable rockets for launch missions, its payload capacity has continued to rise.
Tuesday 25 August 2026
Chinese automakers expand to humanoid robotics with technology, supply chain and scenario advantages
DIGITIMES observes that the humanoid robot market is expanding rapidly, supported by global labor shortages and advances in artificial intelligence (AI), and Chinese automakers are also moving aggressively into this emerging field.
Monday 24 August 2026
Siri AI taps Google Gemini LLM technology, with future development focused on deep third-party app integration
DIGITIMES has observed that Siri AI is built around four core layers - devices, models, reasoning, and applications - and is designed to transform Siri from a voice assistant into an AI agent capable of executing tasks.
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