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REALTIME NEWS
Doosan thins memory-package CCL insulation to 13µm
Semiconductors
0min ago
Kioxia weighs third Kitakami fab as NAND demand rises
Semiconductors
9min ago
Foxconn reportedly weighs major India expansion as global manufacturing footprint grows
ICT
17min ago
Washington's silicon-anode bet tests whether battery innovation can break China's graphite grip
Electric Vehicles
22min ago
Doosan develops 13µm ultra-thin CCL for memory chip substrates
Tomorrow's Headlines
Aug 26, 19:17
Aug 27, 07:27
Nvidia caps its own growth at 70% because that is all the supply it can secure
Aug 27, 07:28
Nvidia says AI labs it is helping to finance will be about a quarter of next year's business
Aug 27, 07:58
Beijing's AI4Chip plan puts AI to work on EDA, fabs, advanced packaging
Aug 27, 07:59
Research Insight: US humanoid supply chains pivot away from China as Taiwan moves from parts to actuator modules
Aug 27, 08:00
Tesla doubles down on custom AI chips as Musk claims AI5 can beat NVIDIA on efficiency and cost
LATEST STORIES
7 days news
SK Hynix questions PIM as thermal, packaging limits constrain HBM
Aug 27, 11:48
SEMICONDUCTORS
Nvidia H200 China sales stall, with US$400M inventory charge
Aug 27, 11:46
EAST ASIA
Nvidia's inventory build shifts upstream as memory costs bite
Aug 27, 11:43
SEMICONDUCTORS
Chart: Nvidia's segment split tells only half the AI demand story
Aug 27, 11:33
COMMENTARY
Nvidia buys Hugging Face for US$12.9 billion, tying open-source AI to chip dominance
China shifts autonomous driving liability to automakers in draft traffic law
China's AI software strategy gains scale as OpenHarmony ecosystem tops 1.35 billion devices
CXMT DDR5 closes in on SK Hynix at 8,000 MT/s, benchmark gap falls below 1%
Tri-fold, rollable foldables intensify materials supply chain battle
CXMT lands early LPDDR6 opportunity with Xiaomi Xring O3, eyes China flagship phones
China OLED buildout lifts Korean equipment sales as backlogs grow
Analysis: From Starlink to Starmind, Nvidia deal reveals SpaceX's blueprint for an orbital AI economy
Apple unveils 2nm M6 Mac mini as workstation race heats up
Apple sets September 9 event for foldable iPhone and iPhone 18 Pro debut
AMD, Broadcom book most of Powertech's FOPLP capacity ahead of 2027 ramp
Google, MediaTek embrace advanced packaging diversification
India's CG Power targets 70% utilization at larger semiconductor packaging plant
Analysis: Smartwatch demand set to outpace broader hardware market in 2026
Uber expands ride-hailing reach across Taiwan as trips and local demand rise
Yttek's ground equipment supports FORMOSAT-8 first satellite
HTSI targets AI chip demand with SiPh, CPO, packaging push
Anthropic prepares IPO pitch centered on a $30 trillion AI market
Proton sales jump 39% as Malaysian automaker expands EV push
Ablecom takes control of Jochu to expand AI server rack, liquid cooling business
Commentary: Nvidia bets on open models to lift GPU usage
Taiwan, Germany map AI-led net-zero push for 2026
Taiwan plans higher power growth to meet AI demand, officials say
AI data center boom lifts Weltrend fan-control chip sales 64%
Xiaomi's Xring O3, O100 and D100 define a three-tier AI chip strategy beyond smartphones
Nvidia reportedly shifts HBM4 mix toward 8-high as memory supply stays tight
More news
BIZ FOCUS
Aug 27, 08:00
ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026
Tuesday 25 August 2026
Conquer Advances Circuit Protection for AI Power With 50 Years of Expertise
Tuesday 25 August 2026
CYP Launches 4K60 Seamless Matrix Switcher to Simplify Multi-Source Operation
Monday 24 August 2026
STMicroelectronics Unveils ISO 21780-Compliant 48V Pre-Driver with 8-Channel Flexibility
MOST-READ
Exclusive: Musk pushes US solar supply chain upstream as polysilicon ambitions emerge
2027 memory capacity reportedly sold out as buyers quietly lock in supply
Tungsten prices surge sixfold as US-China restrictions tighten supply for chips, aerospace, defense
Interview: Nvidia exec on progress of CPO production and pluggable optics
OCP APAC 2026: TSMC tackles CoWoS material risks while cutting 3DIC development cycle to one year
Google's v10 TPU opens door to AMD without sidelining Broadcom, MediaTek
Nvidia Feynman pushes TSMC A16 and CPO ramp
MULTIMEDIA
Jensen Huang in Seoul: Faker, BBQ and one very awkward LG chairman
Humanoid robotics development
Humanoid robotics recently saw notable development in terms of both technology and commercialization.
Commentary: Robots go to work— highlight of the five robotic trends at WRC 2026
Robots shift from POC to ROI as logistics, manufacturing lead
Galbot's fast rise marks new wave in China's humanoid robot race
...More
EV
Wednesday 29 July 2026
Chinese brands seize 25% of Europe midsize SUV sales as BEV demand surges
Driving the future: Malaysia's strategic automotive evolution at GATE 2026
Wednesday 26 August 2026
Southeast Asia mobility shifts put GATE 2026 in focus
Wednesday 26 August 2026
Malaysia mobility sector embraces Chinese firms as investment catalyst
Wednesday 26 August 2026
TECH
Wednesday 26 August 2026
Apple is only the test: Chinese memory makers CXMT, YMTC target North American cloud market
Samsung, SK Hynix step up China NAND upgrades as US tool risks grow
Tuesday 25 August 2026
MediaTek wins Google TPU deal on three key strengths
Monday 24 August 2026
FOPLP's race to scale: Taiwan leads while three technical hurdles test mass production
Friday 21 August 2026
ASIA
Thursday 30 July 2026
China's 28nm DUV lithography enters fab validation, reportedly guided by State Council-level experts
China's chip-tool makers are winning share and paying for it in margins
Wednesday 26 August 2026
Foxconn shifts China manufacturing from expansion to upgrade
Wednesday 26 August 2026
GATE 2026 opens with Sino-ASEAN auto cooperation in focus
Wednesday 26 August 2026
OPINIONS
Tuesday 25 August 2026
Insight: One Nexperia, two supply chains? China-Europe split tests automotive chip model
Commentary: Nvidia's 15% hike piles pressure on the AI supply chain, lifts ASIC prospects
Tuesday 25 August 2026
Analysis: SK Hynix pushes beyond HBM with HBF and CPO
Monday 24 August 2026
Commentary: Robots go to work— highlight of the five robotic trends at WRC 2026
Monday 24 August 2026
TOPICS
HUMANOID ROBOTICS DEVELOPMENT
HUAWEI
TSMC UPDATES
THE RISE OF MALAYSIA
SPECIAL REPORTS
Wednesday 26 August 2026
Growth in low-Earth-orbit satellite communications accelerates; further boosts demand for GaN components
DIGITIMES has observed that since SpaceX began using reusable rockets for launch missions, its payload capacity has continued to rise.
Tuesday 25 August 2026
Chinese automakers expand to humanoid robotics with technology, supply chain and scenario advantages
DIGITIMES observes that the humanoid robot market is expanding rapidly, supported by global labor shortages and advances in artificial intelligence (AI), and Chinese automakers are also moving aggressively into this emerging field.
Monday 24 August 2026
Siri AI taps Google Gemini LLM technology, with future development focused on deep third-party app integration
DIGITIMES has observed that Siri AI is built around four core layers - devices, models, reasoning, and applications - and is designed to transform Siri from a voice assistant into an AI agent capable of executing tasks.
Thursday 20 August 2026
Global server market, 2Q 2026: Supply constraints curb shipment momentum, global server shipments up 2.8% in 3Q26
In the second quarter of 2026, global server shipments were below prior expectations, growing 3.8% quarter-over-quarter. The main reason was tight supply of key components such as memory, CPU, and IC substrate, which curbed overall system shipment momentu
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