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Aug 21, 15:40
SK Chairman warns of 2027 memory shortage, ties expansion to long-term orders
Aug 21, 15:55
Cambricon advances sixth-gen AI silicon, broadens support for DeepSeek, Qwen and GLM
Aug 21, 16:20
Broadcom reportedly eyes up to US$100B debt financing to expand AI chip push
Aug 21, 15:50
Huawei, China power giant Huaneng explore AI compute-power coordination
Aug 21, 14:24
Research Insight: Upstream memory giants eye threefold 2026 revenue as 2027 capacity eases price surge
LATEST STORIES
7 days news
China chip equipment maker Piotech posts 1,324% profit surge, advanced deposition scales up
Aug 21, 16:45
SEMICONDUCTORS
Lee Jae-myung meets SK chief Chey Tae-won with US chip investment pressure in focus
Aug 21, 14:32
EAST ASIA
CoWoS boom lifts Taiwan semiconductor equipment makers, Bosch Rexroth targets 2027 volume growth
Aug 21, 14:20
SEMICONDUCTORS
Google, Marvell long-term deal keeps Broadcom at bay, limits MediaTek impact
Aug 21, 12:17
ICT
Apple's VR retreat deepens with rumored layoffs in its Vision team
DS Technology shifts from custom automation to modular systems, eyes Brazil and Mexico
Vecow eyes robotics growth as North America, EMEA account for 65% of business
Ubtech expands humanoid push as Nvidia executives quietly visit WRC booth
Top 4 CSPs boost AI infrastructure; volume ramping of 800G switches fuels Accton's growth
Hiwin expands into CPO optical coupling process; 2H26 robotics revenue outlook brightens
Taiwan automation shifts from hardware specs to AI platforms and open robot architectures
Automation Taipei 2026: The invisible joint — why aerospace lightweighting is rewriting how parts are built
Power supply lags behind AI compute growth: chips, optical interconnects battle for energy efficiency
Xiaomi's Xring O3 nears launch on TSMC N3P, testing its in-house chip strategy
JCET profit surges 79% on AI demand, with advanced packaging and CPO gaining scale
Honor Robot Phone moves from concept to mass production
Automation Taipei 2026: German suppliers target aerospace's hidden manufacturing bottlenecks
SK Hynix weighs Japan memory fab in Miyagi, but says no investment is final
AI paid user conversion rate in US only 3% as rising token costs fuel edge AI server demand
Research Insight: 2028 key year for optical interconnects in AI racks
Iris Optronics upgrades solar-powered ChLCD e-paper series, expands outdoor and indoor displays
HP Korea localizes AI strategy with Upstage in healthcare, finance
Explainer: Why South Korea's semiconductor concentration may fare better than Taiwan's
Goertek reports higher revenue and profit in 1H26
FOPLP's race to scale: Taiwan leads while three technical hurdles test mass production
Chinese robots pivot to AI models as Unitree, UBTECH shift hardware focus to 'brains'
Anthropic venture acquires Casper Studios to expand enterprise AI services
China's new solid-state battery standards could reshape the industry
Research Insight: CPO gains momentum as AI interconnect demands outpace chip gains
800VDC adoption in AI data centers is set to reshape power chip demand
More news
BIZ FOCUS
Aug 20, 11:00
Corning-IRICO Trade Secret Case Enters New Phase
Thursday 20 August 2026
PGC Helps Startups Accelerate ASIC Development with Turnkey Services
Thursday 20 August 2026
Chroma's Proprietary ASIC Technology Reshapes the Semiconductor Test Landscape
Thursday 20 August 2026
Henkel Launches LOCTITE ABLESTIK CDF900 Series Conductive Die Attach Film
MOST-READ
Exclusive: Musk pushes US solar supply chain upstream as polysilicon ambitions emerge
2027 memory capacity reportedly sold out as buyers quietly lock in supply
Tungsten prices surge sixfold as US-China restrictions tighten supply for chips, aerospace, defense
OCP APAC 2026: TSMC tackles CoWoS material risks while cutting 3DIC development cycle to one year
Interview: Nvidia exec on progress of CPO production and pluggable optics
Nvidia Feynman pushes TSMC A16 and CPO ramp
Google's v10 TPU opens door to AMD without sidelining Broadcom, MediaTek
MULTIMEDIA
Jensen Huang in Seoul: Faker, BBQ and one very awkward LG chairman
Humanoid robotics development
Humanoid robotics recently saw notable development in terms of both technology and commercialization.
CoWoS boom lifts Taiwan semiconductor equipment makers, Bosch Rexroth targets 2027 volume growth
Taiwan automation shifts from hardware specs to AI platforms and open robot architectures
Automation Taipei 2026: The invisible joint — why aerospace lightweighting is rewriting how parts are built
...More
EV
Wednesday 29 July 2026
Chinese brands seize 25% of Europe midsize SUV sales as BEV demand surges
China's new solid-state battery standards could reshape the industry
Friday 21 August 2026
TIER IV and Renesas team up on open AI-native computing platform for autonomous vehicles
Friday 21 August 2026
Samsung and Hyundai expand alliance from EV batteries into software-defined vehicles
Thursday 20 August 2026
TECH
Friday 21 August 2026
FOPLP's race to scale: Taiwan leads while three technical hurdles test mass production
MediaTek widens ASIC services as market share surges
Tuesday 18 August 2026
OCP APAC 2026: Intel sees agentic AI shifting bottlenecks toward CPUs, memory
Thursday 13 August 2026
OCP APAC 2026: Microsoft leans on Taiwan supply chain for 'silicon-to-systems' AI buildout
Wednesday 12 August 2026
ASIA
Thursday 30 July 2026
China's 28nm DUV lithography enters fab validation, reportedly guided by State Council-level experts
Chinese robots pivot to AI models as Unitree, UBTECH shift hardware focus to 'brains'
Friday 21 August 2026
Lee Jae-myung meets SK chief Chey Tae-won with US chip investment pressure in focus
Friday 21 August 2026
Explainer: Why South Korea's semiconductor concentration may fare better than Taiwan's
Friday 21 August 2026
OPINIONS
Friday 21 August 2026
Charts: TSMC's share of Taiwan chip manufacturing revenue falls to 81.8% as memory makers scale up
Charts: AI test demand drives broadest growth among Taiwan's chip equipment suppliers
Friday 21 August 2026
Column: Is 800V really 'high voltage'? —AI data centers revive an old power debate
Friday 21 August 2026
Charts: Foxconn is losing share of Taiwan's EMS revenue as Quanta and Wistron near double
Friday 21 August 2026
TOPICS
HUMANOID ROBOTICS DEVELOPMENT
TRENDS IN INDUSTRIAL COMPUTING
HUAWEI
EMS WATCH
SPECIAL REPORTS
Thursday 20 August 2026
Global server market, 2Q 2026: Supply constraints curb shipment momentum, global server shipments up 2.8% in 3Q26
In the second quarter of 2026, global server shipments were below prior expectations, growing 3.8% quarter-over-quarter. The main reason was tight supply of key components such as memory, CPU, and IC substrate, which curbed overall system shipment momentu
Wednesday 19 August 2026
BYD leverages in-house semiconductors to power next phase of automotive intelligence; smart driving chip roadmap moves towards 4nm SoC
DIGITIMES notes that BYD Semiconductor's portfolio has expanded from the IGBTs and SiC power chips developed to meet early electric vehicle (EV) demand into high-computing-power smart-driving SoCs.
Friday 14 August 2026
AI infrastructure enters multi-architecture fabric competition; Optical-copper interconnects and supply-chain coordination determine system performance
AI infrastructure enters multi-architecture fabric competition; Optical-copper interconnects and supply-chain coordination determine system performance
Thursday 13 August 2026
Taiwan notebook industry, 2Q 2026
Taiwan notebook industry, 2Q 2026
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