DIGITIMES: News and Insight of the Global Supply Chain

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7 days news

AI data centers drive cooling, power, and modular infrastructure demand

Oct 27, 14:46

ICT

Anthropic IPO filing exposes massive compute buildout spanning TPUs, GPUs, and dedicated data centers

Oct 27, 14:33

ICT

PSMC capacity crunch holds back Jeju Semiconductor's growth

Oct 27, 14:00

EAST ASIA

Broadcom, financial firms agree on US$63 billion funding for Anthropic chip purchases

Oct 27, 13:56

SEMICONDUCTORS

Kazakhstan positions AI infrastructure as a potential export industry after Nvidia CEO's visit

US designates helium as critical material amid Middle East supply shock

Ennostar's optical push could add new growth engine for 2027 and onward

Charts: Why German automakers are becoming marginalized in US BEV market

Applied Materials to raise Besi stake to 20% as hybrid-bonding orders surge

Nvidia's Berlin keynote highlights AI scaling challenges in Europe

Fine M-Tec rejects component blame as foldable market outlook remains positive

DRAM price gains fall short as supply shrinks up to 50%

AI data center boom risks squeezing power chip supplies for auto, electronics

Japan sets JPY100 billion push to commercialize perovskite solar cells

HCLTech and Rapidus open India centers to support semiconductor engineering

India's smartphone shipments hit a decade low in 3Q26 amid rising prices

As iPhone Duo inner screens crack, Samsung capitalizes on foldable surge

Intel to acquire quantum computing software firm Classiq

Anthropic's IPO filing puts TSMC, HBM, direct leasing at the center of AI compute risk

Tamil Nadu adds independent chip subsidy route as Indian states vie for investment

OPTOELEC seeks AI data center orders as Himax advances CPO optics

NT1 plans to assemble Chinese delivery vans in Korea in 2027

Hyundai supplier SL eyes first overseas robot deployment in US

Tata Communications plans up to US$450 million fibre network linking India's AI hubs

KAR bets on fleet monitoring as South Korea expands robotaxi trials

ByteDance denies AI micro-dramas consume over half of China's AI computing power

Amkor turns to customer prepayments as global packaging investment accelerates

Cadence bets on its own chip design AI models as Synopsys teams up with OpenAI

Cadence says chip design demand is broadening beyond AI as analysts test margins, rival targets

India sets October 2028 target for homegrown smartphone brand

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BIZ FOCUS

Oct 23, 08:00

AI Wealth Management: MaiCoin Leverages Startup Energy for Next-Gen Fintech

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MULTIMEDIA

K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue

According to DIGITIMES, Agentic AI, AI server expansion, cloud service provider (CSP) in-house CPU ramp-up, and replacement demand for general-purpose servers will lift global server CPU shipments to 52.6 million units in 2027, up 45.7% year-over-year, wi12_s.jpg

DIGITIMES says the most closely watched model in Apple's high-end iPhone 18 lineup, launched in September 2026, is the long-anticipated first foldable smartphone, the iPhone Duo.

DIGITIMES observed that cloud service providers (CSPs) such as Google and AWS will sharply ramp up self-developed ASICs in 2027, lifting high-end cloud AI accelerator shipments to 25.951 million units, up 64.5% year-over-year.