DIGITIMES: News and Insight of the Global Supply Chain

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Eutelsat eyes EUR10B revenue from IRIS2 as EU seeks homegrown answer to Starlink

Oct 30, 16:58

AEROSPACE

HHTD 26: Foxconn unveils three new EVs, expanding Model A and K platforms

Oct 30, 16:35

ELECTRIC VEHICLES

Foxconn, TECO showcase factory-built infrastructure for AI data center expansion

Oct 30, 16:30

ICT

Foxconn argues it is more than a box mover in AI hardware

Oct 30, 16:25

ICT

C Sun Mfg invests in Nemstek to expand advanced packaging equipment

Taiwan's economic indicator signals 'booming' for 10th straight month on AI-driven shipments

Samsung SDI posts 12-quarter high in 3Q26 operating profit

VinFast aims to make India one of its two largest markets as overseas sales trail target

BYD sees 28% profit growth for 3Q26, but still falls short of forecasts

HHTD 26: Foxconn Chairman highlights processing and vertical integration strengths

Jinpao targets power cabinets, BBUs in AI-related expansion

ASE expects packaging and testing margins to stay above 30%

KLA reportedly weighs India manufacturing entry as Semicon 2.0 opens to equipment makers

HyperAccel, Rebellions look beyond chips to AI data center systems

Nvidia dominates AI robot chips with 69% market share

Amazon 3Q26 earnings call: AWS targets 40%-plus growth through 2028 as satellite costs weigh on near-term profit

Intel tells Taiwan's chip suppliers to build service capacity early

Nvidia weighs credit support for Nscale as data center, IPO face pressure

Jensen Huang calls Megaspeed ties normal amid Washington's spy probe

Sandisk sees 60–90GB of NAND per CPU in AI agent workloads

Delta Electronics approves Penang manufacturing base to expand global capacity

Intel's server surge faces a supply setback as PC weakness persists

Analysis: Oracle backs Cerebras as AI cloud shifts to multi-architecture compute

Trump targets foreign robotics imports under Section 232, citing national security risks

In-cabin sensing emerges as automakers' next value-added frontier

Doosan Enerbility expands AI power push with US gas turbine orders, next-gen nuclear

ACM Shanghai ships first 310×310mm panel-level plating tool as order backlog surges 88%

Sandisk says customers are coming back for more NAND

Amazon 3Q26 earnings call: TSMC capacity behind AWS's choice to start selling its own AI chips

Dowoo Insys develops rollable OLED UTG for vehicles

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BIZ FOCUS

Oct 30, 08:00

Macronix to Showcase Automotive and IoT Memory Solutions at electronica 2026

MOST-READ

MULTIMEDIA

K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue

According to DIGITIMES, Agentic AI, AI server expansion, cloud service provider (CSP) in-house CPU ramp-up, and replacement demand for general-purpose servers will lift global server CPU shipments to 52.6 million units in 2027, up 45.7% year-over-year, wi12_s.jpg

DIGITIMES says the most closely watched model in Apple's high-end iPhone 18 lineup, launched in September 2026, is the long-anticipated first foldable smartphone, the iPhone Duo.

DIGITIMES observed that cloud service providers (CSPs) such as Google and AWS will sharply ramp up self-developed ASICs in 2027, lifting high-end cloud AI accelerator shipments to 25.951 million units, up 64.5% year-over-year.