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REALTIME NEWS
Humanoid robot maker PAL says wheels could handle 80% of the market
ICT
5min ago
Elon Musk expands South Korean supplier network for Terafab
Semiconductors
9min ago
Texas Instruments' analog recovery broadens as 12-inch investment turns into margin
Semiconductors
19min ago
China’s IC designers expand AI interconnect efforts as Montage grows in DDR5 and TWSC targets CXL
Tomorrow's Headlines
Oct 21, 19:11
Nvidia emerges as AI industry’s central bank amid cloud startup risks
Tomorrow's Headlines
Oct 21, 19:11
Apple reportedly plans high-end HomeView with robotic arm
Tomorrow's Headlines
Oct 21, 19:10
Rising memory costs push smartphone makers from LTPO to LTPS panels
Tomorrow's Headlines
Oct 21, 19:10
Qiyi Technology’s Arizona fab projects drive order backlog to NT$4.476 billion
Tomorrow's Headlines
Oct 21, 19:10
Oct 22, 07:56
Tesla's car margins recover, but spending on AI and robotics absorbs the gain
Oct 22, 07:58
Nvidia pitches factory-built AI data centers and hardware-enforced agent controls at GTC Berlin
Oct 22, 07:51
Samsung's Nvidia HBM bid raises four strategic concerns
Oct 22, 07:52
Unimicron, STATS ChipPAC, Wistron address advanced packaging bottlenecks in AI system integration
Oct 22, 07:55
Taiwan's FTC blocks Grab's Foodpanda acquisition over competition concerns
LATEST STORIES
7 days news
Texas Instruments' analog recovery broadens as 12-inch investment turns into margin
Oct 22, 09:00
SEMICONDUCTORS
IBM's growth rebounds after a summer stumble, led by software and servers
Oct 22, 08:58
ICT
Meta's advertising engine keeps pace with its AI build-out as legal costs cut into profit
Oct 22, 08:57
ICT
GoldKey Technology posts record 3Q26 profit as industrial share rises
Oct 22, 07:53
SEMICONDUCTORS
Chief Telecom's CTSP AI data center bookings exceed 50%
Taiwan tech supply chain eyes Texas for first US industrial cluster
ESMT sees memory price momentum extending through 4Q26, 2027
TASA satellites reach orbit to test coordinated LEO broadband links
Syscom, Japan's CIJ sign AI partnership for overseas expansion
Khgears targets humanoid robot joints, eyes 2027 mass production
Russia considers reinstating parallel imports of Samsung, SK Hynix products amid memory shortages
3M calls Largan partnership key step for US$2 billion EBO market
2nm and CoWoS expansion lifts Chi Yi Hsin Technology backlog to NT$4.5B
High-end ASIC demand drives TGV adoption as TPK weighs further Taiwan expansion
Analysis: Tesla's flying Roadster promises thrills, but can technology outrun the law?
Holy Stone targets 50% South Korea revenue growth by 2027
Analysis: Musk combines rocket technology with Roadster 2, leveraging synergies across his business empire
Hyundai revamps lineup as Taiwan's hybrid car market enters two-year battle over powertrain systems
TECO targets AI data center cooling as commercial aircon share nears 60%
Micron reaches deal with Taiwan union to introduce quarterly profit bonuses in FY27
Li Auto chip subsidiary Mahe Xin raises CNY1.6 billion in equity financing as automakers aim to become chipmakers
Cloud AI to drive chip growth in 2027 as Taiwan suppliers seek opportunities beyond weak consumer edge AI
Infineon, Wolfspeed pivot to 8-inch SiC to cut costs and meet rising AI power demand
Sony keeps chip unit as imaging sensors, TSMC partnership drive strategy
Samsung shifts M2800 modem to 2nm, frees 4nm capacity for HBM base dies
Samsung Display accelerates MPO and inkjet OLED development for laptops and monitors
HD Hyundai Robotics unveils dual-arm robot as FIX 2026 opens
Samsung, SK Hynix reportedly upgrading China NAND fabs to fend off YMTC amid softening US stance
AMD and Intel align PyTorch CPU optimizations around oneDNN
Micron's Taichung union deal eases Taiwan DRAM strike risk; Taoyuan dispute remains unresolved
More news
BIZ FOCUS
Oct 21, 08:00
Starting with Data Challenges: TS Holdings Explores AI Through Hackathon
Tuesday 20 October 2026
CHT Leverages Hackathon to Cultivate AI Solutions for Urban Governance
Tuesday 20 October 2026
Cincoze's EMC Solution Boosts Equipment Stability and Production Efficiency
Tuesday 20 October 2026
CES 2027 Welcomes First-Ever Chilean Global Pavilion
MOST-READ
TSMC locks in 3-6% wafer out price hikes for 2027
TSMC, Intel named as Musk's Terafab ambitions face reality check
GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
Beyond 16 layers: HBM stacks test advanced packaging equipment makers
TSMC breaks silence on Musk's Terafab: Talks underway, but fab control non-negotiable
Samsung HBM4E wins NVIDIA nod for AI accelerator push
China's memory race turns inward — CXMT, YMTC head toward patent showdown
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
4F2 DRAM development
Memory leaders are making progress with the next-generation 4F2 DRAM designs, a part of the industry's move toward vertically stacked 3D architectures to increase performance.
CXMT's next DRAM milestone: 4F² server memory with hybrid bonding by end-2026
AI dividend drives Taiwan's memory makers from trough to transformation
Elon Musk points to China's 2028 DRAM supply surge to challenge Samsung, SK Hynix pricing power
...More
EV
Wednesday 9 September 2026
Analysis: When 72% of the world's EV batteries are Chinese, one defect travels
Huawei-linked Yinwang gives CATL battery swapping a wider route into smart vehicles
Wednesday 21 October 2026
CATL's profit growth slows, sharpening focus on 50% energy-storage revenue target
Wednesday 21 October 2026
Foxconn and Mitsubishi Electric target SDV with L4 autonomy and EV drive systems
Wednesday 21 October 2026
TECH
Wednesday 21 October 2026
Analysis: From rockets to fabs, SpaceX's TeraFab bet pushes vertical integration into the semiconductor era
Exclusive: Apple's MacBook Neo pressures Microsoft to cut specs for low-cost 12-inch Surface
Tuesday 20 October 2026
AUO, Largan Micro LED debate highlights optical communications uncertainty
Monday 19 October 2026
Charts: YMTC bets on premium eSSDs to take on Samsung
Friday 16 October 2026
ASIA
Thursday 10 September 2026
India's fraud office seeks a Xiaomi probe as the market it once led shrinks around it
US sanctions five Chinese entities over trade secret theft tied to ex-Google engineer
Wednesday 21 October 2026
Li Auto chip subsidiary Mahe Xin raises CNY1.6 billion in equity financing as automakers aim to become chipmakers
Wednesday 21 October 2026
China launches state-owned data group as market-facing arm of its AI infrastructure push
Wednesday 21 October 2026
OPINIONS
Wednesday 21 October 2026
DIGITIMES Insights: AI server PCB upgrades drive explosive demand for advanced backdrilling equipment
Analysis: China's proposed AI export controls reach beyond chips to design IP, computing infrastructure
Tuesday 20 October 2026
Analysis: China's proposed AI export controls target top-ranked foundation models, advanced agents
Tuesday 20 October 2026
DIGITIMES Insight: AI packaging power reaches kilowatt scale as thermal design moves toward the die
Tuesday 20 October 2026
TOPICS
4F2 DRAM DEVELOPMENT
TSMC 3Q26 EARNINGS CALL
TSMC UPDATES
GEOWATCH
SPECIAL REPORTS
Wednesday 21 October 2026
iPhone Duo finally debuts, but with price increases across models, Apple's 4Q26 shipments will take hit
DIGITIMES says the most closely watched model in Apple's high-end iPhone 18 lineup, launched in September 2026, is the long-anticipated first foldable smartphone, the iPhone Duo.
Monday 19 October 2026
Shipments of high-end cloud AI accelerators, 2027
DIGITIMES observed that cloud service providers (CSPs) such as Google and AWS will sharply ramp up self-developed ASICs in 2027, lifting high-end cloud AI accelerator shipments to 25.951 million units, up 64.5% year-over-year.
Monday 12 October 2026
Chinese government and industry make full push into AI glasses development: AR display integration and lightweighting gain traction
DIGITIMES notes that China continued to advance smart glasses policies from the central government to local governments in 2026, driving both enterprise production and consumer purchase subsidies.
Friday 2 October 2026
Global annual AI server shipments, 2025-2026
Continued advances in top-tier LLM capabilities, coupled with the potential for business automation enabled by agentic AI, are prompting major North American cloud providers, Neo Clouds, and leading AI labs to accelerate AI data center buildouts in 2026.
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