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REALTIME NEWS
Broadcom says CPO fits scale-out better than scale-up
Semiconductors
14min ago
Microsoft unveils two-segment reporting structure, standalone Azure financials
ICT
44min ago
Sep 3, 08:00
Broadcom's custom AI silicon takes over the income statement as revenue climbs 86%
Sep 3, 07:29
Samsung to add 1,612 new equipment units at Vietnam chip plant
Sep 3, 00:05
Yield has been semiconductor industry's oldest question; now it's Microsoft's test for AI
Sep 3, 07:30
Global smartphone outlook cut again as foldables shine
Sep 3, 07:35
VinFast reportedly pauses India manufacturing work on three EVs, a year after opening its Tamil Nadu plant
LATEST STORIES
7 days news
CXMT expands global hiring to Japan for DDR5, LPDDR technology upgrade
Sep 3, 11:55
EAST ASIA
Taiwan LED packaging provider Ligitek pivots to silicon photonics; 1.6T modules eye 2H27 revenue
Sep 3, 11:43
DISPLAYS
Zeiss deepens Taiwan bet as advanced chip packaging raises the stakes for inspection tools
Sep 3, 11:21
SEMICONDUCTORS
Huawei, Xiaomi to launch new foldable smartphones ahead of Apple
Sep 3, 11:11
COMMUNICATIONS
Solomon leverages AI vision and optical tech to tap semiconductor inspection market
TSMC doubles down on equipment purchase as AI demand is outpacing semiconductor supply chain planning
SK Hynix weighs Kioxia production tie-up in Japan
Intel pre-funds EMIB-T and CPU capacity, will address DRAM through partners rather than fabs
Taiwan's supply chain is 'one of a kind,' MediaTek CEO says
Apple, Xiaomi and Nvidia chase terabyte-class bandwidth for AI chips
AUO unit eyes TSMC ecosystem as merger benefits emerge
China packaging specialist SJSemi reaches 3.3-reticle 2.5D scale for AI, HBM integration
AI substrate shortages widen as Unimicron signals capacity support through 2029
Win Semiconductors unveils 0.1μm GaN for AI, satellite links
UniVista expands China EDA stack with AI agents, native 3DIC tools
ChangXin Memory's 'Hefei Project' exposed in Samsung DRAM theft case
BYD Semiconductor scales 4D radar chip for L2-L4 driving, deepening its in-house automotive sensing stack
TRUMPF targets advanced packaging as AI chip makers chase higher density and better cooling
Google to expand Taipei AI infrastructure center as Taiwan ties deepen
Broadcom puts 30GW, US$350 billion of custom AI silicon on the calendar through fiscal 2028
China optical module makers ride AI boom as 800G, 1.6T orders stretch into 2027
HPE has already bought the supply behind its raised fiscal 2027 plan
HPE's constraint has shifted from demand to memory
Lutnick confirms chip tariffs are coming, with relief tied to manufacturing in America
CPO material race widens as Taiwan eyes key role
Samsung Electro-Mechanics eyes 30% MLCC price hikes, ABF up too
Auras sees ASIC revenue reaching 50% in 2027, eyes microchannel cooling production in 2028
Alpha Networks, ITRI develop B5G/Pre-6G Massive MIMO base stations
JPC Connectivity sees AI demand driving orders into 2027 as margins benefit from longer lead times
Column: From automation to autonomy—what robotics still needs to make the leap
More news
BIZ FOCUS
Sep 2, 08:22
World Diamond Technology accelerates mass production of 300 mm diamond wafers
Wednesday 2 September 2026
Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
Wednesday 2 September 2026
Innovative Solutions for Fabricating High-Performance AI Multichip Packaging Using Glass Substrates
Wednesday 2 September 2026
8 September Hsinchu seminar: Silicon photonics driving AI chains
MOST-READ
Exclusive: Musk pushes US solar supply chain upstream as polysilicon ambitions emerge
Tungsten prices surge sixfold as US-China restrictions tighten supply for chips, aerospace, defense
Interview: Nvidia exec on progress of CPO production and pluggable optics
OCP APAC 2026: TSMC tackles CoWoS material risks while cutting 3DIC development cycle to one year
Google's v10 TPU opens door to AMD without sidelining Broadcom, MediaTek
Nvidia Feynman pushes TSMC A16 and CPO ramp
Update: ABF substrate maker Unimicron searched in origin-labeling probe
MULTIMEDIA
Jensen Huang in Seoul: Faker, BBQ and one very awkward LG chairman
The end of the Tim Cook era at Apple
After a 15-year tenure, Apple CEO Tim Cook is stepping down on September 1, 2026, and handing the reins to hardware veteran John Ternus.
Tim Cook concludes 15-year Apple tenure, John Ternus takes over
Apple reshuffles leadership, shifts Schiller out of App Store
John Ternus takes over an Apple with one growth engine, no obvious second
...More
EV
Wednesday 29 July 2026
Chinese brands seize 25% of Europe midsize SUV sales as BEV demand surges
Commentary: Malaysia wants foreign automotive investment to leave more behind
Wednesday 2 September 2026
EU EV battery recycling still lacks a profitable model
Wednesday 2 September 2026
China moves to curb overseas price wars as automakers accelerate global expansion
Wednesday 2 September 2026
TECH
Wednesday 2 September 2026
European chip ambitions hinge on more than subsidies, says TSMC
Chinese court freezes US$318M in Nexperia assets, further escalating corp rift
Tuesday 1 September 2026
The architect of Apple's China machine also built its hardest problem
Monday 31 August 2026
Apple is only the test: Chinese memory makers CXMT, YMTC target North American cloud market
Wednesday 26 August 2026
ASIA
Thursday 30 July 2026
China's 28nm DUV lithography enters fab validation, reportedly guided by State Council-level experts
Samsung, SK Hynix inventories surge as valuation reserves fall
Wednesday 2 September 2026
India reportedly readies AI agent payments on UPI, its national payment rails
Wednesday 2 September 2026
Manus resumes independent operations after Meta deal collapses
Wednesday 2 September 2026
OPINIONS
Tuesday 1 September 2026
Commentary: Why America fell behind on Open models — and how Nvidia plans to close the gap
Commentary: DeepSeek out, SMIC in? TIME100 AI maps China's widening AI battleground
Tuesday 1 September 2026
Research insights: AI Fabric optical interconnects move into racks as 400G/lane and CPO maturity emerge as key variables
Tuesday 1 September 2026
Analysis: CXMT's US$11.5B profit surge raises the stakes in China's AI memory race
Tuesday 1 September 2026
TOPICS
THE END OF THE TIM COOK ERA AT APPLE
HUAWEI
TSMC UPDATES
TRENDS IN INDUSTRIAL COMPUTING
SPECIAL REPORTS
Wednesday 2 September 2026
Global smartphone industry, 2Q 2026
According to DIGITIMES, smartphone memory contract prices surged by 50% to 80% in the first half of 2026, prompting most vendors to continue cutting shipments of mid- and low-end models and to raise product prices.
Friday 28 August 2026
AI data center 800VDC power architecture takes shape; future hurdles require balancing multiple key factors
DIGITIMES believes that 2026 will be a pivotal year in the stabilization of 800VDC power architectures for AI data centers.
Wednesday 26 August 2026
Growth in low-Earth-orbit satellite communications accelerates; further boosts demand for GaN components
DIGITIMES has observed that since SpaceX began using reusable rockets for launch missions, its payload capacity has continued to rise.
Tuesday 25 August 2026
Chinese automakers expand to humanoid robotics with technology, supply chain and scenario advantages
DIGITIMES observes that the humanoid robot market is expanding rapidly, supported by global labor shortages and advances in artificial intelligence (AI), and Chinese automakers are also moving aggressively into this emerging field.
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