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REALTIME NEWS
Commentary: Samsung’s Taylor 2nm ramp-up is critical to closing the gap with TSMC
Tomorrow's Headlines
11h 38min ago
Global auto downturn creates risks and opportunities for Taiwan suppliers
Tomorrow's Headlines
11h 38min ago
Chip inflation accelerates smartphone brands’ retreat from low-end devices
Tomorrow's Headlines
11h 38min ago
Analysis: What China's proposed export controls for AI foundation models and agents means
Tomorrow's Headlines
11h 38min ago
Analysis:Why has China expanded export control to AI chip design and computing technologies now
Tomorrow's Headlines
11h 38min ago
Oct 19
SiC powering the future: market scaling meets IDM synergies
Oct 19
DIGITIMES Insight: Microsoft Maia 300 leads 2nm race, TSMC's US strategy shifts, Intel EMIB-T faces yield challenge
Oct 19
Canon Taiwan sees strong global camera demand in 2026 and 2027
Oct 19
Exclusive: Wooptix targets leading chipmakers with wafer metrology technology, eyes production adoption within 3-5 years
Oct 19
SK Hynix advances chip inspection technology as 3D memory pushes conventional metrology to its limits
LATEST STORIES
7 days news
South Korea's FIX 2026 to feature robots from HD Hyundai, Doosan
Oct 20, 00:15
ICT
IT panel market struggles to pass on costs: monitors hold flat, notebooks slide
Oct 20, 00:03
DISPLAYS
OCP 2026 shifts AI competition from chips to rack-scale systems
Oct 20, 00:01
ICT
Solution Finders Part 2 of 2: TSMC's first CTO said no to Intel twice but still wonders what if
Oct 19
SEMICONDUCTORS
Action cameras gain momentum as camera demand fragments
Elon Musk points to China's 2028 DRAM supply surge to challenge Samsung, SK Hynix pricing power
DeepSeek updates V4.1 Flash to improve AI agent performance
Samsung targets Exynos 2700 expansion as Huawei advances Kirin chips
Anthropic offers Blackstone more than 10% return in US$60 billion AI chip financing deal
Weblink International secures AvePoint agency rights to expand AI governance
ACM Research bets on panel-level packaging and overseas growth as adoption risks persist
Solution Finders Part 1 of 2: the DARPA challenge behind TSMC's success
From LCD powerhouse to AI enabler: Taiwan's display industry reinvents itself after 30 turbulent years
Toyota eyes full SDV lineup by 2030, rolling Arene across 50 models
China's 420GWh storage boom enters a quality reset as Beijing reins in overcompetition
Sanan Optoelectronics faces corp governance turmoil amid Micro LED breakthroughs
Foxconn, Mitsubishi Electric form alliance in automotive equipment business
IBM and Siemens collaborate to advance nanostack chip architecture
Von Ardenne's flexible equipment targets unsettled panel-level packaging market
Toyota to deploy gigacasting in China as Shanghai Lexus plant targets 2027
China probes Huawei-JAC Maextro V800 over brake pedal failure
Anthropic opens Singapore office, signs AI cooperation agreement
Taiwan launches first proof-of-concept project for green-power time shifting
Terafab exposes Tesla's growing tensions with Samsung and TSMC
Interview: Zeiss SMO president says High-NA EUV ready for mass production, orders booked through 2027
Lens Technology enters AI server cooling market with US$25 million PMG takeover
Anthropic signs first Canada data center lease
Taiwan plans 25 gas-fired units to secure power for 10 years
iBase Solution targets AI data center EPC contracts with modular liquid cooling, energy storage expertise
Memory giants lock in up to 70% of capacity under long-term deals as AI demand reshapes industry cycles
More news
BIZ FOCUS
Oct 19, 08:00
MKS' Atotech and ESI to Showcase Advanced PCB Solutions at TPCA 2026
Monday 19 October 2026
GMIF2026: AI Inference Drives Token Factory and System Memory Rethinking
Monday 19 October 2026
Breaking free from keyword constraints: How GeoGraph elevates job matching
Thursday 15 October 2026
Samsung Semiconductor Highlights 400+ Layer Flash Powering Agentic AI
MOST-READ
TSMC locks in 3-6% wafer out price hikes for 2027
Musk's Memphis move puts xAI at the center of his empire
TSMC, Intel named as Musk's Terafab ambitions face reality check
GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
Beyond 16 layers: HBM stacks test advanced packaging equipment makers
TSMC breaks silence on Musk's Terafab: Talks underway, but fab control non-negotiable
Chinese memory supply is disruptive to pricing, Acer's Jason Chen says, as shortages ease
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
4F2 DRAM development
Memory leaders are making progress with the next-generation 4F2 DRAM designs, a part of the industry's move toward vertically stacked 3D architectures to increase performance.
CXMT targets DDR5 RDIMMs by end of 2026; SiCarrier showcases China's advanced chipmaking equipment
China's YMTC targets 9,600 MT/s with 4F² DRAM design
Samsung reportedly completes 4F² DRAM development as China's CXMT targets year-end launch
...More
EV
Wednesday 9 September 2026
Analysis: When 72% of the world's EV batteries are Chinese, one defect travels
Toyota eyes full SDV lineup by 2030, rolling Arene across 50 models
Monday 19 October 2026
China's 420GWh storage boom enters a quality reset as Beijing reins in overcompetition
Monday 19 October 2026
Foxconn, Mitsubishi Electric form alliance in automotive equipment business
Monday 19 October 2026
TECH
Monday 19 October 2026
AUO, Largan Micro LED debate highlights optical communications uncertainty
Charts: YMTC bets on premium eSSDs to take on Samsung
Friday 16 October 2026
TSMC, Intel, Samsung seek to break AI chipmaking's next barrier through early technology integration
Wednesday 14 October 2026
AI Server tracker: Taiwan's AI server chain grew 55% in September, but the growth narrowed to fewer suppliers
Tuesday 13 October 2026
ASIA
Thursday 10 September 2026
India's fraud office seeks a Xiaomi probe as the market it once led shrinks around it
Elon Musk points to China's 2028 DRAM supply surge to challenge Samsung, SK Hynix pricing power
Monday 19 October 2026
Exclusive: Chinese energy storage giants reportedly exit US as two-way tech restrictions open door for non-Chinese suppliers
Monday 19 October 2026
South Korea's TelePIX wins global satellite contracts, targets 2027 launch of AI-powered optical payload
Monday 19 October 2026
OPINIONS
Monday 19 October 2026
DIGITIMES Insights: SpaceX moves closer to independent mobile network as Starlink expands spectrum holdings beyond satellites
DIGITIMES Insight: Microsoft Maia 300 leads 2nm race, TSMC's US strategy shifts, Intel EMIB-T faces yield challenge
Monday 19 October 2026
Exclusive: Wooptix targets leading chipmakers with wafer metrology technology, eyes production adoption within 3-5 years
Monday 19 October 2026
Interview: Zeiss SMO president says High-NA EUV ready for mass production, orders booked through 2027
Monday 19 October 2026
TOPICS
4F2 DRAM DEVELOPMENT
TSMC 3Q26 EARNINGS CALL
OCP APAC SUMMIT 2026
HUAWEI
SPECIAL REPORTS
Monday 19 October 2026
Shipments of high-end cloud AI accelerators, 2027
DIGITIMES observed that cloud service providers (CSPs) such as Google and AWS will sharply ramp up self-developed ASICs in 2027, lifting high-end cloud AI accelerator shipments to 25.951 million units, up 64.5% year-over-year.
Monday 12 October 2026
Chinese government and industry make full push into AI glasses development: AR display integration and lightweighting gain traction
DIGITIMES notes that China continued to advance smart glasses policies from the central government to local governments in 2026, driving both enterprise production and consumer purchase subsidies.
Friday 2 October 2026
Global annual AI server shipments, 2025-2026
Continued advances in top-tier LLM capabilities, coupled with the potential for business automation enabled by agentic AI, are prompting major North American cloud providers, Neo Clouds, and leading AI labs to accelerate AI data center buildouts in 2026.
Thursday 1 October 2026
SiC substrate market shows signs of recovery, driven by demand from vehicles, energy and AI infrastructure
DIGITIMES has observed that since Tesla equipped the Model 3 with a traction inverter integrated with SiC power modules in 2018, the application of SiC power devices in the electric vehicle (EV) sector has gradually expanded, prompting suppliers to aggres 8_s.jpg
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