The whole world is striding towards digitization and adopting smart technologies is the key strategy for sustainable development of manufacturers. Coretronic is an expert in the field of optoelectronics, as evidenced in the market share of its high-quality audiovisual products. However, the company not only seeks to continue advancing its optoelectronics business, but also develop unique advantages in the manufacturing sector.

AMICCOM releases new sub-1GHz wireless transmitter SoC, named A9339. A9339 integrates RF transmitter whose performance is the same as A7339. It can be used to communicate with AMICCOM's sub-1GHz RF or SoC transceivers. The data rate of A9339 is 250Kbps and supports FSK and GFSK modulation. The MCU in A9339 is high-performance 1T Pipeline 8051, built-in 16Kbytes flash memory, 1Kbytes SRAM, and 16/8 GPIOs and various digital peripherals. For development, A9339 offers 2-wire ICE and the recommended IDE is Keil C.

YCTek, the world biggest micro heat pipe manufacturer, has reached a formal patent license agreement with NeoGene Tech to adopt PWS (Print Wick Structuring) approach and MagicWick-Inside Technology Platform. Adopting such patented technology along with domestically-made fully automated production lines, YCTek is able to deliver ultra-thin vapor chamber devices with thickness of under 0.25mm in mass production.

ADLINK Technology Inc, a global leader in edge computing, introduces two new modules in the 6-CH EU Series digital I/O – the ECAT-4XMO motion control and trigger module, and the ECAT-TRG4 trigger modules. The new modules are a dynamic extension to ADLINK's EtherCAT System and are designed to perfectly complement the EU Series, enabling higher performance in automatic assembly, test, and inspection equipment across a multitude of applications including cell phone glass inspection, battery cell assembly, camera lens assembly and test and glue dispensing machinery, as well as inspection equipment.

The back-end semiconductor manufacturing process refers to the IC packaging and testing that people often hear about. Specifically, the process known as chip probing (CP) is conducted to test the electrical characteristics of each die on the wafer, so that dies with faulty electrical performance can be vetted before packaging, effectively reducing unnecessary manufacturing costs from faulty products.

Consumer demand for higher audiovisual quality is driving the evolution of technologies behind LCD displays. Specifically, mini-LEDs, with their superior contrast and color gradation performance, have emerged in the field of display backlights. With a strong R&D foundation in the field of mini-LED technology, Macroblock recently launched a series of mini-LED backlight driver ICs that correspond to various LCD display sizes. According to Chris Chen, Macroblock backlight product manager, the company can help clients create the most suitable products tailored to the needs of different groups in the market.