SEMICON Taiwan 2024 featured the latest trends and innovations that focused on the future of Artificial Intelligence (AI) to connect Taiwan and global semiconductor ecosystems. The high demand and getting larger-sized AI chips require advanced packaging technologies to improve performance and time to market while reducing chip manufacturing costs and power consumption. The heterogeneous integration including 2.5D, 3D hybrid bonding, fan-out, and system-on-a-chip (SoC) packaging, along with emerging solutions like silicon photonics and panel-level packaging, are critical in optimizing system performance. These trending technologies are offering a higher-value opportunity and propelling the global semiconductor industry to foster the big waves of AI and high-performance computing chip innovation.The chemical solution providers play an important role in helping chip makers develop and commercializing various advanced packaging solutions to win premium customers. In this exclusive interview in the private conference room of SEMICON Taiwan with Mr. Ramachandran (Ram) Trichur, Global Market & Strategy Head for Semiconductor Packaging at Henkel Adhesive Technologies Electronics. He started recap the market observation of the semiconductor industry in 2024Henkel Adhesive Technologies business unit is the global leading chemical solution provider for adhesives, sealants, and functional coatings with sales of EUR10.790 billion in fiscal 2023. Henkel is the premier materials supplier for the electronics assembly and semiconductor packaging industries.Mr. Ramachandran (Ram) Trichur, Global Market & Strategy Head for Semiconductor Packaging at Henkel Adhesive Technologies Electronics.Expecting AI killer applications drive massive growth for edge computing Ram described the market as in a persistently challenging business environment as well as the market recovery in the Electronics business in 2024. Especially the advanced packaging is now gaining significant momentum as the next pathway for breakthroughs in semiconductor technology. The company expects single-digit market growth for 2024 and is optimistic about looking into 2025 as a massive increase in demand for the semiconductor market.He has observed several notable trends. First of all, in the past two years, generative AI has rapidly evolved and driven cloud computing AI revenue growth for enterprises. However, the volume of AI-enabled electronic devices is not increasing in the same way currently. The chip makers and electronic manufacturing industry are looking for applications to drive the unit count growth happened in the edge computing AI sector.Meanwhile, consumer electronics brands have quickly responded to promote their latest AI-powered products to figure out how consumers use AI to expand use cases that people use every day. There are more AI-enabled devices coming. Nowadays, some newly released fancy devices including AI personal computers (PC), AI smartphones, and intelligent robotics in automation systems are gathering attention. While companies race to incorporate AI technologies internally and externally, consumer use of AI still requires more time to see the results.Henkel hospitality suite showcasing solutions at SEMICON Taiwan 2024Photo: HenkelThermal mechanical challenges in advanced packagingSemiconductor chips are essential for the development and deployment of AI at scale. There are several primary challenges to be tackled in the semiconductor industry. Thermal-induced mechanical stress is now one of the leading causes of semiconductor failures, and it is becoming a top focus for chip manufacturers and ecosystem partners. "The bigger chips mechanically have big space and cause warpage and stress issues happened while ICs in operation," said Ram. He acknowledges the control of the warpage or mechanical stress to prevent chip failure is the highest priority for both material providers and chip manufacturers. The collaboration of ecosystem partners jointly developed and set a guideline on the maximum warpage or stress allowed in 3D-ICs, and designers could follow and avoid exceeding the constraints.Henkel is focusing on providing semiconductor packaging materials with long-term reliability, optimized performance, and processability for high throughput production. The demonstrated chemical solution lineups in SEMICON Taiwan 2024 include several major categories of advanced packaging materials. They are advanced underfill, non-conductive pastes & films (NCP & NCF), wafer-level encapsulation, and lid & stiffener attach materials.Lid & stiffener adhesives strengthening, warpage-reducing, grounding or shieldingRam divided the use of Henkel's materials for 2.5D/3D integrated packages in the manufacturing process into several highlights. The first is the lid & stiffener attach materials. The metal parts of lid & stiffener design in the larger-sized packaging is useful to reduce warpage concerns while dealing with tighter interconnects, thinner dies, complex architectures, and multiple coefficients of thermal expansion (CTE) in a single package. The Henkel's semiconductor adhesives are reliably attached to the lid and peripheral stiffeners to the substrate, allowing the package to maintain flatness throughout production and operational thermal cycles.During the manufacturing process and in operation, these devices and their multiple dies are subjected to several thermal cycles which can stress interconnects, leading to warpage and mechanical damage. The design of Henkel's lid & stiffener attach materials provides a portfolio of stability-enhancing adhesives ranging from conductive and non-conductive formulations, providing warpage-reducing coplanarity as well as grounding or shielding capability.Large die capillary underfill considering bump protection and warpage controlThe second highlight is focusing on advanced underfill materials. The 3D-IC design continues to increase the silicon interposer area to accommodate multiple dies including memory and processor units allowing the dense die integration inherent in advanced packaging techniques. This will require the underfill material with low shrinkage and toughness to provide die and underfill crack resistance, while its low coefficient of thermal expansion (CTE) protects against warpage. Targeting to meet the dimensional demands of highly integrated package designs, Henkel's Capillary Underfill(CUF) materials completely envelop fine-pitch, low gap height die interconnects for rigid protection against stress to deliver good electrical, moisture, and thermal reliability performance for high production yields.However, there is rising processability or manufacturing throughput requirements while the Capillary Flow Materials fill a large area in the substrate for bigger ICs. The flow speed allowing for greater process efficiency is an important feature for complete interconnect coverage. Henkel takes a quick response to release new materials. Taking Loctite Eccobond UF 9000AE as an example, in internal testing versus previous generation Capillary Underfills, Loctite Eccobond UF 9000AE demonstrated 20% faster flow on a 40 mm x 40 mm die, indicating that this material is compatible with even larger die sizes. So far, Loctite Eccobond UF 9000AE's performance has been validated on die as large as 50 mm x 50 mm and within packages up to 110 mm x 110 mm.Liquid compression molding materials support high reliability & high-UPH processThe third highlight is advanced molding and encapsulation materials. Wafer-level packaging shows significant growth potential, chemical solutions including advanced molding and encapsulation are enabling accelerated adoption by providing improved handling, protection, and warpage control for thinner die design approach. The challenges are the molding area is getting larger and the molding thickness is thin. The warpage becomes large after curing and it affects proceed to the subsequent process. Henkel's portfolio of wafer-level encapsulation materials include a variety of solutions to facilitate high-yield processing and in-field reliability for various advanced wafer-level packaging applications. The focus of the demo section is liquid compression molding materials (LCM).Henkel's liquid compression molding materials for wafer-level packaging processes integrate ultra-fine filler technology (less than 10 μm upper-cut) to deliver void-free gap filling and thorough coverage. In addition, the high warpage control and fast in-mold curing of Henkel's formulations molding materials provide high reliability in combination with a high-throughput process for overall lower cost. The LCM materials are anhydride-free and REACH-compliant, ensuring that the die remains protected under various operational stresses.Henkel Adhesive Technologies ElectronicsPhoto: HenkelHenkel Taiwan Electronics Adhesives Technical Center supports customers' technology roadmapsHenkel is well positioned to deliver the sustainable high-performance materials needed for next-generation advanced packaging. These series of Henkel's solutions offer characteristics with high reliability, thermal expansion, fast capillary flow to satisfy the requirements of complex, high-density semiconductor packages. In all product developments, Henkel's sustainability commitments to use renewable carbon content and eliminate Substances of Very High Concern (SVHC) materials will remain a priority. The newest generation of advanced packaging is integrated with the technologies with environmental protection and partnerships with industry leaders. This will drive the material innovation to satisfy the semiconductor manufacturing fab requirements.There are more versatile and potential opportunities for semiconductor advanced packaging technology underway including Co-Package Optics (CPO), panel-level packaging, and other emerging techniques. The next steps for Henkel Adhesive Technologies will continue investing heavily in material innovation and seek to understand the evolving needs of the semiconductor and electronic materials market while actively proposing chemical products that align with customers' technology roadmaps and contributing to the research and development of new products.Moreover, Henkel Taiwan Electronics Adhesives Technical Center at Zhubei City provides prompt technical support and increases collaboration with Taiwan customers to speed up prototype development. This application center is dedicated to supporting customers in technical innovation and product development through faster application simulation, data generation, and analysis, thereby accelerating time-to-market for advanced packaging technologies. Ram concludes, "Through Henkel's dedicated global support teams and in close partnership with customers, Henkel Adhesive Technologies will create technical breakthroughs to open a new frontier for semiconductor advanced packaging."

iCatch Technology, a leading AI image processing IC design company, is excited to announce its participation in the SEMICON Taiwan 2024 Exhibition, taking place from September 4-6, at Nangang TaiNEX Hall 2, 1F, Smart Mobility Pavilion.At the exhibition, iCatch will showcase Privacy Masking Solutions for GDPR-compliant dashcams powered by the CR5 Automotive AI Vision SoC. The company will also conduct two key sessions on the Smart Mobility Pavilion Stage, offering insights into emerging automotive imaging technologies.A standout feature of the CR5 is its advanced privacy masking capabilities, including face and license plate blurring, designed to comply with the European Union General Data Protection Regulation (GDPR). This regulation mandates the protection of personal data, such as facial images and license plates captured by dashcams, before storage, use, or sharing.The CR5's secure engine can automatically encrypt original video streams when the driver accesses the recordings. Only authorized OEMs and law enforcement can decrypt this data, ensuring GDPR compliance while maintaining data integrity.The CR5 AI Vision SoC, designed for automotive applications, integrates ThetaEye AI ISP Gen 8 for efficient noise reduction and superior low-light imaging. It supports up to 8 cameras with 120dB High Dynamic Range (HDR) and Local Tone Mapping, delivering a total resolution of 4K60.The SoC features a 1.5 TOPS AI Neural Processor Unit (NPU) for robust AI processing, and a low-power Smart H.265 codec. It also includes an audio DSP with 3A algorithms, USB3.2 Gen 1 and SDIO 3.0 interfaces, enhanced memory bandwidth with LPDDR4 support, and a secure engine that supports AES encryption standards, ensuring robust data protection.Weber Hsu, General Manager of iCatch Technology, comments, "iCatch Technology's commitment to the Automotive Imaging OE market underscores our focus on innovation and expanding our impact. We are enthusiastic about future opportunities and dedicated to leveraging our existing SoC powered by ThetaEye AI ISP. By incorporating ThetaEye AI ISP IP into a composable VPU platform, we offer customized SoC design services tailored to meet specific client needs."iCatch Technology has made significant strides in the OEM dashcam market, with mass production scheduled to begin in the fourth quarter of 2024, showing our commitment to the automotive vision sector. Interested parties are encouraged to connect with iCatch Technology. For inquiries, please contact our sales representatives at https://www.icatchtek.com/Requests.

Presentation at SEMICON Taiwan 2024 demonstrates how materials impact sustainability, artificial intelligence (AI), and high-performance computing (HPC).Taipei, Taiwan – August 28, 2024 – Brewer Science, Inc., a global leader in developing and manufacturing innovative materials for micro- and optoelectronics, shares its expertise on the impact materials have on sustainable lithography processes. Additionally, Brewer Science presents the role innovative materials have in the critical advanced packaging markets, including artificial intelligence (AI) and high-performance computing. Brewer Science's presentations and exhibition will be at SEMICON Taiwan, from September 4 - 6, 2024.Material Efforts Towards Sustainable ProcessesDr. Douglas Guerrero, Brewer Science's Senior Technologist, presents "Material Efforts Towards Sustainable Processes" addressing the industry's most critical questions when it comes to balancing technology innovation with environmental stewardship, including:How can the semiconductor industry enhance sustainability while meeting growing consumer demands for eco-friendly practices? What innovative solutions are available to reduce energy consumption in EUV lithography processes? Can transitioning from thermal baking to UV curing improve energy efficiency and lithographic performance? What are the benefits of optical crosslinking in semiconductor manufacturing, and how does it optimize material design, process efficiency, and tool throughput?With 30 years of R&D experience in patterning materials and processes, over 20 patents, and 60 publications, Dr. Guerrero combines material expertise and industry leadership to present how sustainable processes can lead to energy savings, while improving tool throughput and maintaining lithographic performance. Attend Dr. Guerrero's presentation on September 6 at 2:20 pm in 401, 4F at SEMICON Taiwan, as part of the IC Forum - Advanced Chip Technology and Manufacturing.The Role of Cutting-edge Materials in Advanced Packaging in AI and High-Performance ComputingMr. Alexander Smith, Brewer Science's Executive Director of the Semiconductor Materials Business Unit, presents "The Role of Cutting-edge Materials in Advanced Packaging in AI and High-Performance Computing," providing an insightful review of the challenges and advancements in packaging materials enabling more efficient and cost-effective flows. Mr. Smith will highlight chemical properties and customizable structures that will offer the most innovative solutions to pressing industry challenges. Attend Mr. Smith's presentation on September 6 at 12:00 pm in 701GH, 7F at SEMICON Taiwan, a part of the Heterogeneous Integration Global Summit 2024 – Day 3.Explore New Innovations in Advanced Packaging at Booth I2116Throughout the events, Brewer Science's experts will be stationed at booth I2116 in the SEMICON Taiwan Exhibit Hall and available for discussions on how Brewer Science's materials assist with advanced-node patterning and wafer thinning. A list of Brewer Science's PFAS-Free Materials is also available.Wednesday, September 4: 10:00 am–5:00 pm Thursday, September 5: 10:00 am–5:00 pm Friday, September 6: 10:00 am–4:00 pmFor those unable to attend, Brewer Science extends an open invitation to explore its Packaging Solutions and Advanced Lithography webpages. You can also request datasheets or schedule expert-led consultations on Brewer Science's website. www.brewerscience.com.About Brewer ScienceBrewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we've expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique quality monitoring systems for water and air applications. We are Certified Employee-Owned and a Certified B Corporation™, using our business as a force for good. Our headquarters are in Rolla, Missouri, with customer support throughout the world. Learn more at www.brewerscience.com.Company Contact Information:Nathan AyresTel: (US) +1.573.364.0300, ext. 1923Email: nayres@brewerscience.comView this announcement on our website.

In a significant leap forward for semiconductor manufacturing, ifm, a global leader in sensor technology, exhibited a comprehensive suite of smart sensing solutions at SEMICON Taiwan 2024. These innovations underscore ifm's formidable expertise in enhancing productivity and optimizing quality in semiconductor processes.According to Wan-Rou Ma, Key Industry Sales Manager at ifm, the showcased solutions including a digital chemical supply system, equipment condition monitoring, assembly inspection applications, and cooling solutions, mark a shift from isolated monitoring to holistic smart management. Leveraging IO-Link technology, AI-driven predictive maintenance, and cutting-edge cooling fluid quality monitoring, ifm is enabling semiconductor manufacturers worldwide to realize their smart manufacturing ambitions.The products featured this year are all equipped with IO-Link capabilities, offering enriched system diagnostics that streamline configuration and maintenance while enhancing data transmission reliability and flexibility. One of the highlights includes the Auto Teach feature within the digital chemical systems, enabling batch configuration of capacitive sensors with a single click, significantly reducing human error and enhancing fab efficiency.Moreover, ifm's non-contact continuous level monitoring technology uses capacitive sensing to detect levels through non-metallic container walls, ensuring sensor longevity by avoiding direct contact with corrosive acids or bases. This not only extends sensor life but also preserves the purity of chemicals.In terms of semiconductor back-end packaging and testing, ifm's solutions focus on two main applications: all-in-one vision systems and wafer inspection. For all-in-one vision systems, the O2I series multi-code reader features 1D and 2D barcode reading, character recognition, and font identification. It maintains high recognition stability in complex environments such as metal interference, external light sources, or reflective surfaces, significantly improving production line efficiency and accuracy.For wafer placement inspection, the O2U5 series dual-function vision sensor accurately detects wafer tilt in narrow, low-light environments, effectively preventing wafer misalignment caused by lift pin operation anomalies. ifm application engineer Chien-chung Chen mentioned that this system can simultaneously inspect the surface and contour of the object under test, perform quality checks, and track wafer position in real time, enhancing process stability and yield. This brings multiple values to semiconductor customers, including increased production efficiency, enhanced quality control, and reduced loss rates.Regarding the recent industry-focused server cooling applications, ifm showcased a complete solution including flow, temperature, pressure, and level. Semiconductor industry and Northern Region application engineer Chi-yang Shih stated that the company's solution is optimized for commonly used fluorinated liquids and mineral oils, ensuring high accuracy and stability. Its features include monitoring the basic state of the coolant and detecting water content and impurities in the oil, providing in-depth analysis of coolant quality.All ifm products come with a five-year global warranty, which is particularly important for liquid cooling systems with high maintenance costs and long downtime. Additionally, as a major sensor manufacturer, ifm's global service support can act as a customer backup, providing immediate, local technical support worldwide.SEMICON Taiwan 2024 provided a platform for ifm to not only display these solutions but also to engage with industry professionals through expert-led sessions. These sessions highlighted ifm's innovative IIoT platform features, which facilitate easy monitoring of equipment conditions and predict future trends, further solidifying ifm's role as a key player in pushing the boundaries of semiconductor manufacturing.ifm Managing Director Chien-hung Liu articulated the company's integral role in the semiconductor industry, emphasizing its commitment to energy conservation, carbon reduction, and the implementation of big data solutions. Marketing Specialist Hao-Han Kang invited all interested parties to visit booth S7635 at Nangang Exhibition Center, Hall 2, Floor 4, to explore these transformative technologies firsthand.Automation made in Germany. Credit: ifm electronic ltd.

Under the theme of "3S Open Lab Platform," 3S will present its achievements and advancements at SEMICON Taiwan 2024, showcasing the unique capabilities of the 3S Open Lab Platform.From September 4th to 6th, 3S Silicon Tech will be at Booth S7640 at Hall 2, Nangang Exhibition Center, introducing the cutting-edge developments of its Open Lab Platform tailored for power devices and power module assembly. The platform is designed to bridge the gap between innovative ideas and market-ready products, having already proven successful with global FABS, Fabless companies, OSATS, EMS, and leading IDM enterprises.3S Open Lab Platform: Turning smart ideas into tangible productsThe 3S Open Lab Platform is a pioneering initiative that offers a collaborative environment where opportunities and knowledge converge. Visitors will have the chance to explore how the platform supports the entire journey from concept to production, ensuring time-to-volume, time-to-market, and time-to-investment return for power chip and power module designers. Through a series of rigorous Design of Experiments (DOE), 3S Silicon Tech has mastered the transition from uncertainty to clarity, providing clients with the tools to overcome challenges and succeed in the competitive semiconductor landscape.Meet-the-Expert Session: Showcasing success stories in process optimizationAs part of SEMICON Taiwan's Smart Manufacturing Expo, 3S Silicon Tech will participate in the "Meet-the-Expert" event at the "Smart Manufacturing Arena." During this session, the team will share inspiring success stories from the Open Lab's continuous process optimization efforts and provide insights into the company's commitment to driving innovation through AI tools and data science to empower smart manufacturing.Join us at SEMICON Taiwan 20243S Silicon Tech cordially invites industry professionals to visit Booth S7640 to engage in insightful discussions on the latest technological advancements and explore collaborative opportunities. This event marks a significant milestone for 3S Silicon Tech as it continues to lead in providing cutting-edge solutions that drive the semiconductor industry forward.We look forward to welcoming you to our booth and sharing our journey of innovation and success.3S Silicon Tech Official Website: https://www.sss-tech.com.tw/

In today's fast-growing industry, the accuracy and stability of gas equipment are indispensable to semiconductor manufacturing. As an integrator in the gas field, Reliya Tech. has been vigorously promoting its own brand and has also introduced three leading brands, ASDevices, Simpure, and Tiger Optics, to the local market.In SEMICON 2024, Reliya will display a full range of products together with its technological innovation and top customer service. We sincerely expect a grand expo in the company of other established leaders in the semiconductor industry in Taiwan.During this year's Semiconductor Expo, which will be held from September 4th to 6th, we are glad to display the gas chromatograph Ka8000 and the intelligent gas calibration system (iGCS) of AS Devices, Purifier 7NG, 9NP003, and 9NP050 series of Cipro, as well as the micro oxygen analyzer of Tiger Optics. In addition, our gas particle counter, independently developed by Reliya's lab, will also be presented at the exhibition.Our gas particle counter has been well received by the industry since its launch, with sales in over 80 countries, including Taiwan, China, and Singapore. Besides, Reliya Technology has just acquired the certification of ISO 9001:2015 and ISO 45001:2018 this year, ensuring our accordance with high quality and industrial standard in manufacturing, installation, gas piping design, and construction of the instrument. Our gas particle counter will soon see its overseas sales in cooperation with companies in Europe and the United States.Innovation and Excellence in fechnologyEquipped with advanced sensors and a control system, ASDevices Ka8000 as a top GC solution is capable of regulating the gas flow with a high degree of accuracy to ensure control of each step in the manufacturing process. Also, the iGCS dilution device can operate in different environments with great stability, which endeavors to provide a stabilized gas supply and ensure its continuity and consistency.In a low-temperature setting, Simpure's purifiers allow the removal of impurities of H2 and He down to the ppt level with the feature of purging not only conventional impurities such as H2O, O2, CO, CO2, NMHC but also other impurities such as Ar, N2, CH4, etc. The purifiers are available in different flow rates and pressure ranges, which are trusted by leading gas companies and 12-inch semiconductor wafer factories. Among them, the 9N 120Nm3/h H2 purifier has performed well in a 12-inch semiconductor wafer fab, passing a comprehensive impurity test with all the criteria met. We can therefore proudly say that we definitely meet our client's requirements.Quality Customer SupportRelyea Technology not only provides top-end products but also values our instant and complete support for our customers. We aspire to take the lead in both technology and services to satisfy our customers' needs and assist them in their business goals.Tailor-made Solutions: Our team provides gas supply solutions tailored to each customer's needs. Prioritizing our clients' interests, we provide the best advice and solutions to different requests such as building a whole new plant and upgrading an existing system.Prompt Technical Support: Our team provides timely customer services at any time and in any place. Our technical professionals are dedicated to troubleshooting in the shortest time to ensure that our client's production is not interrupted.Comprehensive Training Program: Covering basic operation to advanced maintenance, we offer a comprehensive training program to assist our clients in maximizing the benefits of our products, which includes all the core knowledge and skills needed to attain the highest productivity.We cordially invite you to visit our booth and learn more about our products and commitment.Exhibition DetailsLocation: Taipei Nangang Exhibition Center, Hall 2, First floor, Booth Q5252Visiting hours: 10:00-17:00 4-6 September (Wed. - Fri)Contact: sales@reliya.com.twUp to date with the most advanced technology and the latest trends, we aim to deepen our exploration and contributions in gas purification equipment and gas analyzers. We are looking forward to your visit on-site.

Irvine, CA – Henkel recently announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements of the market's most demanding advanced packages, like those used in artificial intelligence (AI) and high-performance computing (HPC) applications. Loctite Eccobond UF 9000AE protects large die within flip-chip BGA (FCBGA), high-density fan-out (HD-FO), and 2.5-D advanced packaging devices.HD-FO and 2.5-D wafer-level packaging techniques have seen significant progress in the last ten years, having achieved dramatic increases in I/O, efficiency, and performance, making them a key enabler of AI growth in the data center and at the edge. With high-density thin, large die (>40 mm x 40 mm) and substantial package body sizes (>100 mm x 100 mm), emerging AI and HPC devices for certain applications can contain more than 2,000 fine-pitch (~100 µm), low gap height (~50 µm) interconnects per die. Bump protection and warpage control are critical for device functionality and optimized package performance. However, achieving thorough bump encapsulation at flow rates that deliver coverage efficiency can be challenging, given the cutting-edge architectural complexity.Henkel has developed a brand-new capillary underfill formulation that meets the dimensional demands of highly integrated package designs. Loctite Eccobond UF 9000AE completely envelops fine-pitch, low gap height die interconnects for rigid protection against stress to deliver good electrical, moisture, and thermal reliability performance for high production yields. The material's low shrinkage and toughness provide die and underfill crack resistance, while its low coefficient of thermal expansion (CTE) protects against warpage. Loctite Eccobond UF 9000AE also has low resin bleed out (RBO) and forms narrow fillets, allowing the dense die integration inherent in advanced packaging techniques.Henkel Global Market Segment Head for Semiconductor Packaging Materials, Ramachandran (Ram) Trichur, acknowledges that while thorough, rugged bump protection against thermal cycling strain and mechanical damage is the highest underfill priority, processability is critical to achieving throughput and yield objectives."Loctite Eccobond UF 9000AE delivers no-voiding bump encapsulation of flip-chip BGA, Cu pillar, and other high-density interconnects, which is fundamental to preserving the value and function of these high-performance devices," Trichur says. "Notably, however, this material does so faster than our prior generation underfills, allowing for greater flow efficiency, which is an important feature for complete interconnect coverage and encapsulation across large surface areas."In internal testing versus previous generation capillary underfills, Loctite Eccobond UF 9000AE demonstrated 20% faster flow* on a 40 mm x 40 mm die, indicating that this material is compatible with even larger die sizes. Its edge-to-edge capillary flow efficiency ensures interconnect encapsulation before any material gelation, eliminating the risk of exposed bumps. So far, Loctite Eccobond UF 9000AE's performance has been validated on die as large as 50 mm x 50 mm and within packages up to 110 mm x 110 mm."The rise of AI underscores semiconductor packaging ingenuity and its ability to drive remarkable levels of computing power and cost-effective scaling alternatives to Moore's Law," Trichur says, citing the well-publicized growth of 2.5-D chip-on-wafer and 3-D advanced packages. "Henkel has been at the forefront of enabling these devices with novel semiconductor materials, and our new underfill further demonstrates our contributions to this dynamic market space."Learn more about Henkel's advanced semiconductor packaging materials at www.henkel-adheisves.com.LOCTITE® is a registered trademark of Henkel and/or its affiliates in the USA, Germany, and elsewhere.*Die size dependent. About HenkelWith its brands, innovations, and technologies, Henkel holds leading market positions worldwide in the industrial and consumer businesses. The business unit Adhesive Technologies is the global leader in the market for adhesives, sealants, and functional coatings. With Consumer Brands, the company holds leading positions especially in laundry & home care, and hair in many markets and categories around the world. The company's three strongest brands are Loctite, Persil, and Schwarzkopf. In fiscal 2023, Henkel reported sales of more than 21.5 billion euros and adjusted operating profit of around 2.6 billion euros. Henkel's preferred shares are listed in the German stock index DAX. Sustainability has a long tradition at Henkel, and the company has a clear sustainability strategy with specific targets. Henkel was founded in 1876 and today employs a diverse team of about 48,000 people worldwide – united by a strong corporate culture, shared values, and a common purpose: "Pioneers at heart for the good of generations." More information at www.henkel.comPhoto material is available at www.henkel.com/pressContact Sebastian HinzPhone +49 211 797-85 94Email sebastian.hinz@henkel.comHenkel AG & Co. KGaA