News tagged Memory chips at DIGITIMES

NEWS TAGGED MEMORY CHIPS

Tuesday 29 April 2025

YMTC lands US$1.3B funding as financials reveal post-Unigroup fallout

YMTC, one of China's leading semiconductor firms, has secured a new funding round with a CNY1.6 billion (approx. US$220 million) capital...

Tuesday 29 April 2025

China launches 'human wave strategy' for R&D, poaching top-level South Korean scholars

Reports indicate that many outstanding South Korean research scholars have been moving to Chinese universities. These experts hold world-class authority in foundational fields of...

Tuesday 29 April 2025

Samsung shifts focus to 3D DRAM in intensifying competition from SK Hynix and Chinese rivals

Samsung Electronics has reportedly decided to adopt Vertical Channel Transistor (VCT) DRAM as its core next-generation memory product, with plans to begin mass production within the...

Tuesday 29 April 2025

Longsys rolls out bespoke automotive memory solutions to power smarter mobility

At Auto Shanghai 2025, Shenzhen Longsys Electronics Co. unveiled its full range of automotive-grade memory solutions, including two new in-house products: the eMMC Full-chip Custom...

Monday 28 April 2025

Weekly news roundup: China's chip merger, Samsung delays, CXMT's rise, and TSMC's global expansion battle

These are the top-read DIGITIMES Asia stories from the week of April 21 – April 27.

Friday 25 April 2025

China's Montage Technology storms into global DDR5 top three as AI chip demand explodes

Montage Technology reported robust first-quarter 2025 results, with revenue climbing 65.78% year-over-year to CNY1.222 billion (approx...

Friday 25 April 2025

Exclusive: Google considers HBM3E supplier change

Samsung Electronics has recently intensified its deployment in advanced high bandwidth memory (HBM) processes. However, supply chain sources reveal that Samsung's HBM3E certification...

Friday 25 April 2025

JEDEC bends rules—Samsung, SK Hynix charge ahead in AI memory war

JEDEC has relaxed the height specification for sixth-generation high bandwidth memory (HBM4), clearing a key obstacle for South Korean memory leaders Samsung Electronics and SK Hynix...

Friday 25 April 2025

Tariffs shadow over NAND: Phison turns cautious, prices rise

In response to potential tariff changes, Taiwanese companies in the industrial computer (IPC) sector are adjusting their strategies. As the US introduced a 90-day tariff exemption...

Thursday 24 April 2025

Sk Hynix completes validation for CXL-based DRAM module, boosting server capacity

SK Hynix has completed customer validation for its 96GB Compute Express Link (CXL) Memory Module, a DRAM solution that has attracted significant industry attention for its potential...

Wednesday 23 April 2025

Hanmi reshapes South Korea's HBM arena, eyes Samsung alliance as SK Hynix ties fray

The South Korean semiconductor industry is abuzz with intrigue as Hanmi Semiconductor's once-ironclad relationship with SK Hynix frays over the supply of thermal compression bonders...

Tuesday 22 April 2025

Hanmi Semiconductor's tough stance against SK Hynix supported by large TC bonder order from Micron

South Korean media outlets have reported that Hanmi Semiconductor has received additional orders for thermo-compression bonding (TCB) equipment from Micron Technology. Some industry...

Tuesday 22 April 2025

Samsung to end DDR4 module production by 2025

Samsung Electronics is accelerating the industry's transition away from DDR4 memory, having informed PC manufacturers that it will discontinue DDR4 modules by the end of 2025, with...

Monday 21 April 2025

Samsung lifts HBM yield as US tariffs loom over China-made chips

South Korean media have reported that Samsung Electronics has made notable progress in developing next-generation high-bandwidth memory (HBM). According to Chosun Biz, the...

Monday 21 April 2025

Samsung faces delays in 1c DRAM development, raising concerns over HBM4 timeline

Samsung Electronics is encountering delays in the development of its next-generation 1c DRAM chips, according to sources familiar with...

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