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Friday 17 July 2026
Interview: QuantumDiamond's EU-backed quantum leap in chip inspection lands in Taiwan

The global tech landscape is currently dominated by two massive tides: the race for semiconductor supremacy and the long-promised dawn...

Friday 17 July 2026
SK Group chair floats 'memory as a service' model for SK Hynix

SK Group chairman Chey Tae-won has floated a "memory as a service" model for SK Hynix, saying the memory chipmaker needs to build a...

Friday 17 July 2026
Exclusive: PC brands reportedly rush to secure CXMT memory as orders extend to end-2027
Chinese DRAM maker ChangXin Memory Technology's (CXMT) IPO has entered its final stage, drawing close market attention. PC supply chain sources said the US had briefly planned to add...
Friday 17 July 2026
South Korean suppliers ramp up hybrid bonding R&D beyond HBM5
As high-bandwidth memory (HBM) stacks add more layers, requirements for chip-to-chip bonding accuracy and signal transmission efficiency are becoming more demanding.
Friday 17 July 2026
Micron locks in automotive supply agreements as vehicle tech grows smarter
Micron Technology said it has completed strategic customer agreements with several tier 1 suppliers and ecosystem partners serving the global automotive industry, including Qualcomm,...
Friday 17 July 2026
Memory shortages deepen as suppliers turn to long-term contracts

Memory shortages are rippling through global electronics supply chains, as tightening supply in DRAM and NAND pushes manufacturers...

Friday 17 July 2026
Memory suppliers push prices higher as Apple and automakers face tighter supply
Memory suppliers have regained pricing power as AI-driven stockpiling and advance capacity bookings tightened supply for consumer electronics and automotive customers. The shift has...
Thursday 16 July 2026
C.C. Wei on EMIB, memory envy, and why TSMC won't squeeze its customers
TSMC Chairman and CEO C.C. Wei used the company's second-quarter 2026 earnings call to push back on two narratives gaining traction among analysts: that rival packaging technologies...
Thursday 16 July 2026
Beyond AI: Resilient consumer demand widens semiconductor supply crunch
Reports of lengthening semiconductor lead times have become increasingly common in recent months, highlighting that the imbalance between chip supply and demand has not eased but is...
Thursday 16 July 2026
As Trump pushes chips onshore, Netlist's ITC memory bid could keep Samsung, Nvidia offshore

A US trade agency has opened an investigation that could block imports of the DDR5 server memory and high-bandwidth memory (HBM) feeding...

Thursday 16 July 2026
CXMT IPO raises fresh capital, but its own prospectus map shows distance still to close
The IPO prospectus filed by Changxin Memory Technologies (CXMT) ahead of its planned listing on Shanghai's STAR Market offers an unusually candid portrait of the global DRAM industry...
Thursday 16 July 2026
Baiwei Storage forecasts sharp first-half profit surge on AI memory demand
Shenzhen Baiwei Storage Technology said its first-half 2026 revenue and profit are likely to rise sharply, highlighting how the global AI boom is reshaping demand for memory chips...
Thursday 16 July 2026
Hanmi, Hanwha clash in court over HBM equipment patents
Hanmi Semiconductor and Hanwha Semitech clashed in a Seoul courtroom over patents covering thermocompression bonders, or TC bonders, critical equipment used to stack DRAM chips vertically...
Thursday 16 July 2026
CXMT outspends all peers on R&D as a share of revenue, IPO filing shows

Across almost every competitive metric disclosed in its STAR Market IPO prospectus, Changxin Memory Technologies (CXMT) trails the...

Thursday 16 July 2026
CXMT IPO filing reveals Micron and Samsung alumni at heart of China's DRAM push

The IPO prospectus of Changxin Memory Technologies (CXMT), filed ahead of a planned listing on Shanghai's STAR Market, lays bare the...