Samsung Electronics (Samsung) is set to construct a test line for 10nm seventh-generation DRAM (1d DRAM) at Pyeongtaek Plant 2 (P2), strengthening its competitive position and enhancing...
Micron Technology announced during its latest investor conference that its HBM4 development is progressing as planned while revealing development of HBM4E is underway. The company...
India-based consumer electronics brand Micromax Informatics has partnered with Phison, a Taiwan-based NAND controller and storage provider, to create MiPhi. This strategic collaboration...
Kioxia, which recently listed on the Tokyo Stock Exchange (TSE), has announced plans to double its market share in AI-focused NAND products. President Nobuo Hayasaka highlighted the...
The world's third-largest NAND flash manufacturer, Kioxia, has officially gone public in Japan, securing funding for investments in artificial intelligence (AI) semiconductor technologies...
The US Department of Commerce has awarded SK Hynix a grant of up to US$458 million under the CHIPS and Science Act (CHIPS Act), supporting the company's efforts to strengthen the...
Micron Technology reported record fiscal first-quarter revenue driven by data center SSD sales, which now represent over half of total revenue. While HBM shipments doubled quarter...
After revealing the latest financial results, Micron held an earnings call, discussing the recovery paces across markets. The company is optimistic about the demand for HBM as it...
Japanese NAND flash manufacturer Kioxia has announced plans to produce three additional types of memory, targeting next-generation products driven by artificial intelligence (AI)...
The US Department of Commerce's Bureau of Industry and Security (BIS) has expanded semiconductor export controls to include high bandwidth memory (HBM), a crucial component for artificial...
Memory-chip maker Kioxia rose in its debut on the Tokyo Stock Exchange on Wednesday, underscoring decent investor demand for new shares in Japan. After initially dropping, the company...
The surging AI market has driven unprecedented demand for high-bandwidth memory (HBM), placing significant strain on supply chains. In early August, reports surfaced that the Biden...
According to ET News, SK Hynix is setting its sights on the semiconductor packaging market by offering packaging foundry services, a move that analysts say capitalizes on...
Samsung Electronics plans to introduce samples of its next-generation LPDDR6 memory by late 2025, addressing the growing demand for on-device AI solutions. The initiative aims to...
The Biden Administration is expected to unveil new regulations by the end of the year, targeting China's acquisition of advanced AI chips through third-party nations. These measures...
