Trends in industrial computing

Digitimes trackes the latest trends in industrial computing applications, including IoT, Industry 4.0 and automation and robotics.

IN THE NEWS

Monday 5 October 2026

Deutsche Telekom targets US$2.8 billion in savings as AI business grows

Deutsche Telekom expects artificial intelligence and automation to generate around EUR2.5 billion (approx. US$2.8 billion) in indirect-cost savings by 2030 compared with 2023, Reuters...

Monday 5 October 2026

AI server lines accelerate automation, boosting cobot demand

The AI server boom is spreading into the market for collaborative robots (cobots). The share of cobots on AI server production lines is rising as Wiwynn expands their use at its Mexico...

Monday 5 October 2026

Japan's strategic push to reclaim silicon supremacy with Rapidus

In a major effort to rebuild its national semiconductor industry, Japanese contract chipmaker Rapidus plans to partner with 17 domestic and international design firms to broaden its...

Saturday 3 October 2026

Synopsys reshapes EDA, IP business models as AI shifts revenue from seats to customer output

Synopsys is reshaping how it monetizes its two core businesses, electronic design automation (EDA) and semiconductor IP, as AI transforms engineering workflows. Announcements at the...

Friday 2 October 2026

Global annual AI server shipments, 2025-2026

Continued advances in top-tier LLM capabilities, coupled with the potential for business automation enabled by agentic AI, are prompting major North American cloud providers, Neo Clouds,...

Friday 2 October 2026

ficonTEC, Hermes Testing target CPO testing scale-up with INS-2 platform

ficonTEC, a maker of optoelectronic automation assembly and test equipment, has announced a strategic partnership with Hermes Testing Solutions Inc. (HTSI) to support Taiwan's rapidly...

Friday 2 October 2026

Hitachi and Fanuc launch Physical AI partnership for factory automation

Hitachi and Fanuc announced on September 30, 2026, that they have formed a strategic partnership on Physical AI, with internal testing beginning immediately and customer promotion...

Thursday 1 October 2026

ASE expands smart OSAT push with six university research partnerships

Advanced Semiconductor Engineering (ASE) held its 11th Automation Industry-Academia Project Results Presentation on September 30, unveiling 12 technology projects developed with six...

Thursday 1 October 2026

Synopsys and OpenAI to share revenue from AI model built to run chip design tools

Synopsys is betting that the surest way to keep generative AI from eroding its electronic design automation (EDA) franchise is to build the model together with the AI developer and...

Tuesday 29 September 2026

RoboTechnik completes Hong Kong listing to fund ficonTEC expansion in silicon photonics

RoboTechnik completed a Hong Kong listing on September 29 and began trading on the Hong Kong stock exchange, according to its German photonics automation subsidiary ficonTEC. The new...

Tuesday 22 September 2026

AirTAC sees pneumatic demand cycle extending through 2027 on China automation growth

AirTAC International Group said demand for pneumatic components in China's automation market has entered a more gradual expansion phase,...

Monday 21 September 2026

Samsung builds fab robot team, targets chip equipment maintenance

Samsung Electronics has formed a dedicated organization to develop and deploy robots in its semiconductor fabs, with equipment preventive...

Thursday 17 September 2026

Taiwan machine tool makers target aerospace, semiconductor boom at major trade shows

Taiwanese machine tool manufacturers are taking part in two major manufacturing trade shows in Europe and the US this September. The participation reflects a shift in Taiwan's machine...

Thursday 17 September 2026

Onsemi puts power density at the center of its next-decade strategy

Onsemi is seeking to capture more value from AI, electrification, and automation by expanding from individual semiconductors into integrated...

Monday 14 September 2026

DIGITIMES Insight: Taiwanese firms lead in FOPLP as overseas rivals race to catch up

Taiwanese chip packaging firms are advancing fan-out panel-level packaging (FOPLP) and glass-substrate development as AI processors demand ever-larger reticle sizes and more complex...

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