Samsung 1ynm DDR4
Samsung Electronics has begun mass producing the second generation of 10nm-class (1y-nm),...
Photo: Company
Samsung 12Gb LPDDR4 DRAM
Samsung Electronics has announced that it is mass producing 12Gb LPDDR4 (low power, double...
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Intel sixth-generation Core processor
Intel has introduced the sixth-generation Core processor family for a range of device designs...
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3D NAND die with M.2 SSD
Intel and Micron have jointly announced the availability of their 3D NAND technology. This...
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Samsung 3D V-NAND SSD
Samsung Electronics has introduced a solid state drive (SSD) based on its 3D V-NAND technology...
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Applied SEMVision G6 defect analysis system
Applied Materials has announced a suite of new defect review and classification technologies...
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Intel 22nm 3D tri-gate transistor
Intel will introduce a 3D transistor design called Tri-Gate, first disclosed by Intel in...
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Spansion GL-S family of NOR flash
Designed for fast data access, interactivity and boot performance, the Spansion GL-S family...
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Intel Atom E600C series
The configurable Intel Atom E600C series features an Intel Atom E600 processor (Tunnel Creek)...
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Lanner LEC-2026, an embedded system with a specialized focus on network capabilities.
Lanner Electronics has released the LEC-2026, an embedded system with a specialized focus...
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KLA-Tencor VisEdge CV300R-EP
KLA-Tencor has announced the latest addition to its VisEdge family of wafer edge inspection...
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KLA-Tencor Archer 300 LCM metrology system
KLA-Tencor has introduced the Archer 300 LCM Metrology system, which offers precision and...
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Intel Core i5 CPU
Intel has introduced its new Intel Core family of processors for notebooks, desktops and...
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Intel Westmere-based die
Intel has introduced its new Intel Core family of processors for notebooks, desktops and...
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ITRI laser technology for flexible electronics applications
Industrial Technology Research Institute (ITRI) has developed a new laser technology for...
Photo: CJ Liu, Digitimes