Apple has introduced the iPhone 7 and iPhone 7 Plus. The iPhone 7 series, the first water and dust resistant iPhone, will be available in more than 25 countries beginning September 16.
The iPhone 7 features a 12-megapixel camera with a f/1.8 aperture and 6-element lens. The iPhone 7 Plus features the same 12-megapixel wide angle camera as iPhone 7 and adds a 12-megapixel telephoto camera that together offer optical zoom at two times and up to 10 times digital zoom for photos.
Coming later in 2016, the dual 12-megapixel cameras also enable a new depth-of-field effect, using both cameras on iPhone 7 Plus to capture images, while sophisticated technology including Machine Learning separates the background from the foreground.
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- TSMC to win more than US$5 billion in grants for US chip plant (Mar 9) - Bloomberg
- China readies US$27 billion chip fund to counter growing US curbs (Mar 8) - Bloomberg
- Water scarcity threatens chipmakers like TSMC and could push prices higher, according to S&P (Mar 6) - CNBC
- Graphene transistor could revolutionize semiconductor industry (Feb 28) - EETimes Europe
- Apple CEO Tim Cook: 'GenAI will redefine the future' (Feb 29) - Computerworld
- North Korea hacked South Korea chip equipment makers, Seoul says (Mar 5) - BBC News
- European Union seeks chip sovereignty using RISC-V (Mar 1) - EE Times
- Largest CHIPS Act awards seen coming for US companies (Feb 26) - EE Times
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