Micro-Star International (MSI) has announced its latest gaming notebook - GT780DX, featuring quad-core Intel Core i7 CPU and the latest Nvidia GeForce GTX 570M discrete graphics card that is equipped with 3GB of GDDR5 display memory.
The machine is also equipped with 32GB of DDR3 memory and RAID 0-based accelerated dual hard disk architecture for its hard drive system to allow storage capacity to double and read-write speed to increase by 70%.
MSI also adds its Turbo Drive Engine (TDE) technology to the machine to ramp up its overall performance. To quickly cool down the system, MSI also has Cooler Boost technology.
Nishant Arya, Vice Chairman, JBM GroupPhoto: Company
Samsung HKMG DDR5
Samsung Electronics has expanded its DDR5 DRAM memory portfolio with a 512GB DDR5 module...Photo: Company
Nvidia GeForce RTX 30 series GPUs
Nvidia's GeForce RTX 30 series GPUs are powered by the company's Ampere architecture. The...Photo: Company
Apple HomePod mini
Apple's HomePod mini is the newest addition to the HomePod family. At just 3.3 inches tall,...Photo: Company
Apple 13-inch MacBook Pro with Magic Keyboard
Apple has updated the 13-inch MacBook Pro with the new Magic Keyboard for an improved typing...Photo: Company
Apple iPad Pros
Apple's new iPad Pros comes with the latest A12Z Bionic chip, an ultra-wide camera, studio-quality...Photo: Company
Taiwan notebooks - 4Q 2021
Taiwan's notebook shipments enjoyed better-than-expected growths in the fourth quarter of 2021, picking up over 10% sequentially,...
Global server revenue forecast, 2022
Taiwan-based manufacturers' revenues generated from server-related businesses including motherboards, complete systems as well...
Global server shipment forecast, 2022
According to Digitimes Research's statistics and analyses, the 2021 global server market has a supply-demand gap as large cloud...
South Korea to build semiconductor ecosystem; Tianma to invest in 8.6-gen panel project; Nissan and Honda unveil EV development plans
This Asia tech industry summary will mainly focus on South Korea's president-elect Yoon Seok-youl nominating Lee Jong-ho, a...
Advanced packaging technology outlook, 2020-2026
Hybrid bonding and other new advanced assembly techniques widely used for smartphone application processors (AP) and high-performance...
Smart manufacturing progress of Taiwan, 2021
Taiwanese manufacturers demonstrated strong ambition toward adopting ISA-95 Layer 1 and 2 manufacturing equipment automation...