Samsung Electronics has announced mass production of the Exynos 7 Dual 727 mobile application processor (AP) designed specifically for wearable devices with 14nm FinFET process technology.
Powered by two Cortex-A53 cores, the Exynos 7270 makes full use of the 14nm process, delivering 20% improvement in power efficiency when compared to its predecessor built on 28nm, and thus notably extending the battery life, Samsung said. By integrating Cat.4 LTE 2CA modem, the new AP allows wearables to connect to a cellular service as a stand-alone device. Tethering and data transfer between devices is also possible with its embedded WiFi and Bluetooth connectivity. In addition, integrated connectivity capabilities support FM radio, and location-based services with GNSS (global navigation satellite system) solutions.
Nishant Arya, Vice Chairman, JBM GroupPhoto: Company
Samsung HKMG DDR5
Samsung Electronics has expanded its DDR5 DRAM memory portfolio with a 512GB DDR5 module...Photo: Company
Nvidia GeForce RTX 30 series GPUs
Nvidia's GeForce RTX 30 series GPUs are powered by the company's Ampere architecture. The...Photo: Company
Apple HomePod mini
Apple's HomePod mini is the newest addition to the HomePod family. At just 3.3 inches tall,...Photo: Company
Apple 13-inch MacBook Pro with Magic Keyboard
Apple has updated the 13-inch MacBook Pro with the new Magic Keyboard for an improved typing...Photo: Company
Apple iPad Pros
Apple's new iPad Pros comes with the latest A12Z Bionic chip, an ultra-wide camera, studio-quality...Photo: Company
Taiwan notebooks - 4Q 2021
Taiwan's notebook shipments enjoyed better-than-expected growths in the fourth quarter of 2021, picking up over 10% sequentially,...
Global server revenue forecast, 2022
Taiwan-based manufacturers' revenues generated from server-related businesses including motherboards, complete systems as well...
Global server shipment forecast, 2022
According to Digitimes Research's statistics and analyses, the 2021 global server market has a supply-demand gap as large cloud...
South Korea to build semiconductor ecosystem; Tianma to invest in 8.6-gen panel project; Nissan and Honda unveil EV development plans
This Asia tech industry summary will mainly focus on South Korea's president-elect Yoon Seok-youl nominating Lee Jong-ho, a...
Advanced packaging technology outlook, 2020-2026
Hybrid bonding and other new advanced assembly techniques widely used for smartphone application processors (AP) and high-performance...
Smart manufacturing progress of Taiwan, 2021
Taiwanese manufacturers demonstrated strong ambition toward adopting ISA-95 Layer 1 and 2 manufacturing equipment automation...