ZenBook 3 Deluxe features a 14-inch display in compact chassis crafted from aerospace-grade aluminum alloy. This grade of alloy is 50% stronger than standard alloy, according to the Asustek. The 14-inch notebook is not much bigger than most 13-inch ones, thanks to its NanoEdge ultra-narrow display bezel, which is just 7.46mm wide.
Its display is protected by a 0.55mm thick Corning Gorilla Glass 5. Measuring 12.9mm thin and weighing 1.1kg, the Asustek notebook is powered by 7th generation Intel Core i7 processor, with up to a 1TB PCIe SSD, two USB Type-C (USB-C) ports and Thunderbolt 3 for dual 4K UHD display support. It comes with and a quad-speaker audio system.
Nishant Arya, Vice Chairman, JBM GroupPhoto: Company
Samsung HKMG DDR5
Samsung Electronics has expanded its DDR5 DRAM memory portfolio with a 512GB DDR5 module...Photo: Company
Nvidia GeForce RTX 30 series GPUs
Nvidia's GeForce RTX 30 series GPUs are powered by the company's Ampere architecture. The...Photo: Company
Apple HomePod mini
Apple's HomePod mini is the newest addition to the HomePod family. At just 3.3 inches tall,...Photo: Company
Apple 13-inch MacBook Pro with Magic Keyboard
Apple has updated the 13-inch MacBook Pro with the new Magic Keyboard for an improved typing...Photo: Company
Apple iPad Pros
Apple's new iPad Pros comes with the latest A12Z Bionic chip, an ultra-wide camera, studio-quality...Photo: Company
Taiwan notebooks - 4Q 2021
Taiwan's notebook shipments enjoyed better-than-expected growths in the fourth quarter of 2021, picking up over 10% sequentially,...
Global server revenue forecast, 2022
Taiwan-based manufacturers' revenues generated from server-related businesses including motherboards, complete systems as well...
Global server shipment forecast, 2022
According to Digitimes Research's statistics and analyses, the 2021 global server market has a supply-demand gap as large cloud...
South Korea to build semiconductor ecosystem; Tianma to invest in 8.6-gen panel project; Nissan and Honda unveil EV development plans
This Asia tech industry summary will mainly focus on South Korea's president-elect Yoon Seok-youl nominating Lee Jong-ho, a...
Advanced packaging technology outlook, 2020-2026
Hybrid bonding and other new advanced assembly techniques widely used for smartphone application processors (AP) and high-performance...
Smart manufacturing progress of Taiwan, 2021
Taiwanese manufacturers demonstrated strong ambition toward adopting ISA-95 Layer 1 and 2 manufacturing equipment automation...