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News tagged 30nm
  • Last update: Friday 7 August 2015 [46 news items]

Elpida approved to issue depositary receipts in Taiwan

Nov 15, 15:03

Elpida Memory's planned TDR (Taiwan depositary receipt) issue has received approval from Taiwan's Industrial Development Bureau (IDB) under the Ministry of Economic Affairs (MOEA)...

Elpida develops 30nm 2Gb DDR3 SDRAM

Sep 29, 13:53

Elpida Memory has completed development of a 30nm-class 2Gb DDR3 SDRAM for PCs and consumer electronics products, with sample shipments slated for December 2010. Mass production is...

Samsung, Seagate team up to co-develop SSD controllers

Aug 13, 12:39

Samsung Electronics and Seagate Technology have announced plans to jointly develop and cross license controller technologies for enterprise-class solid state drives (SSD).

Hynix posts 2Q10 profits on record sales

Jul 22, 11:16

Hynix Semiconductor has reported net profits of 665 billion won (US$550 million) on consolidated revenues of 3.28 trillion won for the second quarter of 2010. The sales figure marks...

Taiwan DRAM makers still queuing for latest ASML systems

Jul 21, 14:46

The lead time for ASML's latest immersion system, the NXT:1950i, has been extended to almost 12 months, prompting some Taiwan-based DRAM makers to switch to alternative products,...

Micron and Nanya intro 42nm DRAM process, working on 3Xnm

Feb 9, 09:38

Micron Technology and Nanya Technology have unveiled their co-developed 2Gb DDR3 chip using copper-based 42nm DRAM process technology, and said they are also working on a 30nm-class...

42nm 2Gb DDR3

Micron makes gains in 2009 NAND flash market, unseats Hynix in top-3

Feb 2, 16:07

Micron Technology captured a 9.4% share of the global NAND flash market in 2009, exceeding Hynix Semiconductor's share by 0.3pp points, according to DRAMeXchange. Samsung Electronics...

Samsung announces 2Gb DDR3 using 30nm-class technology

Feb 1, 16:31

Samsung Electronics has announced its first 30nm-class DRAM memory has just successfully completed customer evaluations, in 2Gb densities. With DDR3 SDRAM becoming the predominant...

Samsung ramps 30nm-class NAND flash production

Dec 1, 17:10

Samsung Electronics has announced volume production of 3-bit, multi-level-cell (MLC) NAND flash chips using 30nm-class process technology began at the end of November. The chips will...

Samsung 30-nm-class asynchronous DDR NAND flash

Silicon Motion 3Q09 sales up 14% sequentially with narrower loss

Oct 30, 15:22

Silicon Motion Technology, a fabless design house specializing in low-power IC solutions for consumer electronics devices, has announced net sales for the third quarter of 2009 increased...

Samsung shipping 30nm NAND memory cards

May 13, 15:54

Samsung Electronics has announced shipments of its 32GB moviNAND, a new embedded memory card utilizing advanced 30nm-class process technology, have kicked off. The new Samsung card...

46 items [2/2]
Realtime news
  • UMC to start shipping 14nm chips in 1Q17

    Bits + chips | 3min ago

  • China market: Future Mobility to build smart electric car plant in Nanjing

    IT + CE - Newswatch | 6min ago

  • NOR flash prices rise, says report

    Bits + chips - Newswatch | Jan 23, 22:18

  • Taiwan December manufacturing production index up on month, year, says MOEA

    Bits + chips | Jan 23, 22:10

  • Chilisin, Ralec to merge

    Bits + chips - Stockwatch | Jan 23, 21:54

  • Taiwan December unemployment rate down on month, year, says DGBAS

    Bits + chips | Jan 23, 21:52

  • Chilisin to acquire ferrite cores maker Ferroxcube

    Bits + chips - Stockwatch | Jan 23, 21:49

  • PTI 1Q17 sales to beat seasonal patterns, says president

    Bits + chips | Jan 23, 21:47

  • UMC expects wafer shipments to drop 1% in 1Q17

    Bits + chips | Jan 23, 21:31

  • Apple expected to adopt 2.5D glass instead of 3D glass for chassis of new iPhone, say Taiwan makers

    Before Going to Press | Jan 23, 21:33

  • Motech Industries to issue 50 million new shares

    Before Going to Press | Jan 23, 21:32

  • China 2016 economic growth hits 25-year low

    Before Going to Press | Jan 23, 21:31

  • Foxconn Electronics chairman clarifies reported Sharp's ending supply of TV panels for Samsung Electronics

    Before Going to Press | Jan 23, 21:30

  • Sharp president reveals focus for fiscal year 2017 operation, says Nikkei

    Before Going to Press | Jan 23, 21:29

  • Digitimes Research: China AMOLED panel makers technologically inferior to Samsung Display, but may win adoption from China smartphone vendors

    Before Going to Press | Jan 23, 21:25

  • Casetek obtains chassis orders from top-5 China smartphone vendors

    Before Going to Press | Jan 23, 21:24

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  • Samsung+30nm+2GB+LPDDR3+mobile+memory

    Samsung 30nm 2GB LPDDR3 mobile memory

    Samsung Electronics has begun mass producing 2GB and low power double-data-rate 3 (LPDDR3) memory using 30nm-class technology for next-generation mobile devices. The new LPDDR3,...

    Photo: Company, Sep 21.

  • Elpida+Wide+IO+Mobile+RAM

    Elpida Wide IO Mobile RAM

    Elpida Memory has developed 4Gb next-generation mobile memory chips for smartphones, tablet PCs and other mobile devices. The new DRAM achieves compliance with the "Wide IO" international...

    Photo: Company, Nov 21.

  • Samsung+30nm+32GB+RDIMM

    Samsung 30nm 32GB RDIMM

    Samsung Electronics has announced the development of 32GB DDR3 registered dual Inline memory modules (RDIMMs) that use 3D through silicon via (TSV) package technology. Its 30nm-class...

    Photo: Company, Aug 22.

  • Samsung+30nm+DDR4+DRAM

    Samsung 30nm DDR4 DRAM

    Samsung Electronics has completed development of what it calls the industry's first DDR4 DRAM module, using 30nm class process technology. The new DDR4 DRAM module can achieve data...

    Photo: Company, Jan 5.

  • Samsung+8Gb+OneNAND+for+smartphones

    Samsung 8Gb OneNAND for smartphones

    Samsung Electronics has announced availability of an 8Gb OneNAND chip that takes advantage of advanced 30nm class process technology. Based on a single-level-cell (SLC) NAND flash...

    Photo: Company, May 12.

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Display panels for wearable devices

24-Jan-2017 09:45 (GMT+8)

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Analysis of China revised domestic semiconductor industry goals
  • Wireless broadband developments in Southeast Asia markets

    As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.

  • 2015 global tablet demand forecast

    This Digitimes Research Special Report provides a 2015 forecast for the global tablet market and analyzes the strategies of key market players such as Google, Apple, Intel, and Microsoft.

  • 2015 China smartphone panel trend forecast

    This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.