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Wednesday 13 September 2023
Qualcomm to continue supplying 5G chips to Apple through 2026
Qualcomm said Monday that it will continue to supply Apple with 5G modem chips through 2026, raising concerns about the progress of Apple's in-house developed 5G chip.
Monday 11 September 2023
3D chiplets to steer the next advanced packaging trend
Advanced packaging and testing have become the hottest topics in the semiconductor industry in 2023, with TSMC's CoWoS packaging technology experiencing extremely high demand due...
Friday 1 September 2023
Semiconductor downturn eclipses strong AI demand, says Broadcom
In spite of strong demand for chips thanks to the generative AI, Broadcom expects the semiconductor soft landing to continue, eclipsing other growth engines for the company.
Wednesday 30 August 2023
GF announces advancements in automotive and RF industries
GlobalFoundries has enhanced two of its technology platforms to enable critical applications for next-generation electric and autonomous vehicles, along with commitments from automotive...
Monday 31 July 2023
TSMC reportedly invited to set up CoWoS packaging capacity in US, Japan
In light of the severe shortage of CoWoS (chip-on-wafer-on-substrate) packaging capacity for AI GPUs now in hot demand, the US and Japan reportedly are aggressively re-inviting TSMC...
Thursday 20 July 2023
Long lead time for US network chip giants opens the door to Taiwan-based competitors
Broadcom and Marvell continue to operate on extended delivery schedules, even though the chip shortage has largely been addressed. Despite the alleviation of the supply-demand imbalance...
Monday 17 July 2023
Wi-Fi 7 SoC makers set to embrace first wave of demand in 2H23
With end-market devices accelerating incorporating Wi-Fi 7 capability into their products, chipmakers including Broadcom, Qualcomm and MediaTek are optimistic that the first wave...
Friday 14 July 2023
Backend fab toolmakers see short lead-time orders from TSMC
TSMC has stepped up its pace of orders with backend equipment suppliers, as the foundry commences its chip-on-wafer-on-substrate (CoWoS) packaging capacity expansion plan, according...
Thursday 13 July 2023
Broadcom gets nod from EU to acquire VMware
The European Commission approved Broadcom's acquisition deal of VMware with open access and interoperability conditions. VMware is still waiting for FTC's approval on its way to diversify...
Monday 3 July 2023
TSMC sees robust AI chip orders from Nvidia, Broadcom, AMD through 2024
TSMC is expected to see a significant revenue rebound in the second half of the year, which will be driven by not only the launch of new iPhones but also strong demand for AI chips...
Thursday 29 June 2023
TSMC to see fab utilization rates rise substantially
Pure-play foundry TSMC will see its fab utilization rates, notably for sub-7nm process manufacturing, rise substantially in the second half of this year, according to sources at fab...
Monday 26 June 2023
TSMC to build new CoWoS capacity in central Taiwan
TSMC has readied plans to build new CoWoS (Chip on Wafer on Substrate) capacity at its manufacturing complex in the Central Taiwan Science Park (CTSP) to meet a rapid surge in demand...
Monday 26 June 2023
Broadcom announces availability of second-generation Wi-Fi 7 wireless connectivity chips
Broadcom has announced sample availability of its second generation of wireless connectivity chipset solutions for the Wi-Fi 7 ecosystem, spanning Wi-Fi routers, residential gateways,...
Monday 19 June 2023
TSMC sees major clients restart order placements for 2024, advanced process utilization rebounding
TSMC has seen its capacity utilization rates for advanced processes below 7nm rebound slowly since June, and is poised to embrace a new wave of chip demand growth in 2024 as major...
Wednesday 14 June 2023
TSMC CoWoS attracts orders from major HPC and network processor vendors
AMD, Broadcom, Marvell, and Nvidia are among the largest consumers of TSMC's CoWoS (Chip-on-Wafer-on-Substrate) backend technology,