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News tagged manufacturing
  • Last update: Tuesday 17 October 2017 [825 news items]

GigaDevice signs wafer supply contract with SMIC

Sep 19, 10:36

China-based GigaDevice Semiconductor, a maker of flash memory devices and microcontroller (MCU) chips, has signed a strategic agreement on the supply of wafers worth about CNY1.2...

Digitimes Research: Top-5 notebook vendors see on-year shipment declines in August

Sep 18, 11:16

Worldwide top-5 notebook brand vendors' combined shipments grew on month, but decline on year in August. With the consumer notebook sector continuing to lack new innovations to stimulate...

SJSemi, Qualcomm announce qualification of 10nm ultra-high density wafer bumping technology

Sep 18, 11:08

China-based SJ Semiconductor has started the qualification of 10nm ultra-high density wafer bumping for Qualcomm, according to the companies. This represents SJSemi's further improvement...

Marketech seeing orders swell, says report

Sep 15, 12:22

Fab toolmaker Marketech International has seen its backlog of orders reach a record NT$13.6 billion (US$452 million), according to a recent Chinese-language Economic Daily News...

IC packager ASE reportedly enters Amazon supply chain

Sep 15, 11:04

Advanced Semiconductor Engineering (ASE) has cut into the supply chain for Amazon's datacenter construction set to begin between 2017 and 2018, by providing 2.5D IC packaging services...

SEMICON Taiwan 2017: Brewer Science showcasing innovative materials for EUV and 3D IC manufacturing

Sep 14, 13:44

With the semiconductor-manufacturing industry needing the high computing power that can only be achieved through advanced node logic and memory, as well as the heterogeneous-integration...

Gudeng obtains FOUP orders from China 12-inch foundries

Sep 14, 11:37

Gudeng Precision Industrial has obtained front opening unified pod (FOUP) orders from a number of 12-inch foundries including United Semiconductor (Xiamen), Huali Microelectronics...

QuickLogic offers eFPGA technology on SMIC 40nm low leakage process

Sep 13, 14:45

Semiconductor Manufacturing International (SMIC) and QuickLogic have announced the availability of QuickLogic's ArcticPro embedded FPGA (eFPGA) technology on SMIC's 40nm low leakage...

SEMICON Taiwan 2017: KLA-Tencor showcasing reticle blank inspection tools

Sep 13, 14:44

At the ongoing SEMICON Taiwan 2017, KLA-Tencor is showcasing its new FlashScan reticle blank inspection product line which represents the company's entry into the dedicated reticle...

China to enhance local memory industry development

Sep 13, 14:36

The China high-end IC Alliance (CHICA), which was set up by China's National Semiconductor Industry Investment Fund (known as the Big Fund) earlier in 2017, is looking to add another...

SEMICON Taiwan 2017: Focus on IoT, AI, smart applications

Sep 13, 14:28

The 22nd annual SEMICON Taiwan trade show has kicked off in Taipei, running from September 13-15, with this year's theme focusing on IoT, AI, smart manufacturing, smart transportation...

SEMICON Taiwan enters its 22nd year

TSMC starts equipment move-in at Nanjing plant

Sep 13, 14:21

TSMC on September 12 held a ceremony to mark the start of equipment move-in at its new 12-inch wafer plant in Nanjing, China.

TSMC chairman Morris Chang at the ceremony to mark the start of equipment move-in at the company's

Global semiconductor equipment billings hit record in 2Q17, says SEMI

Sep 12, 14:55

Worldwide billings for semiconductor manufacturing equipment reached US$14.1 billion in the second quarter of 2017, exceeding the record level set in the first quarter, according...

TSMC August revenues increase 28%

Sep 8, 15:50

Taiwan Semiconductor Manufacturing Company (TSMC) has announced August consolidated revenues increased 28.4% sequentially to NT$91.92 billion (US$3.06 billion).

SPIL obtains packaging orders for AMD Vega 11 GPUs

Sep 8, 15:17

AMD will continue to contract Globalfoundries to manufacture its next-generation Vega GPUs, and will have Siliconware Precision Industries (SPIL) as its major packager for the chips,...

TSMC CoWoS eyeing bigger presence in supercomputer field

Huawei partners with Dassault to add 3DExperience into cloud platform

Sep 8, 14:54

Huawei and France-based software designer Dassault Systemes have signed a memorandum of understanding (MoU) for working closely to enable the latter's 3DExperience platform to run...

TSMC clarifies report on antitrust investigation

Sep 7, 10:39

Taiwan Semiconductor Manufacturing Company (TSMC) has responded to media reports indicating the company is facing EU and US antitrust investigations by saying it has not received...

Pegatron makes new investment in China

Sep 1, 12:28

Pegatron has announced that its three investment subsidiaries will invest a total of US$78.95 million in a newly established subsidiary that is wholly owned by Casetek Holding.

Pegatron subsidiaries investing in new firm in China

IC material supplier Wahlee obtains dry-film photoresist orders

Aug 31, 12:24

Semiconductor material distributor Wahlee Industrial has obtained dry-film photoresist orders from Taiwan-based PCB firms for the production of substrate-like PCBs (SLP), according...

Samsung seeking long-term supply contracts with wafer firms

Aug 30, 13:34

Samsung Electronics is striving to sign long-term supply contracts with multiple wafer makers to ensure sufficient silicon wafer supplies for the manufacture of memory chips and logic...

A new Samsung fab in Pyeongtaek to focus on 64-layer 3D NAND flash production

GigaDevice draws investment from China state-backed fund

Aug 30, 13:25

China-based GigaDevice Semiconductor has obtained investment from China's National IC Industry Investment Fund, commonly known as the Big Fund, according to the maker of flash memory...

Nidec to acquire SV Probe

Aug 29, 10:20

Japan-based Nidec has announced plans to acquire SV Probe, a Singapore-based probe card manufacturer, through subsidiary Nidec-Read. A stock purchase agreement has been reached between...

Worldwide wearable device sales to grow 17% in 2017, says Gartner

Aug 25, 14:48

Gartner forecasts that 310.4 million wearable devices will be sold worldwide in 2017, an increase of 16.7% from 2016. Sales of wearable devices will generate revenues of US$30.5 billion...

Xintec loss widens in 1H17

Aug 25, 11:34

Image sensor packaging specialist Xintec saw its losses widen to NT$609 million (US$20 million) in the first half of 2017, with EPS reaching negative NT$2.25.

Taiwan July manufacturing production index up on year

Aug 24, 11:04

Taiwan recorded manufacturing production index (2011 as base year) of 113.45 for July 2017, decreasing 0.07% on month but increasing 2.94% on year, according to the Ministry of Economic...

China could enhance its position in post-Moore's Law era, says former TSMC COO

Aug 23, 14:04

China's semiconductor industry could have a chance of strengthening its position in the post-Moore's Law era, according to Shang-yi Chiang, former executive VP and co-chief operating...

Chiang

China PCB firms step up capacity expansion

Aug 22, 12:09

China-based PCB manufacturers including Suzhou Dongshan Precision Manufacturing (DSBJ) and Jiangxi Holitech Technology have moved to expand their production capacities eyeing a bigger...

China PCB firms expanding production capacity

Compal reportedly to sell stake in China JV soon

Aug 22, 11:26

Compal Electronics has started to relocate its executives at LCFC (Hefei) Electronics Technology - the notebook manufacturing joint venture between the ODM and Lenovo - back to the...

Qualcomm developing 3D depth sensing technology

Aug 22, 11:14

Qualcomm is partnering with its ecosystem partners to develop 3D depth sensing technology, which will be applied to Andriod smartphones powered the Snapdragon mobile chips, according...

Qualcomm is developing 3D depth sensing technology

Mitac to invest in India-based IT manufacturer

Aug 22, 11:08

Mitac Holding has announced a plan to invest in India-based Infopower Technologies and will become a major shareholder of the firm. Infopower is a manufacturer of printed circuit...

Mitac

Global 2Q17 NAND flash market posts 8% growth, says DRAMeXchange

Aug 22, 10:51

The worldwide NAND flash memory market posted revenues of US$13.22 billion in the second quarter of 2017, up 8% sequentially, according to DRAMeXchange.

Qualcomm to extend tie-up with TSMC, says executive

Aug 21, 13:50

Qualcomm has been working with Taiwan's semiconductor firms for years, including an almost 10-year collaboration with TSMC, said Sudeepto Roy, VP of engineering for Qualcomm Technology...

Qualcomm will extend its collaboration with TSMC to FinFET process

Global DRAM revenues increase 17% in 2Q17, says DRAMeXchange

Aug 21, 11:34

Sales in the global DRAM market surged 16.9% sequentially to US$16.51 billion in the second quarter of 2017, when PC DRAM contract prices rose over 10%, according to DRAMeXchange...

China market: IoT chip demand promising, says ARM CEO

Aug 18, 16:14

Shipments of ARM-based mobile chips from China-based chipmakers have been rising rapidly along with the country's fast-growing IC design industry over the past 10 years, according...

arm CEO Simon Segars

ASE output hit by power outage

Aug 16, 21:25

A sudden massive blackout took place in Taiwan on August 15 which hit Advanced Semiconductor Engineering's (ASE) plants in Kaohsiung. The incident will likely result in losses of...

825 items [2/24]
Realtime news
  • Taiwan market: Lenovo ramping gaming models to expand PC market share

    Before Going to Press | 2h 56min ago

  • Digitimes Research: Global AR/VR HMD device shipments to grow at CAGR of 41.6% in 2017-2022

    Before Going to Press | 2h 59min ago

  • Smartphone panel prices remain steady in October

    Before Going to Press | 3h 1min ago

  • Motech, Giga Solar to form PV module JV

    Before Going to Press | 3h 35min ago

  • AUO expanding its deployment in PV segment

    Before Going to Press | 3h 43min ago

  • Goodix obtains fingerprint sensor orders for new Huawei devices

    Before Going to Press | 3h 49min ago

  • Nanya begins volume shipments of 20nm 4Gb DDR3 chips

    Before Going to Press | 3h 54min ago

  • Kinsus 4Q17 revenues to rise up to 20%, says report

    Before Going to Press | 3h 57min ago

  • MediaTek to post slight decrease in 4Q17 revenues

    Before Going to Press | 4h 1min ago

  • China market: ZTEWelink wins NB-IoT module orders from China Mobile

    Before Going to Press | 4h 1min ago

  • HiSilicon seeking second-source suppliers for 7nm chips

    Before Going to Press | 4h 6min ago

  • Adata pre-tax profits hike 110% in 3Q17

    Before Going to Press | 4h 15min ago

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  • Samsung+12Gb+LPDDR4+DRAM

    Samsung 12Gb LPDDR4 DRAM

    Samsung Electronics has announced that it is mass producing 12Gb LPDDR4 (low power, double data rate 4) mobile DRAM chips based on its 20nm process technology. The new LPDDR4 is...

    Photo: Company, Sep 18.

  • Intel+sixth%2Dgeneration+Core+processor

    Intel sixth-generation Core processor

    Intel has introduced the sixth-generation Core processor family for a range of device designs - from the ultra-mobile compute stick, to 2-in-1s and high-definition all-in-one desktops,...

    Photo: Company, Sep 3.

  • 3D+NAND+die+with+M%2E2+SSD

    3D NAND die with M.2 SSD

    Intel and Micron have jointly announced the availability of their 3D NAND technology. This new 3D NAND technology, jointly developed by the companies, stacks layers of data storage...

    Photo: Company, Apr 7.

  • Samsung+3D+V%2DNAND+SSD

    Samsung 3D V-NAND SSD

    Samsung Electronics has introduced a solid state drive (SSD) based on its 3D V-NAND technology. The new SSD, unveiled during a keynote at the Flash Memory Summit 2013 in California,...

    Photo: Company, Aug 19.

  • Applied+SEMVision+G6+defect+analysis+system+

    Applied SEMVision G6 defect analysis system

    Applied Materials has announced a suite of new defect review and classification technologies for its SEMVision family of products to accelerate time to yield for leading-edge chip...

    Photo: Company, Jul 15.

Global notebook shipment forecast, 2017 and beyond
Global AP demand forecast, 2017-2020

17-Oct-2017 markets closed

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Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Taiwan server shipment forecast and industry analysis, 2017

    Digitimes Research estimates that revenues from sales of server motherboards, servers, storage systems and related network system equipment by Taiwan-based vendors reached NT$555.8 billion in 2016 and the amount is estimated to grow 5.9% on year in 2017.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.