UMC holds groundbreaking ceremony for new facilities at 12-inch fab

May 24, 16:26

United Microelectronics (UMC) on May 24 held a groundbreaking ceremony for the fifth and sixth phase (P5 and P6) construction of its 12-inch plant located in southern Taiwan. Equipment...

North America fab tool book-to-bill slips in April 2012, says SEMI

May 23, 14:56

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.10 in April 2012, down from 1.12 in March, according to SEMI.

UMC to break ground for new factories at Fab 12A

May 15, 12:09

United Microelectronics (UMC) will soon break ground for the fifth and sixth phase construction of its 12-inch fab located at the Southern Taiwan Science Park (STSP), according to...

Commentary: AUO halting new fab plans puts government policy in dilemma

Apr 19, 01:00

Taiwan's National Science Council (NSC), which has overseen the establishment of major science industry parks in Taiwan over the past years, has been pushed into a political storm...

TSMC in race to buy ProMOS fab

Apr 16, 10:28

Taiwan Semiconductor Manufacturing Company (TSMC) has entered the race to buy the 12-inch wafer fab of ProMOS Technologies, which is seeking new funds and investors to restructure...

TSMC begins further expansion of Fab 14

Apr 9, 12:03

TSMC on April 9 held a groundbreaking ceremony at the South Taiwan Science Park in Tainan for Phase 5 of its Fab 14 Gigafab. Following TSMC's Fab 12 Phase 6 in Hsinchu, this facility...

TSMC to fab Dialog chips used in Apple devices, says report

Newswatch - Mar 30, 11:56

Taiwan Semiconductor Manufacturing Company (TSMC), which reportedly has cut into the supply chain for the existing iPhones and iPads through providing foundry services for Broadcom,...

North America fab tool book-to-bill climbs above parity

Mar 26, 10:22

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.01 in February 2012, above parity for the first time in 17 months, according to figures...

Fab equipment spending poised to hit record in 2013, says SEMI

Mar 12, 16:06

Semiconductor fab equipment spending will remain flat at US$38.85 billion in 2012, but climb to a record US$45.5 billion in 2013, according to estimates made by SEMI.

North America fab tool book-to-bill up in January 2012, says SEMI

Feb 24, 12:31

North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.95 for January 2012, up from 0.85 in the prior month and scoring the highest since May...

Japan fab tool book-to-bill climbs above parity

Jan 31, 15:10

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.20 in December 2011, above parity for the first time in 10 months, according to figures from...

Chip fab spending set to decline in 2012, says SEMI

Jan 11, 15:47

Semiconductor fab equipment spending is expected to decline by approximately 11% in 2012, according to SEMI's preliminary forecast. Spending is projected to drop in the first half...

Japan fab tool book-to-bill nears 1.0, says SEAJ

Dec 20, 14:33

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.97 for November 2011, up from 0.83 in October, according to new figures from the Semiconductor...

TSMC to begin third-phase construction at Fab 15

Dec 9, 01:35

Taiwan Semiconductor Manufacturing Company (TSMC) will soon break ground for the third phase construction of its new 12-inch wafer plant in central Taiwan. according to an invitation...

Samsung Austin Semiconductor ramps new 12-inch fab

Dec 6, 12:05

Samsung Austin Semiconductor, Samsung Electronics' only wafer fabrication plant located outside Korea, has announced the completion of its 300mm automated fab, S2.

Toshiba to shut three fabs, cutting chip production

Dec 1, 01:05

Toshiba on November 30 announced a reorganization of its semiconductor production facilities in Japan, aimed at reinforcing the operating structure and profitability of its discrete,...

ON Semiconductor to shut Japan fab

Oct 18, 16:53

ON Semiconductor has announced plans to close its wafer manufacturing facility located in Aizu, Japan, by the end of June 2012.

TSMC Solar readies new CIGS fab

Oct 17, 10:59

TSMC Solar, a wholly-owned subsidiary of Taiwan Semiconductor Manufacturing Company, has announced that it recently completed equipment move-in in preparation for commercial production...

Samsung new memory fab goes on line

Sep 23, 01:30

Samsung Electronics has announced that its new memory semiconductor fabrication facility, Line-16, at its Nano City Complex in Hwaseong, Gyeonggi Province, has commenced operations...

Rexchip might ramp R2 for Elpida

Sep 16, 01:20

Elpida Memory is likely to remove some of its production lines from Japan to Rexchip Electronics's second 12-inch fab, R2, which has been left idle since the shell construction was...

SEMI downgrades forecast for 2011 fab-tool spending, but still sees record year

Sep 7, 10:47

SEMI's latest statistics suggests that capital expenditure will increase to US$41.1 billion in 2011, the highest on record, according to the industry association. The prediction is...

Globalfoundries, Samsung extend fab sync

Sep 2, 01:00

Globalfoundries and Samsung Electronics have jointed announced they expect to broaden collaboration, and synchronize global semiconductor fabrication facilities to produce chips based...

Intel investment reduction plans may affect PC and semiconductor players

Sep 1, 01:15

Intel, facing weak PC performance, reportedly is considering to temporarily halt its plans to upgrade to a 22nm process at Fab 24, and has decided to delay the launch of its next-generation...

IDT to sell Oregon fab for US$26 million

Aug 30, 13:56

Integrated Device Technology (IDT) has announced that it intends to sell its Hillsboro, Oregon wafer fabrication facility and related assets to Alpha and Omega Semiconductor (AOS),...

Macronix allocates more capacity to flash production

Jul 28, 17:00

Macronix International has said that capacity at its newly-opened 12-inch fab has almost all shifted to NOR flash production to meet demand for new orders. The capacity was originally...

Samsung said to ramp new fab in September

Jul 14, 01:00

Samsung Electronics is expected to open a new memory semiconductor fabrication plant in September, according to industry sources. Dubbed Line-16, the facility will be focused on the...

PTI developing advanced packaging technologies

Jul 1, 01:10

Packaging and testing firm Powertech Technology (PTI) expects the development of new technologies including wafer-level packaging, 3D IC packaging and copper pillar bumping to bear...

ProMOS sells China subsidiary with 8-inch fab

May 24, 01:10

Taiwan-based DRAM maker ProMOS Technologies on May 23 announced the sale of ProMOS (Chongqing) Technologies, its wholly owned subsidiary semiconductor maker located in Xiyoung Micro-electronics...