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News tagged fab
  • Last update: Tuesday 24 March 2015 [275 news items]

Huahong Grace to expand 8-inch fab capacity

Oct 21, 22:03

Huahong Grace Semiconductor, established by a merger between Hua Hong Semiconductor and Grace Semiconductor Manufacturing, is set to expand capacity at Fab 3 in 2014.

Digitimes Research: Panel makers take different fab routes in developing high-end panels

Oct 18, 11:23

As demand for 300ppi and above smartphones and tablets continues to strengthen in the market, Japan- and Korea-based panel makers are looking to develop the technology on their 6G...

Micron Hiroshima fab to ramp up mobile DRAM output in 4Q13, say sources

Oct 14, 21:02

Production capacity at Micron Technology's DRAM fab in Hiroshima, Japan, which was formerly owned by Elpida Memory, will ramp up by 20% through upgrading its 30nm process to 25nm,...

US fab tool book-to-bill ratio slips below parity, says SEMI

Sep 23, 14:03

The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment slid to 0.98 in August 2013 after having stayed above parity for seven months.

Fab equipment spending to rise 25% in 2014, says SEMI

Sep 4, 11:04

Capital expenditure for semiconductor fab equipment spending will increase to US$39.8 billion in 2014, the highest on record, according to SEMI.

Toshiba breaks ground for Phase 2 of Fab 5

Aug 23, 16:18

Toshiba on August 23 held a groundbreaking ceremony in readiness for the start of construction of Phase 2 of Fab 5, a NAND flash fab located at the company's Yokkaichi operations...

Macronix ramping utilization rate at 12-inch fab

Jul 31, 11:50

Macronix International managed to ramp up the capacity utilization rate of its 12-inch fab to 88% in the second quarter of 2013, while beginning to transform its 8-inch fab into a...

UMC reportedly to build a 12-inch fab in China

Jul 16, 22:06

United Microelectronics Corporation (UMC) reportedly plans to spend US$300 million to set up a 12-inch fab in Xiamen, China in cooperation with the local government. The planned 12-inch...

Applied lands 8.5G and 5.5G fab equipment orders from BOE

Jul 4, 14:00

Applied Materials announced recently that China-based LCD panel supplier BOE Technology has placed "significant" equipment orders for 8.5G and 5.5G production lines installed...

US fab tool book-to-bill stays above parity in May 2013, says SEMI

Jun 21, 15:07

The book-to-bill ratio for North America-made semiconductor equipment was unchanged in May 2013 from the previous month's level, but remained above one for the fifth consecutive month,...

Global 1Q13 fab tool billings and bookings drop from year ago, says SEMI

Jun 13, 11:25

SEMI has reported that worldwide semiconductor manufacturing equipment billings reached US$7.31 billion in the first quarter of 2013. The billings figure is 8% higher than the fourth...

Fab equipment spending to soar in 2H13, says SEMI

Jun 6, 12:46

Fab equipment spending for the second half of 2013 is expected to be much stronger with a 32% growth rate or US$18.5 billion compared to the first half of the year, according to SEMI...

SMIC forms joint venture to establish new wafer fab in Beijing

Jun 4, 19:36

Semiconductor Manufacturing International (SMIC) has announced that the company and its subsidiary SMIC Beijing have entered into a joint venture with Beijing Industrial Development...

Powerchip to sell 12-inch fab tools for NT$6 billion, says report

Newswatch - Apr 25, 16:16

Powerchip Technology's planned sale of individual production equipment installed at its P3 12-inch wafer fab has come to a conclusion, with 10 companies looking to make their purchases...

Fab tool book-to-bill ratios mixed

Apr 22, 14:25

The book-to-bill ratio for North America-based semiconductor equipment manufacturers grew to 1.14 in March 2013, while Japan's ratio slipped below parity.

TSMC to install 20nm fab equipment ahead of schedule, says report

Apr 2, 11:48

Taiwan Semiconductor Manufacturing Company (TSMC) plans to begin installing production equipment at its 20nm-capable facilities on April 20, about two months ahead of schedule, according...

ProMOS, Globalfoundries agree on sale of 12-inch fab equipment

Mar 28, 16:22

Taiwan-based ProMOS Technologies announced on March 28 that the company has agreed with Globalfoundries on the sale of more than 1,000 items of production equipment installed at its...

LFoundry to take over Micron Italy fab

Feb 27, 15:56

Micron Technology and LFoundry have entered into agreements for LFoundry to acquire Micron Technology Italia, Srl. and all of its semiconductor fabrication facility assets in Avezzano,...

Globalfoundries reportedly shifting interest to ProMOS fab

Feb 26, 12:31

Speculation has circulated in the DRAM industry recently that Globalfoundries may be now more instereted in acquiring ProMOS Technologies' 12-inch wafer fab than taking over equipment...

Powerchip to end P3 fab production at end of 1Q13

Feb 7, 13:47

Powerchip Technology, as most of the production equipment at its 12-inch P3 fab has been sold to Globalfoundries and Texas Instruments, will end production at the fab at the end of...

Globalfoundries, TI beat rivals to buy Powerchip 12-inch fab equipment

Jan 29, 22:00

Globalfoundries and Texas Instruments (TI) reportedly have defeated a group of Taiwan-based niche memory chip providers to win the rights for the purchase of a major portion of the...

Globalfoundries, TI in bid to purchase Powerchip 12-inch fab equipment

Jan 28, 22:59

Globalfoundries and Texas Instruments (TI) have both provided offers to acquire part of the equipment installed at Powerchp Technology's P3 12-inch plant, bringing uncertainty to...

North America fab tool book-to-bill continues growth, says SEMI

Jan 28, 14:07

North America-based semiconductor equipment manufacturers posted a book-to-bill ratio of 0.92 in December 2012, up for the third consecutive month, according to SEMI.

Nanya says 12-inch fab capacity for fabless customers sufficient

Jan 22, 15:01

Nanya Technology is confident that it will have enough capacity for its IC design customers, according to company president Charles Kau.

ESMT to acquire part of Powerchip foundry fab

Stockwatch - Jan 21, 22:31

Elite Semiconductor Memory Technology (ESMT), a Taiwan-based provider of niche-market memory chips, has announced plans to buy part of the facilities at one of Powerchip Technology's...

Powerchip likely to keep P3 fab

Jan 18, 10:28

High-level executives at Powerchip Technology and several Taiwan-based niche-market memory suppliers together visited Taiwan's Industrial Development Bureau (IDB) under the Ministry...

Fab spending to fall another 9.7% in 2013, Gartner says

Dec 20, 11:02

Worldwide wafer fab equipment spending is forecast to total US$27 billion in 2013, a 9.7% decline from 2012, according to Gartner. In 2012, spending is on pace to reach US$29.9 billion,...

ProMOS fails again to sell 12-inch fab

Dec 12, 22:09

ProMOS Technologies failed, for the second time, on December 12 to sell its 12-inch fab located in Taichung, central Taiwan, through an open bid despite offerings from Vanguard International...

Opening bids for ProMOS 12-inch fab delayed

Newswatch - Nov 29, 15:18

ProMOS Technologies was originally scheduled to determine a buyer for its 12-inch fab located in Taichung, central Taiwan, in an open bid held today (November 29). However, as bidders...

VIS likely to win bid to take up ProMOS 12-inch fab

Nov 28, 22:04

ProMOS Technologies will hold an open bid to liquidate its 12-inch fab at the Central Taiwan Science Park (CTSP) on November 29. Some industry watchers believe that Vanguard International...

Powerchip may sell 12-inch fab equipment and land separately

Nov 28, 21:31

Powerchip Technology may tear down its P3 12-inch fab and sell the production equipment and land separately if it cannot liquidate the plant in one lot. Potential buyers including...

VIS in bid to acquire ProMOS 12-inch fab

Nov 26, 10:39

Faced with increased competition from Powerchip Technology in the LCD driver IC foundry sector, Vanguard International Semiconductor (VIS) is actively pursuing a bid to acquire ProMOS...

TSMC starts phase 6 construction of Fab 14

Nov 26, 10:31

Taiwan Semiconductor Manufacturing Company (TSMC) on November 23 held a groundbreaking ceremony for the sixth-phase construction of its Fab 14, a 12-inch wafer plant located in the...

Green buildings: Q&A with Arthur Chuang, director of TSMC's New Fab Planning and Engineering Division

Nov 22, 12:06

Taiwan Semiconductor Manufacturing Company (TSMC) has received Leadership in Energy and Environmental Design (LEED) certifications for its green buidlings. Digitimes recently sat...

Arthur Chuang, director of TSMC's New Fab and Engineering Division

ProMOS to sell fab by year-end, become fabless

Nov 6, 11:11

ProMOS Technologies has announced plans to sell its 12-inch wafer plant and related facilities through open bidding by the end of 2012, in a move to become a fabless memory-IC comp...

ProMOS to become fabless
275 items [2/8]
  • KLA%2DTencor+2910+series+optical+inspection+system+and+eDR%2D7100+e%2Dbeam+review+tool

    KLA-Tencor 2910 series optical inspection system and eDR-7100 e-beam review tool

    KLA-Tencor has announced the new 2910 series optical wafer defect inspection platform with NanoPoint technology and the new eDR-7100 electron-beam wafer defect review system. Meeting...

    Photo: Company, Jul 18.

  • KLA%2DTencor+Surfscan+SP3

    KLA-Tencor Surfscan SP3

    KLA-Tencor has announced a new generation in the Surfscan family of wafer defect and surface quality inspection systems: the Surfscan SP3. As the first unpatterned wafer inspection...

    Photo: Company, Jul 18.

  • KLA%2DTencor+Archer+300+LCM+metrology+system

    KLA-Tencor Archer 300 LCM metrology system

    KLA-Tencor has introduced the Archer 300 LCM Metrology system, which offers precision and measurement speed significantly better than that of its predecessor - the Archer 200, and...

    Photo: Company, Jun 25.

  • Applied+iSYS+

    Applied iSYS

    Applied Materials has unveiled what it claims is the industry's first fully-integrated abatement and vacuum pumping solution for controlling emissions in the semiconductor fab. ...

    Photo: Company, Dec 2.

  • Applied+Materials+Solar+Technology+Center+in+China

    Applied Materials Solar Technology Center in China

    Applied Materials has opened an advanced solar research and demonstration facility in Xian, China. The Solar Technology Center is comprised of laboratory and office buildings covering...

    Photo: Company, Oct 30.

High-brightness LED market trends and forecast, 2015
Analysis of China revised domestic semiconductor industry goals

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