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News tagged fab
  • Last update: Monday 23 November 2015 [303 news items]

Globalfoundries reportedly to likely delay 14nm ramp-up

Dec 30, 14:17

Globalfoundries has stopped deliveries of tools for 14nm to its fab, which would delay the foundry's production ramp-up of the process by one to two quarters, according to an industry...

Korea and Taiwan companies control 56% of global 300mm fab capacity, says IC Insights

Dec 24, 10:48

South Korea- and Taiwan-based chip companies are well known for manufacturing prowess when it comes to efficiently fabricating huge amounts of IC wafers. Most of the IC industry's...

US fab tool book-to-bill ratio rises above parity, says SEMI

Dec 23, 15:14

The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment rose to 1.02 in November 2014 from 0.93 in the prior month.

HLMC said to invest NT$100 billion to build new fab

Dec 22, 21:36

Shanghai Huali Microelectronics (HLMC) will invest around NT$100 billion (US$3.2 billion) to build a new 12-inch wafer fab in 2015, according to industry sources.

Demand for 8-inch fab equipment rises

Dec 19, 11:09

Demand for 8-inch fab tools, particularly used equipment, has risen significantly, as foundries are gearing up for their 8-inch fab expansion to grasp the rising IoT opportunity,...

SMIC Shenzhen 8-inch fab goes into operation

Dec 17, 20:43

Semiconductor Manufacturing International (SMIC) has begun operations at its Shenzhen 200mm (8-inch) wafer fab, according to the China-based IC foundry.

IC foundries gearing up for 8-inch fab expansions

Dec 17, 11:10

China-based IC foundry Semiconductor Manufacturing International (SMIC) is looking to expand production capacity at its 8-inch wafer fab in Shenzhen, while Taiwan Semiconductor Manufacturing...

US fab tool book-to-bill ratio stays below parity, says SEMI

Nov 21, 15:09

The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment came to 0.93 in October 2014, staying below parity for the second consecutive month.

VIS hiking production at 8-inch fab

Oct 20, 11:45

Wafer foundry service provider Vanguard International Semiconductor (VIS) has increased monthly output at its 8-inch Fab 3 to 26,000 wafers since September and will increase to 27,000-28,000...

UMC to build 12-inch fab in Xiamen, keep 28/14nm production in Taiwan

Oct 13, 13:56

Having reached an agreement to invest in a 12-inch fab in Xiamen, China recently, United Microelectronics Corporation (UMC) has insisted that it will keep its advanced manufacturing...

China promoting development of MEMS industry

Sep 16, 14:59

In view of strong demand for MEMS components from China-based smartphone vendors, the China government has been promoting the development of the local MEMS industry by teaming up...

EPA passes initial environmental impact assessment for TSMC planned 18-inch fab

Aug 28, 15:03

A special panel of the Environmental Protection Administration (EPA) has approved the environmental impact assessment for a piece of land designated for construction of an 18-inch...

Samsung to produce DRAM chips at Line-17 fab, causes concerns of oversupply

Aug 21, 13:37

The DRAM and NAND flash chip markets are on alert with spot DRAM prices making a downward correction that could upset contract quotes for September 2014. Prices of NAND flash remain...

SPIL to take over idle ProMOS 12-inch fab for NT$6.4 billion

Aug 19, 22:06

Siliconware Precision Industries (SPIL) has won the bid to take over the idle 12-inch fab of ProMOS Technologies for NT$6.4 billion (US$213.62 million). SPIL will use the fab to develop...

ProMOS idle 12-inch fab is up for grabs

Aug 11, 12:19

A number of semiconductor firms, including Taiwan Semiconductor Manufacturing Company (TSMC), Micron Technology, Globalfoundries and Toshiba, are likely to participate in an open...

Nanya Technology to ramp up 2014 capex

Jul 1, 21:55

Nanya Technology plans to ramp up its capex for 2014 to NT$6.69 billion (US$224 million) from NT$3.05 billion set previously, mainly to remove production bottlenecks at its 12-inch...

GlobalFoundries to upgrade Singapore fab from 8-inch to 12-inch, says senior VP

Jun 30, 22:07

GloablFoundries will upgrade its 8-inch fab in Singapore to a 12-inch fab mainly by having equipment moved from a 12-inch fab in Taiwan that it acquired from Taiwan-based DRAM maker...

Lite-On Semiconductor to expand capacity at 4-inch fab

May 12, 21:49

Taiwan-based discrete device and contact image sensor maker Lite-On Semiconductor will invest NT$800-900 million (US$26.5-29.8 million) to expand annual foundry capacity at its 4-inch...

VIS to increase capital, acquire 8-inch fab

Mar 17, 13:11

Vanguard International Semiconductor (VIS) plans to increase its capital by 22% to NT$1.26 billion (US$41.54 million) for capacity ramps, according to the wafer foundry house.

VIS reportedly to acquire an 8-inch fab from Nanya Technology

Mar 11, 21:53

Vanguard International Semiconductor (VIS) reportedly will acquire an 8-inch fab from Taiwan-based Sumpro Electronic, an affiliate of Nanya Technology. The deal is expected to be...

Fab equipment spending to rise 20-30% in 2014, says SEMI

Mar 6, 14:39

Semiconductor fab equipment spending is forecast to increase 20-30% in 2014, according to SEMI. The uptick to 30% depends on specific fab projects in the Europe/Mideast and Asia regions,...

Intel to cut a deal with Apple for Fab 42?

Feb 13, 14:27

With shipments of desktop and notebooks in the doldrums since 2010, Intel's PC processor business has been in decline. Meanwhile, AMD and others are taking aim at the Intel-dominated...

DRAM supplies to remain tight through 2014

Jan 15, 11:15

The supply of commodity DRAM for PCs is expected to remain tight through the entire year of 2014, despite reports indicating that SK Hynix has resumed wafer start production at its...

Though SK Hynix has gradually resumed production from its fire-hit fab, the facility is suffering p

TSMC to produce fingerprint sensors for next-generation iPhone at 12-inch fab

Jan 13, 21:31

Taiwan Semiconductor Manufacturing Company (TSMC) reportedly will begin producing fingerprint sensors for Apple's next-generation iPhone at its 12-inch fab using a 65nm process in...

ASE, Micron rumored to set up joint venture fab in China

Jan 7, 11:34

Rumors have circulated in the industry that IC packager Advanced Semiconductor Engineering (ASE) and memory chipmaker Micron Technology will set up a joint venture fab in Xi'an, China...

US fab tool book-to-bill rises above parity, says SEMI

Nov 21, 14:10

The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment rose to 1.05 in October 2013 from 0.97 in the prior month.

Restoration of fire-hit SK Hynix China fab likely to be delayed

Oct 29, 22:21

SK Hynix has revealed that it might not be able to resume full operations at its fire-damaged DRAM fab in Wuxi, China by its target timeframe.

North America fab tool book-to-bill continues slide, says SEMI

Oct 22, 14:14

The three-month average book-to-bill ratio for North America-based manufacturers of semiconductor equipment slid to 0.97 in September 2013, down for the third consecutive month, according...

Huahong Grace to expand 8-inch fab capacity

Oct 21, 22:03

Huahong Grace Semiconductor, established by a merger between Hua Hong Semiconductor and Grace Semiconductor Manufacturing, is set to expand capacity at Fab 3 in 2014.

Digitimes Research: Panel makers take different fab routes in developing high-end panels

Oct 18, 11:23

As demand for 300ppi and above smartphones and tablets continues to strengthen in the market, Japan- and Korea-based panel makers are looking to develop the technology on their 6G...

Micron Hiroshima fab to ramp up mobile DRAM output in 4Q13, say sources

Oct 14, 21:02

Production capacity at Micron Technology's DRAM fab in Hiroshima, Japan, which was formerly owned by Elpida Memory, will ramp up by 20% through upgrading its 30nm process to 25nm,...

US fab tool book-to-bill ratio slips below parity, says SEMI

Sep 23, 14:03

The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment slid to 0.98 in August 2013 after having stayed above parity for seven months.

Fab equipment spending to rise 25% in 2014, says SEMI

Sep 4, 11:04

Capital expenditure for semiconductor fab equipment spending will increase to US$39.8 billion in 2014, the highest on record, according to SEMI.

Toshiba breaks ground for Phase 2 of Fab 5

Aug 23, 16:18

Toshiba on August 23 held a groundbreaking ceremony in readiness for the start of construction of Phase 2 of Fab 5, a NAND flash fab located at the company's Yokkaichi operations...

Macronix ramping utilization rate at 12-inch fab

Jul 31, 11:50

Macronix International managed to ramp up the capacity utilization rate of its 12-inch fab to 88% in the second quarter of 2013, while beginning to transform its 8-inch fab into a...

303 items [2/9]
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View more
  • 3D+NAND+die+with+M%2E2+SSD

    3D NAND die with M.2 SSD

    Intel and Micron have jointly announced the availability of their 3D NAND technology. This new 3D NAND technology, jointly developed by the companies, stacks layers of data storage...

    Photo: Company, Apr 7.

  • KLA%2DTencor+2910+series+optical+inspection+system+and+eDR%2D7100+e%2Dbeam+review+tool

    KLA-Tencor 2910 series optical inspection system and eDR-7100 e-beam review tool

    KLA-Tencor has announced the new 2910 series optical wafer defect inspection platform with NanoPoint technology and the new eDR-7100 electron-beam wafer defect review system. Meeting...

    Photo: Company, Jul 18.

  • KLA%2DTencor+Surfscan+SP3

    KLA-Tencor Surfscan SP3

    KLA-Tencor has announced a new generation in the Surfscan family of wafer defect and surface quality inspection systems: the Surfscan SP3. As the first unpatterned wafer inspection...

    Photo: Company, Jul 18.

  • KLA%2DTencor+Archer+300+LCM+metrology+system

    KLA-Tencor Archer 300 LCM metrology system

    KLA-Tencor has introduced the Archer 300 LCM Metrology system, which offers precision and measurement speed significantly better than that of its predecessor - the Archer 200, and...

    Photo: Company, Jun 25.

  • Applied+iSYS+

    Applied iSYS

    Applied Materials has unveiled what it claims is the industry's first fully-integrated abatement and vacuum pumping solution for controlling emissions in the semiconductor fab. ...

    Photo: Company, Dec 2.

Display panels for wearable devices
Taiwan server shipment forecast and industry analysis, 2015

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