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News tagged fab
  • Last update: Wednesday 10 August 2016 [335 news items]

Fingerprint sensor orders filling 8-inch fab capacity

Aug 10, 11:13

Foundries have seen a ramp-up of orders for fingerprint-recognition sensor chips which are filling their 8-inch fab capacity, according to industry sources.

Intel Dalian fab put into operation, says report

Jul 26, 14:34

Intel's 12-inch fab in Dalian has been put into operaton for the manufacture of non-volatile random-access memory (NVRAM) chips, according to a ChinaNews website report.

Fab tool book-to-bill slips

Jul 22, 14:41

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.00 in June, down from 1.09 in May, according to SEMI.

Toshiba, Western Digital open new flash memory fab in Japan

Jul 18, 10:38

Toshiba and Western Digital have jointly announced the opening of a new fab in Yokkaichi, Mie Prefecture, Japan, which will support the conversion of the companies' 2D NAND capacity...

Fujian Jin Hua to break ground for new DRAM fab in mid-July, say reports

Jul 11, 16:00

Fujian Jin Hua Integrated Circuit will break ground for a new 12-inch wafer fab on July 16, according to media reports in China. The facility will be engaged in the manufacture of...

TSMC discloses NT$4.4 billion worth of facility construction for Nanjing site

Stockwatch - Jul 1, 10:55

Taiwan Semiconductor Manufacturing Company (TSMC) has spent NT$4.4 billion (US$136.7 million) on factory building construction with China Construction First Division Group Construction...

UMC orders equipment for Xiamen fab

Stockwatch - Jun 30, 14:25

United Microelectronics (UMC) has purchased NT$562.88 million (US$17.42 million) worth of equipment from ASML for its 12-inch wafer fab in Xiamen, according to a company filing with...

Fab toolmakers seeing significant 12-inch fab expansion in China

Jun 27, 12:39

Capacity expansions are expected to take place at more than 10 12-inch wafer fabs in China over the next five years, according to sources at semiconductor equipment providers, which...

NAND flash supply to fall short in 3Q16, says DRAMeXchange

Jun 21, 14:10

Prices of TLC (triple-level-cell) wafers and spot prices of mainstream memory cards have been on a steady rise for three consecutive months since April 2016. The uptrend will continue...

Samsung fab outage raises flash supply concerns

Jun 21, 11:23

A recent power outage at Samsung's Xian, China fab has disrupted the company's flash production raising concerns that supply of the memory might fall short of demand in the second...

Globalfoundries to expand presence in China with 300mm fab

Jun 1, 14:36

Globalfoundries has announced the signing of a memorandum of understanding to drive its next phase of growth in China. Through a joint venture with the government of Chongqing, the...

TSMC and Nanjing sign 12-inch fab investment agreement

Mar 28, 20:58

Taiwan Semiconductor Manufacturing Company (TSMC) announced on March 28 that the company and the municipal government of Nanjing, China have signed an investment agreement. This agreement...

Micron, PTI JV fab starts operations

Mar 28, 09:23

Micron Technology of the US and Taiwan-based Powertech Technology (PTI) have announced the completion of their joint-venture fab in Xian, China, which has entered volume production...

New XMC memory fab to break ground at end-March, says DRAMeXchange

Mar 22, 13:59

Ground-breaking for Wuhan Xinxin Semiconductor Manufacturing's (XMC) new memory fab in China is set to begin at the end of March, according to DRAMeXchange. The fab is expected to...

Front-end fab equipment spending to rise 3.7% in 2016, says SEMI

Mar 14, 12:54

Front-end fab equipment spending (including new, used and in-house) is projected to increase 3.7% to US$37.2 billion in 2016, and will rise another 13% in 2017 to US$42.1 billion,...

Taiwan passes South Korea to become No.1 in total IC wafer fab capacity, says IC Insights

Mar 1, 15:10

As of December 2015, Taiwan led all regions/countries in wafer capacity with nearly 22% of worldwide IC capacity installed in the country, according to IC Insights. Taiwan surpassed...

Taiwan MOEA approves TSMC 12-inch fab investment in China

Feb 4, 12:38

The Investment Commission of Taiwan's Ministry of Economic Affairs (MOEA) has approved TSMC's proposal to set up a 12-inch wafer fab and a design service center in Nanjing, China...

Tsinghua Unigroup to build own DRAM fab, says report

Feb 2, 12:14

China's state-backed Tsinghua Unigroup reportedly plans to build its own DRAM fab and invite Micron Technology to be a shareholder of the fab, according to a report by Taiwan's Central...

UMC buys equipment from Lam, Tokyo Electron

Stockwatch - Jan 28, 10:08

United Microelectronics (UMC) has purchased a total of NT$1.96 billion (US$58.4 million) worth of equipment from Lam Research and Tokyo Electron for its 12-inch wafer fab in Xiamen,...

LG aims for monthly capacity of 75,000 units on 6G fab in 1H17, says report

Jan 19, 15:24

LG Display has solidified plans to achieve 75,000 substrates in monthly production at its 6G facilities throughout the first half of 2017 for curved OLED displays, according to Korea-based...

UMC buys more equipment for Xiamen fab

Stockwatch - Jan 8, 15:45

United Microelectronics (UMC) has purchased a total of NT$1.98 billion (US$59.5 million) worth of equipment from Murata Machinery and Applied Materials for its 12-inch wafer fab in...

Samsung and TSMC remain top in available wafer fab capacity, says IC Insights

Jan 8, 10:29

IC Insights has provided a ranking of the industry's 10 largest IC manufacturers in terms of installed capacity. Included in the list are four from North America, two from South Korea,...

UMC orders equipment for Xiamen fab

Stockwatch - Jan 6, 20:56

United Microelectronics (UMC) has purchased NT$1.05 billion (US$31.8 million) worth of equipment from KLA-Tencor for its 12-inch wafer fab in Xiamen, according to a company filing...

AUO, Innolux 6G LTPS fab to enter mass production

Jan 5, 15:06

AU Optronics (AUO) expects its 6G LTPS facilities in Kunshan, China to enter mass production in July 2016. The fab will be primarily aimed at providing high-end products to customers...

CEC begins constructing new 8.6G LCD fab

Dec 29, 14:58

China Electronics Corporation (CEC) has kicked off construction of an 8.6G LCD fab in Xianyang, western China that is expected to go into production in August 2017.

New TSMC fab in China likely to target orders for driver ICs, touchscreen solutions

Dec 10, 11:02

Taiwan Semiconductor Manufacturing Company's (TSMC) planned 12-inch wafer fab in China could be vying for 16nm chip orders from China's local IC design houses specializing in the...

SEMI cuts forecast for 2015, 2016 fab equipment spending

Dec 9, 20:21

SEMI has lowered its forecast for the global 2015 semiconductor fab equipment spending growth to 0.5% from the 5% estimated previously. The industry association also revised downward...

Taiwan MOEA confirms receipt of TSMC application for 12-inch fab in China

Dec 7, 23:04

The Investment Commission of Taiwan's Ministry of Economic Affairs (MOEA) has confirmed it has received an application submitted by TSMC for establishing a 12-inch wafer manufacturing...

TSMC applies for 12-inch wafer fab and design service center in China

Dec 7, 15:29

TSMC today submitted an application to the Investment Commission of Taiwan's Ministry of Economic Affairs for an investment project to build a wholly-owned 12-inch wafer manufacturing...

BOE 10.5G fab set to produce large-size, high-resolution panels in 2018

Dec 3, 14:44

China-based panel maker BOE is set to begin construction on a 10.5G fab in February 2016 and finish in 2018. The fab will focus mainly on production of 65-inch and above-size TV panels...

UMC Xiamen fab to go online as early as 3Q16, says report

Dec 2, 11:44

Operations at United Microelectronics' (UMC) 12-inch wafer fab in Xiamen are expected to kick off as early as third-quarter 2016, according to a report from Japan's Nikkei Asian...

RS Technologies to open wafer reclaim fab in Taiwan

Nov 25, 10:58

Japan-based RS Technologies, a provider of wafer reclaim services for the semiconductor industry, will hold an opening ceremony for a new wafer reclaim plant in Tainan, southern Taiwan...

US fab tool book-to-bill ratio slips in October, says SEMI

Nov 23, 11:03

The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment slid to 0.98 in October 2015 after having stayed above parity for three straight months.

LG Display to invest US$4 billion in new OLED fab, says report

Nov 19, 16:04

LG Display plans to invest upwards of US$4 billion in new OLED facilities to meet expected market demand as of 2017 onwards, according to a new report from Korea-based Digital...

BOE to begin constructing 10.5G fab in December

Nov 18, 11:33

China panel maker BOE's long rumored 10.5G line is expected to enter construction in early December 2015, according to China-based supply chain sources.

335 items [1/10]
  • 3D+NAND+die+with+M%2E2+SSD

    3D NAND die with M.2 SSD

    Intel and Micron have jointly announced the availability of their 3D NAND technology. This new 3D NAND technology, jointly developed by the companies, stacks layers of data storage...

    Photo: Company, Apr 7.

  • KLA%2DTencor+2910+series+optical+inspection+system+and+eDR%2D7100+e%2Dbeam+review+tool

    KLA-Tencor 2910 series optical inspection system and eDR-7100 e-beam review tool

    KLA-Tencor has announced the new 2910 series optical wafer defect inspection platform with NanoPoint technology and the new eDR-7100 electron-beam wafer defect review system. Meeting...

    Photo: Company, Jul 18.

  • KLA%2DTencor+Surfscan+SP3

    KLA-Tencor Surfscan SP3

    KLA-Tencor has announced a new generation in the Surfscan family of wafer defect and surface quality inspection systems: the Surfscan SP3. As the first unpatterned wafer inspection...

    Photo: Company, Jul 18.

  • KLA%2DTencor+Archer+300+LCM+metrology+system

    KLA-Tencor Archer 300 LCM metrology system

    KLA-Tencor has introduced the Archer 300 LCM Metrology system, which offers precision and measurement speed significantly better than that of its predecessor - the Archer 200, and...

    Photo: Company, Jun 25.

  • Applied+iSYS+

    Applied iSYS

    Applied Materials has unveiled what it claims is the industry's first fully-integrated abatement and vacuum pumping solution for controlling emissions in the semiconductor fab. ...

    Photo: Company, Dec 2.

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