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News tagged fab
  • Last update: Friday 25 November 2016 [348 news items]

SMIC opens JV fab for analog and specialty IC manufacturing

Nov 25, 10:10

Semiconductor Manufacturing International (SMIC) has announced the official inauguration of Ningbo Semiconductor International (NSI), established by China IC Capital - a wholly-owned...

Spreadtrum places 40nm chip orders with UMC Xiamen fab

Nov 23, 15:50

Spreadtrum Communications has placed 40nm chip orders with United Microelectronics' (UMC) recently-opened 12-inch wafer fab in Xiamen, China, according to industry sources.

US fab tool book-to-bill ratio slips below parity

Nov 23, 15:19

The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment slid to 0.91 in October 2016 after having stayed above parity for 10 straight months.

UMC unveils 12-inch fab in China

Nov 17, 10:08

United Microelectronics (UMC) on November 16 held an opening ceremony for a 12-inch wafer fab in Xiamen, China, according to the Taiwan-based pure-play foundry.

HLMC to break ground for new 12-inch fab in early December

Nov 11, 11:22

Shanghai Huali Microelectronics (HLMC) is scheduled to hold a groundbreaking ceremony in early December for its second 12-inch fab in Shanghai, according to the China-based pure-play...

Toshiba to build new fab for 3D flash memory

Nov 9, 13:42

Toshiba has announced the outline schedule for the construction of a state-of-the-art fabrication facility at Yokkaichi Operations in Mie, Japan, for expanded production of BiCS FLASH,...

Globalfoundries China fab put on hold

Oct 21, 10:19

The government of Chongqing has put on hold a deal with Globalfoundries for a joint venture 12-inch fab, according to industry sources.

China to produce 3D NAND chips as early as end-2017

Oct 18, 11:19

Yangtze River Storage Technology (YRST) will start operating China's first 12-inch fab for the manufacture of NAND flash and DRAM memory at the end of 2016, and is expected to produce...

SMIC breaks ground for new 12-inch fab in Shanghai

Oct 14, 10:57

China-based pure-play foundry Semiconductor Manufacturing International (SMIC) on October 13 held a groundbreaking ceremony for a new 12-inch wafer fab in Shanghai.

Installed 200mm fab capacity rising, says SEMI

Oct 13, 13:42

Installed 200mm fab capacity has increased since 2009. By 2020, capacity is expected to reach 5.5 million wafers per month (wpm), although this is still less than the 2007 peak, according...

China HLMC to build new 12-inch fab

Sep 26, 15:38

Shanghai Huali Microelectronics (HLMC) is expected to announce by the end of 2016 the construction of its second 12-inch plant, which will directly enter 28nm production, according...

China SITRI 8-inch fab ready for MEMS manufacturing

Sep 21, 15:06

The government-sponsored Shanghai Industrial Technology Research Institute (SITRI) has its 8-inch wafer fab targeted specifically at the manufacture of MEMS parts with volume production...

Fab equipment spending trending upwards in 2016 and 2017, says SEMI

Sep 7, 13:44

SEMI has published an August update of its world fab forecast report, which shows increased equipment spending, reaching 4.1% on-year in 2016 and 10.6% in 2017.

Fingerprint sensor orders filling 8-inch fab capacity

Aug 10, 11:13

Foundries have seen a ramp-up of orders for fingerprint-recognition sensor chips which are filling their 8-inch fab capacity, according to industry sources.

Intel Dalian fab put into operation, says report

Jul 26, 14:34

Intel's 12-inch fab in Dalian has been put into operaton for the manufacture of non-volatile random-access memory (NVRAM) chips, according to a ChinaNews website report.

Fab tool book-to-bill slips

Jul 22, 14:41

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.00 in June, down from 1.09 in May, according to SEMI.

Toshiba, Western Digital open new flash memory fab in Japan

Jul 18, 10:38

Toshiba and Western Digital have jointly announced the opening of a new fab in Yokkaichi, Mie Prefecture, Japan, which will support the conversion of the companies' 2D NAND capacity...

Fujian Jin Hua to break ground for new DRAM fab in mid-July, say reports

Jul 11, 16:00

Fujian Jin Hua Integrated Circuit will break ground for a new 12-inch wafer fab on July 16, according to media reports in China. The facility will be engaged in the manufacture of...

TSMC discloses NT$4.4 billion worth of facility construction for Nanjing site

Stockwatch - Jul 1, 10:55

Taiwan Semiconductor Manufacturing Company (TSMC) has spent NT$4.4 billion (US$136.7 million) on factory building construction with China Construction First Division Group Construction...

UMC orders equipment for Xiamen fab

Stockwatch - Jun 30, 14:25

United Microelectronics (UMC) has purchased NT$562.88 million (US$17.42 million) worth of equipment from ASML for its 12-inch wafer fab in Xiamen, according to a company filing with...

Fab toolmakers seeing significant 12-inch fab expansion in China

Jun 27, 12:39

Capacity expansions are expected to take place at more than 10 12-inch wafer fabs in China over the next five years, according to sources at semiconductor equipment providers, which...

NAND flash supply to fall short in 3Q16, says DRAMeXchange

Jun 21, 14:10

Prices of TLC (triple-level-cell) wafers and spot prices of mainstream memory cards have been on a steady rise for three consecutive months since April 2016. The uptrend will continue...

Samsung fab outage raises flash supply concerns

Jun 21, 11:23

A recent power outage at Samsung's Xian, China fab has disrupted the company's flash production raising concerns that supply of the memory might fall short of demand in the second...

Globalfoundries to expand presence in China with 300mm fab

Jun 1, 14:36

Globalfoundries has announced the signing of a memorandum of understanding to drive its next phase of growth in China. Through a joint venture with the government of Chongqing, the...

TSMC and Nanjing sign 12-inch fab investment agreement

Mar 28, 20:58

Taiwan Semiconductor Manufacturing Company (TSMC) announced on March 28 that the company and the municipal government of Nanjing, China have signed an investment agreement. This agreement...

Micron, PTI JV fab starts operations

Mar 28, 09:23

Micron Technology of the US and Taiwan-based Powertech Technology (PTI) have announced the completion of their joint-venture fab in Xian, China, which has entered volume production...

New XMC memory fab to break ground at end-March, says DRAMeXchange

Mar 22, 13:59

Ground-breaking for Wuhan Xinxin Semiconductor Manufacturing's (XMC) new memory fab in China is set to begin at the end of March, according to DRAMeXchange. The fab is expected to...

Front-end fab equipment spending to rise 3.7% in 2016, says SEMI

Mar 14, 12:54

Front-end fab equipment spending (including new, used and in-house) is projected to increase 3.7% to US$37.2 billion in 2016, and will rise another 13% in 2017 to US$42.1 billion,...

Taiwan passes South Korea to become No.1 in total IC wafer fab capacity, says IC Insights

Mar 1, 15:10

As of December 2015, Taiwan led all regions/countries in wafer capacity with nearly 22% of worldwide IC capacity installed in the country, according to IC Insights. Taiwan surpassed...

Taiwan MOEA approves TSMC 12-inch fab investment in China

Feb 4, 12:38

The Investment Commission of Taiwan's Ministry of Economic Affairs (MOEA) has approved TSMC's proposal to set up a 12-inch wafer fab and a design service center in Nanjing, China...

Tsinghua Unigroup to build own DRAM fab, says report

Feb 2, 12:14

China's state-backed Tsinghua Unigroup reportedly plans to build its own DRAM fab and invite Micron Technology to be a shareholder of the fab, according to a report by Taiwan's Central...

UMC buys equipment from Lam, Tokyo Electron

Stockwatch - Jan 28, 10:08

United Microelectronics (UMC) has purchased a total of NT$1.96 billion (US$58.4 million) worth of equipment from Lam Research and Tokyo Electron for its 12-inch wafer fab in Xiamen,...

LG aims for monthly capacity of 75,000 units on 6G fab in 1H17, says report

Jan 19, 15:24

LG Display has solidified plans to achieve 75,000 substrates in monthly production at its 6G facilities throughout the first half of 2017 for curved OLED displays, according to Korea-based...

UMC buys more equipment for Xiamen fab

Stockwatch - Jan 8, 15:45

United Microelectronics (UMC) has purchased a total of NT$1.98 billion (US$59.5 million) worth of equipment from Murata Machinery and Applied Materials for its 12-inch wafer fab in...

Samsung and TSMC remain top in available wafer fab capacity, says IC Insights

Jan 8, 10:29

IC Insights has provided a ranking of the industry's 10 largest IC manufacturers in terms of installed capacity. Included in the list are four from North America, two from South Korea,...

348 items [1/10]
  • 3D+NAND+die+with+M%2E2+SSD

    3D NAND die with M.2 SSD

    Intel and Micron have jointly announced the availability of their 3D NAND technology. This new 3D NAND technology, jointly developed by the companies, stacks layers of data storage...

    Photo: Company, Apr 7.

  • KLA%2DTencor+2910+series+optical+inspection+system+and+eDR%2D7100+e%2Dbeam+review+tool

    KLA-Tencor 2910 series optical inspection system and eDR-7100 e-beam review tool

    KLA-Tencor has announced the new 2910 series optical wafer defect inspection platform with NanoPoint technology and the new eDR-7100 electron-beam wafer defect review system. Meeting...

    Photo: Company, Jul 18.

  • KLA%2DTencor+Surfscan+SP3

    KLA-Tencor Surfscan SP3

    KLA-Tencor has announced a new generation in the Surfscan family of wafer defect and surface quality inspection systems: the Surfscan SP3. As the first unpatterned wafer inspection...

    Photo: Company, Jul 18.

  • KLA%2DTencor+Archer+300+LCM+metrology+system

    KLA-Tencor Archer 300 LCM metrology system

    KLA-Tencor has introduced the Archer 300 LCM Metrology system, which offers precision and measurement speed significantly better than that of its predecessor - the Archer 200, and...

    Photo: Company, Jun 25.

  • Applied+iSYS+

    Applied iSYS

    Applied Materials has unveiled what it claims is the industry's first fully-integrated abatement and vacuum pumping solution for controlling emissions in the semiconductor fab. ...

    Photo: Company, Dec 2.

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Intel strategies in the mobile device market

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