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News tagged fab
  • Last update: Thursday 4 February 2016 [319 news items]

Taiwan MOEA approves TSMC 12-inch fab investment in China

Feb 4, 12:38

The Investment Commission of Taiwan's Ministry of Economic Affairs (MOEA) has approved TSMC's proposal to set up a 12-inch wafer fab and a design service center in Nanjing, China...

Tsinghua Unigroup to build own DRAM fab, says report

Feb 2, 12:14

China's state-backed Tsinghua Unigroup reportedly plans to build its own DRAM fab and invite Micron Technology to be a shareholder of the fab, according to a report by Taiwan's Central...

UMC buys equipment from Lam, Tokyo Electron

Stockwatch - Jan 28, 10:08

United Microelectronics (UMC) has purchased a total of NT$1.96 billion (US$58.4 million) worth of equipment from Lam Research and Tokyo Electron for its 12-inch wafer fab in Xiamen,...

LG aims for monthly capacity of 75,000 units on 6G fab in 1H17, says report

Jan 19, 15:24

LG Display has solidified plans to achieve 75,000 substrates in monthly production at its 6G facilities throughout the first half of 2017 for curved OLED displays, according to Korea-based...

UMC buys more equipment for Xiamen fab

Stockwatch - Jan 8, 15:45

United Microelectronics (UMC) has purchased a total of NT$1.98 billion (US$59.5 million) worth of equipment from Murata Machinery and Applied Materials for its 12-inch wafer fab in...

Samsung and TSMC remain top in available wafer fab capacity, says IC Insights

Jan 8, 10:29

IC Insights has provided a ranking of the industry's 10 largest IC manufacturers in terms of installed capacity. Included in the list are four from North America, two from South Korea,...

UMC orders equipment for Xiamen fab

Stockwatch - Jan 6, 20:56

United Microelectronics (UMC) has purchased NT$1.05 billion (US$31.8 million) worth of equipment from KLA-Tencor for its 12-inch wafer fab in Xiamen, according to a company filing...

AUO, Innolux 6G LTPS fab to enter mass production

Jan 5, 15:06

AU Optronics (AUO) expects its 6G LTPS facilities in Kunshan, China to enter mass production in July 2016. The fab will be primarily aimed at providing high-end products to customers...

CEC begins constructing new 8.6G LCD fab

Dec 29, 14:58

China Electronics Corporation (CEC) has kicked off construction of an 8.6G LCD fab in Xianyang, western China that is expected to go into production in August 2017.

New TSMC fab in China likely to target orders for driver ICs, touchscreen solutions

Dec 10, 11:02

Taiwan Semiconductor Manufacturing Company's (TSMC) planned 12-inch wafer fab in China could be vying for 16nm chip orders from China's local IC design houses specializing in the...

SEMI cuts forecast for 2015, 2016 fab equipment spending

Dec 9, 20:21

SEMI has lowered its forecast for the global 2015 semiconductor fab equipment spending growth to 0.5% from the 5% estimated previously. The industry association also revised downward...

Taiwan MOEA confirms receipt of TSMC application for 12-inch fab in China

Dec 7, 23:04

The Investment Commission of Taiwan's Ministry of Economic Affairs (MOEA) has confirmed it has received an application submitted by TSMC for establishing a 12-inch wafer manufacturing...

TSMC applies for 12-inch wafer fab and design service center in China

Dec 7, 15:29

TSMC today submitted an application to the Investment Commission of Taiwan's Ministry of Economic Affairs for an investment project to build a wholly-owned 12-inch wafer manufacturing...

BOE 10.5G fab set to produce large-size, high-resolution panels in 2018

Dec 3, 14:44

China-based panel maker BOE is set to begin construction on a 10.5G fab in February 2016 and finish in 2018. The fab will focus mainly on production of 65-inch and above-size TV panels...

UMC Xiamen fab to go online as early as 3Q16, says report

Dec 2, 11:44

Operations at United Microelectronics' (UMC) 12-inch wafer fab in Xiamen are expected to kick off as early as third-quarter 2016, according to a report from Japan's Nikkei Asian...

RS Technologies to open wafer reclaim fab in Taiwan

Nov 25, 10:58

Japan-based RS Technologies, a provider of wafer reclaim services for the semiconductor industry, will hold an opening ceremony for a new wafer reclaim plant in Tainan, southern Taiwan...

US fab tool book-to-bill ratio slips in October, says SEMI

Nov 23, 11:03

The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment slid to 0.98 in October 2015 after having stayed above parity for three straight months.

LG Display to invest US$4 billion in new OLED fab, says report

Nov 19, 16:04

LG Display plans to invest upwards of US$4 billion in new OLED facilities to meet expected market demand as of 2017 onwards, according to a new report from Korea-based Digital...

BOE to begin constructing 10.5G fab in December

Nov 18, 11:33

China panel maker BOE's long rumored 10.5G line is expected to enter construction in early December 2015, according to China-based supply chain sources.

Samsung Display stops LCD production at L5 fab amid weak demand, says report

Nov 13, 16:04

Due to weak demand for monitor and notebook panels, Samsung Display has stopped LCD production at its L5 facilities in South Korea as of October, according to a new report from Korea-based...

CPT to end production at 4.5G fab

Nov 3, 15:30

Chunghwa Picture Tubes (CPT) will end production at a 4.5G production fab located in Longtan, Taiwan in the middle of November due to declining demand for for smartphone panels coupled...

North America fab tool book-to-bill continues growth, says SEMI

Oct 23, 15:47

North America-based semiconductor equipment manufacturers posted a book-to-bill ratio of 1.07 in September 2015, up for the third consecutive month, according to SEMI.

200mm wafer fab capacity to reach 5.4 million wspm in 2018, says SEMI

Oct 21, 10:42

Worldwide 200mm semiconductor wafer fab capacity is forecast to reach 5.2 million wafer starts per month (wspm) in 2015, and will expand to 5.4 million wspm in 2018, according to...

Construction of Powerchip JV fab in China begins

Oct 20, 16:15

Taiwan-based foundry Powerchip Technology and the Hefei city government of China's Anhui province on October 20 held a groundbreaking ceremony for a CNY13.5 billion (US$2.1 billion)...

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Samsung Xian fab generates CNY11.51 billion in January-August output value, says China paper

Oct 20, 15:18

Samsung's 12-inch wafer fab in Xian, China generated a total of CNY11.509 billion (US$1.81 billion) in the first eight months of 2015, according to China-based newspaper Xian...

Powerchip fab construction to begin in China

Oct 19, 15:46

A groundbreaking ceremony for a new 12-inch wafer fab in Hefei, China, in which Taiwan's Powerchip Technology is investing, will take place on October 20.

Samsung to construct 10.6G facilities, says report

Aug 6, 15:26

Samsung Display will construct new 10.6G production facilities that are expected to go into production in the second half of 2017, according to a new report from Korea-based ET...

BOE new 10.5G fab to push its LCD capacity to number 3 globally

Jul 15, 21:48

Following recent investments of CNY40 billion (US$6.4 billion) to construct new 10.5G facilities, BOE is expected to become the third largest panel maker in terms of LCD capacity...

Powerchip inks pact to built 12-inch JV fab in China

Newswatch - Jun 29, 10:42

Powerchip Technology has announced that it has inked an agreement with Hefei Construction Investment and Holding to set up a 12-inch joint venture fab in Hefei, China.

HKC expects new 8.5G fab to enter production in 1Q17

Jun 26, 11:37

China-based display solution maker HKC recently signed an agreement with the Chongqing government to invest CNY12 billion (US$1.92 billion) in a new 8.5G fab that will go into production...

US fab tool book-to-bill ratio slips below parity

Jun 22, 23:34

The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment slid to 0.99 in May 2015 after having stayed above parity for four straight months.

Fab equipment growth continues into 2015, says SEMI

Jun 5, 15:45

Semiconductor fab equipment spending is expected to increase 11% to US$38.7 billion in 2015, and grow another 5% to US$40.7 billion in 2016, according to SEMI.

Commentary: UMC aims to trump investment restriction for producing 28nm chips in China

Jun 4, 11:13

United Microelectronics Corporation (UMC) is mulling to accelerate the development of its 18nm process at its fabs in Taiwan in order to pave the way for its subsidiary in Xiamen,...

TSMC to build 10nm pilot line in June, says report

Newswatch - May 26, 22:07

Taiwan Semiconductor Manufacturing Company (TSMC) is scheduled to establish a 10nm pilot line at its 12-inch wafer plant in Hsinchu (Fab 12), northern Taiwan, in June, according to...

CSOT launches new 8.5G fab estimated to bring over US$3 billion a year in revenues

Apr 27, 21:50

TCL subsidiary China Star Optoelectronics Technology's (CSOT) T2 8.5G fab in Shenkeng, China has kicked off production as of April 24, 2015, which is expected to bring in CNY20 billion...

319 items [1/10]
  • 3D+NAND+die+with+M%2E2+SSD

    3D NAND die with M.2 SSD

    Intel and Micron have jointly announced the availability of their 3D NAND technology. This new 3D NAND technology, jointly developed by the companies, stacks layers of data storage...

    Photo: Company, Apr 7.

  • KLA%2DTencor+2910+series+optical+inspection+system+and+eDR%2D7100+e%2Dbeam+review+tool

    KLA-Tencor 2910 series optical inspection system and eDR-7100 e-beam review tool

    KLA-Tencor has announced the new 2910 series optical wafer defect inspection platform with NanoPoint technology and the new eDR-7100 electron-beam wafer defect review system. Meeting...

    Photo: Company, Jul 18.

  • KLA%2DTencor+Surfscan+SP3

    KLA-Tencor Surfscan SP3

    KLA-Tencor has announced a new generation in the Surfscan family of wafer defect and surface quality inspection systems: the Surfscan SP3. As the first unpatterned wafer inspection...

    Photo: Company, Jul 18.

  • KLA%2DTencor+Archer+300+LCM+metrology+system

    KLA-Tencor Archer 300 LCM metrology system

    KLA-Tencor has introduced the Archer 300 LCM Metrology system, which offers precision and measurement speed significantly better than that of its predecessor - the Archer 200, and...

    Photo: Company, Jun 25.

  • Applied+iSYS+

    Applied iSYS

    Applied Materials has unveiled what it claims is the industry's first fully-integrated abatement and vacuum pumping solution for controlling emissions in the semiconductor fab. ...

    Photo: Company, Dec 2.

Intel strategies in the mobile device market
2015 China smartphone panel trend forecast

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