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Friday 31 October 2025
Renesas reports significant profit decline and warns of potential inventory risks with Nexperia dispute
Japanese semiconductor manufacturer Renesas Electronics has disclosed a challenging beginning to 2025, revealing a decline in revenue and a sharp drop in profitability for the first nine months of the year. The company expressed concerns that the ongoing Nexperia dispute may cause customers to stockpile excess semiconductor inventories, potentially disrupting market stability in early 2026
Thursday 30 October 2025
Trump concludes Asia tour with rare earth and tech deals
US President Donald Trump has ended his six-day trip to Asia
Thursday 30 October 2025
AMEC reports 46% sales jump on strong etching, thin-film tool momentum
Chinese semiconductor equipment maker Advanced Micro-Fabrication Equipment (AMEC) reported strong growth in the first three quarters of 2025, driven by surging demand for its etching and thin-film deposition equipment used in advanced logic and memory chip production
Thursday 30 October 2025
Samsung 3Q25 marks the reset of the global memory hierarchy
Samsung Electronics staged a strong rebound in the third quarter of 2025 and set the tone for the next phase of the memory cycle, where AI infrastructure, premium product mix, and heavy capital spending converge in a more competitive landscape. The company's strategy reveals how it plans to stay ahead of SK Hynix and Micron Technology
Thursday 30 October 2025
South Korea agrees to US energy investments in exchange for tariff reductions
US President Donald Trump has approved South Korea's construction of a nuclear-powered submarine at the Philadelphia Naval Shipyard in an effort to strengthen their alliance. South Korea will pay US$350 billion in exchange for a reduction in tariffs and will make large-scale purchases of US oil and natural gas. Its total investment in the US is expected to exceed US$600 billion
Thursday 30 October 2025
Analysis: Japan's new PM aims to replicate TSMC playbook with tech investment push
Japan's new Prime Minister Sanae Takaichi announced a growth strategy prioritizing "crisis management investment" in AI, semiconductors, and quantum technology to address economic and security risks. Key officials have been appointed to lead these efforts
Thursday 30 October 2025
Hanwha Semitech and Hanmi Semiconductor escalate HBM equipment patent dispute
Korean media have confirmed that Hanwha Semitech, previously sued by Hanmi Semiconductor for patent infringement, has now filed a counter-lawsuit against Hanmi, accusing Hanmi's HBM TC Bonder core technology of infringing its patents
Thursday 30 October 2025
Wingtech urges the Netherlands to reverse takeover of Nexperia through Dutch public media

Chinese electronics manufacturer Wingtech Technology has filed a formal statement with the Dutch public broadcaster NOS, urging the Netherlands to revoke its decision to temporarily take control of Nexperia, the semiconductor company Wingtech acquired in 2019. The move marks a new flashpoint in the increasingly strained relationship between China and Europe's technology industries, as national security and industrial policy concerns collide

Thursday 30 October 2025
Samsung 3Q25 profit surges on AI chip demand, beats estimates
Samsung reported consolidated revenue of KRW86.1 trillion (US$59.8 billion) and operating profit of KRW12.2 trillion for the quarter ended September 30, 2025, beating both its own forecast and market estimates. Revenue climbed 15.4% from the second quarter's KRW74.6 trillion and roughly 8.9% year-over-year, while operating profit surged 160% quarter-over-quarter and about 33% from a year earlier
Thursday 30 October 2025
China's 15th Five-Year tech doctrine to tilt global industry balance

China's next phase of technology strategy is injecting fresh uncertainty into global supply chains, signalling a new round of strategic recalibration across industries worldwide

Thursday 30 October 2025
Commentary: China's JCET bets on AI to challenge global packaging giants
Artificial intelligence (AI) is reshaping the global semiconductor supply chain and accelerating transformation in IC packaging and testing. As Qualcomm moves into the AI data center space to challenge Nvidia, OSAT vendors are entering a new phase of technology upgrade and supply-chain reorganization
Thursday 30 October 2025
JCET unveils Singapore blueprint for next-gen semiconductor packaging
Rising demand for AI, 5G, and high-performance computing (HPC) chips is turning advanced packaging into a key front in the semiconductor race. China's largest OSAT provider and the world's third-largest, JCET Group, is ramping up its global expansion while zeroing in on next-generation packaging innovation
Thursday 30 October 2025
Glass substrates edge toward prime time in PCB and chip packaging sector

As Moore's Law nears its physical and commercial limits, advanced packaging has become the new battleground defining the evolution of IC substrate technology and the global PCB landscape. Henry Utsunomiya, President of Fujitsu Interconnect Technologies (FICT) under Fujitsu Limited, noted that with heterogeneous integration now the dominant approach, the industry is undergoing a crucial shift from organic to inorganic substrates

Thursday 30 October 2025
Pony.ai, WeRide duel for Hong Kong's first robotaxi stock in twin IPOs
The race is heating up. Two of China's top autonomous-driving firms — Pony AI Inc. (Pony.ai) and WeRide Inc. (WeRide) — have filed to go public on the Hong Kong Stock Exchange (HKEX) on November 6, 2024, setting up a head-to-head contest for the title of Hong Kong's first robotaxi stock
Wednesday 29 October 2025
BYD reignites price war after smart driving campaign fails to spark demand

After dominating China's first wave of electric vehicle (EV) adoption, BYD is shifting its focus in 2025 from electrification to intelligent mobility. The automaker has launched what it calls a campaign for "smart driving for everyone," aiming to make autonomous driving technologies accessible to mass-market consumers