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Friday 11 September 2026
Huawei stakes out the AI optics rulebook with 7.2Tbps NPO
Huawei Technologies has unveiled a 7.2-terabit-per-second near-packaged optics (NPO) module for AI data centres, coupling a high-bandwidth product launch with an effort to shape emerging optical-interconnect standards as AI clusters strain the limits of copper connectivity.
Friday 11 September 2026
China's DRAM supply chain clears another materials hurdle
China's semiconductor localisation effort has reached another upstream materials milestone.​ Jiangsu Pacific Quartz Co. has secured qualification for high-purity quartz products at a domestic DRAM manufacturer capable of large-scale production.
Friday 11 September 2026
CIOE 2026: Automotive optical-module demand could rival FTTx shipments by 2030
Automotive optical-module demand could approach the scale of the established FTTx market by around 2030 as increasingly data-intensive vehicles shift high-bandwidth connections from copper to fiber, according to Bai Qiang, deputy director for the automotive market at Xiamen UX IC Co. (UXIC).
Friday 11 September 2026
China's energy storage capacity surges 50-fold in five years, sparking crackdown on lithium battery expansion
China's energy storage industry has expanded at breakneck speed since the launch of the 14th Five-Year Plan, growing 50-fold in just five years. The government is now applying the brakes, as local government support has helped spawn large numbers of speculative "energy storage cockroaches"—companies that secure project rights without actually building the projects—causing planned capacity on paper to soar while actual construction lags far behind.
Friday 11 September 2026
SK Hynix raises cash portion of bonuses after 25-vote union rejection

SK Hynix has increased the cash portion of its profit-sharing bonus in a revised tentative wage agreement, after production workers rejected an earlier stock-heavy proposal by just 25 votes.

Friday 11 September 2026
Anthropic disrupts Chinese AI firms' attempts to extract Claude capabilities
Anthropic has disrupted a series of operations in which Chinese AI companies allegedly used its Claude models to extract capabilities for their own AI systems, highlighting growing tensions over AI model distillation and data security.
Friday 11 September 2026
China's Shenzhen Kaifa plans CNY1.85 billion expansion for high-end memory packaging and testing
Chinese electronics manufacturer Shenzhen Kaifa Technology, also known as Shenzhen Kaifa or Kaifa, plans to invest CNY1.85 billion (about US$260 million) to expand high-end memory-chip packaging and testing capacity through its wholly owned subsidiary Payton Technology (Shenzhen), according to a company announcement.
Friday 11 September 2026
Samsung 2nm push gains momentum as Synopsys cuts NPU die area by 22%
Synopsys has reported a 22% reduction in die area for a neural processing unit (NPU) implemented with its Fusion Compiler design tool on Samsung Foundry's SF2P process, providing a concrete design-level result as Samsung seeks to turn its 2nm technology into more commercial foundry business.
Friday 11 September 2026
ProLogium deepens partnership with Kyushu Electric Power through strategic investment

ProLogium said Kyushu Electric Power will make a strategic investment as its long-running collaboration expands from industrial cooperation into capital participation. The move signals growing confidence in next-generation battery technologies, with potential implications for energy security, manufacturing supply chains, and electrification efforts in global markets.

Friday 11 September 2026
Global IC substrate market to surge 32% to US$19.5 billion in 2026 as Taiwan, Korea lead ABF, BT
Rising demand for generative AI, high-performance computing (HPC), and data center buildouts is pushing the global IC substrate industry into a new phase marked by upgrades in high-end product specifications, tight supplies of critical materials, and intensifying competition in advanced packaging technologies.
Friday 11 September 2026
Samsung, SK Hynix eye 2028 High-NA DRAM rollout

SK Hynix is targeting 2028 to apply High-NA extreme ultraviolet lithography to DRAM mass production and is considering joining an industry initiative to develop 12-inch photomasks, according to South Korea's fnnews. The company has separately confirmed both plans.

Friday 11 September 2026
Quantum computer development is more about national security than profits, says expert

Japanese electronics giant NEC stopped development of gate-based superconducting quantum computer hardware at the end of March 2026. According to Japanese media reports, NEC concluded that the commercialization timeline for a physical quantum computer was too long and that hardware investment would be unlikely to deliver commensurate returns. The decision also reportedly prompted quantum R&D researchers to join Fujitsu.

Thursday 10 September 2026
Samsung pushes into display-equipped smart glasses as Meta leads market
Samsung Electronics has begun developing its first smart glasses with an in-lens display, asking Samsung Display in August to develop a microdisplay that meets requirements for form factor, display area, color and price, according to industry sources cited by TheElec.
Thursday 10 September 2026
Navigating economies of scale: how South Korea and China are reshaping the OLED market
Economies of scale occur when a company's average cost per unit falls as overall production volume increases. In the competitive display industry, reaching this state relies on either mass production, technological innovation, or specialization. Currently, South Korean and Chinese display manufacturers are pursuing distinct strategies to achieve cost advantages in the OLED market. While South Korea focuses on advanced process integration and technological upgrades, China leverages massive production infrastructure and upcoming facility amortization.
Thursday 10 September 2026
Gem Terminal rides China plug rule shift for 8.8% sales growth
Gem Terminal Industry said its August 2026 consolidated revenue continued to show steady growth, helped by the approaching conversion deadline for China's new insulation requirements for plug pins under GB 1002-2024 and by stronger orders and a broader customer base for its specialty copper materials business.