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Saturday 11 July 2026
Samsung, SK Hynix margins seen near Micron's 80% level as memory prices surge

Global memory chipmakers are heading toward record revenue and profit in the second quarter of 2026, as AI infrastructure demand keeps memory prices high and pushes operating margins to levels rarely seen in the semiconductor industry.

Saturday 11 July 2026
Samsung's CXL 3.1 memory delay lays bare Intel, AMD server platform lag

Samsung Electronics has postponed mass production of its CXL 3.1 memory modules after delays to next-generation server processors from Intel and AMD pushed back the broader PCIe 6.0 ecosystem, highlighting how AI infrastructure adoption increasingly depends on platform readiness rather than individual components.

Saturday 11 July 2026
China's display makers raise billions to close the OLED gap — and South Korea is watching
Chinese display panel and materials companies are tapping capital markets to fund next-generation OLED, oxide and Mini LED technologies, drawing close attention from South Korea's display industry.
Saturday 11 July 2026
Mobilint touts NPU for physical AI, with CEO urging South Korea to accelerate development
South Korean AI semiconductor startup Mobilint is gaining traction in physical AI with its neural processing units (NPU) for edge devices, as the AI boom spreads from cloud computing into robots, autonomous vehicles and drones. Mobilint CEO Shin Dong-joo (transliterated from Korean) and other industry figures say the next two to three years will be a crucial window for South Korea to capture the physical AI market through NPU technology.
Friday 10 July 2026
China's temporary helium export ban signals fears of a prolonged Middle East supply squeeze
China moved on July 10 to wall off its domestic supply of helium, a gas with no substitute in chipmaking and medical imaging, in a step that suggests Beijing does not expect Middle East supply risks to ease quickly — and one that could tighten an already strained global market.
Friday 10 July 2026
SK Hynix breaks Alibaba's US listing record — but HBM customers will wait until 2028 for the capacity it funds
SK Hynix has priced a US$26.5 billion Nasdaq offering, giving the world's leading supplier of high-bandwidth memory fresh capital to expand DRAM wafer production, advanced packaging and leading-edge manufacturing equipment at the same time.
Friday 10 July 2026
Samsung plans new PC chip in push beyond smartphones
Samsung Electronics is developing a new chip for personal computers (PCs) as its System LSI business seeks growth beyond smartphone processors, according to ET News and the Korea Economic Daily, citing industry sources.
Friday 10 July 2026
Smartphone financing set to cover 42% of India sales in 2026

India's smartphone buyers are increasingly turning to financing, a shift that could shape device sales patterns in other price-sensitive markets as well. Higher handset prices and easier installment options are making monthly payments more attractive than one-time purchases, especially beyond major cities, according to Counterpoint Research.

Friday 10 July 2026
SK AI Summit postponed as SK eyes closer alignment with Nvidia GTC
SK Group, which hosts the annual SK AI Summit as its flagship technology event to showcase its latest AI and semiconductor developments, is reportedly postponing the 2026 edition. Originally scheduled for the second half of 2026, the event is now expected to take place in the first half of 2027. Industry sources believe the move is intended to better align the summit with Nvidia GTC, which is held each March.
Friday 10 July 2026
JCET sets US$1.4bn capex for AI packaging expansion as China orders stay strong
JCET plans to invest about CNY10 billion (approx. US$1.4 billion) in fixed assets in 2026, sharply increasing spending on AI-driven advanced packaging, automotive electronics and selected mainstream packaging capacity while its major Chinese plants run on strong orders.
Friday 10 July 2026
Luxshare's weak HK debut highlights investor skepticism over AI transition

Luxshare Precision's highly anticipated Hong Kong debut got off to a shaky start despite securing the city's largest IPO of 2026, underscoring investor skepticism over the Apple supplier's long-term transformation strategy.

Friday 10 July 2026
Analysis: Samsung, SK Hynix, and Micron's diverging approach to HBM4 base dies

Samsung Electronics, SK Hynix and Micron Technology are taking different manufacturing paths for the logic base die in HBM4, opening a new front in the competition over advanced memory performance, yield and supply.

Friday 10 July 2026
Huawei joins China Mobile, Baidu to build China's first NPO optical interconnect standard

Huawei has joined more than 20 Chinese technology companies and research bodies to launch OPEN NPO, the country's first multi-source agreement for near-packaged optics, in an effort to standardise high-speed optical interconnects for AI supernodes and large-scale computing clusters.

Friday 10 July 2026
GigaDevice's 1H26 profit surges 1,099% on memory chip shortage, higher prices

GigaDevice Semiconductor expects first-half 2026 net profit to reach about CNY6.9 billion (US$960 million), a 1,099% increase from a year earlier, after tight memory chip supply lifted both shipment volumes and prices.

Friday 10 July 2026
India scraps duties on electronics and battery components to boost local manufacturing

India has scrapped import duties on a targeted set of components and factory machinery used to build smartphones, displays, and lithium-ion cells, a move that deepens New Delhi's drive to pull more of the global electronics supply chain onto Indian soil and away from China and Vietnam.