China's leading domestic DRAM maker, ChangXin Memory Technologies (CXMT), is seeking to raise CNY29.5 billion (approx. US$4.2 billion) through an IPO in Shanghai, as it looks to upgrade production lines and expand development of advanced memory technologies
Chinese chip designer GigaDevice Semiconductor is pressing ahead with plans to list its shares in Hong Kong, seeking to raise as much as HK$4.68 billion (approx. US$601.4 million) in what would be one of the latest semiconductor offerings amid a renewed IPO push by Chinese technology firms
Samsung Electronics plans to boost its high-bandwidth memory (HBM) production capacity by approximately 50% through late 2026, according to South Korean media outlet ET News, as the company secures key technical milestones with major AI customers
According to South Korean media reports and industry sources, TSMC is moving to pull forward the production schedule at its second Arizona facility, a shift that could reshape supply planning for major chip designers and weaken the long-running narrative that Samsung Electronics stands as the default alternative when TSMC capacity tightens
China is requiring semiconductor manufacturers to source at least 50% of their equipment from domestic suppliers when adding new production capacity, Reuters reported, citing people familiar with the matter
