Malaysian Prime Minister Anwar Ibrahim concluded a three-day visit to Japan, during which he met with Japanese Prime Minister Sanae Takaichi. The two leaders pledged to strengthen cooperation in critical minerals

SK Hynix is preparing to begin mass production of its next-generation 375-layer 3D NAND flash memory by year-end, while pushing ahead with a broader capacity buildout and moving toward a US listing as early as August

Qualcomm recently held its 2026 Automotive Technology and Cooperation Summit in Wuxi, Jiangsu province, marking the fourth consecutive year it has hosted a China-focused automotive industry event. At the main forum, Frank Meng, chairman of Qualcomm China, said: "2026 is the year of the agent.

ChangXin Memory Technologies (CXMT), China's largest DRAM maker, plans to raise approximately CNY29.5 billion (US$4.35 billion) through an IPO on Shanghai's STAR Market, fueling debate about whether China's push into memory semiconductors can eventually erode the dominance of the industry's established players

Breaking the inference barrier requires a rethink of the whole system architecture, not just faster compute. This was the key takeaway from a recent panel discussion at SuperAI Singapore, which brought chip makers and an AI model accelerator together to address how to overcome inference bottlenecks at a time when compute workloads are hitting up against physical limits

China's export controls on the key semiconductor material indium phosphide (InP), imposed since February 2025, are threatening global AI data-center buildouts and squeezing the optical supply chain across the US and Taiwan. The restrictions have triggered shortages and delayed export licenses, while sending prices soaring for a material with no substitute in photonics. InP is a core material for high-speed optical chips and is irreplaceable in photonics technologies that transmit signals over fiber, making it a potent "materials choke point" weapon in Beijing's US-China trade war