Foxconn Group's electric vehicle business is entering a new phase as it shifts from proving the concept to preparing for mass production and wider regional expansion. The change could reshape Taiwan's auto industry and strengthen Foxconn's case as a cross-border EV manufacturer with ambitions far beyond its home market.
A new Anthropic threat intelligence report offers an unusual glimpse into how advanced AI systems are being used under heavy, real-world workloads. The findings suggest that the decision to buy or host AI servers may depend less on model quality alone, and more on which tasks consume tokens, how long they run, and how much operational state they must preserve.
The extraordinary technological progress humanity has witnessed since AI first emerged has propelled a fundamental shift in industrial development. With experts hailing AI as the next phase of the digital revolution and an extension of Industry 4.0, the technology is increasingly reshaping how industries operate.
Advanced packaging remains one of the semiconductor industry's hottest technology areas in 2026. In Taiwan, terms such as co-packaged optics (CPO), chiplets, and glass substrates are increasingly common as packaging moves deeper into system-level design.
China's Ministry of Industry and Information Technology (MIIT) and National Development and Reform Commission (NDRC) have highlighted ultra-wide bandgap (UWBG) semiconductor materials, including gallium oxide (Ga₂O₃) and synthetic diamond, in their draft development plan for the electronic information manufacturing sector.
The relationship between Nvidia CEO Jensen Huang and US President Donald Trump has evolved from policy friction to a strategic alignment. The rapid shift in their dynamic reflects how deeply the AI sector has become intertwined with US-China technology rivalries and domestic manufacturing policies.
China's rare earth export controls are changing the rules governing global critical mineral supply chains. For Taiwan, the real concern is not that China could suddenly halt all exports one day, but that export licensing, end-use reviews, price volatility, longer lead times, and "hidden dependencies" embedded in intermediate materials and components could gradually raise the cost and uncertainty of maintaining normal production.
DIGITIMES has observed that demand for silicon carbide (SiC) power devices has climbed rapidly in recent years as the EV market expands, triggering a massive wave of capacity expansion among SiC substrate makers. However, as SiC substrate capacity continued to surge, actual demand for SiC power devices from the EV sector fell short of expectations. This imbalance triggered a collapse in SiC substrate prices starting in 2024, extending the downward trend through 2026.
"The narrative is much more practical," Nvidia CEO Jensen Huang said of China's approach to artificial intelligence (AI) at the All-In Summit 2026, contrasting it with US warnings about AI bringing civilization to an end.
DIGITIMES Intelligence said Google used SEMICON Taiwan 2026 to outline the direction of its AI infrastructure strategy, focusing not only on next-generation TPU products but also on how rising AI compute demand is accelerating TPU iteration and deployment.
The global surge in AI demand is accelerating change across the semiconductor industry, and as Moore's Law scaling faces physical limits, chipmaking is no longer only about shrinking transistors. The industry is moving toward a "shrink and stack" model that combines continued scaling with increasingly complex 3D integration.
Where will China's electronics manufacturing industry find growth over the next five years? The answer is taking shape in the 15th Five-Year Plan for the sector, released by the Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC): industry revenue is targeted to exceed CNY30 trillion (US$4.47 trillion) by 2030.
DIGITIMES Intelligence observes that discussions at the semiconductor sustainability and energy forum during SEMICON Taiwan 2026 centered on two questions: whether Taiwan will have enough electricity to support continued semiconductor expansion driven by AI, and whether that electricity will come from renewable sources.
Taiwan's smaller IC design firms posted a strong revenue recovery in the first half of 2026, but the gains may prove difficult to extend. DIGITIMES said higher prices and early customer buying lifted sales, even as consumer demand remained soft. The second half now looks exposed to weaker momentum.
At SEMICON Taiwan 2026, Google outlined the direction of its AI infrastructure, and DIGITIMES notes that the discussion extended well beyond its next-generation TPU. Rather than focusing on a single chip, Google described how it links large numbers of TPUs into an integrated computing system spanning compute clusters, data centers, and ultimately multiple data centers, while also addressing the power constraints that emerge as the system continues to scale.
SK Hynix is reportedly considering Intel as an additional manufacturing source for high-bandwidth memory (HBM) base dies beginning with the HBM4E generation, a move that could reduce its reliance on TSMC and give the memory maker greater supply and cost flexibility.
