Hewlett-Packard (HP) has been forced to revise downward its notebook shipment goal for January due to a delay in shipments of some key parts and components from upstream suppliers,...
Taiwan's Nan Ya PCB (NPC) has begun sampling six- to 12-layer flip-chip (FC) substrates for Intel's recently-announced Sandy Bridge processors, as well as Japan-based Ibiden Electronics...
Nvidia has announced that it plans to build high-performance ARM-based CPU cores, designed to support future products ranging from personal computers and servers to workstations and...
Intel has introduced its second-generation Intel Core processor family at a press conference at the Consumer Electronics Show (CES) 2011. Intel highlighted several new features, services...
AMD has announced a lineup of motherboard products for AMD's 2011 low-power mobile platform (Brazos) and the AMD Embedded G-Series platform for embedded systems (eBrazos), both based...
The world's two largest microprocessor manufacturers - Intel and AMD - held their ground in the third quarter, with neither company able to wrest significant market share away from...
Among Acer's announced initial batch of tablet PCs, a 10.1-inch Windows 7-based model is believed to use AMD's Ontario APU codenamed C-50, according to sources from notebook player...
With the debut of six products based on the Intel Atom processor, Intel is making it easier for customers to go-to-market with differentiated, custom-made designs. The company today...
At its annual Financial Analyst Day, AMD demonstrated how its unique combination of CPU and GPU computing technologies on a single die will enable breakthrough capabilities in an...
As Intel set to launch its latest Sandy Bridge processor at CES 2011 in January 2011, and will account for 20% of Intel's total desktop CPU shipments in the first quarter of 2011,...
The next generation of Intel's power architecture, VR12, to be introduced in the third quarter of 2011 represents a watershed industry event, according to Boris Petrov, managing director...
Nanya PCB (NPC) is actively improving its production yield rates for CPU-use flip-chip (FC) substrate packaging in order to gain a larger share of orders from Intel, according to...
The business climate for the semiconductor industry is deteriorating, according to The Information Network. DRAM manufacturers Samsung Electronics, Hynix Semiconductor, Elpida Memory...
