The first batch of Intel Calpella platform-based notebooks coming from Asustek Computer, Dell, Hewlett-Packard (HP) and Toshiba made their debuts at IDF San Francisco 2009. However,...
Intel president and CEO Paul Otellini has displayed a silicon wafer containing its first working chips built on 22nm process technology. The 22nm test circuits include both SRAM memory...
AMD has announced the AMD Athlon II X4 620 quad-core processor which carries a less than US$100 suggested system builder price (SSBP). The new CPU combines with the AMD 785G chipset...
Intel managed to expand its lead in the global processor market to levels not seen in nearly four years in the second quarter of 2009, according to iSuppli.
Intel has introduced several high-performance desktop and server processors – the new Intel Core i5 processor family, two new Intel Core i7 processors and the Intel Xeon processor...
Taiwan-based motherboard makers hold a pessimistic attitude toward recent news that several Japan-based semiconductor players plan to form alliance to develop a new CPU architecture...
Intel's upcoming Core i5-750, Core i7-860 and Core i7-870 CPUs as well as P55 chipsets are expected to be announced on September 8, 2009, according to sources at motherboard makers...
Asustek Computer plans to launch two new ultra-thin notebooks using Intel's upcoming 45nm Celeron 743 and SU2300 CPUs on September 7, 2009, according to industry sources.
Although Intel is asking vendors to stop selling socket 1156-based CPUs - as well as P55-based motherboards - that it has not yet officially launched, retailers are unlikely to listen...
Taiwan-based Lotes, a maker of sockets for CPU, memory and other PC components, expects its expanded capacity will be fully ready in September to handle Intel's Calpella platform...
Intel's socket 1156-based CPUs - Core i5-750, Core i7-860 and Core i7-870 - as well as Intel P55-based motherboards, are already available in small volumes in some retail channels...
AMD has announced immediate availability of two new dual-core, 18W TDP processors for the scalable ASB1 BGA embedded client platform, the Turion Neo X2 processor Model L625 and the...
