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Monday 8 June 2026
Molex expands in Taiwan as AI interconnect demand splits between copper and optics
Molex is building out a dual-track strategy for AI interconnects, backing both copper and optical solutions as customers pursue different deployment paths, while expanding its Taiwan...
Monday 8 June 2026
Bottlenecks for upstream digital camera components pose dilemma for supply chain players amid market renaissance
Digital camera demand has made a striking comeback as younger consumers, social media creators, and the streaming economy inject new momentum into a market many had considered obsolete...
Monday 8 June 2026
Nvidia push into AI PCs comes as smartphone market faces steep downturn
Nvidia's move to expand AI-powered PCs could reshape where global consumers and companies use artificial intelligence, shifting more work onto local devices rather than cloud services...
Monday 8 June 2026
Nvidia-Microsoft AI PC alliance raises fears of South Korea being sidelined in next AI era
Nvidia and Microsoft have teamed up to launch RTX Spark, an AI PC superchip that could reshape personal computer architecture and intensify competition for AI leadership, according...
Monday 8 June 2026
Dreame under scrutiny for breakneck expansion pace and state-owned funding
A city in China has begun investigating the connections between its local companies and Dreame Technology, a Chinese company known for its robot vacuum cleaners that has reportedly...
Monday 8 June 2026
Uneec breaks into IT, liquid cooling racks on AI demand
Demand for artificial intelligence (AI) is pushing server chassis manufacturers to expand into the server rack business. Chenming Electronic Tech (Uneec) is optimistic about its rack...
Monday 8 June 2026
China launches prefabricated power hub to speed data centers, cut costs

China has launched what state media described as the world's first prefabricated computing-power hub, a modular power system designed...

Monday 8 June 2026
Microloops May revenue rises 54% as CSP cooling module shipments start
Cooling module maker Microloops reported May 2026 consolidated revenue of NT$330 million (approx. US$10.45 million), up 54.97% from a month earlier and down 10.76% from a year earlier...
Monday 8 June 2026
Huawei Cloud targets Agentic AI race with Ascend 950DT, smart driving compute, secure hybrid cloud

Huawei Cloud is tying its next phase of cloud growth to Agentic AI, domestic computing power, and industry-specific deployment, launching...

Monday 8 June 2026
Exclusive: Marvell says AI's copper wall is nearing, with custom silicon and optical I/O set to scale
US chipmaker Marvell took a more visible stance at Computex 2026, with CEO Matt Murphy delivering a keynote speech and senior executives visiting Taiwan to lay out the company's outlook...
Monday 8 June 2026
Nvidia and LG Group team up on AI factory, robotics, and autonomous driving in expansive Korea partnership
Nvidia and LG Group announced a wide-ranging partnership on June 7 covering AI factory infrastructure, home robotics, autonomous driving components, and sovereign AI model development,...
Monday 8 June 2026
India tablet market grows despite memory cost pressure
India's tablet market grew 5% year-over-year in the first quarter of 2026, even as memory prices rose and macroeconomic conditions remained uncertain. For global consumers and manufacturers,...
Monday 8 June 2026
SpaceX's Google deal highlights shift from AI model ambitions to infrastructure monetization
SpaceX's multibillion-dollar cloud agreement with Google underscores a growing shift in the AI industry from building proprietary models to monetizing computing infrastructure. The...
Monday 8 June 2026
Weekly news roundup: Taiwan ecosystem strengthens AI chip supply chain as MediaTek, Nvidia deepen cooperation
Below are the most-read DIGITIMES Asia stories from the week of June 1-7, 2026:
Monday 8 June 2026
Exclusive: Nvidia drops dual-piece cooling architecture for Vera Rubin platform
Nvidia's upcoming Vera Rubin AI server platform has become the focus of intense scrutiny after a late-stage redesign of its thermal architecture.