CONNECT WITH US
NEWS TAGGED IT + CE
Wednesday 6 May 2026
Supermicro posts US$10.2B in Q3 revenue, missing own guidance by US$2B as working capital swings drive US$6.6B cash outflow
Supermicro reported fiscal third-quarter revenue of US$10.24 billion, up 123% year-over-year but down 19% sequentially and well below both the company's own guidance of at least US$12.3...
Wednesday 6 May 2026
From China to Arizona: How AI and TSMC are redrawing Taiwan's economic map
Taiwan's decades-long tilt toward China is giving way to a sharper, US-focused strategy. Semiconductor expansion and surging demand for AI infrastructure are redrawing the island's...
Wednesday 6 May 2026
Foxconn revenue nears US$95B in first four months, AI server racks fuel 2Q26 outlook
Driven by sustained growth in AI server demand, Foxconn reported consolidated revenue of NT$832.1 billion (US$26 billion) for April 2026, marking a record high for the month.
Wednesday 6 May 2026
How Plug and Play is bridging Taiwan's deep tech startups with Silicon Valley capital
For much of the past decade, Taiwan watched from the sidelines as global venture capital poured into software. The island's world-class manufacturers, semiconductor giants, and precision...
Tuesday 5 May 2026
Tesla AI5 dual sourcing may not mean equal weight for Samsung
Tesla CEO Elon Musk has confirmed that the company's in-house AI5 chip has completed design tape-out and entered a critical pre-production validation stage. The move has drawn renewed...
Tuesday 5 May 2026
SEMICON SEA 2026: Delta showcases AI-enabled smart manufacturing
Delta Electronics presented its latest AI-enabled smart manufacturing solutions at SEMICON Southeast Asia 2026, underscoring its efforts to advance efficiency, precision, and scalability...
Tuesday 5 May 2026
South Korea eyes memory-led AI order against Nvidia
As AI shifts from training to inference and from single-task use to multi-agent collaboration, South Korea's semiconductor industry is seeking to recast the market around memory rather...
Tuesday 5 May 2026
Google's TPU push hits Nvidia's neocloud grip

Google's effort to expand its tensor processing units (TPU) beyond its own cloud is meeting resistance from some of the AI infrastructure...

Tuesday 5 May 2026
AI and chips propel US back to top of Taiwan's trade chart
Trade between Taiwan and the US reached US$78.25 billion in the first quarter of 2026, driven primarily by advanced node chips and AI servers. This marks the first time in 25 years...
Tuesday 5 May 2026
Another Qualcomm exec joins Intel to lead PC and physical AI unit
Intel has announced that it has appointed Alex Katouzian as head of its Client Computing and Physical AI Division. With this hire, Intel seeks to align its consumer PC business with...
Tuesday 5 May 2026
OpenAI, Anthropic race to lock in enterprise AI deals with Wall Street capital
OpenAI and Anthropic are moving in parallel to build new enterprise AI distribution engines, teaming up with some of the world's largest asset managers to accelerate adoption of their...
Tuesday 5 May 2026
Delta Electronics' security tie-up positions it to push into integrated smart buildings
Delta Electronics has moved to consolidate its security brands, aiming to align AI video analytics and cloud services with its building automation strategy. This shift could accelerate...
Tuesday 5 May 2026
Analysis: Big Tech's AI tab tops US$700 billion with Google Cloud pulling ahead — but investors are picking sides
The AI spending arms race just got more expensive — and more consequential.
Tuesday 5 May 2026
DDR6 server memory moves into early development as industry prepares for next-generation AI demand
The development of next-generation server memory DDR6 is reportedly entering early hardware validation, as memory makers and supply chain partners begin pre-development work ahead...
Tuesday 5 May 2026
Univacco eyes 2027 Vietnam plant ramp-up for CPO and advanced packaging materials
Univacco said its Vietnam plant will begin mass production in the second quarter of 2027 as the company moves to position itself in the co-packaged optics and advanced packaging materials...