As HPC and AI processors push computing performance to unprecedented levels, transistor density has reached a point where thermal behavior is no longer uniform. Instead of gradual,...
US efforts to localize lithium battery production are encountering a new challenge: a mismatch between supply and demand, driven by political shifts and changes to subsidy programs...
Cooling module manufacturer Microloops has said its major cloud service provider (CSP) customer has been increasing pull-ins starting in the second quarterof 2026, driving significant...
Heat sink manufacturers continue to benefit from the surge in AI-driven server growth, with Asia Vital Components (AVC), Auras, and Jentech all posting record-high revenues in March...
As GPU platforms continue to iterate each year, the buildout of AI infrastructure is accelerating in tandem. For data center operators, cloud service providers, hyperscalers, and large...
The surge of generative artificial intelligence is reshaping not only computing power but also the very geography of data centers, extending their reach beyond Earth's atmosphere....
Cooling module manufacturer Microloops announced plans to expand its liquid cooling plate production capacity in Vietnam and China to address growing demand for liquid cooling solutions...
The demand for liquid cooling technology in AI servers continues to rise, and Foxconn is increasingly showcasing its components and subsystems in this space. At Nvidia's recently concluded...
Power semiconductor design company Inergy Technology expects strong growth momentum in its cooling and power device businesses in 2026, supported by rising demand from artificial intelligence...
At the Nvidia GTC 2026 conference, CEO Jensen Huang emphasized that power delivery and liquid cooling will become core elements requiring co-design. He said that future AI racks and...
Nvidia has revealed more details about its next-generation Vera Rubin (VR) servers at Nvidia GTC 2026, confirming a full transition to liquid cooling architecture. Thermal module makers...
Foxconn Interconnect Technology (FIT) showcased connectivity, power, and cooling solutions at multiple 2026 industry events as it seeks a larger role in the AI computing supply chain...
Taiwan-based power semiconductor packaging and testing firm GEM Services has announced advancements in its copper clip bonding technology to meet growing demand for enhanced cooling...
Foxconn will hold an online investor conference on March 16, with market attention focused on the progress of AI server orders, capacity adjustments, and new business developments...
