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NEWS TAGGED COOLING
Wednesday 15 October 2025
OCP Summit: AI data centers embrace high-voltage power and liquid cooling
The global artificial intelligence data center sector is advancing into a phase characterized by high-power, high-density infrastructure, as highlighted at the Open Compute Project...
Tuesday 14 October 2025
OCP Summit: Supermicro says soaring GPU power demands are forcing shift to rack-scale AI standardization
The explosive rise in AI computing power is pushing the data center industry to rethink its entire architectural model, according to Vik Malyala, senior vice president for technology...
Tuesday 14 October 2025
OCP Summit: Oracle outlines zettascale AI ambitions, urges open standards to support gigawatt-scale data centers
Oracle Cloud Infrastructure (OCI) is expanding its global footprint with plans to build multiple gigawatt-scale AI supercluster campuses capable of hosting millions of GPUs, as it...
Tuesday 14 October 2025
Beyond the rack: how OCP is wiring the world for AI
The Open Compute Project (OCP) Global Summit, held at the San Jose Convention Center, drew a record crowd of more than 11,000 participants, underscoring the event's growing importance...
Tuesday 14 October 2025
OCP Summit: Inside Google's plan to make data centers as adaptive as AI itself
Google unveiled a new industry-wide initiative to redefine data center architecture for the artificial intelligence era, announcing the creation of an "agile, fungible data center"...
Tuesday 14 October 2025
OCP Summit: Microsoft expands AI infrastructure by 2 GW, cuts GPT-4 cost by 93%, and backs new power and cooling standards

Microsoft is accelerating its transformation into what it calls "the world's AI supercomputer," revealing that it added 2 gigawatts of...

Tuesday 14 October 2025
YS Tech opens new Taiwan plant to boost AI server cooling capacity
Yen Sun Technology (YS Tech) has completed a new factory in Kaohsiung as it moves to capitalize on the booming demand for AI server cooling systems. The company announced that mass...
Monday 13 October 2025
Niching sustains growth momentum in heat spreaders and IC substrates amid AI server and auto electronics demand
Taiwan-based Niching Industrial continues its steady growth trajectory in 2025, buoyed by robust demand from AI servers and automotive electronics. The company's heat spreader and...
Tuesday 7 October 2025
Liquid cooling becomes essential for next-gen AI servers
The new generation of AI servers has significantly upgraded its power consumption and density compared to traditional data centers. As single-cabinet power continues to rise, traditional...
Sunday 5 October 2025
AI data center surge tests connector makers on speed, power, and cooling
The global AI boom is driving a new wave of server and data center build-outs. With hyperscalers and chipmakers expanding compute infrastructure, data transmission is surging, and...
Friday 3 October 2025
OpenAI and Hitachi sign MOU to develop power and cooling solutions for AI data centers
OpenAI has entered into a strategic cooperation agreement with Hitachi, focusing on power distribution and cooling technologies for artificial intelligence (AI) data centers. The...
Tuesday 30 September 2025
Schneider Electric and Nvidia announce global partnership on AI data center infrastructure
Schneider Electric and Nvidia have announced a global strategic partnership to advance the development of infrastructure supporting artificial intelligence workloads. The collaboration...
Friday 26 September 2025
Microsoft microfluidics cooling claims meet cold shower from industry veterans
Microsoft has introduced microfluidics cooling, a chip-level technique that etches microchannels into silicon, allowing coolant to flow directly across the chip surface. The company...
Monday 22 September 2025
Exclusive: ByteDance readies new AI glasses prototypes and waiting for Apple to heat up trend
The smart-glasses boom shows no signs of cooling, with market demand clearly established. Yet shipments have consistently fallen short of expectations, constrained by hardware limits...
Sunday 21 September 2025
Huawei patents SiC cooling tech to power next-gen AI chips
Huawei has disclosed two new patents in China targeting advanced cooling solutions for AI chips, highlighting the rising urgency around thermal management as chip power consumption...