Samsung Electronics has reportedly secured new AI chip manufacturing orders from major US cloud service providers for a second consecutive quarter, with commercial shipments expected...

Samsung Electronics is expanding its high-bandwidth memory (HBM) packaging operations in South Korea as its Cheonan campus runs short of space, prompting the company to develop nearby...

Samsung Electronics has unveiled 30 AI smart-glasses models developed with Google, Gentle Monster and Warby Parker, marking its entry into the AI smart-glasses market. The Intelligent...

SK Hynix's sixth-generation high-bandwidth memory (HBM4) production yield has reportedly surpassed 70%, Chosun Biz reported on November 12, citing semiconductor industry sources,...

LG Chem is developing materials for the mass reflow-molded underfill (MR-MUF) process used to make high-bandwidth memory (HBM), Korean media outlet ETNews reported, citing...

Samsung Electronics is targeting an exit from its 8-inch foundry business by the end of 2029, a year earlier than previously reported, and has been outsourcing some production to Taiwan's...

OpenAI CEO Sam Altman warned Samsung Electronics executives that AI memory demand could fluctuate in the short term, with the market potentially counting the same demand more than...

Samsung Group and Hyundai are deepening their strategic partnership, exploring opportunities in robotics, energy and physical AI alongside existing cooperation in automotive semiconductors,...

Samsung Electronics said on November 12 it had moved up the planned opening of its new high-bandwidth memory (HBM) packaging plant in South Korea by one year to June 2028 to meet rising...

Apple and Samsung Electronics are working with suppliers on foldable phone glass that is thinner at the hinge and thicker elsewhere, a design they are considering for 2028 models,...

Samsung Electronics and AMD are teaming up to upgrade the Korean chipmaker's semiconductor manufacturing test infrastructure, combining AMD's new EPYC Embedded 9006 processors with...

Samsung Electronics is testing electronic skin on the hands of its humanoid robots with South Korean startup Midas H&T, seeking to overcome a key commercialization barrier: combining...

Samsung Electronics acquired four US silicon photonics patents from UK-based Rockley Photonics in September 2026, South Korea's Shinailbo reported on November 11, citing US...

Samsung Electronics aims to complete its first 3D Cube-H design kit, a hybrid copper bonding technology for vertically stacked logic chips, in early 2027, with prospective customer...

Qualcomm has identified Samsung Electronics and Micron Technology as its primary memory suppliers for certain products, including automotive applications, in its fiscal 2026 annual...