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Friday 19 June 2026
Samsung Foundry to make Claros power-management chips for AI data centers

Samsung Electronics' foundry business has signed a strategic manufacturing collaboration with Claros, a US power-management startup,...

Friday 19 June 2026
Apple to work with Intel on US chip design and manufacturing, Trump says
US President Donald Trump said on June 18 that Apple has agreed to work with Intel to design and manufacture chips in the US, a claim he made in a post on his Truth Social platform...
Friday 19 June 2026
Interview: Oppstar grows ASIC design ties with Japan, South Korea clientele, plans Taiwan office

Founded in 2014, Oppstar is one of the few Malaysian companies operating at the front end of the semiconductor value chain as an IC...

Thursday 18 June 2026
Samsung, SK Hynix weigh first chip packaging plants in South Korea's Honam region

Samsung Electronics and SK Hynix are each reviewing locations in South Korea's Honam region for new semiconductor packaging plants,...

Thursday 18 June 2026
AI glasses race turns into a battle of devices, LLMs, and user interfaces

AI glasses are gaining momentum as Meta, Rokid, RayNeo, Xreal, Viture, HTC, and other vendors step up their efforts, with Google and...

Thursday 18 June 2026
SMIC narrows Intel's metal pitch gap, but Kirin 9030 teardown shows China's chip limits remain

A teardown of Huawei's latest Mate 80 Pro Max smartphone has put China's semiconductor progress back under scrutiny, after analysis...

Thursday 18 June 2026
Samsung advances 1d DRAM roadmap; pilot production eyed by end-2027
Samsung Electronics is reportedly working with multiple partners to develop production equipment for its seventh-generation 10nm-class (1d) DRAM process. The company aims to begin...
Thursday 18 June 2026
Samsung to offer 2nm prototype runs as South Korea pushes chip design

Samsung Electronics' foundry division plans to open its Multi-Project Wafer, or MPW, service to its 2nm process next year, giving South...

Thursday 18 June 2026
SK Hynix ships HBM4E samples to customers
SK Hynix has begun shipping samples of HBM4E, its next-generation high-bandwidth memory, to major customers. The South Korean chipmaker said the 12-layer product was delivered on s...
Thursday 18 June 2026
Samsung pushes vertical transistor design as chip scaling hits limits

Samsung Electronics has demonstrated a 3D stacked transistor structure with a 42-nanometer gate pitch, a research milestone that extends...

Thursday 18 June 2026
Samsung said to open fab data to suppliers in AI factory push

Samsung Electronics is developing and operating a data-sharing platform with semiconductor materials, components and equipment suppliers,...

Wednesday 17 June 2026
Nvidia Vera CPU strains LPDDR supply as AI servers tap phone memory

Nvidia is expected to surpass Apple and Samsung Electronics' mobile division to become the world's top buyer of LPDDR, as AI servers and...

Wednesday 17 June 2026
Samsung, SK Hynix suppliers seek war-cost payback after US-Iran shock drains chip materials inventory

Semiconductor materials suppliers are moving to rebuild depleted inventories and recover sharply higher costs from Samsung Electronics,...

Wednesday 17 June 2026
Chip supply chains shift: TSMC's capacity crunch reportedly pushes Google, Tesla, BYD toward Samsung

Global chip buyers, including BYD, Google, AMD, and Tesla, are turning to Samsung Electronics as TSMC's advanced production lines remain...

Tuesday 16 June 2026
Samsung reportedly moves closer to 5nm-class MRAM as TSMC advances its roadmap

Samsung Electronics has secured key technology for a 5nm-class magnetoresistive random-access memory cell, according to Korean financial...