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Friday 13 November 2026
SK Hynix's HBM4 yield tops 70% as Samsung expands chip packaging capacity
SK Hynix's sixth-generation high-bandwidth memory (HBM4) production yield has reportedly surpassed 70%, Chosun Biz reported on November 12, citing semiconductor industry sources,...
Friday 13 November 2026
LG Chem reportedly developing MR-MUF materials for HBM on top of NCF work
LG Chem is developing materials for the mass reflow-molded underfill (MR-MUF) process used to make high-bandwidth memory (HBM), Korean media outlet ETNews reported, citing...
Friday 13 November 2026
Samsung reportedly moves up 8-inch foundry exit to 2029, outsources some production to UMC
Samsung Electronics is targeting an exit from its 8-inch foundry business by the end of 2029, a year earlier than previously reported, and has been outsourcing some production to Taiwan's...
Thursday 12 November 2026
Sam Altman warns Samsung of short-term AI demand volatility
OpenAI CEO Sam Altman warned Samsung Electronics executives that AI memory demand could fluctuate in the short term, with the market potentially counting the same demand more than...
Thursday 12 November 2026
Samsung and Hyundai forge AI alliance
Samsung Group and Hyundai are deepening their strategic partnership, exploring opportunities in robotics, energy and physical AI alongside existing cooperation in automotive semiconductors,...
Thursday 12 November 2026
Samsung moves up HBM packaging plant opening to June 2028
Samsung Electronics said on November 12 it had moved up the planned opening of its new high-bandwidth memory (HBM) packaging plant in South Korea by one year to June 2028 to meet rising...
Thursday 12 November 2026
Apple, Samsung reportedly developing new foldable glass for 2028
Apple and Samsung Electronics are working with suppliers on foldable phone glass that is thinner at the hinge and thicker elsewhere, a design they are considering for 2028 models,...
Thursday 12 November 2026
Samsung, AMD team up to upgrade chip testing
Samsung Electronics and AMD are teaming up to upgrade the Korean chipmaker's semiconductor manufacturing test infrastructure, combining AMD's new EPYC Embedded 9006 processors with...
Thursday 12 November 2026
Samsung explores electronic skin for humanoid robot hands
Samsung Electronics is testing electronic skin on the hands of its humanoid robots with South Korean startup Midas H&T, seeking to overcome a key commercialization barrier: combining...
Wednesday 11 November 2026
Samsung reportedly buys four silicon photonics patents from Rockley
Samsung Electronics acquired four US silicon photonics patents from UK-based Rockley Photonics in September 2026, South Korea's Shinailbo reported on November 11, citing US...
Wednesday 11 November 2026
Samsung targets early 2027 for first 3D Cube-H design kit
Samsung Electronics aims to complete its first 3D Cube-H design kit, a hybrid copper bonding technology for vertically stacked logic chips, in early 2027, with prospective customer...
Wednesday 11 November 2026
Qualcomm names Samsung, Micron as memory suppliers in annual filing
Qualcomm has identified Samsung Electronics and Micron Technology as its primary memory suppliers for certain products, including automotive applications, in its fiscal 2026 annual...
Wednesday 11 November 2026
Samsung and Nvidia demonstrate up to 3,800-fold speedup in chip simulation
At Nvidia AI Day Seoul 2026, Samsung Electronics demonstrated a workflow that combined Nvidia's AI modeling tools and GPU computing with homogenization, cutting one semiconductor simulation...
Tuesday 10 November 2026
Nvidia probe fuels push for China chip curbs, raising risks for Samsung, SK Hynix
Samsung Electronics and SK Hynix face uncertainty over demand for high-bandwidth memory (HBM) as US lawmakers press for tighter controls on AI chip exports to China following allegations...
Tuesday 10 November 2026
Global smartphone revenue rises despite sharp shipment decline
Global smartphone revenue rose 3% year on year to US$114 billion in the third quarter of 2026, even as shipments fell 19%, highlighting a worldwide shift toward more expensive devices...