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Friday 10 July 2026
Analysis: Samsung, SK Hynix, and Micron's diverging approach to HBM4 base dies

Samsung Electronics, SK Hynix and Micron Technology are taking different manufacturing paths for the logic base die in HBM4, opening...

Friday 10 July 2026
Micron's US$250 billion memory push sharpens three-way race with Korean and Chinese rivals
Micron Technology's decision to lift its planned US investment to more than US$ 250 billion through 2035, unveiled July 9 alongside the first concrete pour at its Clay, New York, site,...
Friday 10 July 2026
Meta readies Iris chip, locks in supply for push to 14 gigawatts
Meta Platforms plans to begin manufacturing its Iris AI accelerator in September 2026 while securing long-term supplies of memory, storage and optical equipment for a computing expansion...
Friday 10 July 2026
Samsung's mobile business balances stronger demand against mounting profit pressure

Samsung Electronics' mobile business has shown signs of improving demand in recent months, prompting the company to increase production...

Thursday 9 July 2026
Samsung eyes broader Exynos 2700 use in Galaxy S27
Samsung Electronics is reportedly set to expand use of its in-house mobile application processor, Exynos 2700, across the Galaxy S27 flagship series slated for 2027. Money Today...
Thursday 9 July 2026
AI demand pushes TSMC, Samsung to raise foundry prices — Rapidus aims to undercut 2nm

Rising demand for AI chips is changing how foundries set prices, giving TSMC and Samsung Electronics more leverage while forcing new...

Thursday 9 July 2026
Samsung, SK Hynix rethink hybrid bonding timeline for next-gen HBM

Samsung Electronics and SK Hynix may take longer than expected to adopt hybrid bonding in next-generation high-bandwidth memory, as...

Thursday 9 July 2026
Samsung weighs first AI glasses launch as it prepares July 22 Unpacked event
Samsung Electronics said on July 8 that it will hold its Samsung Galaxy Unpacked 2026 global launch event in London on July 22. The company is expected to introduce next-generation...
Thursday 9 July 2026
SK Hynix supplier talks show AI memory boom shifting pricing power

The AI data center boom is reshaping the memory supply chain, giving Samsung Electronics, SK Hynix, and Micron greater pricing power...

Wednesday 8 July 2026
Samsung's Jae-yong Lee heads to Sun Valley Conference for likely AI talks

Samsung Electronics Chairman Jae-yong Lee departed for the Sun Valley Conference in the US on July 7, marking his second straight year...

Wednesday 8 July 2026
Samsung widens Nvidia Vera Rubin memory play with PCIe 6.0 eSSD

Samsung Electronics has started mass production of its PM1763 enterprise SSD, a PCIe 6.0-based drive built for AI infrastructure and slated...

Wednesday 8 July 2026
Winning the AI Glasses Race: Why Myopia Users and Optical Retailers Hold the Key to Mass Adoption
AI glasses are emerging as the next major access point for artificial intelligence, delivering a "see what you see, hear what you hear" experience through a familiar eyewear form factor...
Wednesday 8 July 2026
Samsung's HBM4 comeback hinges on one chip-level advantage

Samsung Electronics is using HBM4 to test whether its memory, logic, foundry, and advanced packaging businesses can finally work as...

Wednesday 8 July 2026
Apple reportedly broadens iPad OLED driver supply, chipping at Samsung's grip as foldables enlarge the pie
Apple's supply chain for OLED display driver ICs (DDI) — the chips that control how a screen's pixels light up — is diversifying, loosening Samsung's exclusive hold on...
Tuesday 7 July 2026
Samsung, SK Hynix reportedly seek China-free chip tool buffer against US controls
Samsung Electronics and SK Hynix are reportedly accelerating efforts to reduce China's role in their semiconductor supply chains in preparation for the possibility of tighter US export...