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NEWS TAGGED 12-INCH WAFER
Thursday 18 November 2021
Taiwan Mask poised to raise prices in 2022
Photomask supplier Taiwan Mask, which already raised its prices by 10-30% in the first half of 2021, plans to initiate another price hike next year to reflect its tight supply, according...
Wednesday 27 October 2021
Foundry prices to continue rising in 2022, says PSMC chairman
Pure-play foundries will remain encouraged to raise their quotes in 2022, according to Frank Huang, chairman for Taiwan-based foundry Powerchip Semiconductor Manufacturing (PSMC).
Tuesday 26 October 2021
UMC mulls new plant in Singapore
Pure-play foundry United Microelectronics (UMC) reportedly is mulling setting up a new 12-inch wafer fab in Singapore, according to market sources.
Friday 22 October 2021
Shortage of PWM ICs prompts suppliers to transition to 12-inch wafer manufacturing
The supply of handset-use power management ICs remains severely tight, prompting the chip suppliers to transition to 12-inch wafer manufacturing, according to industry sources.
Friday 15 October 2021
Will foundry expansions lead to capacity glut?
Many IDMs and pure-play foundries, including second-tier ones, are all poised to expand their fab capacities sparking concerns that the arrival of the additional capacities could...
Monday 27 September 2021
China stepping up development of homegrown 3rd-gen semiconductor supply chain
China with its 14th 5-year Plan (2021-2025) will be stepping up the development of the country's homegrown third-generation semiconductor industry supply chain, according to industry...
Friday 24 September 2021
MediaTek urged to lead Taiwan mmWave 5G chips supply chain
Taiwan's makers of RF and PA devices hope MediaTek can lead the local supply chain to meet competition from Qualcomm in tapping the mmWave 5G market, according to industry sources...
Thursday 19 August 2021
Huahong hikes 12-inch fab capacity in Wuxi
Specialty IC foundry Huahong Semiconductor has seen monthly capacity at its 12-inch wafer fab in Wuxi more than double in less than six months to 48,000 wafers, according to company...
Friday 13 August 2021
Semiconductor prosperity to last through 2022
A new wave of prosperity is taking place in the global semiconductor industry. Fabless chipmakers, foundries and backend houses have all seen their supplies fall short of customer...
Monday 9 August 2021
SiC, GaN devices to see production costs fall in next 5 years, says Infineon
Production costs for third-generation semiconductor SiC and GaN devices are expected to gradually drop to roughly the same levels as silicon-based components in the next 3-5 years,...
Monday 9 August 2021
TSMC to freeze quotes for 28nm process, sources say
Having already raised its quotes for 28nm process technology, TSMC has moved to maintain the prices throughout the second half of this year, according to industry sources.
Friday 6 August 2021
TSMC raises 12-inch foundry quotes for LCD driver ICs
TSMC has notified customers about 15-20% price hikes for its 12-inch wafer fabrication services for vendors of LCD driver ICs starting August, which in turn will prompt the vendors...
Wednesday 4 August 2021
Taiwan backend houses bracing for robust China mature-node chips demand
Taiwan-based IC backend houses are gearing up for robust packaging demand for mature-node chips from foundries in China, as the supply of such chips is increasingly short of demand...
Monday 19 July 2021
Chip probing houses to gain from new iPhone SE series, say sources
Apple reportedly is set to roll out its third-generation iPhone SE series in the first half of 2022, providing new business opportunities for chip probing specialists including TSMC...
Friday 16 July 2021
Intel GF buyout unlikely, sources say
Intel's acquisition of Globalfoundries is unlikely, as GF's manufacturing capability that is more focused on mature and specialty process technology contradicts Intel's ambition of...
Wednesday 30 March 2016
Winbond SpiStack memories
Winbond Electronics has announced an expansion of its flash product portfolio with the introduction of a family of stackable SpiFlash memory devices. The new SpiStack W25M Series is Winbond's first to allow the "stacking" of homogeneous or heterogeneous flash, thus achieving memories of varying densities for code and/or data storage, while providing designers with the flash solutions most appropriate for their design requirements. The Winbond SpiStack W25M series provides a wide range of densities in the well-established 8-pin package to which designers are accustomed. Additionally, W25M memories feature the popular, multi-IO SpiFlash interface and command set. SpiStack homogeneous memories are achieved by stacking SpiFlash dies. For example, two 256Mb dies combining to form a single SpiFlash 512Mb NOR memory in the industry-standard 8-pin 8x6mm WSON package. Winbond's stacked product, W25M512JV, is also available in the widely used 16-pin SOIC or 24-pad BGA packages and is sampling now. SpiStack heterogeneous memories call for the stacking of a NOR memory with a NAND die, such as a 64Mb SpiFlash NOR blended with a 1Gb Serial NAND die, which gives designers the flexibility to store code in the NOR die and data in the NAND memory. Winbond's SpiFlash memory devices are manufactured at the company's 12-inch wafer fabrication facility in Taichung, Taiwan.
Dec 3, 10:53
Enter the next phase of networking at a steady pace
Friday 3 December 2021
Impact of e-commerce, smart manufacturing on fashion industry
Friday 19 November 2021
Digitalizing textile supply chain
Friday 19 November 2021
Textile industry goes digital
TSMC enters pilot production of 3nm chips
Intel executives soon to visit TSMC for 3nm
Taiwan firms gearing up for upcoming Nvidia 5nm gaming GPUs
Samsung eyes reduced dependence on Qualcomm chips
Memory spot prices drop at slower pace
US-Taiwan Economic Prosperity Partner Dialogue to connect Taiwan companies with US telecoms
Taiwan top-3 foundries poised to see combined revenues increase 25% in 2021
Digitimes Research worldwide notebook shipment update – October 2021
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