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Thursday 4 December 2025
Samsung teases Exynos 2600 as Galaxy S26 faces backlash from chip split
Samsung, on December 3, confirmed its next-generation Exynos 2600 mobile processor in an official teaser video, signaling a renewed commitment to in-house silicon for the upcoming...
Thursday 4 December 2025
Samsung previews Exynos 2600, claims to match Apple and Qualcomm chips
In an unusual move, Samsung Electronics has released a teaser video for its next-generation mobile application processor, the Exynos 2600, before the chip officially hits the market...
Thursday 4 December 2025
Samsung reportedly wins majority of Nvidia's 2026 SOCAMM2 supply

Samsung Electronics is reportedly on track to supply more than half of Nvidia's next-generation System on CAMM (SOCAMM2) memory modules...

Thursday 4 December 2025
Samsung and SK Hynix align 2026 DRAM strategies
Samsung Electronics and SK Hynix reportedly both plan to raise their DRAM production growth targets for 2026. Samsung is focusing on standard DRAM such as DDR5, LPDDR5X, and GDDR7,...
Thursday 4 December 2025
Commentary: Micron exits consumer memory market as structural chip shortage hits
Micron has announced it will exit its Crucial consumer product business, including SSDs and memory modules, with all shipments ending by February 2026. This move amid escalating memory...
Thursday 4 December 2025
Transcend warns memory supply tightness to last 3-5 months amid market turmoil
Market sources indicate that memory module maker Transcend Information recently notified its customers that key suppliers SanDisk and Samsung Electronics have informed the company...
Wednesday 3 December 2025
Samsung's Z TriFold overcomes fragility, redefines mobile AI
Samsung Electronics recently unveiled its first tri-fold smartphone, the Galaxy Z TriFold, emphasizing advanced in-folding dual-side panels to deliver enhanced durability and technical...
Wednesday 3 December 2025
Samsung sixth-gen HBM reportedly cleared for production readiness, targets Nvidia supply chain
Samsung Electronics has reportedly completed the Production Readiness Approval (PRA) for its sixth-generation high-bandwidth memory (HBM), officially entering the production preparation...
Wednesday 3 December 2025
Memory spot prices surged as Samsung's RDIMM limitedly ease supply in late 4Q25
Global memory capacity remained tight with strong demand pushing DRAM and NAND flash spot prices sharply higher in November. Samsung Electronics planned to moderately release RDIMM...
Wednesday 3 December 2025
Apple reportedly to push back against India's order to preload cyber safety app, citing privacy concerns and past resistance
Apple does not plan to comply with an Indian government directive requiring smartphone makers to preload a state-developed cyber safety app, Reuters reported, citing industry...
Tuesday 2 December 2025
Samsung launches first triple-folding phone with 10-inch display
Samsung Electronics announced its first triple-folding smartphone, the Galaxy Z TriFold, on December 2, 2025, marking the company's latest attempt to expand its foldable portfolio...
Tuesday 2 December 2025
Samsung, SK Hynix set profit-first DRAM regime
Samsung Electronics and SK Hynix, which control about 70% of the global DRAM market, signalled in recent IR meetings with global investment banks that they will not pursue aggressive...
Tuesday 2 December 2025
Samsung Electronics to maintain quarterly DRAM supply negotiations amid rising memory costs
Samsung Electronics' Device Solutions (DS) division will continue negotiating mobile DRAM supplies on a quarterly basis with its Mobile eXperience (MX) division, despite ongoing memory...
Tuesday 2 December 2025
Samsung Display maps out OLED expansion in Vietnam's Bac Ninh hub
Samsung Display (SDC) is preparing to reposition Vietnam's Bac Ninh Province as a core base for its next-generation OLED business under a plan that shifts the facility from a general...
Tuesday 2 December 2025
Apple's potential Intel partnership hinges on 18A-P process maturity by 2027
Apple may resume chip production cooperation with Intel for entry-level M-series chips as early as 2027, contingent on the maturity of Intel's 18A-P process within 18 to 24 months...