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Thursday 27 August 2026
Samsung signals zHBF push as memory race moves beyond HBM
Samsung Electronics is signaling a push into high bandwidth flash (HBF), extending its next-generation memory ambitions beyond HBM as rivals move to establish a new NAND-based memory...
Thursday 27 August 2026
SK Hynix questions PIM as thermal, packaging limits constrain HBM
South Korean memory rivals Samsung Electronics and SK Hynix are taking fundamentally different routes to solve HBM performance bottlenecks. While Samsung frames processing-in-memory...
Thursday 27 August 2026
Tri-fold, rollable foldables intensify materials supply chain battle
Samsung Electronics' first tri-fold handset of 2025, the Galaxy Z TriFold, has repeatedly sold out, but with global shipments of only about 30,000 units, it functioned more as a technology...
Thursday 27 August 2026
Nvidia reportedly shifts HBM4 mix toward 8-high as memory supply stays tight

Nvidia has reportedly asked Samsung Electronics and SK Hynix to increase the share of 8-high products...

Thursday 27 August 2026
Supply shortages, price hikes fail to slow new phone wave
Mobile phone sales are under pressure as shortages and price increases for multiple upstream components squeeze the market. But brand makers have stepped up new product launches, with...
Thursday 27 August 2026
Samsung Galaxy A1 DDI packaging shifts to Chipbond
Rising gold prices are squeezing Samsung Electronics' entry-level smartphone supply chain, with South Korean media reporting that back-end packaging and testing orders for display...
Wednesday 26 August 2026
Hot Chips 2026: Samsung advances LPDDR5X-PIM as HBM costs mount
At Hot Chips 2026, Samsung Electronics moved processing-in-memory (PIM) closer to practical deployment, presenting what it described as the industry's first LPDDR-based PIM device...
Wednesday 26 August 2026
Samsung's 3-year shareholder returns seen topping KRW600T
AI memory excess profits are beginning to change Samsung Electronics' capital-allocation logic. The company recently said that, under its current 2024-2026 shareholder return policy,...
Wednesday 26 August 2026
Samsung, Intel widen AI chip battle into memory, packaging
Samsung Electronics and Intel are pushing into each other's core businesses as AI semiconductor competition shifts from individual chips to full-system integration. South Korean reports...
Wednesday 26 August 2026
Waymo's 320 million-km milestone exposes the next robotaxi challenge: scaling the silicon
As robotaxi services expand beyond individual cities into wider regions, the growing appeal of AI-assisted driving and the technological vision that AV developers are eager to realize...
Wednesday 26 August 2026
TSMC's 310mm push threatens Samsung's PLP lead
Samsung Electronics commercialized fan-out panel-level packaging (FOPLP) before rivals, using the technology in mobile and wearable chips and now preparing to extend it into AI and...
Wednesday 26 August 2026
Samsung steps up Taylor Fab 2 preparations as foundry capacity tightens
Samsung Electronics has begun asking semiconductor equipment suppliers to complete safety-compliance groundwork for a second foundry fab in Taylor, Texas, months before construction...
Wednesday 26 August 2026
SK hynix adds second major customer as Nvidia misses Samsung's top five
SK hynix added a second customer accounting for more than 10% of revenue in the first half of 2026, while Nvidia remained outside Samsung Electronics' five largest customers, highlighting...
Wednesday 26 August 2026
Samsung, LG ramp up India for AI cooling and appliances
India is emerging as a new battleground for South Korea's two electronics giants, with Samsung Electronics using the country as a production and supply-chain base for AI data center...
Tuesday 25 August 2026
Samsung Foundry sees higher 4nm volumes as Nvidia ramps Groq 3
Nvidia's Groq 3 ramp is adding meaningful 4nm volume to Samsung Electronics' foundry business, with monthly wafer input estimated at about 10,000 and expected to rise above 15,000...