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Friday 18 April 2025
Micron challenges South Korean dominance in HBM market amid tariff protectionism
Recently, reports from South Korea claim that Micron is set to become a rising star in the HBM market, following Samsung Electronics and SK Hynix. Although Donald Trump's current policies remain unclear, many in the South Korean industry predict that the US will adopt strict protectionist measures for its semiconductor industry. As a result, Micron, being a US company, is likely to benefit.
Friday 18 April 2025
SK Hynix-Hanmi alliance fractures as Korean memory giant seeks new suppliers
SK Hynix's eight-year partnership with Hanmi Semiconductor is showing signs of strain after the memory chipmaker began sourcing thermal compression bonding machines from rival Hanwha Semitech, according to industry sources.
Friday 18 April 2025
Hanmi hikes TCB equipment prices by nearly 30% for SK Hynix, ends free maintenance
Hanmi Semiconductor has reportedly informed SK Hynix of a planned price increase for its thermal compression bonding (TCB) equipment, marking the first price hike since the South Korean equipment maker began supplying the TCB product in 2017.
Tuesday 15 April 2025
Trump tariffs rattle global memory market as Micron shifts costs; Samsung and SK Hynix hold steady

Following President Donald Trump's recent announcement of a sweeping "reciprocal tariffs" policy, a new wave of economic uncertainty is rippling through the global tech supply chain. US chipmaker Micron Technology has already responded, stating it will pass the additional costs onto customers. Meanwhile, South Korean memory giants Samsung Electronics and SK Hynix are taking a more cautious approach—adopting a wait-and-see strategy while maintaining current pricing policies.

Tuesday 15 April 2025
Micron reportedly secures Nvidia certification for fifth-gen 12-layer HBM3E supply
Micron Technology is advancing in the high bandwidth memory (HBM) market, historically led by South Korean giants SK Hynix and Samsung. Reports indicate that Micron has secured Nvidia's quality certification for its fifth-generation HBM3E and will supply this memory for Nvidia's upcoming AI accelerator, Blackwell Ultra (GB300), report Korean outlets SBS Biz and Donga.
Tuesday 15 April 2025
DRAM prices climb amid tariffs; Nanya Tech eyes 2Q25 recovery
Nanya Technology, a memory manufacturer, reported a net loss of NT$1.941 billion (approx. US$60 million) in the first quarter of 2025, marking an expansion compared to the previous quarter and reflecting ten consecutive quarters of losses. However, with the ongoing improvement in DRAM supply and demand conditions in the second quarter, contract prices have stopped declining and are beginning to recover. Nanya General Manager Pei-ying Li believes that gross margins are likely to turn positive.
Monday 14 April 2025
CSIA issues urgent notice as new tariffs cause pricing chaos for imported chips in China
The escalation in the tariff war has affected the global chip supply chain, causing significant disruption in pricing within China's imported chip market. As a result, some OEMs have temporarily suspended price quotes and are instead adopting a wait-and-see approach, which is expected to impact IC distributors first.
Friday 11 April 2025
Memory prices face turbulence as tariff storm looms
A looming 32% reciprocal tariff from the US on Taiwan is set to reverberate through the memory module industry, with consumer electronics demand likely to bear the brunt. Industry insiders report that US distributors, constrained by lean inventories and depleted low-cost stockpiles, are scrambling to shore up supplies. Upstream memory manufacturers continue to push for price hikes, but the looming tariff costs may precipitate a decline in overall demand, potentially upending the anticipated supply constraints in the latter half of the year.
Friday 11 April 2025
Samsung redirects foundry talents to HBM business, stirring internal tensions

In a strategic pivot aimed at bolstering its high-bandwidth memory (HBM) operations, Samsung Electronics has begun reassigning personnel from its semiconductor division's foundry unit to its growing HBM business. The move, however, has sparked internal debate and raised concerns about the company's long-term competitiveness in the foundry sector, especially against rival TSMC.

Friday 11 April 2025
HBM helps SK Hynix claim crown as Samsung loses DRAM leadership
Surpassing Samsung in DRAM market share for the first time in its 40-year history can be attributed mainly to SK Hynix's dominance in the high bandwidth memory (HBM) market. Samsung's inability to keep pace with the AI era is seen as a significant factor in its loss of the top spot.
Thursday 10 April 2025
China's memory leaders hoard chips as US trade war bites
As the US-China trade war intensifies, Chinese memory module manufacturers are ramping up procurement efforts to secure inventory for at least two to three quarters. Industry insiders reveal that fears of supply chain disruptions, exacerbated by escalating tariff barriers, have prompted these firms to accelerate stockpiling. This unexpected surge in demand has bolstered upstream suppliers and supply chain operations, enabling some companies to meet sales targets ahead of schedule.
Thursday 10 April 2025
SK Group chairman makes unannounced Taiwan visit, focuses on AI supply chain
After nearly ten months, SK Group chairman Tae-won Choi's private jet landed again in Taiwan, signaling renewed efforts to deepen ties with key players in the AI supply chain. Exclusive images obtained by DIGITIMES show the jet on the tarmac, marking the start of a discreet two-day visit that includes closed-door meetings with top Taiwanese OEMs such as Inventec and Wistron Corporation, as well as a confidential session with TSMC.
Wednesday 9 April 2025
Micron reportedly to surcharge US sales amid Trump tariffs
Micron Technology will reportedly add a surcharge to US product sales in response to tariffs implemented during the Trump administration. This move, aimed at offsetting import costs, may impact market demand despite protecting Micron's margins amidst ongoing trade tensions.
Wednesday 9 April 2025
Micron lifts HBM market forecast as Nvidia B300 shipments loom
At its GTC event in March, Nvidia unveiled the B300 and GB300 AI accelerators, both scheduled for a mid-2025 release. The GB300, featuring significantly higher performance and power consumption than the GB200, will require full liquid cooling and more advanced packaging technologies.
Wednesday 9 April 2025
Samsung pioneers with immersion cooling to tackle DRAM heat challenges and drive AI advancements
The meteoric rise of generative AI has unleashed an insatiable demand for computational power, propelling the memory industry into a fierce technological crucible. While Samsung Electronics continues to catch up with competitors in high-bandwidth memory (HBM), the company is proactively advancing its storage technologies. At its Xi'an facility in China, Samsung has constructed an in-house data center, embracing immersion cooling to validate the compatibility of solid-state drive (SSD) materials with cutting-edge coolants.
Tuesday 8 April 2025
Samsung to raise memory chip prices amid US tariff concerns
Samsung Electronics plans to increase DRAM and NAND Flash memory prices by 3-5% in response to potential new US semiconductor tariffs, according to reports from South Korean media. The global tech giant is currently negotiating these price adjustments with major clients, with some customers already beginning contract discussions based on the anticipated increases.
Monday 7 April 2025
Weekly news roundup: US hits Asia with steep tariffs; Samsung, TSMC, Intel ramp up AI and chip strategies
These are the most-read DIGITIMES Asia stories from the week of March 31 – April 5. From sweeping US tariff hikes to strategic moves by major tech players, here's a quick look at the headlines that captured industry attention.
Wednesday 2 April 2025
Towa's HBM4 packaging breakthrough powers ambitious growth plan
Towa, a prominent name in Japan's semiconductor manufacturing equipment industry, has introduced a new technology specifically designed for the sixth-generation high bandwidth memory (HBM4) advanced packaging. In addition to this development, the company revealed a strategic three-year midterm plan set to culminate in March 2028. The aim is to expand its sales channels throughout Asia for its leading equipment. Towa forecasts a 31% increase in consolidated revenue from March 2025 figures, expecting it to reach JPY71 billion (US$473.97 million), while net profit is projected to rise by 39% to JPY10.9 billion.
Wednesday 2 April 2025
CXMT DDR4 price hike on table as memory market stabilizes
The memory market has shown signs of stabilization after a notable downturn, with recent price increases indicating a positive shift. This transition comes in the wake of manufacturers announcing impending price hikes, resulting in a rebound in spot market quotes for DRAM and NAND Flash products over the past month.
Wednesday 2 April 2025
Lee Jae-yong reportedly brought Samsung's chip and display chiefs along on China trip; signals strategic reset
Samsung Electronics Chairman Lee Jae-yong was recently joined by senior executives from the company's semiconductor and display departments on a rare visit to China. Industry analysts in South Korea say the joint trip is highly unusual and likely points to a strategic pivot in Samsung Group's China operations.
Wednesday 2 April 2025
Hanmi Semiconductor hikes key HBM equipment price, likely impacts SK Hynix
Hanmi Semiconductor has increased the price of its thermal compression bonder (TC Bonder; TCB), a critical piece of equipment for high-bandwidth memory (HBM) production, by 25% starting April 1. This marks the company's first price hike for TCB equipment, according to reports from South Korean media outlets ET News and Money Today.
Tuesday 1 April 2025
Samsung looks to salvage chip fortunes as chairman Lee Jae-yong courts China's AI and EV powerhouses
Samsung Electronics Chairman Lee Jae-yong recently made a high-profile visit to China, meeting with leading Chinese automaker executives and President Xi Jinping. South Korean analysts suggest the trip was more than diplomatic optics—it reflects Samsung's bid to capitalize on China's surging artificial intelligence (AI) demand and revive its faltering semiconductor division.
Tuesday 1 April 2025
Tokyo Electron forecasts stable semiconductor demand and expansion in AI chip equipment
Hiroshi Kawamoto, Division Officer, Finance Division of Tokyo Electron Limited (TEL), one of Japan's leading semiconductor equipment manufacturers, projects that demand for high-bandwidth memory (HBM) equipment—vital for powering generative AI—will continue to grow. However, he anticipates that sales of front-end semiconductor manufacturing processes in 2025 will likely remain on par with 2024 levels.
Monday 31 March 2025
Hanwha Semitech expands HBM production capabilities with orders from SK Hynix
Hanwha Semitech is poised to expand its supply of thermal compression bonding machines (TCB) for high-bandwidth memory (HBM) production to SK Hynix.
Monday 31 March 2025
Micron initiates price increase; Samsung and SK Hynix may follow suit
Following the announcement of a price increase by Micron, the world's third-largest DRAM manufacturer, South Korean media analysis indicates that the other two major DRAM players, Samsung Electronics and SK Hynix, are also expected to raise their prices soon. According to a report from South Korea's Chosun Biz, demand related to artificial intelligence has exceeded expectations, and the inventory levels of general memory have gradually depleted.