Bits + chips
TSMC to launch InFO-AiP volume production for mmWave devices in 2020
Julian Ho, Taipei; Willis Ke, DIGITIMES

TSMC's backend antenna-in-package technology, dubbed InFO-AiP, has attracted orders from US-based clients for packaging 5G mmWave devices, with volume production set to kick off next year, according to industry sources.

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