TSMC to launch InFO-AiP volume production for mmWave devices in 2020
Julian Ho, Taipei; Willis Ke, DIGITIMES
TSMC's backend antenna-in-package technology, dubbed InFO-AiP, has attracted orders from US-based clients for packaging 5G mmWave devices, with volume production set to kick off next year, according to industry sources.
The article you are trying to open requires News database subscription. Please sign in if you wish to continue.