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News tagged packaging
  • Last update: Friday 21 November 2014 [413 news items]

TSMC to offer InFO packaging for 16nm chips in 2016, says paper

Newswatch - Nov 21, 16:11

Taiwan Semiconductor Manufacturing Company (TSMC) will be able to offer its backend InFO (integrated fan-out) wafer-level packaging process for 16nm chips as soon as 2016, the Chinese-language...

Taiwan estimated to supply 20% of global IC packaging materials, says IEK

Nov 21, 15:37

Output from Taiwan-based IC packaging materials suppliers is forecast to account for about 20% of the global output in 2014 indicating the industry's less-competitive global presence...

Packaging material supplier Chang Wah swings to loss in 3Q14

Nov 17, 10:58

IC-packaging material and equipment supplier Chang Wah Electromaterials (CWE) has reported pre-tax losses of NT$17 million (US$553,000) for the third quarter of 2014, as affiliate...

Niching 3Q14 net profits soar 86% on year

Nov 13, 19:27

IC packaging material and tool distributor Niching Industrial saw its third-quarter net profits soar 86% from a year earlier, with revenues increasing 37%.

Demand for high-end packaging to stay strong in 4Q14, say materials suppliers

Nov 7, 10:47

Semiconductor materials suppliers expect demand for high-end packaging to remain strong and buoy their sales in the fourth quarter of 2014.

China LED packaging firms expanding capacity for 0.2-0.5W 2835 chips

Nov 4, 11:26

China-based LED packaging houses, including Leedarson Lighting and Yankong Lighting, have fully automated packaging lines for 0.2-0.5W 2835 (specification code) low-power LED chips...

LED packaging market to expand 3.2% in 2015

Oct 27, 22:12

The LED packaging industry's value is anticipated to only rise 3.2% on year from US$14.6 billion in 2014 to US$15 billion in 2015, according to LEDinside.

Semicon Taiwan 2014: Focus on new processing, packaging technologies

Sep 2, 22:13

Semicon Taiwan 2014 will kick off in Taipei from September 3-5, with this year's theme focusing on advanced wafer processes, next-generation memory technologies, 3D ICs and SiP packaging...

IC packaging material distributor Niching looks to 5-10% sequential revenue growth in 3Q14

Aug 25, 13:38

IC packaging material and tool distributor Niching Industrial is expected to see its revenues grow 5-10% sequentially in the third quarter of 2014, buoyed by rising capacity utilization...

Everlight to expand monthly LED packaging capacity to 4 billion chips, says chairman

Jul 28, 10:09

Everlight Electronics started expanding its LED packaging capacity in June and when the expansion completes in September, its monthly capacity will have increased by 500 million LED...

Trends in mobile computing technologies and component packaging

Jun 6, 10:18

2.5D interposer packaging technologies are being used in products ranging from Intel's Haswell/Broadwell processors to AMD's mobile high-performance GPU chips. DDR4, which is about...

Asia Tech Image steps into packaging 13-megapixel smartphone-use lens modules, says paper

Newswatch - May 30, 12:19

Taiwan-based contact image sensor module maker Asia Tech Image has stepped into packaging 13-megapixel smartphone-use lens modules based on its COB (chip on board) process and will...

Altera-TSMC tie-up to bring advanced packaging technology to Arria 10 FPGAs and SoCs

Newswatch - Apr 23, 15:13

Altera and Taiwan Semiconductor Manufacturing Company (TSMC) have signed a cooperation deal that will bring TSMC's patented, fine-pitch copper bump-based packaging technology to Altera's...

TSMC to ramp IC packaging revenues to US$1 billion in 2015, says paper

Newswatch - Apr 21, 11:27

Taiwan Semiconductor Manufacturing Company (TSMC) aims to ramp up its IC packaging revenues to US$1 billion in 2015 and to US$2 billion in 2016, according to a Chinese-language...

Digitimes Research: Taiwan IC backend production value to expand 5.9% in 2014

Apr 11, 10:47

The production value of Taiwan's IC testing and packaging industry is expected to grow 5.9% in 2014, higher than the 4.9% growth posted a year earlier, as well as the 4.2% growth...

ASE, Inotera reportedly to set up 3D IC packaging joint venture

Mar 31, 21:48

Advanced Semiconductor Engineering (ASE) reportedly plans to team up with Inotera Memories to set up a joint venture for handling TSV (through-silicon via) 3D IC packaging.

ASE, ChipMOS stepping into MEMS packaging sector

Newswatch - Mar 28, 16:00

IC backend service companies Advanced Semiconductor Engineering (ASE) and ChipMOS Technologies have been strengthening their deployments in the MEMS packaging sector, according to...

Micron to release more commodity DRAM packaging orders to Taiwan backend service suppliers

Mar 18, 21:37

Micron Technology reportedly plans to release more backend packaging orders for its commodity DRAM chips to Taiwan-based IC testing and packaging companies starting the first half...

ChipMOS to land more large-size LCD driver IC packaging orders in 2014

Mar 14, 16:23

IC backend service company ChipMOS Technologies is expected to land more packaging orders for large-size LCD driver ICs supporting Ultra HD displays amid increasing penetration, according...

STATS ChipPAC introduces FlexLine wafer level packaging method

Mar 12, 16:07

STATS ChipPAC has designed and implemented a new manufacturing method for wafer level packaging (WLP). This new approach is known as FlexLine.

ASE may land more packaging orders for Apple A8 CPUs

Mar 11, 21:40

Advanced Semiconductor Engineering (ASE) may land a higher portion of packaging orders for Apple's next-generation A8 processor than the 20% expected previously, according to industry...

apple

Tong Hsing, Lingsen see MEMS driving 2014 growth

Mar 4, 13:45

Tong Hsing Electronic Industries, which provides assembly and packaging services for CMOS image sensors as well as other niche ICs, expects robust growth in sales generated from its...

SMIC, JCET form JV for 12-inch bumping and testing

Feb 21, 14:26

Semiconductor Manufacturing International (SMIC) and Jiangsu Changjiang Electronics Technology (JCET), an IC assembly and test services provider in China, have established a joint...

SPIL to grow sales of silver wire-bonding packaging in 2014

Feb 12, 11:49

Chip packager Siliconware Precision Industries (SPIL) expects the development of its silver wire-bonding packaging business to bear fruit in 2014.

Amkor, STATS ChipPAC and ASE to share backend orders for Apple A8 chip, say sources

Jan 27, 14:55

Amkor Technology and STATS ChipPAC have each obtained 40% of the total packaging orders placed by Apple for its next-generation A8 processor, with the remaining 20% will be taken...

Asia Tech Image steps into COB packaging of smartphone CCMs, says paper

Newswatch - Jan 17, 10:32

Contact image sensor (CIS) module supplier Asia Tech Image has extended operation to COB (chip on board) packaging of smartphone compact camera modules (CCMs) and will start shipments...

Semiconductor packaging materials market to approach US$21 billion by 2017, says SEMI

Jan 14, 14:00

The market for semiconductor packaging materials, including thermal interface materials, is expected to maintain its US$20 billion value through 2017 despite shifts away from the...

Packaging material distributor Niching to set up nano silver paste production lines

Dec 26, 16:20

Taiwan-based IC packaging material distributor Niching Industrial has spent NT$125 million (US$4.16 million) for the purchase of a building in preparation for setting up nano silver...

PTI to grow sales of logic IC backend service biz in 2014

Dec 26, 10:29

Memory-IC packaging and testing specialist Powertech Technology (PTI) is expected to enjoy significant growth in sales of its logic IC backend service business in 2014, thanks to...

PTI chairman DK Tsai expresses optimism about company logic IC backend service business

ChipMOS to nearly halve capex for 2014

Dec 19, 22:04

Packaging and testing firm ChipMOS Technologies plans to allocate NT$1.8 billion (US$60.2 million) for its capex in 2014, down from NT$3.5 billion in 2013.

ASE starts moving production equipment at offending factories to other plants, say sources

Dec 16, 21:33

Advanced Semiconductor Engineering (ASE) has begun to move some of the production equipment installed at its K5, K7 and K11 factories to other plants, in order to mitigate the impact...

Amkor, Globalfoundries and Open-Silicon partner to develop SoC on 2.5D interposer

Nov 25, 10:21

Amkor Technology, Globalfoundries and Open-Silicon have jointly announced the successful demonstration of a functional SoC featuring two 28nm logic chips with embedded ARM processors,...

Chip carrier packaging grows on widespread adoption of QFN package, says IC Insights

Sep 4, 12:32

Advanced packaging of semiconductor chips has emerged as a key enabler in many of today's electronic system products. While much attention with regard to IC packaging is on 3D stacking...

SEMICON Taiwan 2013: 3D-IC, 450mm and advanced packaging in the spotlight

Sep 4, 11:08

The 18th annual SEMICON Taiwan trade show has kicked off and will run through Friday at the Taipei World Trade Center Nangang Exhibition Hall, highlighting seven theme pavilions including...

TSMC

STATS ChipPAC delivers ultra thin PoP solutions with eWLB packaging

Aug 20, 11:44

STATS ChipPAC has announced it has reduced package-on-package (PoP) height with its ultra thin embedded wafer level ball grid array (eWLB) technology. The eWLB-based PoP solutions...

413 items [1/12]
Realtime news
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    IT + CE - Stockwatch | 2h 6min ago

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  • TSMC orders equipment for NT$2.4 billion

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    Green energy | 2h 37min ago

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    Before Going to Press | 3h 3min ago

  • TSMC to grab 40-50% of A9 chip orders

    Before Going to Press | 3h 4min ago

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    Before Going to Press | 3h 5min ago

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    Before Going to Press | 3h 7min ago

  • Taiwan and Kora makers expanding touch-embedded solutions in 2015

    Before Going to Press | 3h 7min ago

  • China market: Online search value over CNY15 billion in 3Q14, says Analysys

    Before Going to Press | 3h 8min ago

  • Digitimes Research: China makers to drop pricing for Full HD panels by 11.5% in 2015

    Before Going to Press | 3h 9min ago

  • Mirle, Hiwin expect sales growth in 2015

    Before Going to Press | 3h 10min ago

  • Digitimes Research: Global tablet shipments to decline 11.8% in 2015

    Before Going to Press | 3h 12min ago

  • China-based Xery able to produce 50,000 home-use 3D printers a year

    Before Going to Press | 3h 13min ago

  • More monitor vendors expected to release 5K units in 2015

    Before Going to Press | 3h 14min ago

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  • IMEC+EUV+sensor+dies

    IMEC EUV sensor dies

    IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field,...

    Photo: Company, Oct 13.

  • Applied+Producer+InVia+dielectric+deposition+system

    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

  • Samsung+0%2E6mm%2Dthick+multi%2Dchip+memory+package

    Samsung 0.6mm-thick multi-chip memory package

    Samsung Electronics has developed what it claims is the world's thinnest multi-die package, whch measures 0.6mm in height. Designed initially for 32GB densities, the new memory package...

    Photo: Company, Nov 10.

  • Finetech+Japan+2009%3A+Ito+Electronics%27+water%2Dproof+OLED+display

    Finetech Japan 2009: Ito Electronics' water-proof OLED display

    Japan-based Ito Electronics showcased its water-proof OLED display at Finetech Japan 2009. With its packaging technology, Ito allows OLED to work under water.

    Photo: Jessie Lin, Digitimes, Apr 21.

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Greater China touch panel shipment forecast through 2015
  • 2014 global high brightness LED market, trends and shipment forecast

    For the global LED lighting market, the market size will reach US$25.82 billion in 2014 or a market penetration rate of 23.4%. This is attributable to exponential shipment growth for light bulbs, tubes, and directional lamps.

  • Greater China touch panel shipment forecast through 2015

    This Special Report provides forecasts through 2015 for Greater China touch panel shipments with breakdowns based on technology (glass, film, resistive), application (smartphone, NB and tablet) and by firm.

  • 2014 global tablet demand forecast

    This report analyzes the main players, their strategies and shipments forecasts for 2014, as well as other factors contributing to either growth or decline in various segments within the tablet market, with a particular focus on Apple, Google, Samsung, and Microsoft, along with whitebox vendors.