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News tagged packaging
  • Last update: Wednesday 25 March 2015 [424 news items]

Xintec to list on Taiwan OTC on March 30

Mar 25, 21:53

Image sensor packaging house Xintec will be listed on the Taiwan over-the-counter (OTC) stock market at a tentative price of NT$42 (US$1.34) per share on March 30, according to the...

Xintec 12-inch wafer-level CSP ready for volume production in 2H15, says chairman

Mar 17, 20:01

Image sensor packaging house Xintec will have its 12-inch wafer-level chip-scale package (WL-CSP) line ready for volume production in the second half of 2015, according to company...

Xintec chairman Robert Kuan

National Instrument transforms Taiwan office to independent company

Mar 13, 15:59

National Instrument has announced it has transformed its branch office in Taiwan to become an independent company starting March and expects the company to achieve 20-40% on-year...

TSMC to offer InFO-WLP technology for 16nm chips, eyeing Apple orders

Feb 4, 13:45

Taiwan Semiconductor Manufacturing Company (TSMC) will have its backend integrated fan-out (InFO) wafer-level packaging (WLP) technology ready for 16nm chips, eyeing orders for Apple's...

SPIL gearing up for fan-out WLP

Jan 29, 19:39

Siliconware Precision Industries' (SPIL) fan-out type wafer level packaging (WLP) will be ready for mass production in 2016, company chairman Bough Lin said during a January 28 investors...

Chipbond, ChipMOS 1Q15 sales to drop 5-10%

Jan 19, 10:36

LCD driver IC packaging and testing houses Chipbond Technology and ChipMOS Technologies are both expected to see their first-quarter 2015 sales decrease 5-10% sequentially, compared...

UTAC said to set up 12-inch wafer-level packaging line in Taiwan

Dec 23, 15:13

United Test and Assembly Center (UTAC), a Singapore-based assembly and test company, will continue its investment in Taiwan in 2015 by setting up a 12-inch wafer-level packaging line,...

Micron, PTI partner for assembly and packaging services in China

Stockwatch - Dec 3, 22:10

Micron Technology and Powertech Technology (PTI) have entered into a series of agreements forming the basis of a long-term strategic relationship for assembly and packaging services...

Over 100 China-based LED packaging houses to be forced out of competition in 2014

Dec 2, 22:10

Profitability for LED products is shrinking due to continual price drops along with increasing competition, and more than 100 relatively small China-based LED packaging service providers...

IC backend firms cautious about 2015 capex plans

Dec 2, 15:52

Having spent big in 2014, major Taiwan-based IC packaging and testing houses are cautious with their capital expenditures (capex) for 2015.

LED packaging houses to see 10% sequential drop in 4Q14 revenues

Nov 26, 15:27

Due to weak demand for LED backlighting and lighting, Taiwan-based LED packaging service providers are expected to see fourth-quarter 2014 consolidated revenues decrease 10% sequentially...

TSMC to offer InFO packaging for 16nm chips in 2016, says paper

Newswatch - Nov 21, 16:11

Taiwan Semiconductor Manufacturing Company (TSMC) will be able to offer its backend InFO (integrated fan-out) wafer-level packaging process for 16nm chips as soon as 2016, the Chinese-language...

Taiwan estimated to supply 20% of global IC packaging materials, says IEK

Nov 21, 15:37

Output from Taiwan-based IC packaging materials suppliers is forecast to account for about 20% of the global output in 2014 indicating the industry's less-competitive global presence...

Packaging material supplier Chang Wah swings to loss in 3Q14

Nov 17, 10:58

IC-packaging material and equipment supplier Chang Wah Electromaterials (CWE) has reported pre-tax losses of NT$17 million (US$553,000) for the third quarter of 2014, as affiliate...

Niching 3Q14 net profits soar 86% on year

Nov 13, 19:27

IC packaging material and tool distributor Niching Industrial saw its third-quarter net profits soar 86% from a year earlier, with revenues increasing 37%.

Demand for high-end packaging to stay strong in 4Q14, say materials suppliers

Nov 7, 10:47

Semiconductor materials suppliers expect demand for high-end packaging to remain strong and buoy their sales in the fourth quarter of 2014.

China LED packaging firms expanding capacity for 0.2-0.5W 2835 chips

Nov 4, 11:26

China-based LED packaging houses, including Leedarson Lighting and Yankong Lighting, have fully automated packaging lines for 0.2-0.5W 2835 (specification code) low-power LED chips...

LED packaging market to expand 3.2% in 2015

Oct 27, 22:12

The LED packaging industry's value is anticipated to only rise 3.2% on year from US$14.6 billion in 2014 to US$15 billion in 2015, according to LEDinside.

Semicon Taiwan 2014: Focus on new processing, packaging technologies

Sep 2, 22:13

Semicon Taiwan 2014 will kick off in Taipei from September 3-5, with this year's theme focusing on advanced wafer processes, next-generation memory technologies, 3D ICs and SiP packaging...

IC packaging material distributor Niching looks to 5-10% sequential revenue growth in 3Q14

Aug 25, 13:38

IC packaging material and tool distributor Niching Industrial is expected to see its revenues grow 5-10% sequentially in the third quarter of 2014, buoyed by rising capacity utilization...

Everlight to expand monthly LED packaging capacity to 4 billion chips, says chairman

Jul 28, 10:09

Everlight Electronics started expanding its LED packaging capacity in June and when the expansion completes in September, its monthly capacity will have increased by 500 million LED...

Trends in mobile computing technologies and component packaging

Jun 6, 10:18

2.5D interposer packaging technologies are being used in products ranging from Intel's Haswell/Broadwell processors to AMD's mobile high-performance GPU chips. DDR4, which is about...

Asia Tech Image steps into packaging 13-megapixel smartphone-use lens modules, says paper

Newswatch - May 30, 12:19

Taiwan-based contact image sensor module maker Asia Tech Image has stepped into packaging 13-megapixel smartphone-use lens modules based on its COB (chip on board) process and will...

Altera-TSMC tie-up to bring advanced packaging technology to Arria 10 FPGAs and SoCs

Newswatch - Apr 23, 15:13

Altera and Taiwan Semiconductor Manufacturing Company (TSMC) have signed a cooperation deal that will bring TSMC's patented, fine-pitch copper bump-based packaging technology to Altera's...

TSMC to ramp IC packaging revenues to US$1 billion in 2015, says paper

Newswatch - Apr 21, 11:27

Taiwan Semiconductor Manufacturing Company (TSMC) aims to ramp up its IC packaging revenues to US$1 billion in 2015 and to US$2 billion in 2016, according to a Chinese-language...

Digitimes Research: Taiwan IC backend production value to expand 5.9% in 2014

Apr 11, 10:47

The production value of Taiwan's IC testing and packaging industry is expected to grow 5.9% in 2014, higher than the 4.9% growth posted a year earlier, as well as the 4.2% growth...

ASE, Inotera reportedly to set up 3D IC packaging joint venture

Mar 31, 21:48

Advanced Semiconductor Engineering (ASE) reportedly plans to team up with Inotera Memories to set up a joint venture for handling TSV (through-silicon via) 3D IC packaging.

ASE, ChipMOS stepping into MEMS packaging sector

Newswatch - Mar 28, 16:00

IC backend service companies Advanced Semiconductor Engineering (ASE) and ChipMOS Technologies have been strengthening their deployments in the MEMS packaging sector, according to...

Micron to release more commodity DRAM packaging orders to Taiwan backend service suppliers

Mar 18, 21:37

Micron Technology reportedly plans to release more backend packaging orders for its commodity DRAM chips to Taiwan-based IC testing and packaging companies starting the first half...

ChipMOS to land more large-size LCD driver IC packaging orders in 2014

Mar 14, 16:23

IC backend service company ChipMOS Technologies is expected to land more packaging orders for large-size LCD driver ICs supporting Ultra HD displays amid increasing penetration, according...

STATS ChipPAC introduces FlexLine wafer level packaging method

Mar 12, 16:07

STATS ChipPAC has designed and implemented a new manufacturing method for wafer level packaging (WLP). This new approach is known as FlexLine.

ASE may land more packaging orders for Apple A8 CPUs

Mar 11, 21:40

Advanced Semiconductor Engineering (ASE) may land a higher portion of packaging orders for Apple's next-generation A8 processor than the 20% expected previously, according to industry...

apple

Tong Hsing, Lingsen see MEMS driving 2014 growth

Mar 4, 13:45

Tong Hsing Electronic Industries, which provides assembly and packaging services for CMOS image sensors as well as other niche ICs, expects robust growth in sales generated from its...

SMIC, JCET form JV for 12-inch bumping and testing

Feb 21, 14:26

Semiconductor Manufacturing International (SMIC) and Jiangsu Changjiang Electronics Technology (JCET), an IC assembly and test services provider in China, have established a joint...

SPIL to grow sales of silver wire-bonding packaging in 2014

Feb 12, 11:49

Chip packager Siliconware Precision Industries (SPIL) expects the development of its silver wire-bonding packaging business to bear fruit in 2014.

424 items [1/13]
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    Photo: Company, Mar 31.

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    Samsung 0.6mm-thick multi-chip memory package

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    Photo: Company, Nov 10.

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    Finetech Japan 2009: Ito Electronics' water-proof OLED display

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31-Mar-2015 markets closed

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