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News tagged packaging
  • Last update: Monday 21 April 2014 [400 news items]

TSMC to ramp IC packaging revenues to US$1 billion in 2015, says paper

Newswatch - 9h 16min ago

Taiwan Semiconductor Manufacturing Company (TSMC) aims to ramp up its IC packaging revenues to US$1 billion in 2015 and to US$2 billion in 2016, according to a Chinese-language...

Digitimes Research: Taiwan IC backend production value to expand 5.9% in 2014

Apr 11, 10:47

The production value of Taiwan's IC testing and packaging industry is expected to grow 5.9% in 2014, higher than the 4.9% growth posted a year earlier, as well as the 4.2% growth...

ASE, Inotera reportedly to set up 3D IC packaging joint venture

Mar 31, 21:48

Advanced Semiconductor Engineering (ASE) reportedly plans to team up with Inotera Memories to set up a joint venture for handling TSV (through-silicon via) 3D IC packaging.

ASE, ChipMOS stepping into MEMS packaging sector

Newswatch - Mar 28, 16:00

IC backend service companies Advanced Semiconductor Engineering (ASE) and ChipMOS Technologies have been strengthening their deployments in the MEMS packaging sector, according to...

Micron to release more commodity DRAM packaging orders to Taiwan backend service suppliers

Mar 18, 21:37

Micron Technology reportedly plans to release more backend packaging orders for its commodity DRAM chips to Taiwan-based IC testing and packaging companies starting the first half...

ChipMOS to land more large-size LCD driver IC packaging orders in 2014

Mar 14, 16:23

IC backend service company ChipMOS Technologies is expected to land more packaging orders for large-size LCD driver ICs supporting Ultra HD displays amid increasing penetration, according...

STATS ChipPAC introduces FlexLine wafer level packaging method

Mar 12, 16:07

STATS ChipPAC has designed and implemented a new manufacturing method for wafer level packaging (WLP). This new approach is known as FlexLine.

ASE may land more packaging orders for Apple A8 CPUs

Mar 11, 21:40

Advanced Semiconductor Engineering (ASE) may land a higher portion of packaging orders for Apple's next-generation A8 processor than the 20% expected previously, according to industry...

apple

Tong Hsing, Lingsen see MEMS driving 2014 growth

Mar 4, 13:45

Tong Hsing Electronic Industries, which provides assembly and packaging services for CMOS image sensors as well as other niche ICs, expects robust growth in sales generated from its...

SMIC, JCET form JV for 12-inch bumping and testing

Feb 21, 14:26

Semiconductor Manufacturing International (SMIC) and Jiangsu Changjiang Electronics Technology (JCET), an IC assembly and test services provider in China, have established a joint...

SPIL to grow sales of silver wire-bonding packaging in 2014

Feb 12, 11:49

Chip packager Siliconware Precision Industries (SPIL) expects the development of its silver wire-bonding packaging business to bear fruit in 2014.

Amkor, STATS ChipPAC and ASE to share backend orders for Apple A8 chip, say sources

Jan 27, 14:55

Amkor Technology and STATS ChipPAC have each obtained 40% of the total packaging orders placed by Apple for its next-generation A8 processor, with the remaining 20% will be taken...

Asia Tech Image steps into COB packaging of smartphone CCMs, says paper

Newswatch - Jan 17, 10:32

Contact image sensor (CIS) module supplier Asia Tech Image has extended operation to COB (chip on board) packaging of smartphone compact camera modules (CCMs) and will start shipments...

Semiconductor packaging materials market to approach US$21 billion by 2017, says SEMI

Jan 14, 14:00

The market for semiconductor packaging materials, including thermal interface materials, is expected to maintain its US$20 billion value through 2017 despite shifts away from the...

Packaging material distributor Niching to set up nano silver paste production lines

Dec 26, 16:20

Taiwan-based IC packaging material distributor Niching Industrial has spent NT$125 million (US$4.16 million) for the purchase of a building in preparation for setting up nano silver...

PTI to grow sales of logic IC backend service biz in 2014

Dec 26, 10:29

Memory-IC packaging and testing specialist Powertech Technology (PTI) is expected to enjoy significant growth in sales of its logic IC backend service business in 2014, thanks to...

PTI chairman DK Tsai expresses optimism about company logic IC backend service business

ChipMOS to nearly halve capex for 2014

Dec 19, 22:04

Packaging and testing firm ChipMOS Technologies plans to allocate NT$1.8 billion (US$60.2 million) for its capex in 2014, down from NT$3.5 billion in 2013.

ASE starts moving production equipment at offending factories to other plants, say sources

Dec 16, 21:33

Advanced Semiconductor Engineering (ASE) has begun to move some of the production equipment installed at its K5, K7 and K11 factories to other plants, in order to mitigate the impact...

Amkor, Globalfoundries and Open-Silicon partner to develop SoC on 2.5D interposer

Nov 25, 10:21

Amkor Technology, Globalfoundries and Open-Silicon have jointly announced the successful demonstration of a functional SoC featuring two 28nm logic chips with embedded ARM processors,...

Chip carrier packaging grows on widespread adoption of QFN package, says IC Insights

Sep 4, 12:32

Advanced packaging of semiconductor chips has emerged as a key enabler in many of today's electronic system products. While much attention with regard to IC packaging is on 3D stacking...

SEMICON Taiwan 2013: 3D-IC, 450mm and advanced packaging in the spotlight

Sep 4, 11:08

The 18th annual SEMICON Taiwan trade show has kicked off and will run through Friday at the Taipei World Trade Center Nangang Exhibition Hall, highlighting seven theme pavilions including...

TSMC

STATS ChipPAC delivers ultra thin PoP solutions with eWLB packaging

Aug 20, 11:44

STATS ChipPAC has announced it has reduced package-on-package (PoP) height with its ultra thin embedded wafer level ball grid array (eWLB) technology. The eWLB-based PoP solutions...

Taiwan 3Q13 IC backend production value to register slight growth, says IEK

Aug 16, 16:13

The production value of Taiwan's IC packaging and testing industry sectors will register sequential growth of 4.6% and 4.3%, respectively, in the third quarter of 2013, according...

Tong Hsing looks to strong sales in 3Q13

Aug 12, 18:09

Tong Hsing Electronic Industries expects its sales in the third quarter of 2013 to grow at the same pace or higher than the 8% it posted in the previous quarter, powered by ever growing...

Amkor completes acquisition of Toshiba packaging unit in Malaysia

Aug 1, 14:50

IC assembly and test service provider Amkor Technology has completed its acquisition of Toshiba's semiconductor packaging operation in Malaysia, according to the two companies.

Nichia faces competition for LED packaging from Taiwan-, China-, South Korea-based makers

Jul 23, 14:42

Japan-based Nichia has gained a leading market status in EMC (epoxy molding compound)-based LED chip packaging, but some Taiwan-, China- and South Korea-based LED packagers have been...

PTI enjoys rising shipments for mobile DRAM

Jul 15, 21:07

Packaging and testing firm Powertech Technology (PTI) has enjoyed growth in its shipments for mobile DRAM chips to Elpida Memory since the second half of 2012, according to market...

Some LED chip makers extend to packaging

Jul 10, 11:11

Some of Taiwan-based LED chip makers have extended to packaging, offering solutions that EMS players can directly turn into lighting products, according to industry sources.

High-end packaging next battlefield for IC assembly and test services providers, says Amkor executive

Jul 9, 15:53

Robust growth in smartphone usage is encouraging semiconductor assembly and test services providers to head towards related packaging technologies. Amkor Technology is already among...

Kevin Yu, Amkor sales director for Greater China

Edison Opto expanding LED packaging capacity

Jul 8, 10:23

Edison Opto is expanding its monthly LED packaging capacity from 150 million PLCC (plastic leaded chip carrier) small- to medium-power devices and 10 million high-power devices at...

LED packaging houses face rising technological challenge

Jun 17, 10:33

South Korea-based TV makers hope to further reduce the cost of direct-lit LED TVs by using fewer LED chips in backlight modules, hence the firms hope LED packaging houses can increase...

Demand for large-size driver ICs to boom in 2H13, say backend firms

May 21, 14:47

Packaging and testing firms Chipbond Technology and ChipMOS Technologies both expect orders for large-size LCD driver ICs to pull in during the second half of 2013 on booming demand...

Touchscreen IC suppliers to see May sales increase

May 10, 11:25

Touchscreen controller IC suppliers Elan Microelectronics and Egalax-Empia Technology (EETI) are expected to post significant growth in May sales driven by demand from the PC sector,...

Supply for high-end IC packaging to fall short in 2H13, says SPIL chair

May 2, 14:49

Supply for high-end IC packaging is likely to fall short of demand during the second half of 2013, according to Bough Lin, chairman for Siliconware Precision Industries (SPIL). SPIL...

SPIL chairman Bough Lin

Backend firms see DRAM market recovery

Apr 23, 16:16

Memory packaging and testing specialists Powertech Technology (PTI), Walton Advanced Engineering and Formosa Advanced Technologies (FATC) are expected to benefit from a recovery in...

400 items [1/12]
  • IMEC+EUV+sensor+dies

    IMEC EUV sensor dies

    IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field,...

    Photo: Company, Oct 13.

  • Applied+Producer+InVia+dielectric+deposition+system

    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

  • Samsung+0%2E6mm%2Dthick+multi%2Dchip+memory+package

    Samsung 0.6mm-thick multi-chip memory package

    Samsung Electronics has developed what it claims is the world's thinnest multi-die package, whch measures 0.6mm in height. Designed initially for 32GB densities, the new memory package...

    Photo: Company, Nov 10.

  • Finetech+Japan+2009%3A+Ito+Electronics%27+water%2Dproof+OLED+display

    Finetech Japan 2009: Ito Electronics' water-proof OLED display

    Japan-based Ito Electronics showcased its water-proof OLED display at Finetech Japan 2009. With its packaging technology, Ito allows OLED to work under water.

    Photo: Jessie Lin, Digitimes, Apr 21.

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TAIEX (TSE)8951.19-15.47-0.17% 

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