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News tagged packaging
  • Last update: Wednesday 16 August 2017 [527 news items]

Electric car vendor Thunder Power to build plants in Taiwan

Aug 16, 15:36

Hong Kong-based Thunder Power Holding has announced a new electric car in Taiwan and has also recently signed a letter of intent with a local government to establish plants for battery...

Globalfoundries demos 2.5D HBM solution

Aug 16, 09:33

Globalfoundries has demonstrated silicon functionality of a 2.5D packaging solution for its 14nm FinFET FX-14 integrated design system for application-specific integrated circuits...

Globalfoundries intros solution leveraging 2.5D packaging with low-latency

Taiwan Chelic 2Q17 revenues rise 58% sequentially

Aug 15, 16:03

Pneumatic automation component maker Taiwan Chelic has reported its second-quarter 2017 consolidated revenues reached NT$418 million (US$14.09 million), up 58.33% sequentially, with...

SPIL to invest US$25 million in China

Aug 15, 10:27

Siliconware Precision Industries (SPIL) has announced plans to invest indirectly a total of US$25 million in its newly-established wholly-owned subsidiary in China. Named Siliconware...

Taiwan IC industry output value drops in 2Q17, says TSIA

Aug 10, 14:36

Taiwan's IC industry, consisting of designers, manufacturers, packaging and testing houses, generated output value of NT$572.6 billion (US$18.9 billion) in the second quarter of 2017,...

Taiwan IC industry output value drops in 2Q17

TSMC approves new capex spending for capacity expansion

Aug 9, 12:26

Taiwan Semiconductor Manufacturing Company (TSMC) has approved the appropriation of around US$3.15 billion, which includes funding for new facilities construction with costs estimated...

Taiwan passive component makers post record July revenues

Aug 8, 10:53

Major Taiwan-based passive component makers including Yageo, Walsin Technology and Chilisin Electronics have reported record-high revenues for July 2017, thanks to a pick-up in customer...

Capacitor

SPIL July revenues rise 6%

Aug 8, 09:52

IC packaging and testing house Siliconware Precision Industries (SPIL) saw its July revenues climb to a 7-month high of NT$7.26 billion (US$240.1 million).

Global Unichip targeting AI sector

Aug 7, 14:44

Taiwan-based Global Unichip, an IC design service company partnering with Taiwan Semiconductor Manufacturing Company (TSMC), is looking to expand its business in the artificial intelligence...

Global Unichip partnering with TSMC to expand business in AI field

China market: Prices for LED packaging materials rise

Aug 7, 09:30

Due to tight supply, suppliers of materials used in LED packaging in the China market have hiked quotes and the increased prices are likely to remain in the fourth quarter of 2017,...

ASE likely to post over 10% revenue growth in 3Q17

Jul 31, 09:09

Packaging and testing company Advanced Semiconductor Engineering (ASE) is expected to report 10-13% sequential growth in consolidated revenues for the third quarter of 2017, with...

ASE

PTI optimistic about 3Q17

Jul 25, 21:46

Memory backend specialist Powertech Technology (PTI) expects its sales to peak in the third quarter, and remains optimistic about the outlook for the fourth quarter.

TSMC to expand CoWoS capacity to fill increasing AI chip packaging orders

Jul 24, 13:47

Taiwan Semiconductor Manufacturing Company (TSMC) is planning to carry out the first-ever expansion of its CoWoS (Chip on Wafer on Substrate) packaging and testing capacity to fill...

TSMC CoWoS packaging and testing capacity

TSMC InFO packaging brings more competitiveness to its 7nm process technology

Jul 20, 11:45

Taiwan Semiconductor Manufacturing Company's (TSMC) integrated fan-out (InFO) wafer-level packaging technology is about to enter its second generation, which will bring more competitiveness...

Chipbond reportedly to sell partial stake in China subsidiary to BOE

Jul 19, 21:19

Speculation has circulated in the industry that Taiwan-based Chipbond Technology plans to sell part of its stake in its China-based subsidiary Chipmore Technology to BOE Technology...

Chipbond, ChipMOS seeing robust gold bumping demand

Jul 19, 15:37

Backend houses Chipbond Technology and ChipMOS Technologies have both cut into the supply chains of US and Korea smartphone brands with their gold bumping services, and are set to...

Global semiconductor equipment sales set to reach record high in 2017, says SEMI

Jul 12, 15:11

Worldwide sales of new semiconductor manufacturing equipment are projected to increase 19.8% to total US$49.4 billion in 2017, marking the first time that the semiconductor equipment...

Sigurd to acquire half of Winstek via Bloomeria takeover

Jul 5, 22:20

IC testing company Sigurd Microelectronics has announced plans to acquire 100% of Singapore-based Bloomeria Limited, which will allow the Taiwan-based company to also obtain a more...

SPIL 2Q17 revenues rise, KYEC down

Jul 5, 21:58

IC packaging and testing house Siliconware Precision Industries (SPIL) saw its second-quarter revenues increase 4.5% sequentially, while revenues at fellow company King Yuan Electronics...

Tongfu Microelectronics to set up advanced IC backend plant in Xiamen, says report

Jun 27, 21:05

China-based Tongfu Microelectronics has struck a deal with the Xiamen Haicang District government to set up a manufacturing base for advanced packaging and testing services locally...

China Big Fund commits investment of CNY85 billion

Jun 27, 15:43

China's National Semiconductor Industry Investment Fund (known as the Big Fund) has committed to invest CNY85 billion (US$12.4 billion) into the local IC industry, mainly the manufacturing...

Chipbond to see revenues peak in 3Q17

Jun 19, 15:20

Chipbond Technology, a backend house specializing in LCD driver ICs, is expected to see its third-quarter revenues peak for 2017 driven by a pull-in of orders from Japan-based clients,...

Packaging can extend physical limits of semiconductors, says TSMC chair

Jun 12, 15:41

Moore's Law will reach its physical limits in 8-10 years, but the development of advanced packaging technology will help extend innovations, according to Morris Chang, chairman of...

TSMC chairman Morris Chang

China market: ASE re-submits application for planned merger with SPIL

Jun 9, 13:43

Advanced Semiconductor Engineering (ASE) has said its application submitted previously to China's antitrust regulators for a planned merger with Siliconware Precision Industry (SPIL)...

PTI optimistic about memory-dominated packaging

Jun 2, 10:30

The era of memory-dominated packaging technology has arrived, and heterogeneous stacking with memory and logic devices has become a trend, according to DK Tsai, chairman and CEO for...

Tsinghua Unigroup chair criticizes Qualcomm for forming JV with local chipmaker

Jun 1, 21:16

Tsinghua Unigroup chairman Zhao Weiguo has criticized Qualcomm's intention of forming a joint venture with fabless chip firm Leadcore Technology and two local investment firms in...

ASE lands FOWLP packaging orders from Infineon, says paper

Newswatch - May 24, 12:08

Advanced Semiconductor Engineering (ASE) has reportedly secured orders for providing fan-out wafer-level packaging (FOWLP) service for Infineon Technologies' power management (PWM)...

ASE, SPIL get US antitrust approval

May 17, 14:36

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have received approval from US antitrust regulators for their proposed merger, according to the...

Packaging material distributor Chang Wah posts high EPS for 1Q17

Newswatch - May 16, 15:11

Semiconductor and packaging material and equipment supplier Chang Wah Electromaterials (CWE) has reported net profits of NT$334 million (US$11.095 million) for the first quarter of...

TSMC obtains 12nm chip orders from fabless firms

May 11, 11:59

Taiwan Semiconductor Manufacturing Company (TSMC) has secured 12nm chip orders from Nvidia, MediaTek, Silicon Motion Technology and HiSilicon for the fabless firms' different chip...

PTI April revenues increase

May 8, 23:00

Packaging and testing company Powertech Technology (PTI) has reported consolidated revenues of NT$4.36 billion (US$144.4 million) for April 2017, up 20.7% on year and 2.1% sequenti...

ASE posts profit decrease in 1Q17

May 2, 10:59

Packaging and testing company Advanced Semiconductor Engineering (ASE) saw its profits fall to a 4-year low in the first quarter of 2017.

Cree to set up LED packaging joint venture with San'an Optoelectronics

Apr 27, 12:03

Cree has announced it is forming a joint venture with San’an Optoelectronics to produce and deliver to market high-performing, mid-power lighting class LED packaged products.

SPIL posts profit drop in 1Q17

Apr 27, 11:10

IC packager Siliconware Precision Industries (SPIL) has reported net profits of NT$996 million (US$33.1 million) for the first quarter of 2017, down 64.8% sequentially and 37.9% on...

Micron talks about its integrated global operations

Apr 26, 15:37

Micron Technology has been actively allocating its global resources to enhance its DRAM and NAND flash product lines, according to Wayne Allan, VP of global manufacturing at the US-based...

Wayne Allan, VP of global manufacturing at Micron
527 items [1/16]
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  • Samsung+128GB+TSV+DDR4+RDIMM

    Samsung 128GB TSV DDR4 RDIMM

    Samsung Electronics has announced that it is mass producing what it calls the industry's first "through silicon via" (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules...

    Photo: Company, Dec 9.

  • IMEC+EUV+sensor+dies

    IMEC EUV sensor dies

    IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field,...

    Photo: Company, Oct 13.

  • Applied+Producer+InVia+dielectric+deposition+system

    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

  • Samsung+0%2E6mm%2Dthick+multi%2Dchip+memory+package

    Samsung 0.6mm-thick multi-chip memory package

    Samsung Electronics has developed what it claims is the world's thinnest multi-die package, whch measures 0.6mm in height. Designed initially for 32GB densities, the new memory package...

    Photo: Company, Nov 10.

  • Finetech+Japan+2009%3A+Ito+Electronics%27+water%2Dproof+OLED+display

    Finetech Japan 2009: Ito Electronics' water-proof OLED display

    Japan-based Ito Electronics showcased its water-proof OLED display at Finetech Japan 2009. With its packaging technology, Ito allows OLED to work under water.

    Photo: Jessie Lin, Digitimes, Apr 21.

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Global AP demand forecast, 2017-2020

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Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.