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News tagged packaging
  • Last update: Friday 25 November 2016 [475 news items]

ASE, VisEra obtain packaging orders for under-glass fingerprint sensors from Synaptics, says report

Newswatch - Nov 25, 16:06

Taiwan-based Advanced Semiconductor Engineering (ASE) and VisEra Technologies have both landed packaging orders for under-glass fingerprint sensors from Synaptics, according to a...

Packaging material supplier Chang Wah 3Q16 profits rise 68%

Nov 15, 15:08

Packaging material and equipment supplier Chang Wah Electromaterials (CWE) has reported net profits of NT$152 million (US$4.8 million) for the third quarter of 2016, up 67.8% sequentially,...

ASE ready to enter volume production of fan-out wafer-level packaging

Oct 26, 11:54

Advanced Semiconductor Engineering (ASE) has reportedly obtained orders for fan-out wafer-level packaging (FOWLP) from Qualcomm, MediaTek and HiSilicon with volume production set...

PTI expects another quarter of record revenues

Oct 26, 11:46

Powertech Technology (PTI) expects its revenues to increase by a low single-digit percentage point sequentially in the fourth quarter of 2016, which will mark the second consecutive...

Digitimes Research: Nichia tops LED packaging service providers in 1H16 revenues

Oct 14, 11:16

Among LED packaging service providers around the world, Japan-based Nichia ranked first in LED revenues for the first half of 2016 with JPY126.58 billion (US$1.248 billion), followed...

E Ink Holdings, HTC, Palladio cooperate to develop smart packaging solution for pharmaceuticals

Oct 5, 15:19

EPD (electrophoretic display) maker E Ink Holdings (EIH), smartphone vendor HTC and Italy-based packaging solution provider Palladio Group have announced a jointly-developed smart...

Smart packaging solution for pharmaceuticals developed by EIH, HTC, Palladio

PTI buys wafer-level packaging equipment

Stockwatch - Sep 28, 14:08

Packaging and testing company Powertech Technology has purchased wafer-level packaging equipment from Ultratech SE Asia for NT$544 million (US$17 million), according to a company...

Cadence delivers integrated system design solution for TSMC InFO packaging technology

Sep 23, 10:55

Cadence Design Systems has announced the immediate availability of an integrated system design solution for TSMC's advanced wafer-level integrated fan-out (InFO) packaging technology,...

Applied Materials, IME to advance R&D in fan-out wafer-level packaging

Sep 20, 00:46

Applied Materials and the Institute of Microelectronics (IME), a research institute under Singapore's Agency for Science, Technology and Research, have announced a five-year extension...

CWTC listed on Taiwan OTC

Sep 14, 14:55

Chang Wah Technology (CWTC), which manufactures LED leadframe packaging materials, started trading on Taiwan's over-the-counter (OTC) stock market at an initial price of NT$102 (US$3.22)...

SEMICON Taiwan 2016: Advanced packaging remains in the spotlight

Sep 7, 12:22

Semicon Taiwan 2016 will kick off in Taipei from September 7-9, with advanced packaging remaining a major focus.

Demand from Taiwan chipmakers brisk, says Namics

Sep 2, 11:36

Demand from Taiwan-based Taiwan Semiconductor Manufacturing Company (TSMC), Siliconware Precision Industries (SPIL) and other chipmakers has been strong, according to Japan-based...

SPIL chairman calls for more open government policy

Aug 26, 10:18

Packaging and testing company Siliconware Precision Industries (SPIL) chairman Bough Lin has urged Taiwan's government to create a more open investment environment for China-based...

SPIL chairman Bough Lin

Micron to acquire Cando plant

Jul 21, 22:11

Micron Technology plans to buy touch panel maker Cando's plant in central Taiwan, which will be operated by Powertech Technology (PTI) to provide the US memory vendor packaging and...

All Ring June revenues hit record for 2nd straight month

Stockwatch - Jul 7, 14:45

Equipment maker All Ring Tech has reported consolidated revenues of NT$253 million (US$7.8 million) for June 2016, hitting a monthly record for the second consecutive month.

Everlight to expand packaging capacity to 5.8 billion LED chips

Jul 4, 10:54

LED packaging service provider Everlight Electronics will complete the construction of a factory in central Taiwan in third-quarter 2016, which will expand monthly LED chip packaging...

Amkor opens MEMS packaging line in China

Jul 4, 10:42

Driven by the increase in global demand for sensors from the smartphone and automotive markets, Amkor Technology has announced it is ramping up a new MEMS and sensor packaging line...

Taiwan backend firms seeing robust orders from HiSilicon

May 25, 11:10

Demand for HiSilicon's chips has been robust, according to sources at Taiwan-based IC backend firms, which have identified the China-based fabless IC vendor as one of their important...

Lextar to move part of Taiwan LED packaging capacity to China

May 23, 11:20

Vertically-integrated LED firm Lextar Electronics will move part of LED packaging capacity at its factory in Taiwan to its factory in Suzhou, eastern China, to reduce production cost,...

STATS ChipPAC fan-out wafer-level packaging shipments exceed 1 billion units

May 11, 14:45

STATS ChipPAC has shipped over one billion fan-out wafer level packages (FOWLP), also known in the industry as embedded wafer-level ball grid array (eWLB), according to the company...

PTI to buy factory building from Epistar for NT$620 million

Stockwatch - May 5, 21:51

IC packaging and testing company Powertech Technology (PTI) has announced the acquisition of a factory building and related facilities from LED chipmaker Epistar for a total of NT$620...

Driver-IC backend houses lower quotes to woo orders

Apr 26, 22:32

LCD driver IC packaging and testing houses Chipbond Technology and ChipMOS Technologies have both decided to lower their quotes following in the footsteps of their China- and South...

Price competition among LCD driver IC firms heating up

Taiwan university develops aluminum ball bonding technology

Apr 25, 10:42

While copper wire is considered a cheaper alternative to gold wire for ball wire bonding used in semiconductor packaging, a process based on aluminum wire has been developed by Taiwan's...

Aluminum wire developed for use in semiconductor packaging

China backend houses expand into advanced-process segment

Apr 1, 13:58

China-based IC packaging and testing houses are vying for more orders, particularly those requiring advanced technologies, from Taiwan-based IC design houses, according to industry...

ASE fails to gain antitrust approval for SPIL bid

Mar 17, 11:57

Advanced Semiconductor Engineering (ASE) will be unable to win antitrust approval in Taiwan by March 17 - the deadline of its tender offer for another 24.71% stake in Siliconware...

Cadence launches complete IC packaging design and analysis solutions for fan-out WLCSP

Mar 16, 11:03

Cadence Design Systems has announced the availability of foundry-proven IC packaging design and analysis solutions for advanced fan-out wafer-level chip scale packaging (WLCSP) and...

New Kinpo to start trial production at Brazil NAND flash plant in May

Mar 14, 14:33

Taiwan-based New Kinpo Group expects construction of a NAND flash packaging factory in Brazil to complete by the end of March with trial production to begin in May, according to the...

Xintec February revenues rise 30% on month

Mar 14, 11:38

Taiwan-based Xintec, an affiliate of Taiwan Semiconductor Manufacturing Company (TSMC) specializing in packaging services for CMOS image sensors as well as MEMS and fingerprint sensors,...

MLS to extend packaging from LEDs to ICs, says president

Mar 1, 15:52

The largest China-based LED packaging service provider MLS will extend business operations to IC packaging and testing services, according to company president Lawrence Lin.

MLS president Lawrence Lin

SPIL to deal out cash dividend per share of NT$3.80 for 2015

Feb 25, 13:58

IC packager Siliconware Precision Industries (SPIL) has decided to distribute a cash dividend per share of NT$3.80 (US$0.11) for 2015, according to a resolution passed by the company's...

Digitimes Research: IC manufacturers to cross into packaging industry

Feb 19, 15:38

With IT products such as smartphone and Internet of Things (IoT) devices being designed with considerations of high performance, low cost, low power consumption and small form factor,...

ASE, SPIL set to report robust profits for 2015

Jan 20, 14:44

Advanced Semiconductor Engineering (ASE) is expected to see its 2015 profits hit the second-highest level in the company's history, while fellow packaging and testing company Siliconware...

ChipMOS to expand production capacity for LCD driver ICs

Dec 24, 15:15

Packaging and testing company ChipMOS Technologies is expected to expand production capacity for LCD driver ICs during 2016 as the company is positive about Ultra HD TV demand, according...

Advanced semiconductor packaging drives materials consumption through 2019, says SEMI

Dec 15, 15:54

The US$18 billion semiconductor packaging materials will undergo steady single-digit unit volume growth for many material segments through 2019, including laminate substrates, IC...

TSMC to provide backend InFO packaging technology for Apple chips, says report

Newswatch - Dec 11, 10:48

TSMC is scheduled to move its integrated fan-out (InFO) wafer-level packaging technology to volume production in the second quarter of 2016. Apple will be among the first wave of...

475 items [1/14]
  • Samsung+128GB+TSV+DDR4+RDIMM

    Samsung 128GB TSV DDR4 RDIMM

    Samsung Electronics has announced that it is mass producing what it calls the industry's first "through silicon via" (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules...

    Photo: Company, Dec 9.

  • IMEC+EUV+sensor+dies

    IMEC EUV sensor dies

    IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field,...

    Photo: Company, Oct 13.

  • Applied+Producer+InVia+dielectric+deposition+system

    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

  • Samsung+0%2E6mm%2Dthick+multi%2Dchip+memory+package

    Samsung 0.6mm-thick multi-chip memory package

    Samsung Electronics has developed what it claims is the world's thinnest multi-die package, whch measures 0.6mm in height. Designed initially for 32GB densities, the new memory package...

    Photo: Company, Nov 10.

  • Finetech+Japan+2009%3A+Ito+Electronics%27+water%2Dproof+OLED+display

    Finetech Japan 2009: Ito Electronics' water-proof OLED display

    Japan-based Ito Electronics showcased its water-proof OLED display at Finetech Japan 2009. With its packaging technology, Ito allows OLED to work under water.

    Photo: Jessie Lin, Digitimes, Apr 21.

Taiwan server shipment forecast and industry analysis, 2016
Intel strategies in the mobile device market

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