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News tagged 3D
  • Last update: Tuesday 17 October 2017 [437 news items]

Xintec to swing to profit in 4Q17, says report

Oct 17, 15:05

Image sensor packaging specialist Xintec is expected to return to profitability in the fourth quarter of 2017 with revenues likely to increase around 30% sequentially to nearly NT$1.3...

Yield rates for iPhone X components improving

Oct 17, 11:00

Yield rates for certain iPhone X components have improved and become more stable, and shipments of the smartphone are set to grow substantially after October, according to sources...

iPhone X components supply has become stable

Toshiba discloses further investment in 3D NAND flash facility

Oct 16, 15:37

Toshiba announced recently its board of directors had approved a further investment by Toshiba Memory in production equipment for Fab 6 at its Yokkaichi operations in Mie (Japan).

Toshiba reportedly suspends NAND flash production in Japan

Oct 16, 12:37

Toshiba recently suspended NAND flash production at its Japan facilities for a few weeks due to ransomware attacks on its computer network, according to sources at channel distributors...

Largan developing 3D sensing solutions

Oct 13, 11:26

Lens module maker Largan Precision has been developing 3D sensing solutions for smartphones, according to company CEO Lin En-ping.

Largan Precision CEO

Himax reportedly supplying WLO chips for iPhone X face ID

Oct 12, 15:10

Fabless IC firm Himax Technologies has begun shipments of chips based on wafer-level optics (WLO) technology to Apple, according to industry sources. The solution is reportedly a...

XYZprinting unveils panchromatic FFF 3D printer

Oct 11, 13:28

XYZprinting has unveiled a panchromatic FFF (fused filament fabrication) 3D printer for sale in the Taiwan market. Target customers of the printer are startups, small- to medium-size...

Win Semiconductors reportedly enters iPhone X supply chain

Oct 6, 13:59

Win Semiconductors, one of Taiwan's top-3 GaAs PA (power amplifier) suppliers, has reported consolidated revenues of NT$4.395 billion (US$144.58 million) in the third quarter of 2017,...

Low yield rates for 3D sensing modules to blame for smartphone shipment delays

Oct 5, 10:55

Low yield rates during production for 3D sensing modules to be incorporated into Apple's iPhone X and other Android-based smartphone brands have forced major global vendors to postpone...

NAND flash to reach supply-demand balance in 2018, says DRAMeXchange

Sep 28, 10:39

The global NAND flash market will shift away from undersupply and reach a supply-demand balance in 2018, when supply bit growth is forecast to reach 42.9%, according to DRAMeXchang...

Aurora eyeing Taiwan educational 3D printing market

Sep 27, 15:04

Aurora, a distributor of office automation machines and office furniture in Taiwan and China, will start offering 3D printing promotional services at its outlets around Taiwan for...

Supply of 12-inch silicon wafers to stay tight through 2019

Sep 22, 11:11

The global supply of 12-inch silicon wafers will further tighten over the next two years, when new fabs in China are set to come online, according to industry sources.

12-inch wafer supply to remain tight through 2019

Tokyo Electron optimistic about etching equipment demand for 3D NAND, FinFET

Sep 22, 10:32

Etching equipment demand for the manufacture of 3D NAND flash memory and FinFET chips is expected to grow in 2018 and 2019, according to Tokyo Electron, which expects its share of...

Tokyo Electron eyeing larger share of global etching equipment market

Toshiba agrees to sell memory-chip unit to Bain Capital-led consortium

Sep 21, 10:33

Toshiba has agreed to sell its memory-chip business to KK Pangea, a special purpose acquisition company formed by a Bain Capital Private Equity-led consortium. The decision was made...

Intel provides 10nm updates, plan for 10nm FPGA

Sep 20, 10:49

Intel has provided updates for its 10nm process and plans for 10nm FPGAs, as well as the availability of its 64-layer 3D NAND for data center applications. The disclosures were made...

iPhone X sets new trends for smartphones

Sep 15, 14:11

A number of new features that come along with Apple's newly released iPhone X such as 3D sensing are likely to become new standards for next-generation smartphones launched by Android-based...

iPhone X sets new trends for smartphone

SEMICON Taiwan 2017: Brewer Science showcasing innovative materials for EUV and 3D IC manufacturing

Sep 14, 13:44

With the semiconductor-manufacturing industry needing the high computing power that can only be achieved through advanced node logic and memory, as well as the heterogeneous-integration...

China to enhance local memory industry development

Sep 13, 14:36

The China high-end IC Alliance (CHICA), which was set up by China's National Semiconductor Industry Investment Fund (known as the Big Fund) earlier in 2017, is looking to add another...

Solomon demonstrating 3D machine vision system

Sep 8, 12:08

Taiwan-based automation product maker Solomon Technology is showcasing its in-house developed artificial intelligence (AI) and 3D machine vision system at Taipei International Industrial...

Solomon showcasing 3D machine vision system

Lextar to ship IR LED devices for 3D facial recognition

Sep 6, 15:23

Vertically-integrated LED firm Lextar Electronics has revealed it has cooperated with clients to develop infrared (IR) LED devices for 3D facial recognition, with such devices being...

lextar

Most of 2017 capital spending will go to foundry and flash memory, says IC Insights

Sep 1, 11:28

Following a substantial increase in semiconductor capital expenditures during the first half of 2017, IC Insights raised its annual semiconductor capex forecast to a record high of...

Qualcomm, Himax jointly develop 3D depth sensing solution

Aug 30, 19:04

Qualcomm and Himax Technologies have jointly announced a collaboration to accelerate the development and commercialization of a high-resolution, low-power active 3D depth sensing...

Samsung seeking long-term supply contracts with wafer firms

Aug 30, 13:34

Samsung Electronics is striving to sign long-term supply contracts with multiple wafer makers to ensure sufficient silicon wafer supplies for the manufacture of memory chips and logic...

A new Samsung fab in Pyeongtaek to focus on 64-layer 3D NAND flash production

GigaDevice draws investment from China state-backed fund

Aug 30, 13:25

China-based GigaDevice Semiconductor has obtained investment from China's National IC Industry Investment Fund, commonly known as the Big Fund, according to the maker of flash memory...

Samsung to expand NAND chip capacity in China

Aug 29, 13:57

Samsung Electronics has disclosed plans to expand production capacity at its NAND flash memory wafer fab in Xian, northwest China for a total of US$7 billion over the next three ye...

Chipbond, ChipMOS see rising orders for TDDI chips

Aug 25, 12:19

Backend houses Chipbond Technology and ChipMOS Technologies have seen orders for TDDI (touch with display driver integration) chips for use in 18:9 smartphone panels ramp up, which...

Xintec loss widens in 1H17

Aug 25, 11:34

Image sensor packaging specialist Xintec saw its losses widen to NT$609 million (US$20 million) in the first half of 2017, with EPS reaching negative NT$2.25.

China to phase in 14nm semiconductor process in 2018, says top tech master

Aug 22, 15:47

China is proceeding with systematic deployments in 14nm semiconductor fabrication equipment, process, packaging and materials, which will be fully industrialized in 2018. And the...

Ye Tianchun, director of Institute of Microelectronics, Chinese Academy of Science

Qualcomm developing 3D depth sensing technology

Aug 22, 11:14

Qualcomm is partnering with its ecosystem partners to develop 3D depth sensing technology, which will be applied to Andriod smartphones powered the Snapdragon mobile chips, according...

Qualcomm is developing 3D depth sensing technology

Global 2Q17 NAND flash market posts 8% growth, says DRAMeXchange

Aug 22, 10:51

The worldwide NAND flash memory market posted revenues of US$13.22 billion in the second quarter of 2017, up 8% sequentially, according to DRAMeXchange.

ChipMOS to enter production for 3D sensing components in 3Q17, says report

Aug 14, 12:20

Backend house ChipMOS Technologies will enter production for 3D sensing components for new consumer electronics devices in the third quarter of 2017, according to a report by Taiwan's...

ChipMOS obtains backend orders from Novatek

Aug 10, 11:46

ChipMOS Technologies has obtained backend orders for touch display driver ICs (TDDI) from Novatek Microelectronics, with shipments set to kick off in the fourth quarter of 2017, according...

ChipMOS gearing up for robust demand for TDDI chips

Samsung announces 1Tb V-NAND memory

Aug 10, 11:41

Samsung Electronics has announced a 1Tb vertical NAND (V-NAND) memory chip. The arrival of the chip in 2018 will enable 2TB of memory in a single V-NAND package by stacking 16 1Tb...

Samsung 1Tb V-NAND

Himax to start producing 3D sensing solutions as early as 2018

Aug 8, 10:34

Himax Technologies has expressed optimism about the growth prospects for its non-driver IC business, most notably with its structure light integrated solution for 3D sensing and wafer-level...

Himax enhancing its product mix for profit improvement

Worldwide semiconductor capital spending to grow 10.2% in 2017, says Gartner

Aug 4, 14:22

Worldwide semiconductor capital spending is projected to increase 10.2% to US$77.7 billion in 2017, according to Gartner. This growth rate is up from Gartner's previous forecast of...

437 items [1/13]
Realtime news
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  • Samsung+1Tb+V%2DNAND

    Samsung 1Tb V-NAND

    Samsung has announced a 1Tb V-NAND chip that it expects to be available next year. Since first mentioning it in 2013, during unveiling of the industry's first 3D NAND, Samsung has...

    Photo: Company, Aug 11.

  • Samsung+256GB+UFS+card

    Samsung 256GB UFS card

    Samsung Electronics has unveiled removable memory cards based on the JEDEC Universal Flash Storage (UFS) 1.0 Card Extension Standard for use in high-resolution mobile shooting devices...

    Photo: Company, Jul 13.

  • Apple+iPhone+6s+and+iPhone+6s+Plus

    Apple iPhone 6s and iPhone 6s Plus

    Apple has announced the iPhone 6s and iPhone 6s Plus, the latest iPhone models from the company. The new iPhones introduce 3D Touch, which senses force to access features and interact...

    Photo: Company, Sep 11.

  • Samsung+V%2DNAND+SSDs

    Samsung V-NAND SSDs

    Samsung Electronics has announced that it is adding three TCO-optimized, high-performance SSDs, based on 3-dimensional (3D) Vertical NAND (V-NAND) technology, to its portfolio of...

    Photo: Company, Aug 27.

  • Intel+fifth%2Dgeneration+Core+%28Broadwell%2DH%29+processors

    Intel fifth-generation Core (Broadwell-H) processors

    The fifth-generation Intel Core family also now includes the first LGA socketed desktop processor with integrated Iris Pro graphics, Intel's most powerful client processor graphics...

    Photo: Company, Jun 4.

UMC
Global AP demand forecast, 2017-2020

19-Oct-2017 markets closed

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Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Taiwan server shipment forecast and industry analysis, 2017

    Digitimes Research estimates that revenues from sales of server motherboards, servers, storage systems and related network system equipment by Taiwan-based vendors reached NT$555.8 billion in 2016 and the amount is estimated to grow 5.9% on year in 2017.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.