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News tagged 3D
  • Last update: Monday 14 August 2017 [407 news items]

ChipMOS to enter production for 3D sensing components in 3Q17, says report

Aug 14, 12:20

Backend house ChipMOS Technologies will enter production for 3D sensing components for new consumer electronics devices in the third quarter of 2017, according to a report by Taiwan's...

ChipMOS obtains backend orders from Novatek

Aug 10, 11:46

ChipMOS Technologies has obtained backend orders for touch display driver ICs (TDDI) from Novatek Microelectronics, with shipments set to kick off in the fourth quarter of 2017, according...

ChipMOS gearing up for robust demand for TDDI chips

Samsung announces 1Tb V-NAND memory

Aug 10, 11:41

Samsung Electronics has announced a 1Tb vertical NAND (V-NAND) memory chip. The arrival of the chip in 2018 will enable 2TB of memory in a single V-NAND package by stacking 16 1Tb...

Samsung 1Tb V-NAND

Himax to start producing 3D sensing solutions as early as 2018

Aug 8, 10:34

Himax Technologies has expressed optimism about the growth prospects for its non-driver IC business, most notably with its structure light integrated solution for 3D sensing and wafer-level...

Himax enhancing its product mix for profit improvement

Worldwide semiconductor capital spending to grow 10.2% in 2017, says Gartner

Aug 4, 14:22

Worldwide semiconductor capital spending is projected to increase 10.2% to US$77.7 billion in 2017, according to Gartner. This growth rate is up from Gartner's previous forecast of...

TSMC, UMC offer higher prices to secure wafer supplies

Jul 27, 15:09

Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics (UMC) have recently secured 1-2 year supply contracts with Shin-Etsu and Sumco and offered higher prices...

SK Hynix delivers another quarter of record results

Jul 25, 13:19

SK Hynix saw its revenues, operating profits and net profits reach record-high levels for the second consecutive quarter in the second quarter of 2017.

NOR flash supply to remain tight in 2018, says Macronix president

Jul 24, 21:56

Supply of NOR flash memory is expected to remain tight in 2018, as demand will continue to outpace supply, according to Macronix International president CY Lu.

Macronix president CY Lu

Toshiba develops 3D flash memory with TSV technology

Jul 14, 15:48

Toshiba has announced development of its BiCS flash three-dimensional (3D) flash memory utilizing through-silicon via (TSV) technology with 3-bit-per-cell (triple-level cell, TLC)...

Toshiba 3D NAND flash with TSV

Brewer Science, Arkema partner to develop high-chi DSA materials for advanced node patterning

Jul 12, 22:35

Brewer Science has announced the extension of its partnership with Arkema to develop second-generation directed self-assembly (DSA) materials using high-x (chi) block copo...

Supply of NAND flash for new iPhone falling short

Jul 5, 22:17

SK Hynix and Toshiba have both experienced lower-than-expected yield rates for their 3D NAND technologies resulting in fewer supplies for Apple's 2017 series of iPhones, according...

3D printing may sharply alter production mode, says HP executive

Jul 5, 11:18

Extensive application of 3D printing technologies is very likely to trigger a drastic change in the manufacturing sector in the foreseeable future, with customized production of personalized...

HP 3D printing

Tong Hsing starts shipments for 3D sensing products

Jun 30, 15:56

Tong Hsing Electronic Industries, which provides assembly and packaging services for CMOS image sensors as well as other niche ICs, started shipments for 3D sensing products in small...

Micron posts profit growth on record revenues in fiscal 3Q17

Jun 30, 14:30

Micron Technology has announced revenues for its third quarter of fiscal 2017 climbed to a record US$5.57 billion, 20% higher compared to the second quarter and 92% higher compared...

Talks to sell Toshiba Memory continue; announces new products

Jun 30, 11:01

Toshiba has disclosed the company continues to negotiate the sale of its memory chip business, Toshiba Memory, with Innovation Network of Japan, Bain Capital Private Equity and Development...

Digitimes Research: Japan government boosts development of high-precision 3D maps

Jun 29, 13:48

The Japan government, in line with the goal of realizing autonomous driving in Japan before the 2020 Tokyo Olympic Games, is promoting development and production of high-precision...

CMOS image sensor sales to reach another record high in 2017, says IC Insights

Jun 28, 22:22

CMOS image sensor sales are on pace to reach a seventh straight record high in 2017, and nothing ahead should stop this semiconductor product category from breaking more annual records...

Intel intros 64-layer, 3D NAND SSD

Jun 28, 14:24

Intel has announced the delivery of what the company claims is the world’s first commercially available 64-layer, TLC 3D NAND SSD.

Intel 64-layer, 3D NAND SSD

Samsung ramps up 64-layer V-NAND memory production

Jun 20, 15:54

Samsung Electronics has begun volume production of 64-layer, 256Gb V-NAND flash memory for use with an expanding line-up of storage solutions for server, PC and mobile applications,...

Global Unichip rolls out HBM2 total solution

Jun 19, 19:38

Global Unichip has successful taped out a 16nm, second-generation high bandwidth memory (HBM) PHY and controller with verified interposer design and CoWoS package. The ultra-high...

Toppan welcomes partnership with China firms

Jun 13, 15:22

Toppan Printing welcomes the potential for China-based companies to become partners, according to the Japan-based photomask vendor. Toppan is looking to work closely with China-based...

PTI optimistic about memory-dominated packaging

Jun 2, 10:30

The era of memory-dominated packaging technology has arrived, and heterogeneous stacking with memory and logic devices has become a trend, according to DK Tsai, chairman and CEO for...

Fifteen chipmakers to spend more than US$1 billion on capex, says IC Insights

Jun 2, 10:29

There are 15 companies forecast to have semiconductor capital expenditures of more than US$1 billion in 2017, up from 11 in 2016 and only eight in 2013, according to IC Insights.

3S teaming up with Marvell to develop 28nm controller chips

May 23, 22:40

Solid State System (3S) has announced it is teaming up with Marvell to develop DRAM-less SSD controller solutions.

TPK hikes 3D Touch price for iPhone with OLED, says paper

Newswatch - May 19, 11:43

Touch panel maker TPK Holdings has quoted US$18-22 for 3D Touch solution for use in a new iPhone equipped with OLED panel to be launched later in 2017 and Apple has accepted the quote,...

Sumco says new capacity to arrive in 2019

May 15, 21:59

Sumco expects its additional new capacity to come online in 2019 at the earliest, according to the Japan-based silicon wafer vendor, adding that it will enhance and optimize its existing...

Sumco lowering wafer shipments to XMC, say sources

May 11, 11:01

Sumco has reportedly cut its wafer shipments to Wuhan Xinxin Semiconductor Manufacturing (XMC), and given priority to Taiwan Semiconductor Manufacturing Company (TSMC), Intel and...

YMTC 64-layer 3D NAND technology ready for mass production in 2019, says acting chairman

May 8, 15:52

Yangtze River Storage Technology's (YMTC) 64-layer 3D NAND technology will be ready for mass production in 2019, according to Charles Kau, company acting chairman and executive VP...

Charles Kau, executive VP of Tsinghua Unigroup and acting chairman of YMTC

Semiconductor wafer-level manufacturing equipment revenues up 11% in 2016, says Gartner

May 3, 11:13

Worldwide semiconductor wafer-level manufacturing equipment (WFE) revenues totaled US$37.4 billion in 2016, an 11.3% increase from 2015, according to final results by Gartner. The...

ITRI unveils PBF 3D large-size printing platform

Apr 28, 15:44

The Laser and Additive Manufacturing Technology Center under the government-sponsored Industrial Technology Research Institute (ITRI) has unveiled an in-house-developed PBF(powder...

LMD 3D large-size printing platform developed by the Laser and Additive Manufacturing Technology Cen

Macronix developing 3D NAND technology for SSDs

Apr 28, 15:19

Macronix International has been engaged in the development of 3D NAND technology, and expects to enter volume production of chips built using the technology for SSDs in 2018, according...

Macronix chairman Miin Wu

Micron talks about its integrated global operations

Apr 26, 15:37

Micron Technology has been actively allocating its global resources to enhance its DRAM and NAND flash product lines, according to Wayne Allan, VP of global manufacturing at the US-based...

Wayne Allan, VP of global manufacturing at Micron

PTI looks to sequential revenue growth through 4Q17

Apr 26, 11:09

Packaging and testing company Powertech Technology (PTI) expects to post mid single-digit sequential growth in revenues for the second quarter of 2017, said company president JY Hung...

SK Hynix posts record revenues and profits for 1Q17

Apr 25, 11:46

SK Hynix has reported operating profits of KRW2.47 trillion (US$2.2 billion) on consolidated revenues of KRW6.29 trillion for the first quarter of 2017, with both results hitting...

Silicon wafer suppliers seeking long-term contracts

Apr 25, 11:18

Silicon wafer suppliers have advised their semiconductor customers to sign long-term contracts amid tight supply, according to industry sources.

407 items [1/12]
Realtime news
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  • Global 2Q17 NAND flash market posts 8% growth, says DRAMeXchange

    Before Going to Press | 6h 1min ago

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  • Samsung+1Tb+V%2DNAND

    Samsung 1Tb V-NAND

    Samsung has announced a 1Tb V-NAND chip that it expects to be available next year. Since first mentioning it in 2013, during unveiling of the industry's first 3D NAND, Samsung has...

    Photo: Company, Aug 11.

  • Samsung+256GB+UFS+card

    Samsung 256GB UFS card

    Samsung Electronics has unveiled removable memory cards based on the JEDEC Universal Flash Storage (UFS) 1.0 Card Extension Standard for use in high-resolution mobile shooting devices...

    Photo: Company, Jul 13.

  • Apple+iPhone+6s+and+iPhone+6s+Plus

    Apple iPhone 6s and iPhone 6s Plus

    Apple has announced the iPhone 6s and iPhone 6s Plus, the latest iPhone models from the company. The new iPhones introduce 3D Touch, which senses force to access features and interact...

    Photo: Company, Sep 11.

  • Samsung+V%2DNAND+SSDs

    Samsung V-NAND SSDs

    Samsung Electronics has announced that it is adding three TCO-optimized, high-performance SSDs, based on 3-dimensional (3D) Vertical NAND (V-NAND) technology, to its portfolio of...

    Photo: Company, Aug 27.

  • Intel+fifth%2Dgeneration+Core+%28Broadwell%2DH%29+processors

    Intel fifth-generation Core (Broadwell-H) processors

    The fifth-generation Intel Core family also now includes the first LGA socketed desktop processor with integrated Iris Pro graphics, Intel's most powerful client processor graphics...

    Photo: Company, Jun 4.

WCIT 2017
Global AP demand forecast, 2017-2020

21-Aug-2017 markets closed

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Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Taiwan server shipment forecast and industry analysis, 2017

    Digitimes Research estimates that revenues from sales of server motherboards, servers, storage systems and related network system equipment by Taiwan-based vendors reached NT$555.8 billion in 2016 and the amount is estimated to grow 5.9% on year in 2017.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.