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News tagged 3D
  • Last update: Tuesday 12 December 2017 [465 news items]

Solomon Technology partners with UR for 3D vision technology development

Dec 12, 16:00

Taiwan-based Solomon Technology, a 3D vision robot developer, has partnered with Universal Robots (UR) to integrate their technologies for robotic applications.

NAND flash shortfall to see improvement in 1Q18

Dec 8, 13:55

The tight supply of NAND flash memory is expected to ease in the first quarter of 2018 as the yield rates at major 3D NAND flash suppliers continue improving, which will significantly...

Western Digital unveils new portfolio of 3D NAND embedded flash drives

Dec 6, 20:23

Western Digital has introduced a new portfolio of advanced iNAND embedded flash drives (EFDs) to empower smartphone users to unlock the full potential of data-driven applications...

Smartphone chips suppliers to see gross margins rebound in 2018

Dec 6, 13:26

Smartphone chip solution providers including MediaTek, Spreadtrum Communications and Qualcomm are expected to see their gross margins rebound in 2018, as smartphone vendors are incorporating...

Phison poised to embrace 96-layer 3D NAND tech by end of 2018

Dec 5, 14:27

With the global NAND flash industry successfully transitioning to the 64/72-layer 3D specification era in 2017, Taiwan-based Phison Electronics is prepared to advance further to the...

Altek expects 3D sensing boom in next 5-8 years

Dec 5, 11:06

Digital camera and imaging solution supplier Altek expects 3D sensing to see strong demand in the next 5-8 years, according to company chairman and CEO Alex Hsia.

Altek

Taiwan players in 3D sensor supply chain to see lucrative market in 2018

Dec 4, 15:04

With Android-based smartphones vendors expected to incorporate 3D sensors into their smartphone models following Apple's adoption of TrueDepth facial recognition system of iPhone...

iPhone X with 3D sensor facial recognition system

Macronix to highlight novel SGVC 3D NAND development at 2017 IEDM

Nov 30, 15:24

Macronix International has disclosed its research on a novel 3D NAND structure, called single-gate vertical channel (SGVC), will be presented as a highlight paper at the 2017 IEEE...

Toshiba Memory unveils 2TB NVMe SSD

Nov 30, 12:28

Toshiba Memory has enhanced its line-up of client SSDs with the launch of premium models in its XG5-P series. The new NVM Express (NVMe) client SSDs improve on the performance of...

Toshiba Memory NVMe client SSD premium model XG5-P series

Kinko developing receiver optical lenses for 3D sensing

Nov 27, 10:47

Kinko Optical is developing receiver optical lenses for 3D sensing, which is expected to see fast growing adoption by smartphone vdndors, according to company chairman Kent Chen.

Kinko Optical chairman Kent Chen (standing) at an investor confernece

ChipMOS Shanghai to grab backend orders for China homegrown 3D NAND chips

Nov 24, 12:33

ChipMOS Technologies (Shanghai), of which Tsinghua Unigroup is a major stakeholder, is expected to secure backend orders for 3D NAND flash chips developed by Yangtze River Storage...

Global 3Q17 NAND flash market posts 14% increase, says DRAMeXchange

Nov 22, 10:49

Revenues of the global NAND flash industry surged 14.3% sequentially to US$15.12 billion in the third quarter of 2017, according to DRAMeXchange. The price tracker credited the growth...

Austria chipmaker ams partners with China firm to develop 3D sensing camera solutions

Nov 17, 13:17

Austria-based ams and China-based Ningbo Sunny Opotech, an optical image system solution provider, have announced a collaboration to jointly develop and market 3D sensing camera solutions...

More Android smartphone vendors to adopt 3D sensing for new models

Nov 17, 12:03

Android smartphone vendors including Huawei, Oppo and Xiaomi Technology are expected to equip 3D sensing functionality to their new models slated for launch in 2018, according to...

More smartphone vendors are to adopt 3D sensing technology

Samsung huge chip capex for 2017 shows move to defend its memory dominance

Nov 16, 11:20

After spending US$11.3 billion in semiconductor capex last year, Samsung announced that its 2017 outlays for the semiconductor group are expected to more than double to US$26 billion...

China IC firm sets milestone with rollout of 3D NAND flash

Nov 15, 14:16

Yangtze River Storage Technology (YMTC) under the Tsinghua Unigroup has successfully developed 32-layer 3D NAND flash chips, marking a new milestone and major technological breakthrough...

YMTC has unveiled 3D NAND flash memory

Intel, Micron increase 3D XPoint manufacturing capacity with IM Flash fab expansion

Nov 14, 09:31

Intel and Micron Technology have announced the completion of an expansion to Building 60 (B60) at the IM Flash facilities in Lehi, Utah. The expanded fab will produce 3D XPoint memory...

Product marketability hinges more on user experience, says Dassault CEO

Nov 13, 10:59

The market catering to personalized and diverse demand hinges on user experience rather than product functionality, Bernard Charles, president and CEO of Dassault Systemes, has remarked...

Dassault Systemes CEO Bernard Charles

Experience economy brings new challenges to manufacturers, says Delmia CEO

Nov 9, 13:57

The advent of the experience economy era has changed the essence of the manufacturing industry, and how to quickly respond to market demands by integrating digital and remote manufacturing...

Delmia CEO Guillaume Vendroux

Oppo, Xiaomi to adopt 3D sensors for smartphones in 2018

Nov 9, 11:40

China-based vendors Oppo and Xiaomi Technology will adopt 3D sensing solutions for smartphones to be launched in 2018, with such solutions to be developed by Himax Technologies via...

Robust 3D sensing module demand benefiting related suppliers

Nov 7, 11:49

Robust 3D sensing module demand has buoyed the performance of related suppliers, such as GaAs IC foundry Win Semiconductors and testing equipment supplier Chroma ATE.

Optical PCB inspection firm Machvision scores record net profits in 3Q17

Nov 3, 14:50

Automated optical inspection (AOI) equipment specialist Machvision saw its net profits climb to a record high of NT$116 million (US$3.84 million) in the third quarter of 2017, with...

Machvision likely to score record EPS of NT$9 in 2017

Micron intros industrial microSD cards for surveillance

Nov 1, 22:22

Micron Technology has announced a full portfolio of edge storage solutions for video surveillance that will enable new deployment models and reduce total cost of ownership for both...

Lite-On Tech looks to ship smartphone 3D sensing CCMs in 2Q18

Oct 31, 11:28

Lite-On Technology expects to ship smartphone-use 3D sensing CCMs to China-based vendors in second-quarter 2018 at the earliest. In the wake of Apple's adoption of facial recognition-enabled...

lite-on

Supply of high-density NOR flash to remain tight in 2018, says Macronix chairman

Oct 27, 13:52

The supply of high-density NOR flash memory will remain tight through 2018, while the low-density market segment will be affected by China-based suppliers' new capacities, according...

Macronix chairman Miin Wu

Innovative products, technologies take center stage at TPCA Show 2017

Oct 26, 16:16

Many Taiwan players in the PCB supply chain have debuted their newest products, technologies and solutions at the TPCA Show 2017 running October 25-27 at the Taipei Nangang Exhibition...

Machvision showcasing new optical inspection systems at TPCA Show 2017

Test solutions provider Chroma eyeing AI-based smart production

Oct 25, 19:51

Testing equipment and solutions supplier Chroma ATE is actively moving to incorporate AI (artificial intelligence) into its products and pursue smart manufacturing operations by investing...

PTI expects another quarter of record revenues in 4Q17

Oct 24, 13:51

Robust demand for flash memory chips will buoy further sales performance at Powertech Technology (PTI) in the fourth quarter of 2017, said the memory backend specialist at an October...

Smartphones and other mobile devices continue to boost memory chip demand

Xintec to swing to profit in 4Q17, says report

Oct 17, 15:05

Image sensor packaging specialist Xintec is expected to return to profitability in the fourth quarter of 2017 with revenues likely to increase around 30% sequentially to nearly NT$1.3...

Yield rates for iPhone X components improving

Oct 17, 11:00

Yield rates for certain iPhone X components have improved and become more stable, and shipments of the smartphone are set to grow substantially after October, according to sources...

iPhone X components supply has become stable

Toshiba discloses further investment in 3D NAND flash facility

Oct 16, 15:37

Toshiba announced recently its board of directors had approved a further investment by Toshiba Memory in production equipment for Fab 6 at its Yokkaichi operations in Mie (Japan).

Toshiba reportedly suspends NAND flash production in Japan

Oct 16, 12:37

Toshiba recently suspended NAND flash production at its Japan facilities for a few weeks due to ransomware attacks on its computer network, according to sources at channel distributors...

Largan developing 3D sensing solutions

Oct 13, 11:26

Lens module maker Largan Precision has been developing 3D sensing solutions for smartphones, according to company CEO Lin En-ping.

Largan Precision CEO

Himax reportedly supplying WLO chips for iPhone X face ID

Oct 12, 15:10

Fabless IC firm Himax Technologies has begun shipments of chips based on wafer-level optics (WLO) technology to Apple, according to industry sources. The solution is reportedly a...

XYZprinting unveils panchromatic FFF 3D printer

Oct 11, 13:28

XYZprinting has unveiled a panchromatic FFF (fused filament fabrication) 3D printer for sale in the Taiwan market. Target customers of the printer are startups, small- to medium-size...

465 items [1/14]
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  • Samsung+1Tb+V%2DNAND

    Samsung 1Tb V-NAND

    Samsung has announced a 1Tb V-NAND chip that it expects to be available next year. Since first mentioning it in 2013, during unveiling of the industry's first 3D NAND, Samsung has...

    Photo: Company, Aug 11.

  • Samsung+256GB+UFS+card

    Samsung 256GB UFS card

    Samsung Electronics has unveiled removable memory cards based on the JEDEC Universal Flash Storage (UFS) 1.0 Card Extension Standard for use in high-resolution mobile shooting devices...

    Photo: Company, Jul 13.

  • Apple+iPhone+6s+and+iPhone+6s+Plus

    Apple iPhone 6s and iPhone 6s Plus

    Apple has announced the iPhone 6s and iPhone 6s Plus, the latest iPhone models from the company. The new iPhones introduce 3D Touch, which senses force to access features and interact...

    Photo: Company, Sep 11.

  • Samsung+V%2DNAND+SSDs

    Samsung V-NAND SSDs

    Samsung Electronics has announced that it is adding three TCO-optimized, high-performance SSDs, based on 3-dimensional (3D) Vertical NAND (V-NAND) technology, to its portfolio of...

    Photo: Company, Aug 27.

  • Intel+fifth%2Dgeneration+Core+%28Broadwell%2DH%29+processors

    Intel fifth-generation Core (Broadwell-H) processors

    The fifth-generation Intel Core family also now includes the first LGA socketed desktop processor with integrated Iris Pro graphics, Intel's most powerful client processor graphics...

    Photo: Company, Jun 4.

Global notebook shipment forecast, 2017 and beyond
Global AP demand forecast, 2017-2020

12-Dec-2017 markets closed

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TAIEX (TSE)10443.28-29.81-0.28% 

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OTC electronic221.78-1.15-0.52% 

Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Taiwan server shipment forecast and industry analysis, 2017

    Digitimes Research estimates that revenues from sales of server motherboards, servers, storage systems and related network system equipment by Taiwan-based vendors reached NT$555.8 billion in 2016 and the amount is estimated to grow 5.9% on year in 2017.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.