With air cooling being the mainstream solution at data centers, 3D Vapor Chambers (VCs) have successfully broken through the theoretical heat dissipation limitations of air cooling...
Samsung Electronics has set up a new memory research and development (R&D) organization to advance 3D DRAM technologies and secure competitiveness through technology differenti...
Samsung Electronics and Intel have long competed with each other for first place in the fierce global semiconductor IDM market, and a fierce battle for orders and rankings has begun...
SK Group's KRW40 billion (US$31 million) acquisition of Kumho Petrochemical's electronic material business in 2020 is bearing fruit. SK Materials Performance (SKMP), the new subsidiary...
In 2023, Intel announced a new achievement on AI-empowered advancing precision medicine and Wincomm was invited to demonstrate AI-based brain surgical and GI endoscopy solutions to...
Faraday Technology, a Taiwan-based provider of fabless ASIC services and silicon IP, expects to post a revenue decrease of 4-6% sequentially in the fourth quarter of 2023.
Samsung Electronics has recently released its new-generation memory solutions aimed at the generative AI and large language model (LLM) markets, including the fifth-generation high-band...
Some predictions suggest that as DRAM technology development is gradually approaching a bottleneck, hybrid bonding technology may be introduced into future DRAM manufacturing processes...
Applied Materials and its equipment and materials partners have entered the supply chain for Intel's recently announced glass substrates for advanced packaging, according to industry...
At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...
NAND flash memory made using mature processes is reportedly in tight supply as a result of Apple's decision to adopt older generation NAND for its iPhone 15, which caught its memory...
Advanced packaging and testing have become the hottest topics in the semiconductor industry in 2023, with TSMC's CoWoS packaging technology experiencing extremely high demand due...
Amid the AI frenzy, advanced packaging technology such as CoWoS has gained significant market attention, but smartphone APs based on 3D chiplet technology are expected to take off...