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Feb 21
Intel on the brink: boardroom battles, Trump's policies, the TSMC dilemma
With geopolitical tensions reshaping the semiconductor landscape, Intel's future hinges on decisions made by its board, the Trump administration, and Wall Street investors eyeing its assets. But inside Intel, engineers are pushing back against the company's current course.
Taiwan's status as a global powerhouse in the semiconductor industry could be undermined by labor shortages, but talent from India could provide a solution.
In October 2024, South Korean media reported that Intel's CEO, Pat Gelsinger, aimed to meet Samsung's chairman, Lee Jae-Yong, to discuss a foundry alliance that would involve sharing resources in manufacturing, R&D, and technology processes. This information is deemed credible.
Dirk Beljaarts. Economy Minister of Netherlands and Peter Wennink, former CEO of ASML, visited Samsung Electronics' semiconductor facility in Pyeongtaek, South Korea, drawing significant industry attention regarding potential future collaborations.
SK Hynix CEO Noh-Jung Kwak, reflecting on the emergence of China's DeepSeek, predicts that the generative AI model will ultimately have a positive impact on the semiconductor industry in the long run.
Statistics from the Ministry of Economic Affairs (MOEA) indicate that Taiwan's overseas production ratio in January was 44.8%, a year-over-year decrease of 4.2pp. If Taiwan's major server ODMs relocate abroad or if TSMC increases its investments in the US, this indicator will certainly reverse and rise.
According to Infineon's press release, the European Commission has approved funding for Infineon's Smart Power Fab in Dresden under the European Chips Act, with expected approval from Germany's Federal Ministry for Economic Affairs and Climate Action in the coming months. The fab also benefits from the European Commission's IPCEI ME/CT program, totaling about EUR1 billion (approx. US$1.05 billion) in funding. Construction began in March 2023, and the facility is set to open in 2026.
If two competitive strategies within an industry can both become dominant at different times, it is natural for these strategies to shift as industry conditions change.
In recent years, Quad-Level Cell (QLC) NAND has gradually penetrated mainstream applications such as PCs and enterprise-level storage, but it has yet to make substantial inroads into the mobile phone supply chain. Numerous media stories have indicated that Apple was considering the adoption of QLC NAND to cut costs; nevertheless, these claims remain unverified.
With the ongoing development of new-generation processors, the introduction of PCIe Gen5 specifications into high-end PC applications is set to commence in 2025. According to Micron Technology, Gen4 products currently represent 25% of PC applications, and it is expected that half of these will transition to Gen5 over the next year.
Rayzher posted consolidated revenue of NT$633 million (approx. US$19.34 million) in the fourth quarter of 2024, marking a 68.24% year-over-year increase and a new quarterly record.
Apple has officially launched its newest budget-friendly model, the iPhone 16e, which is equipped with the company's self-developed modem chip, the C1. The market is keenly observing its performance in terms of communication and power efficiency.