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Nov 4
SK Hynix reportedly plans independent HBM division by late 2024 for AI memory leadership
As artificial intelligence (AI) applications expand, the demand for high-bandwidth memory (HBM) has surged. South Korean memory maker SK Hynix is set to establish a dedicated HBM division through organizational restructuring by the end of 2024, a move drawing significant industry attention.
NXP Semiconductors anticipates that its revenue and profit performance for the fourth quarter of 2024 will be below market expectations, with an estimated range of US$3 billion to US$3.2 billion, as a result of a slowdown in the automotive industry, uncertainty regarding demand in Europe and the US, and general macroeconomic weakness.
The uncertainty and potential disruption that may unfold in the wake of the 2024 US presidential election looms over Taiwan's booming semiconductor industry. At the recent launch of the Mandarin translation of "Silicon Triangle: The United States, Taiwan, China, and Global Semiconductor Security," industry leaders convened to discuss Taiwan's crucial role in the semiconductor industry, along with the broader implications of the upcoming US election.
Nvidia CEO Jensen Huang emphasized during a video call at the SK AI Summit in Seoul's Coex that he aims to strengthen collaboration with SK Hynix in the high bandwidth memory (HBM) sector. Specifically, he requested an expedited supply of the sixth-generation HBM (HBM4).
With the US presidential election on the horizon, Republican Donald Trump and Democrat Kamala Harris have drawn attention for their stances on Taiwan's semiconductor industry. Interest surged following Trump's controversial July 2024 interview, where he accused Taiwan of "taking away" US chip business and suggested Taiwan would need to pay for US protection.
Taiwan-based AutoSys, which specializes in algorithms for automotive 360-degree surround image detection and ADAS sensing system fusion, has penetrated the supply chains of the US and Japanese automotive markets.
MA-tek will launch its new lab in Hokkaido, Japan by the end of this year, well ahead of schedule, to meet increasing demand for inspection and analysis services supporting 2nm chip production, according to the company.
AUO has said they are focusing on silicon photonics opportunities while holding onto its cautious approach panel-level fan-out packaging (FOPLP), a notable divergence from its rivals like Innolux and BOE Technology. CEO Frank Ko indicates the company is leveraging its optoelectronics expertise and Micro LED technology to target the growing AI-driven optical communication market.
The upcoming US presidential election is poised to significantly influence the prospects of TSMC and Intel.
Chunghwa Precision Test Tech (CHPT), a developer of IC test interface solutions, experienced double-digit revenue growth on both an annual and sequential basis in October 2024 as a result of the high demand for advanced packaging and handset chips.
Following Intel's disappointing financial results, CEO Pat Gelsinger addressed Bloomberg and Yahoo Finance, openly criticizing the Biden administration for delays in CHIPS and Science Act subsidies. He further condemned recent media speculation on potential Intel acquisitions as "irresponsible rumors," emphasizing the company's commitment to independence.
Toshiba Electronic Devices & Storage has set an ambitious target to boost its market share in the global power semiconductor market from the current 3.2% to a double-digit percentage by 2030, according to General Executive Noriyasu Kurihara.