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Jun 20
Micron challenges South Korean rivals with SOCAMM breakthrough and PTI support
As competition intensifies in the high-end memory market, Micron has taken the lead over South Korean competitors by becoming the first memory supplier for Nvidia's next-generation memory module, SOCAMM. Industry sources reveal that SOCAMM uses LPDDR5X chip stacking technology. With Micron expanding its outsourced packaging and testing (OSAT) orders for LPDDR5X, leading memory OSAT provider PTI is a primary beneficiary. This partnership not only helped Micron win significant contracts but also boosted PTI's second quarter 2024 shipments of LPDDR5X packaging, greatly enhancing its operational performance and future growth prospects.
In a rare and insightful interview with People's Daily, Huawei founder Ren Zhengfei shared his perspective under the headline "The More Open a Country Is, the More It Advances."
A global surge in demand for DDR4 memory chips is driving prices sharply higher as major DRAM manufacturers reduce legacy production and supply chain constraints push third-quarter allocations to their limits. Taiwanese firm Nanya Technology has reportedly ceased issuing price quotations after selling its entire third-quarter production, leaving buyers to await allocations in the fourth quarter amid escalating price pressures.
The Economic Times reported that Applied Materials is set to establish a cutting-edge Innovation Center for Semiconductor Manufacturing (ICSM) in Bengaluru, India, with the potential to catalyze over US$2 billion in future investments, according to Suraj Rengarajan, managing director and head of the semiconductor products group at Applied Materials India. His remarks follow the Karnataka government's recent approval of three semiconductor projects, including Applied's proposal.

Riding a wave of demand driven by AI smartphones, servers, ASICs, optical transceivers, and networking gear, Taiwan-based IC testing firm Sigurd Microelectronics is scaling up investment to expand its advanced testing capacity and R&D operations. General Manager Charles Yeh noted that the AI boom has significantly accelerated chip testing needs and fueled top-line growth.

Global Brands Manufacture (GBM), a PCB and EMS subsidiary of Walsin Technology, recently held a shareholders' meeting led by chairman Yu-Heng Chiao to discuss acquiring Japan's Lincstech. The deal aims to boost the company's presence in AI servers, semiconductors and expand production in Singapore.
Taiwan's semiconductor packaging and testing companies confront three major operational challenges in the second half of 2025 as US President Donald Trump's reciprocal tariff suspension expires in less than a month.
TSMC is deepening its US manufacturing presence with key suppliers including United Integrated Service Co., Marketech International and L&K Engineering supporting the expansion. Yet industry executives question whether Arizona can replicate Taiwan's Hsinchu Science Park success.
South Korea's top chipmakers, SK Hynix and Samsung Electronics, are heading into 2025 with dramatically diverging fortunes, as the global race for AI-driven memory dominance accelerates. Fueled by surging demand for high-bandwidth memory (HBM), SK Hynix is expected to outpace Samsung's semiconductor division by nearly KRW13 trillion in first-half 2025 operating profit, according to industry estimates.
Japanese electronics components giant TDK has announced the acquisition of SoftEye, a US-based smart glasses hardware and software developer, in a strategic push to diversify into artificial intelligence (AI)-driven devices. The move marks a significant step for TDK, traditionally known for its smartphone batteries, as it seeks growth beyond its core business, according to sources including Reuters and Nikkei.
Samsung and SK Hynix are advancing vertical channel transistor (VCT) technology through 4F² DRAM prototypes as a transitional step toward 3D DRAM, while Micron is bypassing VCT entirely to focus directly on true 3D DRAM development, signaling a strategic divergence in next-generation memory architectures.
Niche PCB manufacturer FHt held its annual shareholders meeting, where general manager Taylor Lee highlighted the strong demand for AI server orders from the ASIC sector in 2025. This surge not only fills the capacity gap caused by a sluggish global automotive market but has also prompted the company to convert previously leased factory space into owned facilities to aggressively expand production. The goal is to achieve full capacity utilization across all three plants by 2026.