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    OpenAI's multi-year GPU deal with AMD intensifies AI hardware infrastructure expansion
    Oct 7, 18:55
    The rising concerns surrounding AMD's alliance with OpenAI
    Oct 7, 18:55
    China accelerates DUV lithography breakthroughs with patent and testing
    Oct 7, 18:55
    YMTC's bonding advancment aims to disrupt HBM market
    Oct 7, 18:55
    OpenAI's key partnerships and investments face critical year end test
    Oct 7, 18:55
    Taiwan IPC makers accelerate North American capacity amid edge AI demand
    Oct 7, 18:55
    Home Tech Semiconductors Passive, PCB, other IC components
    Tuesday 7 October 2025
    Upstream substrate and leadframe price hikes pressure IC packaging costs
    Since early 2025, rising costs of precious metals such as gold and silver have triggered price increase signals in the supply chain for key materials like substrates and leadframes used in the IC packaging industry. Market watchers expect these cost pressures to shift downstream to packaging companies, potentially impacting customer pricing.
    Tuesday 7 October 2025
    China's SiC industry finds high-value exit in Meta's AR supply chain

    As the global semiconductor industry eyes the rise of 12-inch silicon carbide (SiC) wafers as potential game-changers in advanced packaging, a surprising development is reshaping the conversation. A Chinese startup has reportedly discovered a high-value application for large-diameter SiC substrates—one that directly aligns with the supply chain of tech giant Meta's AI-powered smart glasses.

    Tuesday 7 October 2025
    Chang Wah Technology announces significant price hike for LED lead frames from 2026
    Facing continuing growth in precious metal costs, IC packaging lead frame manufacturer Chang Wah Technology has revealed plans to raise prices on its LED lead frames starting January 1, 2026. The company informed customers that shipment order prices for its entire LED lead frame range will increase by 15% to 25%, depending on product type and design specifications.
    Tuesday 7 October 2025
    AI demand drives PCB material prices up amid supply strain
    Due to global tariffs and inflation, the consumer market outlook for the second half of 2025 remains pessimistic. Taiwanese PCB industry players believe that overall industry growth momentum still relies on demand from AI servers and low-orbit satellites.
    Tuesday 7 October 2025
    Taiwan PCB posts record 1H25 output, TPCA projects 12% annual growth
    According to the Taiwan Printed Circuit Association (TPCA), the PCB manufacturing output value of Taiwanese companies in the second quarter of 2025 reached NT$218.2 billion (US$7.2 billion), a 14.4% increase compared to the same period in 2024; cumulative output value in the first half of 2025 hit NT$423.6 billion, up 13.8% year-over-year, demonstrating strong growth despite the usual off-season.
    Monday 6 October 2025
    Gold and copper prices soar as Trump's policies shake global supply chains
    Upon US President Donald Trump's return to the White House, his chip containment policy has ignited a rare earth export control battle with China, affecting the already imbalanced supply and demand for key AI server materials. US federal government shutdowns have further driven up gold and other precious metals to record highs, testing component makers' ability to manage costs.
    Friday 3 October 2025
    Shibaura deal clears Japan's national security review; opens path for Yageo acquisition
    Yageo announced on October 3 that it has successfully passed a key milestone in its tender offer for Japan's Shibaura Electronics, securing 50.01% of outstanding shares, or 7,624,200 shares.
    Thursday 2 October 2025
    Yageo accelerates strategy to integrate active and passive components with Anpec acquisition
    Taiwan-based passive components manufacturer Yageo Corporation has completed its public tender offer for power management IC (PMIC) design firm Anpec Electronics. On October 1, 2025, Yageo announced that it had officially incorporated Anpec into its group, after acquiring a significant number of shares in the tender offer.
    Wednesday 1 October 2025
    Intel & TSMC invest billions to transform Arizona into semiconductor powerhouse
    More and more tech giants have followed TSMC's lead after its announcement of a US$165 billion investment to build more plants in Arizona. A half mountain, half desert state is slowly but surely becoming a new semiconductor hub.
    Wednesday 1 October 2025
    Yageo surpasses minimum share acceptance in public tender offer to acquire Anpec Electronics
    Taiwan's Yageo has successfully crossed the minimum acceptance threshold in its public tender offer to acquire power management IC designer Anpec Electronics, reaching this milestone ahead of schedule. The achievement marks a significant step forward for Yageo's expansion under Pierre Chen's leadership, solidifying its position in the power management segment.
    Wednesday 1 October 2025
    China's 12-inch SiC leap: SICC, Jingsheng in spotlight
    The global race in third-generation semiconductors is intensifying, with larger silicon carbide (SiC) wafers seen as critical to cutting costs and enhancing power device performance. While global leaders remain centered on 6-inch and 8-inch wafers, Chinese firms are rapidly advancing 12-inch SiC development to secure an early lead in the materials race.
    Wednesday 1 October 2025
    China's copper foil sector pushes back against price war with processing fee hike
    China's PCB industry has, in recent years, been entangled in a vicious price war, leading many local PCB manufacturers to collapse under the pressure of internal cutthroat competition. This underlying issue is now spreading upstream to the copper-clad laminate (CCL) supply chain.
    Tuesday 30 September 2025
    TSMC 2025 full-year revenue set to break US$100 billion
    Although semiconductor chip tariffs have yet to be finalized, with exchange rates stabilizing and strong pull-in momentum from major smartphone and AI chip clients, TSMC's third quarter 2025 revenue in USD is expected to surpass its financial forecast. Based on a full-year US$ revenue growth estimate of 30%, fourth quarter 2025 revenue is projected to decline by around 10%.
    Tuesday 30 September 2025
    Allied Circuit, Meiko to co-build high-layer PCB plant in Vietnam for AI servers
    Compal Electronics' PCB subsidiary, Allied Circuit Co., Ltd. (ACCL), has announced a joint venture with Japan's Meiko to establish a high-layer count (HLC) printed circuit board plant in Vietnam. The new entity, tentatively named AlliedCircuitMeikoVietnam, will set up operations within Meiko's new factory complex in Hoa Binh Province, northern Vietnam.
    Tuesday 30 September 2025
    PCB giant GCE expands Thailand plant phase 2, ASIC server capacity to start 2H26
    Networking and server PCB giant GCE announced plans to expand its Thailand facility with a US$40 million investment to boost ASIC server production capacity by the second half of 2026. This move comes as ASIC server customer orders ramp up, pushing Taiwan and China plants to full capacity and driving strong revenue growth expected in the third quarter of 2025.
    Saturday 27 September 2025
    Infineon, Rohm sign MOU to support flexible SiC power device shipments
    Infineon Technologies announced on September 25, 2025, that it has signed a memorandum of understanding (MOU) with Japanese semiconductor manufacturer Rohm Semiconductor to collaborate on packages for silicon carbide (SiC) power semiconductors.
    Friday 26 September 2025
    Anpec says share price undervalued in Yageo public tender offer
    Taiwanese passive components maker Yageo, on September 11, 2025, unilaterally announced plans to invest over NT$4.8 billion (US$158 million) to acquire a major stake in power management IC (PMIC) design house Anpec Electronics. In a statement released on September 24, 2025, in response to the acquisition bid, Anpec expressed regret that Yageo did not engage in any prior discussions before the announcement and noted that the current per-share offer still has room for upward adjustments.
    Friday 26 September 2025
    Ennostar advances AI optical communication with X-Celeprint partnership to promote SiPh integration
    Ennostar, a Taiwan-based developer of optoelectronic semiconductors, is actively expanding its presence in the AI optical communication market. It has announced a collaboration with European micro-transfer printing (MTP) specialist X-Celeprint, aiming to accelerate the implementation and commercialization of mass transfer technology in silicon photonics (SiPh) applications.
    Thursday 25 September 2025
    Memory shortage drives BT substrate orders, boosting 4Q25 growth momentum
    The memory market shortage has reignited a new wave of price increases. As supply tightens for NAND flash storage memory, traditional hard disk drives (HDD) and solid-state drives (SSD) have also raised prices. Taiwanese IC packaging and testing companies as well as BT substrate manufacturers report an unusual surge in urgent customer orders.
    Wednesday 24 September 2025
    Taiwan's three major science parks report chip-driven record revenue in 1H25
    The National Science and Technology Council's three major science parks achieved a combined revenue of NT$2.74 trillion (approximately US$90.6 billion) in the first half of 2025, marking a 26.74% increase year-over-year. This surge reflects the semiconductor sector's robust performance alongside expanding AI applications and investments in cloud services.
    Wednesday 24 September 2025
    Why your next PC or smartphone will cost more: chipmakers, suppliers raise prices amid AI frenzy
    Escalating tariffs, high inflation, and a shift in supply chains to the US are driving up manufacturing costs, leaving little room for prices on consumer electronics and business technology to come down.
    Tuesday 23 September 2025
    Nvidia-Intel alliance to boost long-term demand for ABF substrates
    Nvidia and Intel have announced a rare partnership to jointly develop next-generation AI data center and PC platform chips. Despite predominantly negative market interpretations, the industry remains optimistic that this "powerful collaboration" will promote closer integration of GPU and CPU designs, thereby driving increased demand for high-end ABF substrates. Leading suppliers closely working with both companies are expected to be the biggest beneficiaries.
    Tuesday 23 September 2025
    Yole Group CEO interview (Part 1): TSMC dominates AI era as supply chain dynamics undergo massive shifts
    The semiconductor industry is experiencing its most dramatic transformation in decades, driven by artificial intelligence's relentless demand for computing power. Traditional boundaries between design, manufacturing, and supply chains are crumbling as AI accelerates innovation from advanced process nodes to next-generation packaging. Yet this revolution comes with consequences—bottlenecks in upstream equipment and materials are forcing a complete reconfiguration of the ecosystem.
    Tuesday 23 September 2025
    Episil bets on SiC and GaN for Q4 rebound as compound semiconductor market bottoms out

    Episil and its epitaxy-focused subsidiary Episil Precision, spanning both silicon (Si) and wide-bandgap semiconductors such as silicon carbide (SiC) and gallium nitride (GaN), told investors on Sept. 17 that its SiC and GaN businesses sank to a low point in the first half of 2025. The company expects recovery only by the fourth quarter.

    Monday 22 September 2025
    Murata doubles down on quality as Chinese rivals expand in MLCC market
    Murata Manufacturing, the world's largest MLCC producer, is reinforcing its strategy around quality in the face of intensifying competition from Chinese manufacturers. The company remains committed to defending the "volume zone" of its core markets, betting that further improvements in quality and production efficiency will sustain its competitive edge, even as rivals make inroads into lower-priced segments.
    More Passive, PCB, other IC components coverage
    Research Report Database
    BIZ FOCUS
    Oct 2, 10:32
    SK Group partners with OpenAI to advance global AI infrastructure
    Wednesday 1 October 2025
    Wise Integration Launches First Digital Controller, WiseWare 1.1, for GaN Totem Pole PFC with High Switching Frequency Up to 2 MHz
    Wednesday 1 October 2025
    AI Applications, Innovation Empowered! The Fourth GMIF2025 Innovation Summit Successfully Concluded
    Wednesday 1 October 2025
    Embracing WP.29 R155 and R156-Winbond Secure Flash Memory Accelerates Automotive Compliance and Differentiation
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    MULTIMEDIA
    Agility Robotics on humanoid robots
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    Will Taiwan, South Korea, Japan join semiconductor alliance with US?