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Saturday 21 June 2025
Sigurd lifts capex by 75% to chase AI smartphone boom, BIS-driven test orders

Riding a wave of demand driven by AI smartphones, servers, ASICs, optical transceivers, and networking gear, Taiwan-based IC testing firm Sigurd Microelectronics is scaling up investment to expand its advanced testing capacity and R&D operations. General Manager Charles Yeh noted that the AI boom has significantly accelerated chip testing needs and fueled top-line growth.

Friday 20 June 2025
GBM expands AI product line via Lincstech acquisition, focus on Singapore and Malaysia operations
Global Brands Manufacture (GBM), a PCB and EMS subsidiary of Walsin Technology, recently held a shareholders' meeting led by chairman Yu-Heng Chiao to discuss acquiring Japan's Lincstech. The deal aims to boost the company's presence in AI servers, semiconductors and expand production in Singapore.
Friday 20 June 2025
Auto market headwinds offset by AI servers; FHt expands production to capitalize on ASIC growth
Niche PCB manufacturer FHt held its annual shareholders meeting, where general manager Taylor Lee highlighted the strong demand for AI server orders from the ASIC sector in 2025. This surge not only fills the capacity gap caused by a sluggish global automotive market but has also prompted the company to convert previously leased factory space into owned facilities to aggressively expand production. The goal is to achieve full capacity utilization across all three plants by 2026.
Thursday 19 June 2025
New front opens in CPO, SiPh race: TSMC and Taiwanese supply chain in the lead
Surging demand for AI compute is driving global investment in GPUs, ASICs, and next-generation datacenter infrastructure. As conventional electronic interconnects fall short of meeting high-bandwidth, low-latency data exchange needs, silicon photonics (SiPh) and co-packaged optics (CPO) are emerging as foundational technologies for next-generation AI system performance.
Thursday 19 June 2025
Urgent orders boost memory packaging and testing in 2Q25; AI stabilizes variables for 2H25
Benefiting from a rapid recovery in memory market demand during the first half of 2025, memory packaging and testing companies are sharing in the gains. Although the US 90-day tariff exemption period is about to expire, increasing uncertainties around order visibility starting from the third quarter are expected to make customers adopt more conservative stocking strategies.
Wednesday 18 June 2025
Nittobo material price hikes exclude AI server-grade glass fabric
Japanese glass fiber supplier Nitto Boseki (Nittobo) reportedly has raised prices of its composite material products by up to 20% due to increasing costs, but the price hike does not include electronic-grade glass fabric materials used in IC substrates and PCBs for AI servers.
Wednesday 18 June 2025
Japan's AGC and University of Tokyo unveil laser tech 1 million times faster for AI chip manufacturing

AGC, a leading Japanese manufacturer of specialty glass and ceramics, has partnered with researchers at the University of Tokyo to develop an advanced laser processing technology aimed at semiconductor applications. The new technique, designed for use with glass substrates, dramatically increases processing speeds - by as much as one million times compared to traditional methods.

Wednesday 18 June 2025
Sony accelerates image sensor growth in automotive amid record earnings and evolving market strategy
Sony Group has provided an update on its semiconductor business, particularly focusing on its position in the image sensor market. Despite failing to meet its ambitious target of capturing a 60% market share in image sensors by 2025, Sony anticipates building on record revenue and operating profit for fiscal year 2024, which spans from April 2024 to March 2025. The company sees growth potential across various image sensor applications.
Tuesday 17 June 2025
AI ASIC drives expansion in semiconductor test market, intensifying competition among Taiwanese test interface firms
As artificial intelligence (AI) applications extend from the cloud to the edge, the surge in AI application-specific integrated circuits (ASICs) is accelerating growth in the semiconductor testing market. Coupled with minimal impact from US-China tariff conflicts on upstream test interface suppliers, Taiwanese supply chains posted impressive revenue performances in May 2025, collectively reaching record highs for the period and laying a solid foundation for quarterly revenue growth throughout the year.
Monday 16 June 2025
Intelligo leverages AI acoustics to power Switch 2, drive 150% revenue surge in 2025
Taiwan-based Intelligo, an ASIC design firm focused on AI acoustics and voice recognition, expects substantial growth in 2025 driven by three core segments—gaming consoles, mobile-related businesses, and a new North American notebook client—according to chairman JJ Yan. The company projects strong year-over-year increases in both revenue and profit compared to 2024.
Monday 16 June 2025
Hanwha Semitech faces patent war with Hanmi Semiconductor over TCB breakthrough
A high-stakes patent dispute between Hanwha Semitech and Hanmi Semiconductor over a critical piece of equipment in the HBM production process — the TCB machine — is set to unfold, with significant implications for the HBM industry. The outcome of this legal battle is expected to influence SK hynix, the global leader in HBM production, given the pivotal role TCB technology plays in semiconductor manufacturing.
Monday 16 June 2025
Beyond sci-fi: AI robots push PCB players into new frontier
Rapid advances in generative AI are accelerating the commercialization of humanoid robots, with 2025 projected as the industry's first year of mass production. Taiwanese PCB makers—Zhen Ding Technology (ZDT), Flexium Interconnect, and Ichia Technologies—are reportedly positioning themselves within the emerging supply chain.
Monday 16 June 2025
Canon Anelva looks to AI and compact equipment to outpace flat market

Canon's semiconductor business, best known for its photolithography equipment, is also bolstered by a range of specialized subsidiaries. One such unit, Canon Anelva, focuses primarily on thin-film deposition systems — a critical component in semiconductor manufacturing. Despite projections that the broader market will remain flat in 2025 compared to 2024, Canon Anelva expects to achieve more than 20% revenue growth, driven by two flagship product lines.

Monday 16 June 2025
Weekly news roundup: Intel, Samsung, TSMC shift chip strategy, DDR4 surges, China rises in AI and CIS
Below are the most-read DIGITIMES Asia stories from June 9 to June 15, 2025. Highlights include major chipmaking advances, a DDR4 supply crunch, and shifting strategies from Intel, Samsung Electronics, and TSMC. From renewed EDA access in China to rising momentum among Chinese CIS suppliers, this roundup tracks the key forces reshaping the global semiconductor and AI landscape.
Monday 16 June 2025
Everlight pivots to SiC and photonics amid pricing wars
Everlight Electronics, a longtime profit leader in Taiwan's LED packaging sector, plans to begin pilot production of SiC components in the second half of 2025. Chairman Robert Yeh said the company is confident it can replicate its LED market success in the competitive SiC space. The initial rollout will target discrete power devices, particularly MOSFETs, where Everlight aims to capitalize on cost efficiencies to stay competitive against aggressive Chinese pricing.
Saturday 14 June 2025
Broadcom's AI chip sales hit 52%, with SoftBank and OpenAI on deck

Broadcom is emerging as a key supplier in the artificial intelligence (AI) supply chain, with revenue from AI-related chips now comprising a majority of its semiconductor business.

Saturday 14 June 2025
China’s chip tool reboot: AMEC backs a “2.5-player” play
In late April 2025, South Korea's ZDNet Korea reported that China is moving ahead with a major overhaul of its domestic semiconductor equipment sector, aiming to consolidate more than 200 companies into roughly 10 key players. While the announcement drew international attention, industry insiders in China have long seen this as an inevitable, if largely unspoken, challenge.
Friday 13 June 2025
Taiwanese chip tester MPI sees three-year order visibility as AI drives demand
Taiwan's MPI Corporation, a major producer of probe cards and semiconductor test equipment, said artificial intelligence infrastructure demand is driving capacity utilization to maximum levels, with customers providing order forecasts stretching three years ahead.
Friday 13 June 2025
AI-fueled demand lifts Keystone Microtech's 2025 forecast; FX risk clouds margin outlook
Taiwan's test interface supplier Keystone Microtech Corp. expects sustained order momentum through late 2025, fueled by growing demand for chip testing in AI and high-performance computing (HPC) applications. At the company's annual shareholder meeting, Director and President An-hsuan Liu said order visibility remains strong through the fourth quarter and projected minimal impact from reciprocal tariffs on the broader semiconductor market in the second half of the year. Keystone is forecasting sequential revenue increases and targeting double-digit annual growth.
Thursday 12 June 2025
China's MLCC makers carve out 10% share — How does Semco adjust course?
Chinese multilayer ceramic capacitor (MLCC) manufacturers—including Guangdong Fenghua Advanced Technology, Chaozhou Three-Circle Group, and Eyang Technology—have rapidly expanded their global market share, reaching an estimated 10% of total revenue in the second half of 2024. That reflects a four-percentage-point gain from 2019 and signals growing competitive pressure on incumbents such as Samsung Electro-Mechanics (Semco), according to Business Post and Futubull.
Wednesday 11 June 2025
Nan Ya PCB sees another executive change as president Andy Tang retires
IC substrate manufacturer Nan Ya PCB announced that company president Andy Tang will retire and step down on June 16, 2025. The company has yet to announce a successor.
Wednesday 11 June 2025
Taiwan-Korea alliance targets semiconductor materials dominance
PCB wet process equipment and semiconductor materials agent Ampoc recently announced a strategic technical partnership with South Korean semiconductor materials leader DCT Material. The collaboration aims to expand their presence in the Asian market and capture opportunities in the global advanced semiconductor process high-end materials sector, potentially breaking the long-standing monopoly held by certain major players.
Wednesday 11 June 2025
China's STAR Market reforms spark record M&A wave as tech firms seek scale and strategy
Marking the first anniversary of China's "Eight Measures for the STAR Market"—a landmark reform package aimed at boosting tech innovation and industrial upgrading—the country has recorded its biggest-ever merger in the computing power sector.
Tuesday 10 June 2025
Ampoc partners with South Korea's DCT Material to expand advanced process materials market
Ampoc, a distributor of PCB wet process equipment and semiconductor materials, announced that in response to the growing global demand for high-end materials in advanced semiconductor processes, it will collaborate with South Korean semiconductor material manufacturer DCT Material to establish a joint venture company in Taiwan by the end of 2025. This partnership aims to introduce advanced process material technologies with mass production experience into Taiwan, further strengthening product deployment in the Asian market and providing localized services to key semiconductor customers.
Monday 9 June 2025
Shibaura takeover heats up as Yageo moves closer to Japan's regulatory green light
Taiwan-based Yageo Corporation has refiled its foreign investment application under Japan's Foreign Exchange and Foreign Trade Act (FEFTA) as of June 2, in a renewed bid to acquire Shibaura Electronics. The move signals Yageo's growing confidence in clearing regulatory scrutiny—a key barrier that has held back its unsolicited tender offer since February.
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