DIGITIMES Communications news

Sep 30, 08:37

Apple iPhone Duo revives UDC battle as Samsung weighs trade-offs

Apple has launched its first foldable phone, the iPhone Duo, adopting under-display camera (UDC) technology long used by Samsung Electronics. The move puts all-screen design back at the center of foldable-phone competition and could pressure Samsung to reconsider its technology roadmap.

Apple A20 Pro ditches PoP memory packaging for WMCM

Sep 30, 17:13

DIGITIMES Insight: AI is emerging as the new growth anchor in the mobile communications industry

Sep 30, 16:20

Chief Telecom, Google Cloud launch backup services to bolster cable resilience

Sep 30, 15:34

Apple's foldable iPhone Duo faces low yields ahead of October launch

Sep 29

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MOBILE DEVICESApple keeps iPhone Duo in China, exposing limits of India's phone supply chain

Sep 28

Apple's first foldable iPhone has become a test of how far India has come as a manufacturing base, and the answer is sobering. As India-assembled iPhones reach record export levels, Apple kept development and assembly of its most complex phone, the iPhone Duo, in China. The decision points to a gap that Pune Times Mirror summed up this way: India has become indispensable to Apple's assembly operations, but not yet to its engineering.

WIRELESS NETWORKINGWi-Fi 7 drives enterprise network refresh as channel inventories normalize
Sep 26

Europe's enterprise networking market is emerging from a two-year inventory correction as Wi-Fi 7 adoption accelerates and pulls spending into campus switching, broadening what began as a wireless upgrade into a wider infrastructure refresh.

MOBILE COMPONENTSQualcomm splits flagship mobile SoCs into more tiers
Sep 24

Qualcomm is launching two flagship platforms in 2026—the Snapdragon 8 Elite Gen 6 and the Snapdragon 8 Elite Extreme Gen 6—signaling a new era of finer-grained flagship mobile SoC segmentation. The move has raised questions about whether pricier flagship phones are on the way.

MOBILE COMPONENTSQualcomm adopts 'offset PoP' packaging to cool new flagship phone SoC
Sep 24

Qualcomm unveiled two flagship mobile platforms at the Snapdragon Summit 2026, including the Snapdragon 8 Elite Extreme Gen 6, which changes its packaging approach to improve heat dissipation. During a media Q&A, Qualcomm Senior Vice President and General Manager of Mobile Handsets Chris Patrick said the new package still falls under existing Package on Package (PoP) technology, but the memory is no longer stacked directly above the die and is shifted to the side to create a thermal path.

MOBILE COMPONENTSVivo launches camera monitor accessory, stoking panel demand
Sep 23

Vivo officially unveiled its new flagship X500 series smartphones in Shanghai on September 21, along with wearable accessories including smartwatches and earphones. The X500 series is positioned around a broader push to extend image capture from still photography into video recording and content creation. Vivo has further integrated its hardware and software imaging functions, and is now testing whether the camera monitor can become a standard accessory for high-end imaging phones.

MOBILE COMPONENTSQualcomm launches dual Snapdragon flagship platforms for Xiaomi, Honor
Sep 23

Qualcomm unveiled two flagship mobile platforms, Snapdragon 8 Elite Gen 6 and Snapdragon 8 Elite Extreme Gen 6, at Snapdragon Summit 2026 in Maui, Hawaii this week, marking the company's first split of its premium Snapdragon lineup into two Elite tiers. Xiaomi, Honor, and Motorola appeared on stage as early partners, with the Xiaomi 18 Pro series and Honor Magic9 series expected to be the first devices and to launch in September.

MOBILE DEVICESVivo unveils X500 strategy to bolster premium phone push
Sep 22

Vivo unveiled its new X500 series imaging flagship phones in Shanghai on September 21, 2026, aiming to build a stronger moat in mobile imaging and break through more aggressively in the premium smartphone market. As rising memory prices force handset makers to lift retail prices, IDC expects worldwide smartphone shipments to fall 16.7% in 2026 to just over 1 billion units.

WIRELESS NETWORKINGTmytek lists on Taiwan Innovation Board, pushes 5G/6G, satellite, defense
Sep 22

Millimeter-wave communications technology and solutions provider TMY Technology (Tmytek) officially listed on Taiwan's Innovation Board on September 22 at an offering price of NT$60 (approx. US$1.90) per share. The company said its products, which span millimeter-wave R&D and validation instruments, Lego-like phased-array antennas and subsystem modules, have moved from development and verification into commercial delivery and mass production.

MOBILE DEVICESHuaqin challenges Quanta for Steam Deck ODM order
Sep 22

Industry sources say Valve is expected to launch a new Steam Deck in 2027, setting up a tougher contest for Taiwanese original design manufacturer (ODM) Quanta as China's Huaqin moves to win the manufacturing order. The winner has not yet been confirmed.

MOBILE DEVICESUS iPhone 18 Pro Max teardown reveals Qualcomm modem, suggesting prior supply-chain commitments
Sep 22

Apple's latest flagship iPhone 18 Pro series is now shipping, and the choice of modem chip has drawn close market attention. A newly released teardown report has revealed an unexpected exception: the US iPhone 18 Pro Max still uses Qualcomm's Snapdragon X80 rather than Apple's newly announced in-house C2 chip.

MOBILE DEVICESiPhone Duo takes the baton from 18 Pro to extend Apple's upgrade wave
Sep 21

Apple has changed its iPhone launch cadence this year, splitting its high-end releases into two waves. The iPhone 18 Pro series went on sale on September 18, with Apple's first foldable iPhone, the iPhone Duo, set to follow on October 23.

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