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REALTIME NEWS
Hyundai Motor Group expands US research unit ahead of EREV and HEV push
Tomorrow's Headlines
11h 33min ago
LB Semicon begins shipments to Qualcomm after two-year partnership
Tomorrow's Headlines
11h 33min ago
Commentary: Apple shifts to smart vehicle software layer as Ternus era arrives
Tomorrow's Headlines
11h 33min ago
Kyocera opens first new Japan plant in 21 years to tap Kyushu chip supply chain
Tomorrow's Headlines
11h 33min ago
CPO testing shifts upstream as equipment makers vie for integration lead
Tomorrow's Headlines
11h 33min ago
Sep 3, 16:33
Exclusive: China 6-inch SiC substrate supply tightens, prices set to rise
Sep 3, 14:15
Semiconductor sustainability shifts to cost control as fab resource demand surges
Sep 3, 15:15
China chip tool makers expand beyond import substitution at CSEAC 2026
Sep 3, 11:21
Zeiss deepens Taiwan bet as advanced chip packaging raises the stakes for inspection tools
Sep 3, 17:15
Infineon sees AI data centers, physical AI as growth drivers
LATEST STORIES
7 days news
Mitsubishi Heavy Industries and NEC form alliance to advance defense tech, AI sovereignty
Sep 3, 15:35
AEROSPACE
Turing Drive highlights overseas expansion, extends invitation to global automakers
Sep 3, 15:25
ELECTRIC VEHICLES
KEPCO seeks US$18 billion from Samsung, SK Hynix to fund Korea's power grid
Sep 3, 15:04
SEMICONDUCTORS
Fei-Fei Li's World Labs unveils Atlas world model for 3D AI and robotics
Sep 3, 14:28
ICT
Niching validates 500-ton press for large heat spreaders
CXMT expands global hiring to Japan for DDR5, LPDDR technology upgrade
Taiwan LED packaging provider Ligitek pivots to silicon photonics; 1.6T modules eye 2H27 revenue
Huawei, Xiaomi to launch new foldable smartphones ahead of Apple
Solomon leverages AI vision and optical tech to tap semiconductor inspection market
Intel pre-funds EMIB-T and CPU capacity, will address DRAM through partners rather than fabs
Apple, Xiaomi and Nvidia chase terabyte-class bandwidth for AI chips
AUO unit eyes TSMC ecosystem as merger benefits emerge
China packaging specialist SJSemi reaches 3.3-reticle 2.5D scale for AI, HBM integration
AI substrate shortages widen as Unimicron signals capacity support through 2029
Win Semiconductors unveils 0.1μm GaN for AI, satellite links
UniVista expands China EDA stack with AI agents, native 3DIC tools
CXMT's 'Hefei Project' exposed in Samsung DRAM theft case
BYD Semiconductor scales 4D radar chip for L2-L4 driving, deepening its in-house automotive sensing stack
TRUMPF targets advanced packaging as AI chip makers chase higher density and better cooling
Google to expand Taipei AI infrastructure center as Taiwan ties deepen
Broadcom puts 30GW, US$350 billion of custom AI silicon on the calendar through fiscal 2028
China optical module makers ride AI boom as 800G, 1.6T orders stretch into 2027
HPE has already bought the supply behind its raised fiscal 2027 plan
HPE's constraint has shifted from demand to memory
Lutnick confirms chip tariffs are coming, with relief tied to manufacturing in America
Broadcom's custom AI silicon takes over the income statement as revenue climbs 86%
CPO material race widens as Taiwan eyes key role
Samsung Electro-Mechanics eyes 30% MLCC price hikes, ABF up too
CHPT spans wafer to system-level testing
SanDisk pushes HBF ecosystem as AI inference reshapes token economics
More news
BIZ FOCUS
Sep 2, 08:22
World Diamond Technology accelerates mass production of 300 mm diamond wafers
Wednesday 2 September 2026
Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
Wednesday 2 September 2026
Innovative Solutions for Fabricating High-Performance AI Multichip Packaging Using Glass Substrates
Wednesday 2 September 2026
8 September Hsinchu seminar: Silicon photonics driving AI chains
MOST-READ
Exclusive: Musk pushes US solar supply chain upstream as polysilicon ambitions emerge
Tungsten prices surge sixfold as US-China restrictions tighten supply for chips, aerospace, defense
Interview: Nvidia exec on progress of CPO production and pluggable optics
OCP APAC 2026: TSMC tackles CoWoS material risks while cutting 3DIC development cycle to one year
Google's v10 TPU opens door to AMD without sidelining Broadcom, MediaTek
Nvidia Feynman pushes TSMC A16 and CPO ramp
Update: ABF substrate maker Unimicron searched in origin-labeling probe
MULTIMEDIA
Jensen Huang in Seoul: Faker, BBQ and one very awkward LG chairman
The end of the Tim Cook era at Apple
After a 15-year tenure, Apple CEO Tim Cook is stepping down on September 1, 2026, and handing the reins to hardware veteran John Ternus.
Tim Cook concludes 15-year Apple tenure, John Ternus takes over
Apple reshuffles leadership, shifts Schiller out of App Store
John Ternus takes over an Apple with one growth engine, no obvious second
...More
EV
Wednesday 2 September 2026
China moves to curb overseas price wars as automakers accelerate global expansion
BYD Semiconductor scales 4D radar chip for L2-L4 driving, deepening its in-house automotive sensing stack
Thursday 3 September 2026
Turing Drive highlights overseas expansion, extends invitation to global automakers
Thursday 3 September 2026
VinFast reportedly pauses India manufacturing work on three EVs, a year after opening its Tamil Nadu plant
Thursday 3 September 2026
TECH
Thursday 3 September 2026
Broadcom says CPO fits scale-out better than scale-up
Chinese court freezes US$318M in Nexperia assets, further escalating corp rift
Tuesday 1 September 2026
The architect of Apple's China machine also built its hardest problem
Monday 31 August 2026
Apple is only the test: Chinese memory makers CXMT, YMTC target North American cloud market
Wednesday 26 August 2026
ASIA
Thursday 3 September 2026
CXMT's 'Hefei Project' exposed in Samsung DRAM theft case
Exclusive: China 6-inch SiC substrate supply tightens, prices set to rise
Thursday 3 September 2026
China chip tool makers expand beyond import substitution at CSEAC 2026
Thursday 3 September 2026
SK Hynix weighs Kioxia production tie-up in Japan
Thursday 3 September 2026
OPINIONS
Tuesday 1 September 2026
Commentary: Why America fell behind on Open models — and how Nvidia plans to close the gap
Commentary: DeepSeek out, SMIC in? TIME100 AI maps China's widening AI battleground
Tuesday 1 September 2026
Research insights: AI Fabric optical interconnects move into racks as 400G/lane and CPO maturity emerge as key variables
Tuesday 1 September 2026
Analysis: CXMT's US$11.5B profit surge raises the stakes in China's AI memory race
Tuesday 1 September 2026
TOPICS
THE END OF THE TIM COOK ERA AT APPLE
HUAWEI
TSMC UPDATES
TRENDS IN INDUSTRIAL COMPUTING
SPECIAL REPORTS
Wednesday 2 September 2026
Global smartphone industry, 2Q 2026
According to DIGITIMES, smartphone memory contract prices surged by 50% to 80% in the first half of 2026, prompting most vendors to continue cutting shipments of mid- and low-end models and to raise product prices.
Friday 28 August 2026
AI data center 800VDC power architecture takes shape; future hurdles require balancing multiple key factors
DIGITIMES believes that 2026 will be a pivotal year in the stabilization of 800VDC power architectures for AI data centers.
Wednesday 26 August 2026
Growth in low-Earth-orbit satellite communications accelerates; further boosts demand for GaN components
DIGITIMES has observed that since SpaceX began using reusable rockets for launch missions, its payload capacity has continued to rise.
Tuesday 25 August 2026
Chinese automakers expand to humanoid robotics with technology, supply chain and scenario advantages
DIGITIMES observes that the humanoid robot market is expanding rapidly, supported by global labor shortages and advances in artificial intelligence (AI), and Chinese automakers are also moving aggressively into this emerging field.
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