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Oct 16, 15:52
AI server tracker: semiconductor testing and design services rally on compute demand
Oct 16, 17:08
Taiwan to build industrial parks in US; Texas site already found
Oct 16, 15:01
Samsung to break ground on second Texas chip fab in November
Oct 16, 13:52
Samsung's chip and device chiefs head to Tokyo during Lee's visit
Oct 16, 12:23
Analysis: Intel CEO Lip-Bu Tan's power of humility — how one phone call helped reshape the chip giant's comeback
LATEST STORIES
7 days news
Gemtek partners with Starman to make optical transceivers in US
Oct 16, 17:10
ICT
South Korea's September ICT Exports Surge Past US$75B on AI Demand
Oct 16, 16:39
ICT
Telco giant builds Taiwan's high-speed computing network for AI agent era
Oct 16, 15:37
COMMUNICATIONS
ASE unveils 18 advanced packaging projects with three universities
Oct 16, 15:26
SEMICONDUCTORS
Samsung, SK Hynix aim to ease AI memory bottlenecks with zHBM, HBF
Project Bromo tests Europe's new industrial policy as Brussels weighs fast track for space champion
Bolt Graphics seeks US$100 million to challenge Nvidia, AMD beyond AI with Zeus GPU
Delta says AI power gap will drive standalone microgrids
Taiwan forecasts 6.04% growth in 2027 on AI-driven exports
FICG eyes 4x optical communications capacity by 2027
Volvo Cars and Nvidia expand partnership on automated driving
Holtek targets higher-value MCU markets with AI server cooling orders set to lift 2027 revenue
Supermicro appoints Mark Long as chief financial officer
US chipmakers rely more on overseas production than supplier data suggests, SIA finds
Nvidia deepens China gaming push with DLSS 5 partnerships
Myson Century signs 3 AUSA MOUs for defense expansion
DIGITIMES Insights: China's automakers pursue three humanoid robot strategies as EV supply chains offer 60% overlap
Analysis: TSMC-GF deal moves mature nodes into AI packaging: What it means for China
LCD TV panel prices struggle to rise in 4Q26
BOE's 24-layer glass substrates reach AI chip packaging trials, with mass production still ahead
Taiwan's Chun Yuan Steel sees 4Q26 auto surge, expands into AI robotics
Charts: YMTC bets on premium eSSDs to take on Samsung
China's chip earnings boom masks a widening gap between AI processor demand, fading DRAM, NAND price gains
AIDC white paper flags energy efficiency, power management as key to site selection
Japan bets on physical AI as Murata, AWS, Hitachi showcase self-learning robots at CEATEC 2026
Nvidia-backed CoreWeave bond spike highlights debt risks in the AI infrastructure boom
Samsung's India chip research arm opens quantum lab at IISc
LG Innotek targets 2028 glass substrate supply as it expands beyond smartphones
AI buyers lock in capacity, driving Taiwan private investment to record NT$6.95T
Chip inflation drives Samsung, LG toward premium TVs
More news
BIZ FOCUS
Oct 15, 08:00
Samsung Semiconductor Highlights 400+ Layer Flash Powering Agentic AI
Wednesday 14 October 2026
Practical Insights & Industry Ideas
Wednesday 14 October 2026
GMIF 2026 Awards: Samsung, Sandisk, BIWIN, and Others Honored
Wednesday 14 October 2026
Hybrid Copper Bonding - A Manufacturing Lever for The AI Era
MOST-READ
TSMC locks in 3-6% wafer out price hikes for 2027
Musk's Memphis move puts xAI at the center of his empire
TSMC, Intel named as Musk's Terafab ambitions face reality check
GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
Beyond 16 layers: HBM stacks test advanced packaging equipment makers
Chinese memory supply is disruptive to pricing, Acer's Jason Chen says, as shortages ease
ByteDance's China AI chip push hits substrate shortage
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
TSMC 3Q26 earnings call
During its 3Q26 earnings call on October 15, 2026, TSMC reported its sixth consecutive quarter of record net profit, exceeding market expectations on sustained demand for advanced semiconductors used in AI.
TSMC excludes CPUs from AI accelerator growth forecast
TSMC bars capacity resale, aims to leave no AI money on the table
TSMC investor conference: TSMC lifts 2026 revenue growth forecast to 44%, 2nm expansion, new 3nm fab
...More
EV
Wednesday 9 September 2026
Analysis: When 72% of the world's EV batteries are Chinese, one defect travels
DIGITIMES Insights: China's automakers pursue three humanoid robot strategies as EV supply chains offer 60% overlap
Friday 16 October 2026
LG Innotek targets 2028 glass substrate supply as it expands beyond smartphones
Friday 16 October 2026
Japan's automakers turn to vehicle-road coordination to advance autonomous driving
Friday 16 October 2026
TECH
Friday 16 October 2026
Charts: YMTC bets on premium eSSDs to take on Samsung
TSMC, Intel, Samsung seek to break AI chipmaking's next barrier through early technology integration
Wednesday 14 October 2026
AI Server tracker: Taiwan's AI server chain grew 55% in September, but the growth narrowed to fewer suppliers
Tuesday 13 October 2026
TSMC, ASML eye 12-inch photomasks to unlock High-NA EUV's full-field potential
Monday 12 October 2026
ASIA
Thursday 10 September 2026
India's fraud office seeks a Xiaomi probe as the market it once led shrinks around it
China's chip earnings boom masks a widening gap between AI processor demand, fading DRAM, NAND price gains
Friday 16 October 2026
DIGITIMES Insights: China's automakers pursue three humanoid robot strategies as EV supply chains offer 60% overlap
Friday 16 October 2026
BOE's 24-layer glass substrates reach AI chip packaging trials, with mass production still ahead
Friday 16 October 2026
OPINIONS
Friday 16 October 2026
Analysis: TSMC-GF deal moves mature nodes into AI packaging: What it means for China
DIGITIMES Insights: China's automakers pursue three humanoid robot strategies as EV supply chains offer 60% overlap
Friday 16 October 2026
Analysis: TSMC's chipmaking edge strengthens C.C. Wei's hand — from advanced-node capacity to Musk's Terafab
Friday 16 October 2026
Interview: The AI economy needs US$6T in funding — but from where?
Friday 16 October 2026
TOPICS
TSMC 3Q26 EARNINGS CALL
TSMC UPDATES
THE RISE OF MALAYSIA
GEOWATCH
SPECIAL REPORTS
Monday 12 October 2026
Chinese government and industry make full push into AI glasses development: AR display integration and lightweighting gain traction
DIGITIMES notes that China continued to advance smart glasses policies from the central government to local governments in 2026, driving both enterprise production and consumer purchase subsidies.
Friday 2 October 2026
Global annual AI server shipments, 2025-2026
Continued advances in top-tier LLM capabilities, coupled with the potential for business automation enabled by agentic AI, are prompting major North American cloud providers, Neo Clouds, and leading AI labs to accelerate AI data center buildouts in 2026.
Thursday 1 October 2026
SiC substrate market shows signs of recovery, driven by demand from vehicles, energy and AI infrastructure
DIGITIMES has observed that since Tesla equipped the Model 3 with a traction inverter integrated with SiC power modules in 2018, the application of SiC power devices in the electric vehicle (EV) sector has gradually expanded, prompting suppliers to aggres 8_s.jpg
Thursday 17 September 2026
Physical AI drives autonomous driving upgrade; three efficiency factors lift AI accelerator demand
End-to-end autonomous driving has become the mainstream technology path, and the inference demand created by Physical AI in autonomous driving systems is, in turn, reshaping automotive system-on-chip (SoC) design.
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