Chinese AI chip developer Enflame said at the World Artificial Intelligence Conference (WAIC) 2026 that it had jointly showcased an AI chip sample with Shanghai Xianfeng Technology using glass-based Chip-on-Panel-on-Substrate (CoPoS) panel-level advanced packaging.
Chinese GPU developer Biren Technology unveiled a next-generation near-packaged optics (NPO) super node at the World Artificial Intelligence Conference (WAIC) 2026, targeting the growing computing demands of large language models and AI agents.
China is considering tighter export controls on artificial intelligence and semiconductor technologies amid intensifying competition with the US in frontier AI. The proposed measures, reported by Financial Times, would also target overseas acquisitions of advanced technology startups and could appear in the next revision of Beijing's export control catalogue.
Rising investment in AI servers, high-speed networking, and satellite communications is accelerating a shift in Southeast Asia's electronics industry. Thailand, Vietnam, and Malaysia are moving beyond traditional consumer device assembly and building a deeper regional ecosystem for printed circuit boards, advanced substrates, and semiconductor-related manufacturing.
Ishihara Sangyo Kaisha plans to double production capacity for high-purity titanium dioxide used to make dielectric materials for multilayer ceramic capacitors, as rising AI server power requirements increase demand for the components.
Chinese AI developer Z.ai has completed a giant data center running exclusively on domestically made chips, a milestone in Beijing's drive to replace restricted Nvidia silicon for future AI development.
South Korean semiconductor materials and parts supplier CMTX has developed a roughly 590mm single-crystal silicon ground ring for chip-etching equipment and plans to begin customer validation as it scales production of the 600mm-class ingots used to make oversized chamber components.
China's AI hardware race is shifting from individual accelerators to supernodes, optical interconnects, advanced packaging and cloud-scale systems.
