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Wednesday 27 May 2026
Qualcomm and ByteDance's rumored AI ASIC deal signals potential shift in China's data center chip supply
The agreement between Qualcomm and ByteDance positions the former for large-scale AI ASIC demand from the latter, as reported by Bloomberg, but market viability remains uncertain amid intense AI chip competition, evolving China procurement preferences, and regulatory pressures affecting cross-border semiconductor adoption
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Thursday 28 May 2026
China tightens travel bans on private-sector AI to stem tech leaks
China has expanded its state travel controls into the private technology sector, deliberately blocking top AI talent from leaving the country without explicit government authorization
Thursday 28 May 2026
Samsung foundry targets robotics, auto AI chips with Cadence platform
Samsung Electronics is preparing to expand its foundry push into physical AI semiconductors through a chiplet platform developed with Cadence, targeting chips for robotics, automotive systems, drones, and industrial automation, ETNews reported, citing industry sources
Thursday 28 May 2026
QRT eyes aerospace, defense growth with portable chip radiation tester

South Korean semiconductor testing company QRT is expanding its equipment business with a portable chip radiation reliability testing system, aiming to build a larger presence in aerospace and defense markets

Wednesday 27 May 2026
Samsung reportedly to expand Vietnam footprint with new memory chip testing plant

Samsung Electronics plans to invest VND39 trillion (approx. US$1.5 billion) in a new semiconductor testing facility in northern Vietnam, according to documents reviewed by Reuters, marking the company's first chip testing plant in the country as global memory demand surges amid the AI boom

Wednesday 27 May 2026
VinFast names new chair to tackle global expansion
Vietnamese electric-vehicle maker VinFast has appointed a new chairman amid mounting challenges in its overseas expansion across Asia and the US, including delays to its planned US factory, rising losses, and intensifying competition in global EV markets
Wednesday 27 May 2026
Luxshare projects multi-year AI infrastructure surge while flagging energy and standards challenges
Luxshare Precision Industry said at its annual shareholders meeting on May 22 that it expects AI infrastructure to expand strongly over the next three to five years. Still, it warned that energy constraints and immature industry standards will pose significant hurdles. The Chinese electronics manufacturer compared the AI opportunity to the 2017 consumer electronics market and said it is accelerating AI infrastructure efforts through its communications business
Wednesday 27 May 2026
Former Tencent AI lead says Chinese firms are trailing US on core LLM innovation
A former Tencent large-model technical chief warned that Chinese artificial intelligence companies lack independent paradigm-level breakthroughs and are trailing US rivals, according to an interview with the South China Morning Post. He said the gap in large language model technology was about three months and could widen to six months by year-end as OpenAI prepares to launch GPT 5.6, and that US chip export controls had reduced China's available computing power for training advanced models
Wednesday 27 May 2026
China tightens drone, flying-car rules as low-altitude market takes off

China is building a more formal safety and regulatory framework for its low-altitude economy, as drones, electric vertical takeoff and landing aircraft, and other aerial services move closer to commercial use

Wednesday 27 May 2026
SK Hynix seeks to embed cooling inside HBM to beat the heat
SK Hynix has unveiled a new high-bandwidth memory technology designed to reduce heat buildup in next-generation AI systems, as rising computing density turns thermal management into a more critical front for HBM suppliers
Wednesday 27 May 2026
TSMC and Micron's fabs expanding; how do Samsung and SK Hynix's bonus systems come into play?
Samsung Electronics' 2026 tentative labor-management agreement is expected to pass after already surpassing an 86% voting participation rate within just three days. While the agreement has temporarily eased concerns over potential strikes, South Korea's semiconductor industry is increasingly worried that the newly expanded performance bonus structure, which guarantees employees a fixed percentage of business performance, could negatively impact the country's long-term semiconductor competitiveness
Wednesday 27 May 2026
Huawei Tau Law series 2: Advanced packaging, AI interconnects, EDA lead the way
Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking, optical interconnects, and system-level architecture design
Tuesday 26 May 2026
Inside China's chip war: How Xiaomi, BYD, and Nio are rewriting the rules
China's semiconductor war has been underway for seven or eight years now
Tuesday 26 May 2026
Samsung's reported 900-layer V-NAND prototype puts NAND race with YMTC in focus
The race to dominate next-generation NAND flash memory has long been measured in layers — and Samsung Electronics appears to be pulling ahead. The South Korean chipmaker has reportedly developed a 900-layer-class V-NAND prototype, a significant leap that brings the memory industry closer to the 1,000-layer threshold as chipmakers intensify efforts to pack more storage into smaller chips while cutting power consumption
Tuesday 26 May 2026
Huawei Tau Law series 1: How China's chip industry is pivoting beyond Moore's Law
When Huawei unveiled its "Tau (τ) Scaling Law" at ISCAS 2026 in Shanghai, the announcement signalled more than another chip architecture update. It marked China's most ambitious attempt yet to redefine how semiconductor performance is measured in the post-Moore era
Tuesday 26 May 2026
Samsung's P4 HBM push could worsen DRAM crunch in 2027

Samsung Electronics is reportedly preparing to allocate much of its Pyeongtaek P4 cleanroom capacity to next-generation high-bandwidth memory (HBM) in 2027, a move that could tighten the supply of general-purpose DRAM as memory makers shift more production toward higher-value AI server products