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Tuesday 26 May 2026
Huawei eyes AI storage breakthrough with DoB packaging, 245TB SSD roadmap
Huawei has released its Data Storage 2030 white paper, setting out a technology roadmap for the global storage industry over the next five to 10 years, as AI large language models drive data creation into what the company calls the yottabyte era
Tuesday 26 May 2026
Analysis: Huawei's Tau Law signals a new semiconductor framework — with implications beyond China
As the global semiconductor industry approaches the physical limits of transistor scaling, Huawei has proposed a new framework for the post-Moore era through its recently introduced "Tau (τ) Law" and a related time-scaling theory
Tuesday 26 May 2026
China pushes homegrown AI stack with local chips, LLMs

Following the conclusion of the Trump-Xi meeting and amid continued delays in China approving imports of Nvidia H20 GPUs, China's National Development and Reform Commission (NDRC) on May 22 sent a strong policy signal on artificial intelligence (AI) self-sufficiency, explicitly calling for greater efforts to pair domestic large language models with domestically developed computing chips

Tuesday 26 May 2026
TP-Link India begins local manufacturing of Wi‑Fi 7, aiming to boost global supply
TP-Link India has started local production of Wi‑Fi 7 devices, beginning with the Omada EAP770 enterprise access point, a move that could accelerate the adoption of next‑generation wireless worldwide. The decision follows India's delicensing of the lower 6 GHz band and positions the company to serve domestic and select international markets, according to The Times of India, AP7AM, and The Statesman
Tuesday 26 May 2026
Advantech deepens partnerships in South Korea to push hybrid edge for manufacturing AI
Advantech has deepened partnerships with Nvidia, AMD, and South Korean startups to push a hybrid edge architecture for manufacturing AI, promising faster on-site inference and continuous cloud-driven model updates. Global manufacturers could use this approach to scale Physical AI across factories while managing compute, protocol, and sensor challenges for worldwide adoption
Tuesday 26 May 2026
TECO completes Malaysia's Dynaciate acquisition to boost data center build capacity
TECO Electric & Machinery announced on the 25th that it signed an agreement to acquire about 78% of Malaysian engineering firm Dynaciate Engineering Sdn. Bhd. for roughly 200 million ringgit (about NT$1.6 billion). The closing was targeted by the end of August and the firm said the move is intended to expand TECO's data center infrastructure footprint in Southeast Asia to serve global cloud service provider customers
Tuesday 26 May 2026
Samsung's silicon photonics push adds new layer to Korea-Dutch chip ties

South Korea and the Netherlands are looking to broaden their semiconductor partnership beyond ASML's EUV lithography machines, as silicon photonics (SiPh) emerges as a potential next field of cooperation amid rising power and bandwidth demands from AI data centers

Tuesday 26 May 2026
Inside China's humanoid robot boom: Price war, fractured supply chains
China's humanoid robot market is expanding rapidly, but intensifying price competition and growing concerns over product reliability are beginning to expose structural weaknesses across the supply chain
Monday 25 May 2026
Japan's Axelspace plans mid-2026 SpaceX launch for next-gen Earth observation constellation
Japanese space startup Axelspace has formally announced plans to launch up to seven next-generation GRUS-3 Earth-observation microsatellites in as early as July 2026 aboard a Falcon 9 rocket operated by SpaceX from Vandenberg Space Force Base, significantly expanding the company's commercial satellite constellation
Monday 25 May 2026
BYD and Chery lead China's advance into Europe's EV market
Chinese automakers are rapidly gaining ground in Europe's electric-vehicle market, underscoring a transformation from low-cost challengers into formidable global competitors
Monday 25 May 2026
Huawei reveals post-Moore semiconductor roadmap targeting 1.4nm-equivalent chip performance
As the global semiconductor industry confronts the limits of Moore's Law, Huawei has unveiled a new roadmap aimed at extending chip performance growth through architecture, interconnect, and system-level optimisation rather than pure transistor miniaturisation
Monday 25 May 2026
CATL weighs stake in AI startup deepSeek

According to several people familiar with the matter, Contemporary Amperex Technology Limited (CATL), the world's largest maker of electric-vehicle (EV) batteries, is in talks to participate in a major financing round for the Chinese artificial intelligence (AI) start-up DeepSeek. The prospective investment highlights how China's AI boom is forging new alliances among technology firms, industrial companies, and energy providers, all competing to build the infrastructure required for the next generation of computing

Monday 25 May 2026
India-based Cyient Semiconductors raises US$30 million to scale power chips for global AI markets
Cyient Semiconductors has secured a total of about US$30 million in financing from Edelweiss-managed funds and co-investors, comprising a US$10 million equity investment at a valuation of roughly US$500 million alongside structured debt. The deal bolsters its capital base to scale its power semiconductor and custom silicon offerings for global AI markets
Monday 25 May 2026
GoPro takeover talks highlight China's growing clout in cameras
GoPro's takeover talks are putting a spotlight on a broader shift in handheld cameras, as the market moves from rugged action devices toward creator-focused gimbal and 360-degree products increasingly shaped by Chinese brands
Monday 25 May 2026
Nvidia's Vera CPU push lifts LPDDR outlook for Samsung, SK Hynix
Nvidia's decision to sell its Vera CPU as a standalone chip could create a new source of demand for low-power DRAM, adding another pressure point to the already tight memory supply chain