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Friday 20 March 2026
Samsung reportedly secures OpenAI HBM4 supply deal, shifts foundry capacity
Samsung Electronics is reportedly set to exclusively supply sixth-generation high-bandwidth memory (HBM4) to OpenAI while reallocating more than half of its advanced foundry capacity to internal production, according to Hankyung and industry sources. The move underscores the South Korean chipmaker's drive to meet surging demand for artificial intelligence (AI) components as orders from major customers — including Nvidia and Advanced Micro Devices (AMD) — continue to accelerate
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Friday 20 March 2026
Samsung plans over KRW110 trillion investment in AI semiconductor facilities and R&D for 2026
Samsung Electronics announced it will invest more than KRW110 trillion (approx. US$73.4 billion) in facilities and R&D by 2026 to secure a leading position in the AI semiconductor era. This marks the first time its annual investment surpasses the "KRW100 trillion" threshold
Friday 20 March 2026
Samsung reportedly ceasing TriFold smartphone sales

Samsung Electronics is reportedly discontinuing its premium Galaxy Z TriFold smartphone just months after launch, underscoring the device's role as a technological showcase rather than a mass-market product, according to Bloomberg. The US$2,899 foldable, featuring a dual-hinge design that expands into a 10-inch tablet, will first be pulled from South Korea before sales are halted in the US. Samsung's website has already removed messaging around restocks, listing the device as "sold out.

Friday 20 March 2026
Tencent leverages WeChat ecosystem to lead AI agent race in China
Tencent's rapid rollout of agentic AI across WeChat could reshape the competitive dynamics of Chinese AI, with potential implications for global markets given WeChat's 1.4 billion users and integrations across communication, payments, content, and services, possibly accelerating AI agent adoption and raising questions about competitors' responses and timing
Friday 20 March 2026
Volkswagen signals shift away from Nvidia as Chinese chips gain ground

Recent reports suggest that Volkswagen may move away from relying on Nvidia's automotive computing platforms, instead increasingly integrating Chinese-made chips into its vehicles

Friday 20 March 2026
China's AI robot industry surges on market freedom and strategic autonomy
Despite lacking the industrial legacy of Japan and Germany, China has rapidly built its AI robotics sector into a formidable force, posing as a subtle challenge to US technological dominance. Tien-Chong Cheng, chairman of Aurotek, attributes this swift growth to two key drivers: maintaining high market competition and freedom, and allowing the industry itself to shape development strategies
Thursday 19 March 2026
Samsung Electro-Mechanics rumored to supply MLCCs to top private aerospace firm
Samsung Electro-Mechanics (Semco) is reportedly supplying multilayer ceramic capacitors (MLCC) for low Earth orbit (LEO) satellites to the world's largest private aerospace company. According to industry sources, this expansion from the automotive and industrial sectors into aerospace is a significant step for the company, as it demonstrates that its components have gained global recognition for durability and reliability
Thursday 19 March 2026
SK Hynix posts record pay, R&D, and capex in 2025
Driven by the AI dividend and a robust semiconductor market, SK Hynix's average employee annual salary reached KRW185 million (approx. US$124,494) in 2025, up 58.1% year-over-year to set a new high. At the same time, the company also broke records for R&D investment and capital expenditure (capex)
Thursday 19 March 2026
China's photoresist push moves from lab wins to mass supply
China's semiconductor materials localisation is shifting into commercial scale, with domestic photoresist suppliers moving from pilot validation to mass supply, marking a turning point in one of the chip industry's most tightly controlled segments
Thursday 19 March 2026
Nexperia's China split sends orders to Taiwan
Nexperia's China unit has begun producing power semiconductors on 12-inch wafers. The move marks a decisive break from its Dutch headquarters and is sending ripple effects across global supply chains
Thursday 19 March 2026
US reveals Tesla battery deal with LG, lifting veil on supply chain
US government disclosures have shed unusual light on a closely guarded corner of the electric vehicle supply chain, confirming that LG Energy Solution signed a battery supply agreement worth KRW6 trillion (approx. US$4 billion) with Tesla in July 2025
Thursday 19 March 2026
Tencent to double AI spending on 13% revenue growth as chip curbs reshape capex
Tencent is preparing a sharp escalation in artificial intelligence investment, with plans to more than double spending to over CNY36 billion (US$5.2 billion) in 2026, even as chip export restrictions have disrupted its earlier capital expenditure strategy
Thursday 19 March 2026
AMD, Samsung deepen AI chip ties with HBM4 supply and foundry talks

AMD CEO Lisa Su met Samsung Chairman Lee Jae-yong on March 18, the same day the two companies signed a memorandum of understanding (MOU) to expand semiconductor cooperation, signalling a broader push into AI chips, memory, and foundry services

Thursday 19 March 2026
Column: OpenClaw pulls AI from cloud to the edge
OpenClaw's rapid rise has pushed "lobster-raising" from a niche developer trend into a cross-industry race spanning chips, hardware, and end devices
Thursday 19 March 2026
Column: OpenClaw ignites China's AI agent land grab
OpenClaw's "lobster-raising" wave is moving from developers into China's internet and software sectors at speed in early 2026. Unlike earlier large-model races centred on parameters and compute, this AI agent cycle is defined by a single question: who controls the user entry point
Thursday 19 March 2026
Analysis: China's on-device AI chipmakers rush to supply OpenClaw, race for edge AI silicon leadership
OpenClaw is forcing a rethink of the AI hardware stack, shifting the locus of deployment from cloud-based interaction to autonomous, always-on agents running locally on devices