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Monday 24 November 2025
Japan to become majority stakeholder in Rapidus with JPY100 billion investment
Japan's Ministry of Economy, Trade and Industry plans to invest JPY100 billion (US$671 million) in Rapidus in fiscal 2025, securing a controlling stake as the government accelerates its push to rebuild domestic advanced chip manufacturing. The funding will be executed through the Information-Technology Promotion Agency, and Rapidus aims to reach break-even around 2030 and pursue an initial public offering in 2031
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Monday 24 November 2025
Lenovo builds a 50% inventory buffer to hold PC prices through 2025
Lenovo expects component costs to stay elevated but says its inventory buffer, scale, and long-term supplier contracts will keep PC and server prices steady through 2025. During its latest earnings call, the company said it has the "capacity and experience" to navigate the sharp rise in memory prices
Monday 24 November 2025
Samsung Technology Conference 2025 highlights four key domains for AI transformation
At Samsung Technology Conference (STC 2025), the latest research findings in AI agents, communications, healthcare, and cybersecurity were showcased. Security, intelligent software, robotics, and open-source ecosystems were identified as four key fields that will guide AI transformation
Monday 24 November 2025
DDR5 breakthrough: CXMT showcases 8000Mbps memory at IC China 2025

China's memory maker CXMT used this year's IC China 2025 expo to debut its new DDR5 product line, signalling its most assertive push into high-end server and AI-focused DRAM. The chips reach 8000Mbps and 24Gb per die, placing CXMT firmly among top-tier global DRAM suppliers

Monday 24 November 2025
SailPoint report reveals polarized identity security landscape in APAC
Cybersecurity solutions provider SailPoint recently released a report, "The Horizons of Identity Security, 2025-2026," revealing the current state of identity security among global enterprises. The Asia-Pacific (APAC) region shows a polarized development pattern: over half of the surveyed companies are still in early stages while the proportion of highly mature firms surpasses Europe and matches North America
Monday 24 November 2025
China launches Burning Plasma international scientific program, aims for net energy gain
On November 24, 2025, the Chinese Academy of Sciences (CAS) officially launched the "Burning Plasma" international scientific program at the "Future Big Science City" in Hefei, Anhui. The CAS also presented the Burning Plasma Experimental Superconducting Tokamak (BEST) research plan to the global fusion research community
Monday 24 November 2025
Samsung reportedly converts NAND lines to DRAM to meet surging AI memory demand
Samsung Electronics is reportedly preparing to convert portions of its NAND flash production lines in Pyeongtaek and Hwaseong into DRAM facilities as the company races to meet surging demand for general-purpose DRAM used in AI servers and data centers
Monday 24 November 2025
Nexperia dispute continues as Wingtech appeals to Dutch government
The turmoil surrounding Nexperia persists as Wingtech, the Chinese parent company of Nexperia, has formally lodged a complaint with the Dutch government, demanding the withdrawal of its control over Nexperia Netherlands. This follows the Dutch government's recent announcement suspending the takeover execution amid negotiations with China's Ministry of Commerce (MOFCOM), while not revoking the original court ruling that authorized the takeover
Monday 24 November 2025
Nvidia shifts to LPDDR for AI servers, Samsung poised to benefit most
Nvidia is reportedly adopting low-power DDR (LPDDR) memory in its servers to enhance power efficiency, marking a major shift in memory architecture. Industry analysts suggest this move could elevate LPDDR to become a core semiconductor in the AI era, following the prominence of high-bandwidth memory (HBM)
Monday 24 November 2025
Weekly News Roundup: US moves to ban Chinese chipmaking equipment; Tesla eyes in-house fab; Intel hires TSMC veteran
These are the most-read DIGITIMES Asia stories in the week of November 17 to November 23, 2025
Monday 24 November 2025
SK On swaps shares with EVE Energy to restructure joint ventures in China
South Korean battery maker SK On has restructured its investment portfolio by exchanging shares with Chinese battery firm EVE Energy, resulting in SK On acquiring full ownership of its Jiangsu-based joint venture SKOJ and divesting its entire stake in the Guangdong-based EUE factory. This move aims to enhance operational efficiency amid challenges in the EV market
Monday 24 November 2025
NGK Insulators to expand capacity for chiplet ceramic support wafers that offer 5x warpage resistance
Japanese ceramics firm NGK Insulators has announced plans to triple its production capacity of support wafers by fiscal year 2027 (April 2027-March 2028). More specifically, these refer to double-sided polished alumina ceramic HICERAM Carriers used in chiplet packaging
Monday 24 November 2025
Doosan poised to secure exclusive Nvidia Rubin CCL supply as EMC fails GB300 test
Doosan Electronic Business Group (Doosan Electro-Materials) is on track to become the exclusive supplier of copper-clad laminate (CCL) for Nvidia's next-generation AI chip, Rubin, following Taiwan competitor Elite Material Co. (EMC)'s failure to pass quality certification for the Nvidia Blackwell GB300 compute tray
Sunday 23 November 2025
SK Hynix reportedly plans to boost 1c DRAM output eightfold in 2026
SK Hynix is reportedly preparing a major ramp-up of its next-generation 1c DRAM production, with plans to increase capacity eightfold in 2026 to meet rising demand for high-performance general-purpose memory in server and accelerator systems. The chipmaker is expected to boost output of GDDR7 and SOCAMM2 modules built on the 1c platform to support growing orders from Nvidia and global cloud service providers
Sunday 23 November 2025
Intel's China debut highlights AI expansion, Gaudi 2E, and disaggregated supernodes
The 2025 Intel Technology Innovation and Industry Ecosystem Conference was held from November 19 to 21, 2025, in Chongqing, China. At the event, Intel CEO Lip-Bu Tan and newly appointed chairman of Intel China Alan Wang both made their first public appearances in China following their appointments. They took office in March and September 2025, respectively. In contrast to former CEO Pat Gelsinger, their remarks focused heavily on AI
Saturday 22 November 2025
Foxconn activates Model A for Japan, forecasting bigger CDMS impact by 2026
Electric vehicles continued to dominate Hon Hai Tech Day (HHTD25) this year, with Foxconn unveiling a fully realized version of its Model A concept and framing the project around the idea of "From Japan for Japan.