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Tuesday 26 May 2026
Samsung's reported 900-layer V-NAND prototype puts NAND race with YMTC in focus
The race to dominate next-generation NAND flash memory has long been measured in layers — and Samsung Electronics appears to be pulling ahead. The South Korean chipmaker has reportedly developed a 900-layer-class V-NAND prototype, a significant leap that brings the memory industry closer to the 1,000-layer threshold as chipmakers intensify efforts to pack more storage into smaller chips while cutting power consumption
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Wednesday 27 May 2026
Unitree sprints toward IPO as profits crumble under rising costs
Chinese humanoid robot maker Unitree Robotics is moving quickly toward an initial public offering, but its latest prospectus points to the commercial challenges still facing the sector
Wednesday 27 May 2026
Facing Chinese rivals, Hyundai accelerates robotaxi plans and cost cuts
As Chinese automakers intensify a global price war, South Korea's Hyundai Motor Group is responding on two fronts at once: accelerating its push into autonomous mobility while pressing suppliers for sweeping cost cuts that could reshape its manufacturing ecosystem
Wednesday 27 May 2026
Qualcomm and ByteDance's rumored AI ASIC deal signals potential shift in China's data center chip supply
The agreement between Qualcomm and ByteDance positions the former for large-scale AI ASIC demand from the latter, as reported by Bloomberg, but market viability remains uncertain amid intense AI chip competition, evolving China procurement preferences, and regulatory pressures affecting cross-border semiconductor adoption
Wednesday 27 May 2026
China clears 9 domestic AI chips for state procurement
China has formally brought AI chips into its national security and reliability evaluation framework for the first time, marking a further expansion of the country's Information Technology Application Innovation procurement policy into AI computing infrastructure
Wednesday 27 May 2026
Samsung wage deal pushed through by chip workers, widening bonus divide
Samsung Electronics' tentative 2026 wage agreement has cleared a union vote with 73.7% approval, moving a months-long labor dispute closer to settlement while exposing a deeper divide between workers in the company's chip and consumer electronics businesses, according to Korean media reports
Wednesday 27 May 2026
Luxshare projects multi-year AI infrastructure surge while flagging energy and standards challenges
Luxshare Precision Industry said at its annual shareholders meeting on May 22 that it expects AI infrastructure to expand strongly over the next three to five years. Still, it warned that energy constraints and immature industry standards will pose significant hurdles. The Chinese electronics manufacturer compared the AI opportunity to the 2017 consumer electronics market and said it is accelerating AI infrastructure efforts through its communications business
Wednesday 27 May 2026
Former Tencent AI lead says Chinese firms are trailing US on core LLM innovation
A former Tencent large-model technical chief warned that Chinese artificial intelligence companies lack independent paradigm-level breakthroughs and are trailing US rivals, according to an interview with the South China Morning Post. He said the gap in large language model technology was about three months and could widen to six months by year-end as OpenAI prepares to launch GPT 5.6, and that US chip export controls had reduced China's available computing power for training advanced models
Wednesday 27 May 2026
China tightens drone, flying-car rules as low-altitude market takes off

China is building a more formal safety and regulatory framework for its low-altitude economy, as drones, electric vertical takeoff and landing aircraft, and other aerial services move closer to commercial use

Wednesday 27 May 2026
SK Hynix seeks to embed cooling inside HBM to beat the heat
SK Hynix has unveiled a new high-bandwidth memory technology designed to reduce heat buildup in next-generation AI systems, as rising computing density turns thermal management into a more critical front for HBM suppliers
Wednesday 27 May 2026
TSMC and Micron's fabs expanding; how do Samsung and SK Hynix's bonus systems come into play?
Samsung Electronics' 2026 tentative labor-management agreement is expected to pass after already surpassing an 86% voting participation rate within just three days. While the agreement has temporarily eased concerns over potential strikes, South Korea's semiconductor industry is increasingly worried that the newly expanded performance bonus structure, which guarantees employees a fixed percentage of business performance, could negatively impact the country's long-term semiconductor competitiveness
Wednesday 27 May 2026
Huawei Tau Law series 2: Advanced packaging, AI interconnects, EDA lead the way
Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking, optical interconnects, and system-level architecture design
Tuesday 26 May 2026
Huawei eyes AI storage breakthrough with DoB packaging, 245TB SSD roadmap
Huawei has released its Data Storage 2030 white paper, setting out a technology roadmap for the global storage industry over the next five to 10 years, as AI large language models drive data creation into what the company calls the yottabyte era
Tuesday 26 May 2026
China pushes homegrown AI stack with local chips, LLMs

Following the conclusion of the Trump-Xi meeting and amid continued delays in China approving imports of Nvidia H20 GPUs, China's National Development and Reform Commission (NDRC) on May 22 sent a strong policy signal on artificial intelligence (AI) self-sufficiency, explicitly calling for greater efforts to pair domestic large language models with domestically developed computing chips

Tuesday 26 May 2026
Wingtech sues Nexperia for US$1.2B as it fights delisting risk
Wingtech Technology, the Chinese tech company that owns Dutch semiconductor manufacturer Nexperia, has filed a civil lawsuit against Nexperia and five defendants for alleged damages worth CNY8 billion (approx. US$1.2 billion). The case is the latest development of the legal troubles between the Chinese company and its subsidiary following the Dutch government's seizure of the company in late 2025 for national security reasons
Tuesday 26 May 2026
NTT updates tsuzumi 2 to read charts and boost numerical reasoning
NTT updated its lightweight Japanese large language model, tsuzumi 2, to better understand charts, graphs, and other visuals in business documents, thereby strengthening numerical and logical reasoning. The change is aimed at on-premises and private-cloud deployments that handle sensitive data, with implications for multinational firms and organizations that need secure, accurate Japanese document processing