On December 17, Rapidus announced a new suite of AI-based semiconductor design tools under its Rapidus AI-Assisted Design Solution (Raads), aimed at supporting the company's Rapid and Unified Manufacturing Service (RUMS) concept. The technology will be rebranded as Rapidus AI-Agentic Design Solution, with multiple tools scheduled for release starting in 2026. Customers will receive the tools alongside a process design kit (PDK) and reference flows

As AI inference workloads grow and models expand rapidly, Samsung Electronics and SK Hynix are advancing high-bandwidth memory (HBM) technologies while integrating processing-in-memory (PIM) capabilities. This approach allows computations to occur within memory itself, reducing data movement and easing power and performance constraints

Five months after launching an accelerated artificial intelligence (AI) development plan, the Trump administration is shifting its focus to robotics. Following semiconductors and AI, the US is preparing for its next "strategic high ground," this time targeting humanoid robots

China has quietly crossed a psychological and potentially strategic threshold in the global semiconductor race. In a tightly controlled laboratory in Shenzhen, Chinese scientists have built a working prototype of an extreme ultraviolet (EUV) lithography machine, the most complex and geopolitically sensitive tool in modern chipmaking, according to Reuters

For the global automotive electronics industry, the Chinese market has become a glittering trap: a massive, indispensable arena of innovation that is simultaneously cannibalizing the profit margins of the very companies that sustain it

Cyient Ltd's wholly owned subsidiary, Cyient Semiconductors Singapore Pte Ltd, has entered into a definitive agreement to acquire over 65% of US-based power semiconductor company Kinetic Technologies for US$93 million. The transaction is expected to close by April 30, 2026

At the recent "Human X Car X Home" partner conference, Xiaomi's MiMo model team leader Luo Fuli introduced the open-source MiMo-V2-Flash model, designed to boost agent execution capabilities as foundational technology within Xiaomi's interconnected device ecosystem

In a post-earnings analyst call on December 17, 2025, Micron Technologies outlined plans for capital expenditure in fiscal year 2026, driven by global construction projects and the ramp-up of its India assembly facility in Sanand. The company also noted flat operating expenses through the mid-fiscal year, strong SSD demand, and a phased rollout of HBM4 on the 1-beta process node

Apple is reportedly in preliminary talks with Indian chip manufacturers to assemble and package components for the iPhone, potentially marking a first step in shifting part of its semiconductor operations to India

Texas has become one of the world's leading regions for AI data center construction. However, this trend has put its power grid under dangerous pressure, exceeding what realistic power supply conditions can support. Texas is only one example; several other states are facing similar problems of aging and fragmented power grids, lacking a cross-regional, large-scale power dispatch system

Murata Manufacturing plans to start mass production of AI server power modules in 2026 and is coordinating with major cloud service providers. The company expects the business to generate about JPY50 billion (US$332 million) in revenue over fiscal 2026 to fiscal 2027, covering April 2026 to March 2028

InnoCare Optoelectronics held an investor conference on December 16, 2025, where company chairman James Yang pointed out that while the global medical device market grows annually by about 5–8%, InnoCare maintains a double-digit growth rate, outperforming the overall market. The company expects to sustain stable growth through 2026

MetaX, a Chinese graphics processor startup founded by former Advanced Micro Devices engineers, soared in its trading debut on Shanghai's STAR Market on December 17, 2025. The rally highlights the premium investors are placing on Beijing's semiconductor self-sufficiency drive even as the company grapples with widening losses and intense geopolitical headwinds

Semiconductor test equipment supplier Advantest and Tokyo Seimitsu have announced a joint plan to co-develop a next-generation die-level prober for high-performance computing components