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Tuesday 5 May 2026
SEMICON SEA 2026: Delta showcases AI-enabled smart manufacturing
Delta Electronics presented its latest AI-enabled smart manufacturing solutions at SEMICON Southeast Asia 2026, underscoring its efforts to advance efficiency, precision, and scalability in semiconductor packaging production amid intensifying industry demands
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Wednesday 6 May 2026
DeepSeek pulls multimodal paper after brief release, reveals new visual reasoning approach
DeepSeek briefly released, then removed, a multimodal research paper that offers rare insight into its evolving AI strategy, drawing attention across the developer community
Wednesday 6 May 2026
SoftBank, Intel target HBM limits with 9-layer memory
SoftBank's memory unit SAIMEMORY is preparing to present a new 3D DRAM technology developed with Intel, as the AI hardware industry seeks ways to ease the power and heat constraints of high-bandwidth memory
Wednesday 6 May 2026
Southeast Asia's fab deficit threatens a chip boom shutout
Global semiconductor sales are projected to reach US$1 trillion this year and could double to US$2 trillion by 2035, driven by rapid growth in AI data centers. But the boom is also shining new light on Southeast Asia's limited front-end manufacturing base, as SEMI urges the region to add more fabs to reduce chip supply-chain concentration in China and Taiwan
Wednesday 6 May 2026
Samsung board chairman warns strike could disrupt chip output

Samsung Electronics' labor dispute is widening beyond a fight over bonuses, after board chairman Shin Je-yoon made a rare appeal for management and unionized workers to resolve the standoff through dialogue as a planned strike threatens to disrupt chip production, customer trust, and South Korea's broader economy

Tuesday 5 May 2026
AMI capacity sold out through 2028 as CCL makers race for high-end tools

The PCB industry is entering a new phase of transformation in the AI era, as rising demand for high-frequency and high-speed applications accelerates upgrades in upstream copper-clad laminate (CCL) materials. Among the beneficiaries is impregnation equipment maker Asia Metal Industries (AMI)

Tuesday 5 May 2026
Onsemi says China remains a strong market despite softer passenger vehicle volumes
Onsemi told investors during its first-quarter 2026 earnings call, held on May 4, that China remains a key growth market for its automotive power products, even as China's passenger vehicle market softened. The company reported that "Our China automotive revenue grew year-over-year in the first quarter, despite a decline in the China passenger vehicle market of 6% for the same period," framing the performance as evidence of rising semiconductor content and share gains within Chinese electric vehicle programs
Tuesday 5 May 2026
Analysis: How China’s HJT curb accelerates domestic consolidation and redefines solar competition
China is reportedly planning targeted export rules for heterojunction (HJT) solar equipment. The move has sparked broad industry debate in 2026, as energy transition and aerospace development grow increasingly intertwined. More than a trade measure, it reflects a cross-domain effort to protect technological sovereignty and keep core R&D value within China
Tuesday 5 May 2026
Samsung reportedly eyes SiC foundry reboot, targets 2028 mass production
Samsung Electronics is reportedly restarting its silicon carbide (SiC) wafer foundry business, aiming to tap into the fast-growing next-generation power semiconductor market, reinforce its market position, and improve utilization rates at its existing 8-inch foundry lines. Industry estimates suggest Samsung could enter mass production of SiC chips by 2028
Tuesday 5 May 2026
Malaysia becomes AI data center hub, attracts Chinese cloud giants and Nvidia AI chips

As power constraints and tighter policy controls in Singapore limit expansion, Malaysia is rapidly emerging as Southeast Asia's most important data center hub. A DIGITIMES research report finds that Chinese cloud service providers (CSPs), including ByteDance and Alibaba, are accelerating their shift southward, using Malaysia's unique supply chain pathways to deploy high-end AI computing power locally, including Nvidia's B200 systems

Tuesday 5 May 2026
SK Hynix weighs memory plant shift as HBM demand outlook changes

SK Hynix is considering a shift in its DRAM investment strategy at its new M15X memory production base in Cheongju, South Korea, from fifth-generation 10nm-class, or 1b, DRAM toward sixth-generation 10nm-class, or 1c, DRAM, as the high-bandwidth memory (HBM) supply chain prepares for its next technology transition, according to reports from ZDNet Korea and NewsPim

Tuesday 5 May 2026
Kioxia, SanDisk to unveil 3D flash architecture targeting 1,000-layer milestone
Kioxia and SanDisk are set to present a new 3D flash memory architecture aimed at extending NAND scaling beyond 1,000 stacked layers, as memory makers seek ways to overcome the physical and electrical limits of conventional layer increases
Monday 4 May 2026
ADT lands US AI chip deal using Samsung 4nm
ADTechnology said it has signed a KRW40 billion (US$27.1 million) turnkey contract with a US-based AI fabless company to develop and supply HPC SoC chiplets for AI data-center applications using Samsung Foundry's 4nm process
Monday 4 May 2026
Samsung strike exposes AI-era pay divide, raises HBM supply risks

A looming strike at Samsung Electronics is exposing deeper fractures than a typical labor dispute, with widening pay gaps, divisional tensions, and a controversial bonus structure converging into a broader test of how AI-era profits are distributed inside one of the world's most critical semiconductor suppliers

Monday 4 May 2026
DIGITIMES Chair: South Korea's 260,000 GPU plan relies heavily on Taiwanese production, highlights need for collaboration in AI era
As global demand for AI infrastructure accelerates, the collaboration between Taiwan and South Korea—the core pillars of the global semiconductor supply chain—is critical to winning the new tech race. Colley Hwang, chairman of DIGITIMES and IC Broadcasting, said South Korea's plan to deploy 260,000 Nvidia GPUs remains heavily reliant on Taiwan's manufacturing capabilities
Monday 4 May 2026
AI's 1.6T shift turns InP into optical supply chain bottleneck

The transition from 800G to 1.6T optical modules is no longer an upgrade cycle — it is a physics-driven inflection point