BOE Technology Group's push into glass-based packaging substrates remains short of mass production, even as the Chinese display maker expands into new materials and advanced display technologies to build growth beyond conventional panels

As artificial intelligence drives an insatiable demand for computing power, China is beginning to look beyond terrestrial data centers and edge computing toward a new frontier: space

DRAM prices are climbing as Samsung Electronics, SK Hynix, and Micron Technology prioritize high-bandwidth memory, or HBM, for AI applications, tightening supply of mainstream DDR5 and DDR4 products used in PCs, servers, and other electronics, according to Nikkei

Huawei has formally introduced its "Tau Law," proposing a shift from traditional process-node scaling to "time scaling," a model aimed at improving chip performance through optimisation across components, circuits, chips, and systems, even under mature process technologies