China's silicon wafer industry is entering a new phase of simultaneous capacity expansion and consolidation, with Xi'an Eswin Material Technology investing further in a 12-inch wafer base in Wuhan while Hangzhou Lion Microelectronics moves to take full control of Zhejiang Jinruihong Technologies.
Shanghai-based AMIES Technology has secured repeat volume orders for its domestically developed AST6200 350nm stepper projection lithography system after passing process validation at a leading Chinese compound-semiconductor customer, extending the company's reach beyond its established advanced-packaging equipment business.
Samsung Electronics is expected to double its purchases of TV LCD panels from BOE in 2026 while cutting orders from CSOT, as Samsung and LG Electronics rebalance their supplier mixes in an LCD market increasingly dominated by Chinese panel makers.
Google's planned AI data center in Andhra Pradesh, India, has drawn its first major opposition, with environmental groups protesting over water rights and wildlife concerns. The project, announced in October 2025, calls for US$15 billion in investment over five years and includes participation from Adani Group.
SK Hynix is considering options for its semiconductor packaging and testing facility in Chongqing, China, including bringing in an outside investor or selling a stake in the operation, which could be valued at about US$3 billion, as the memory chipmaker ramps up investment in South Korea.
DeepSeek's participation in Unitree's Shanghai STAR Market IPO was made at the corporate level, not personally by founder Liang Wenfeng or a fund associated with him.
Samsung Electronics has reportedly pushed the production yield of its sixth-generation high-bandwidth memory (HBM4) close to 80%, marking a sharp improvement from the start of mass production as competition with SK Hynix increasingly shifts toward production capacity and supply stability.
US technology controls are reaching deeper into communications supply chains. Under FCC 26-50, the Federal Communications Commission no longer focuses only on brands or final assembly. Its emerging framework now extends to chips, modules, software, firmware, design ownership, production location and supply-chain control, raising new compliance risks for optical transceivers, networking equipment and ODM suppliers.
