Samsung Electro-Mechanics (Semco) is facing a slower glass-substrate rollout as a reliability evaluation of through-glass via (TGV) modules submitted to TSMC takes longer than expected, pushing back related equipment orders and adding pressure to a commercialization schedule that had already shifted into 2028.
China's leading DRAM maker ChangXin Memory Technologies (CXMT) has begun trial production of HBM3, but its initial yield has reportedly remained around 25%, highlighting the difficulty of translating its progress in conventional DRAM into high-performance AI memory.
China's next-generation communications push is beginning to reveal a broader ambition than simply putting faster wireless connections into future smartphones.
