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Wednesday 11 February 2026
TCL narrows gap with Samsung as Chinese TV brands gain ground
Chinese television manufacturers are intensifying pressure on South Korean brands that have long dominated the global market, as shipment growth at companies such as TCL and Hisense contrasts with stagnation at Samsung Electronics and LG Electronics. What began as a volume-driven push is increasingly paired with premium strategies, setting the stage for fiercer competition across the global television industry
Wednesday 11 February 2026
Why SMIC’s full fabs don’t guarantee fatter profits
China's largest contract chipmaker Semiconductor Manufacturing International Corporation (SMIC) reported a resilient fourth quarter and record full-year results for 2025, supported by accelerating domestic chip localization and sustained demand for mature-node capacity
Wednesday 11 February 2026
Commentary: Foreign EDA playbook frays as China's domestic camp mobilizes
Qun Ge, global senior vice president and chairman and president of Synopsys China, is set to depart. The move appears routine. But it points to deeper structural shifts in the global EDA industry's China market
Wednesday 11 February 2026
Coretronic warns seasonal dip but sees 10-20% annual growth potential across product lines
Coretronic said shipments of its energy-saving and imaging products will fall in the first quarter of 2026 due to seasonal factors and fewer working days, while projecting 10–20% year-on-year shipment growth for both categories across 2026. The company reported stronger fourth-quarter revenue and modest annual results
Wednesday 11 February 2026
SMIC breaks 2025 revenue record, margins fall to 19.2%
On February 10, Semiconductor Manufacturing International Corporation (SMIC) reported record 2025 revenues, but quarterly gross margins fell to 19.2%. The decline, driven by heavy depreciation costs and shifting smartphone supply chain dynamics, underscores the financial pressure of aggressive capacity expansion despite sustained high utilization across manufacturing facilities
Wednesday 11 February 2026
Alibaba builds Google-class AI stack with 'golden triangle' chip, cloud and model integration
Alibaba has completed the final piece of its AI strategy. T-Head Semiconductor has launched the Zhenwu 810E AI chip, developed in-house by Alibaba across hardware and software. The company's AI structure is now fully visible, built around Tongyi Lab, Alibaba Cloud, and T-Head Semiconductor operating as an integrated trio
Wednesday 11 February 2026
LGD to sell Nanjing automotive LCD module business

LG Display (LGD) agreed on February 9 to sell its automotive LCD module business in Nanjing, China, to Toprun Total Solution, according to a regulatory filing reported by ZDNet Korea. The transaction is valued at approximately KRW104.1 billion (approx. US$71 million) and is scheduled to close on July 30

Wednesday 11 February 2026
Nokia opens its largest fixed network R&D facility in Tamil Nadu
Nokia has inaugurated a new research and development (R&D) facility for fixed networks in Tamil Nadu, marking the Finnish telecom equipment maker's largest such center globally and reinforcing its long-term commitment to India as a technology and engineering hub
Wednesday 11 February 2026
Anthropic faces trademark lawsuit in India as it expands local operations
A trademark dispute has emerged in India as US-based AI company Anthropic accelerates its expansion in the country, highlighting tensions that can arise when global AI firms enter fast-growing local markets, according to Hindu Business Line and TechCrunch
Tuesday 10 February 2026
Renesas turns to China and India for recovery after first net loss in six years
Renesas Electronics recorded its first net loss in six years in fiscal 2025, reflecting weak demand for automotive semiconductors and a limited contribution from AI-related products. The company is recalibrating its strategy, with India and China positioned as key pillars in its recovery roadmap
Tuesday 10 February 2026
SK Hynix set to ship HBM4 for Nvidia's Vera Rubin this month

SK Hynix is expected to begin shipments this month of its sixth-generation high-bandwidth memory, HBM4, a high-performance, low-power semiconductor designed for Nvidia's next-generation artificial intelligence accelerator, Vera Rubin

Tuesday 10 February 2026
Analysis: Japan's supermajority reshapes Asia's semiconductor competition
Japan's latest election is being read by global markets as a turning point in industrial policy, capital flows, and technology sovereignty across Asia — not a routine political cycle. Following the February 2026 lower house election, Prime Minister Sanae Takaichi's Liberal Democratic Party secured 316 seats, crossing the two-thirds threshold and delivering one of the strongest mandates in postwar Japan. The broader ruling bloc with the Japan Innovation Party reached about 352 seats, giving the coalition effective legislative control in the 464-seat chamber
Tuesday 10 February 2026
Nexchip Phase IV expansion supports SmartSens, Xiaomi in building domestic CIS supply chain
China's foundry sector is accelerating expansion across mature and specialty nodes. Nexchip Semiconductor, the country's third-largest foundry, plans to invest CNY2 billion (approx. US$288 million) in Hefei Jingyi Integrated via equity transfer and capital injection to secure full ownership. Upon completion, Hefei Jingyi Integrated will become a wholly owned Nexchip subsidiary
Tuesday 10 February 2026
Exclusive: only cash strength can save China's TOPCon solar sector from endgame
With China's solar products set to lose a 9% export tax rebate in April 2026, compounded by raw material inflation, a wave of pre-rebate-cancellation stockpiling should theoretically emerge. Instead, this buying momentum has mainly come from overseas players. Meanwhile, many other foreign customers, faced with being passed on higher raw material costs, have ultimately chosen to stay on the sidelines. Survival in the industry is increasingly dependent on cash reserves rather than technological superiority
Tuesday 10 February 2026
India launches PRITVI-ACE pre-silicon validation facility to boost domestic chip design ecosystem
According to The Economic Times, India's Centre for Development of Advanced Computing (C-DAC) inaugurated its largest pre-silicon validation facility in Bengaluru on February 6, 2026. Named PRITVI-ACE (Platform for Reconfigurable Integrated Testing and Validation of IPs – Advanced Chip Evaluation), the facility offers large-scale, near-silicon-speed prototyping and validation of complex semiconductor designs before fabrication. It addresses a critical bottleneck in India's chip design ecosystem