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Thursday 17 September 2026
Applied Materials announces 10-year investment plan ahead of SEMICON India
US-based semiconductor equipment maker Applied Materials will invest INR36 billion (US$375 million)) in the Indian state of Karnataka over the next 10 years, Karnataka Industries Minister M B Patil said on September 15, 2026. The project, to be located in the Bengaluru Signature Business Park (BSBP) area, is expected to create around 1,000 jobs, according to Moneycontrol and PTI.
Thursday 17 September 2026
Lam Research plans US$1 billion India manufacturing expansion
Lam Research plans to invest INR100 billion (approx. US$1.04 billion) in India over the next several years, adding its first silicon component manufacturing facility in the country and expanding its advanced research and development operations.
Thursday 17 September 2026
South Korea's chip boom lifts 2027 corporate tax above KRW200 trillion

South Korea's semiconductor boom is spilling over from corporate profits into government tax revenue. Corporate tax revenue for fiscal 2027 is projected to reach KRW216.7 trillion (about US$160 billion), up 113.9% from the 2026 supplementary budget, topping KRW200 trillion for the first time and, after 15 years, overtaking income tax as the country's largest tax source.

Thursday 17 September 2026
Samsung looks to outside suppliers as HBM boom shifts priorities
Samsung Electronics has long benefited from a level of vertical integration few technology companies can match, spanning smartphones, memory, chip design, foundry manufacturing and packaging. However, recent sourcing moves suggest those internal links are becoming more selective as individual businesses pursue their own customers, margins and capacity priorities.
Thursday 17 September 2026
Huawei's 3D data center redesign targets the next AI compute density wall
Huawei has unveiled what it calls the world's first 3D data center, introducing a vertically stacked four-layer architecture designed for increasingly dense AI computing clusters and gigawatt-scale infrastructure.
Thursday 17 September 2026
Huawei aims to become 'China's Nvidia,' rules out building satellites or spacecraft

Huawei's internal Heart Voice Community recently published minutes from a discussion between Guo Ping, chairman of Huawei's supervisory board, and newly hired employees, offering a glimpse into the company's ambitions in AI, computing, semiconductors, and future technologies.

Wednesday 16 September 2026
Analysis: Jensen Huang is in Trump's ear; what it means for Taiwan's chip supply chain
"The narrative is much more practical," Nvidia CEO Jensen Huang said of China's approach to artificial intelligence (AI) at the All-In Summit 2026, contrasting it with US warnings about AI bringing civilization to an end.
Wednesday 16 September 2026
Taiwan, South Korea should stop comparing, says DIGITIMES chairman

As global AI investment continues to expand and US-China geopolitical pressure intensifies, how Taiwan and South Korea can preserve their semiconductor and manufacturing advantages has become a focal point. DIGITIMES and IC975 chairman Colley Hwang said the two sides should look for complementary strengths, work together to help Vietnam, Malaysia, and other countries develop, and first increase corporate exchanges to build a positive environment for cooperation.

Wednesday 16 September 2026
India's Eastern state clears SiCSem's SiC unit in SEZ
The Falta Special Economic Zone unit approval committee has cleared a proposal from SiCSem Private Limited to build an integrated silicon carbide (SiC) device plant near Bhubaneswar, a project with an investment of INR34.06 billion (US$355 million) and expected to employ about 1,270 people directly.
Wednesday 16 September 2026
Nvidia's Jensen Huang expected to attend Trump-Xi Summit as tech and trade take center stage
US President Donald Trump and Chinese President Xi Jinping are scheduled to meet on September 24 in Washington for a state dinner now dubbed the "G2 Summit". The meeting follows a turbulent economic period marked by an April 2025 tariff surge where both nations raised levies above 100% before reaching a temporary stalemate. Alongside traditional trade discussions and potential climate change or pandemic prevention talks, technology leadership, export controls, and regulatory frameworks are set to dominate the agenda.
Wednesday 16 September 2026
EV batteries cannot simply power humanoid robots, with energy density and costs posing key hurdles
Power battery technology has reached maturity in the new energy vehicle (NEV) market, but transferring it to humanoid robots presents two major barriers: the need for significant technological upgrades and the difficulty of spreading costs across a market characterized by low-volume, highly customized demand.
Wednesday 16 September 2026
SK Hynix union approves revised pay deal after 25-vote rejection

SK Hynix's production workers' union has approved a revised pay agreement that raises the cash share of employee profit-sharing bonuses, ending weeks of uncertainty after members rejected the previous proposal by just 25 votes.

Wednesday 16 September 2026
SK Hynix, Intel in talks on US production to ease memory crunch
SK Hynix is in talks with Intel about a potential deal that could give the South Korean company its first memory chip manufacturing operation in the US, as tight supply pushes customers and governments to secure more domestic capacity.
Wednesday 16 September 2026
Apple reportedly accepts Samsung's 1Q27 memory hike, raising the 2027 smartphone cost floor
Apple's acceptance of sharply higher Samsung Electronics memory prices for early 2027 is putting a number on the cost of the AI boom for smartphones. The reported agreement comes just days after Apple limited the iPhone 18 Pro price increase to US$100, highlighting its willingness to absorb part of a historic rise in memory costs to defend shipments and market position.
Wednesday 16 September 2026
Samsung reportedly pushes conventional memory modules to partners in Vietnam and India as HBM crowds its back end
Samsung Electronics is reportedly handing the growth in its commodity memory module business to outside assemblers in Vietnam, India, and the Philippines, a sign of how completely high-bandwidth memory (HBM) has taken over its own packaging space. The shift keeps Samsung's scarce back-end capacity focused on its most profitable products and pushes the geography of its conventional memory supply increasingly outside South Korea.