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Friday 22 May 2026
BOE, Corning target glass substrates for AI chip packaging

BOE Technology, China's leading display panel maker, is expanding its push into new businesses beyond panels. The company said on the evening of May 20 that it had signed a three-year memorandum of understanding with US glass materials supplier Corning to cooperate in glass-based packaging substrates, foldable glass, perovskite glass substrates and optical interconnects

Friday 22 May 2026
AI agents reshape enterprise computing, Lisa Su and Kai-Fu Lee say
At AMD AI DevDay 2026 in Shanghai, AMD CEO Lisa Su and 01.AI founder Kai-Fu Lee outlined what could become the next major shift in artificial intelligence: the transition from generative AI chatbots to autonomous AI agent systems. Their discussion focused on AI agents, multi-agent collaboration, open-source ecosystems and next-generation AI computing infrastructure, signalling a broader industry shift from "question-and-answer" AI towards systems capable of independently executing enterprise goals
Thursday 21 May 2026
xFusion drives CNY58.2 billion revenue as China backs domestic AI supply chain
Chinese server maker xFusion reached a revenue of CNY58.2 billion (approx. US$8.6 billion) for the year 2025. The figure indicates the company's rising profits as it benefits from China's push for a domestic AI supply chain and the benefits for companies breaking into the country's high-end server market
Thursday 21 May 2026
Commentary: Trump's Taiwan chip claim tests TSMC's silence
US President Donald Trump, after recently concluding a visit to China, again publicly accused Taiwan of having "stolen our chip industry." This was not the first time he had made such a claim. From the 2024 campaign period to a Fox News interview in May 2026, before his departure after visiting China, Trump has repeatedly argued that the business originally belonged to Intel and that, had the US government understood how to impose tariffs for protection, Taiwan would never have had a role in the chip industry
Thursday 21 May 2026
GigaDevice sees niche DRAM and NAND prices rising through 2026
GigaDevice said tight supply and rising prices across DRAM, NOR Flash, and SLC NAND Flash continued to fuel strong first-quarter 2026 earnings growth, supported by recovering demand from AI, server, and industrial applications
Thursday 21 May 2026
Five weak links India Semiconductor Mission 2.0 must fix
India's first semiconductor mission brought fabs, OSAT units, and chip projects into the policy pipeline. Its second phase is being shaped around a harder question: whether India can fix the weak links that determine if those projects become a sustainable semiconductor ecosystem
Thursday 21 May 2026
SK Hynix reportedly shifts Cheongju mask fab toward HBM yield push
SK Hynix is reportedly moving to reshape part of its Cheongju campus around wafer testing, a shift that underscores how high-bandwidth memory, or HBM, is putting new pressure on the back end of the chipmaking process
Thursday 21 May 2026
Vietnam issues AI regulations, requires OpenAI and Anthropic to appoint local government liaisons
Vietnam has issued artificial intelligence (AI) regulations requiring companies such as OpenAI and Anthropic to appoint representatives to communicate with the government, with affected firms needing to comply by March 2027
Thursday 21 May 2026
China uses iron-fist policies to expel inefficient TOPCon capacity from solar supply chain
China's top-down policies are creating a tech elimination battle in its solar supply chain. Because of severe oversupply in the mainstream N-type tunnel oxide passivated contact (TOPCon) technology, combined with intensifying internal competition and price-cutting wars, the overall solar industry is on a downfall. For TOPCon companies suffering long-term losses and struggling to survive, the Chinese government has directly ordered local governments to "prohibit bailouts," therefore accelerating industry reshuffling and the elimination of inefficient production capacity
Thursday 21 May 2026
Exclusive: TOPCon faces funding cuts while HJT and BC receive government support
As China's solar market enters a downfall, market sources indicate that China's central government is reshaping the industry landscape through an aggressive dual-track strategy. On one hand, authorities continue tightening funding for the mainstream tunnel oxide passivated contact (TOPCon) technology. On the other hand, they are launching targeted national-level support measures for higher-efficiency next-generation technologies such as heterojunction (HJT) and back-contact (BC)
Thursday 21 May 2026
Commentary: China builds its memory twin engines; IPO push for YMTC, CXMT intensifies

China's memory chip industry is entering a critical capital markets phase, with YMTC formally launching IPO counselling and CXMT resuming its STAR Market listing review after updating its prospectus. The parallel moves mark an accelerated push by China's two leading memory chipmakers to secure long-term funding and expand their role in the global semiconductor industry

Thursday 21 May 2026
Samsung labor dispute adds pressure to memory chip market
Surging demand for AI data center infrastructure has already pushed the memory market into a structural shortage. Now, Samsung Electronics' labor dispute is adding another layer of uncertainty for DRAM and NAND Flash prices
Thursday 21 May 2026
How South Korea is pitching itself to Silicon Valley's startup elite
South Korea made its case to Silicon Valley investors and startups on the first day of the Plug and Play May Summit in Sunnyvale, positioning Seoul not as an emerging market but as a fully operational launch pad for global technology products
Thursday 21 May 2026
Nvidia excludes China from its outlook while citing analyst estimates of US$1 trillion in hyperscaler capex by 2027
Nvidia continues to exclude Chinese data center compute revenue from its outlook, with CFO Colette Kress citing uncertainty around whether H200 imports will be allowed into the country despite recent US export license approvals
Thursday 21 May 2026
OpenAI picks Singapore for first overseas applied AI lab

OpenAI will commit more than S$300 million (approx. US$235 million) to expand Singapore's artificial intelligence (AI) ecosystem, choosing the city-state for its first applied AI lab outside the US as Singapore pushes to strengthen its position as a regional AI hub