Taiwan's drone industry has grown rapidly in recent years, with output surging from about NT$5 billion (US$154.87 million) in 2024 to NT$12.9 billion in 2025, while export value jumped from NT$140 million to NT$2.9 billion. Still, compared with semiconductors and electronics assembly, the drone sector remains small, making it critical for the industry to expand technology cooperation and secure government subsidies.
An organization under China's State Administration of Science, Technology and Industry for National Defense (SASTIND) released the membership list of the National Commercial Space Alliance's Commercial Space Entrepreneurship Consortium on July 1, offering a rare look at 271 officially recognized space-related organizations. Covering everything from launch services and satellite development to ground infrastructure and financial services, the list signals Beijing's increasingly institutionalized approach to identifying and supporting established commercial space companies.
A Taiwan-Japan AI technology forum held at Taiwan Expo Japan brought together government, industry, academia and research representatives to discuss AI applications, semiconductor supply chains, smart manufacturing and innovation. Terry Tsao, SEMI's global marketing chief and head of the organization's operations in Taiwan, told DIGITIMES before the event that IBM has already demonstrated 2nm chip manufacturing capability in the lab, but the biggest challenge for its licensed partner, Japanese chipmaker Rapidus, to achieve mass production in Hokkaido will be yield.
China and the Netherlands agreed that their governments should create a favorable environment for companies to resolve the Nexperia dispute through consultation, China's Ministry of Commerce said July 16.
Powertech Technology is deepening its panel-level packaging (FOPLP) strategy after its board approved a joint venture with Broadcom in Singapore to build panel-level advanced packaging (PLP) manufacturing capacity, with the planned investment totaling US$400 million.
China's AI industry is shifting from model scale to the infrastructure needed to train, deploy and commercialize AI, with supernodes, high-speed interconnects, and computing efficiency dominating WAIC 2026.
ChangXin Memory Technologies (CXMT) opened subscriptions for its STAR Market IPO on July 16, launching one of China's largest A-share listings of 2026 and marking the country's first complete DRAM journey from technology acquisition and manufacturing validation to mass production and capital market recognition.
ChangXin Memory Technologies' (CXMT) STAR Market IPO is more than just one of China's biggest semiconductor listings. It also marks the culmination of Zhu Yiming's two-decade effort to build a domestic memory industry, taking the entrepreneur from founding flash memory designer GigaDevice to creating China's first globally competitive DRAM maker.
Vietnam has opened direct access to green electricity for companies, easing a major obstacle for Foxconn and its suppliers as global electronics makers shift production away from China. The change could help global supply chains expand in Vietnam while also increasing pressure on the country's power system, renewable capacity, and environmental management.
SK Group chairman Chey Tae-won has floated a "memory as a service" model for SK Hynix, saying the memory chipmaker needs to build a higher-value business beyond manufacturing and selling chips.
