The European Union is strengthening its response to cybersecurity risks posed by artificial intelligence, planning to use automated measures to accelerate incident response while testing Chinese open-weight AI models to assess the capabilities and limitations of different technologies.
Academia Sinica academician Chenming Hu has published an autobiography titled Find the Solutions, taken from the words on a crystal plaque presented to him by then TSMC chairman Morris Chang. Hu, who has worked in both academia and industry, said universities' ability to conduct thorough testing could help the semiconductor industry overcome technological bottlenecks.
Major Chinese energy storage system suppliers that once dominated the US market have reportedly withdrawn almost entirely from US operations in 2026, amid mounting regulatory restrictions, overlapping tariffs, and stringent ownership scrutiny, according to US supply chain sources.
Tata's Dholera fab faces customer and shareholder tests as India's semiconductor push broadens, with packaging, chip services, AI hardware and infrastructure investments accelerating across the country's domestic technology ecosystem rapidly.
South Korean space AI solutions provider TelePIX is accelerating the development of high-resolution optical payloads and onboard AI technologies, with plans to launch its next-generation system into space for validation in 2027.
Singapore is targeting high-value semiconductor manufacturing, advanced packaging, and silicon photonics, building on its strengths in engineering, precision manufacturing, and reliability, according to Zeng Yi Wong, assistant managing director for manufacturing at Enterprise Singapore (EnterpriseSG).
On October 16, Japan's Ministry of Economy, Trade and Industry (METI) approved a revised plan from Taiwan Semiconductor Manufacturing Co. (TSMC) to build 3nm logic chips at its second fab in Kumamoto Prefecture, on the southern island of Kyushu. 3nm is one of the most advanced chip processes in commercial production. The plan replaces the 6nm and 12nm production approved in February 2024.
Taiwan Mask Corporation (TMC) is expanding its presence in Japan through the acquisition of semiconductor equipment services provider TCK, extending its business beyond precision photomask manufacturing to equipment assembly and engineering support in Japan's growing Kyushu semiconductor market.
Chinese EV giant and AI mobility manufacturer XPeng has made a major appearance at the Paris Automotive Summit by bringing not just its automotive expertise into the European collaborative space, but a broader technology stack built on the automaker's existing strengths in EV manufacturing and humanoid robotics.
Samsung Electro-Mechanics (Semco) faces potential equipment procurement bottlenecks in its KRW6.78 trillion (approx. US$5.1 billion) expansion of semiconductor substrate production for AI servers, as machinery manufacturers struggle with component shortages and longer delivery times. The South Korean company maintains that its investment is proceeding as planned. No production delay has been confirmed.
Singapore is moving its AI strategy beyond pilot-heavy experimentation toward a more deployment-focused model centered on enterprise adoption, sector transformation and resilient access to compute.
FICG is aggressively expanding optical communications production in Malaysia and China to meet surging AI-driven demand, which the company estimates is 3-4x current supply capacity. Chairman Leo Chien described the next three years as a "frenzied expansion period," with the company's Johor, Malaysia, facility set to increase capacity 4x by the end of 2027.
Five senior Samsung Electronics executives, including the heads of its semiconductor and consumer electronics businesses, reportedly traveled to Tokyo on October 13 while chairman Lee Jae-yong was visiting Japan, bringing together the company's three executive directors and key corporate decision-makers as it expands cooperation with Japanese semiconductor suppliers.
Myson Century, a subsidiary of Sun Yad Group, signed strategic memorandums of understanding with IXI EW, SafeSky Systems USA, and Global Ordnance Group at the Association of the United States Army's 2026 Annual Meeting and Exposition, or AUSA 2026. The agreements link counter-drone, unmanned vehicle, and defense supply-chain resources, creating opportunities to expand the company's product portfolio and develop markets in Taiwan and the Association of Southeast Asian Nations (ASEAN) region.
Chinese automakers are accelerating their expansion into humanoid robotics, leveraging artificial intelligence (AI) technologies, electric drive systems, and supply chain resources developed through their automotive businesses, according to DIGITIMES Intelligence.
