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Frankly speaking

DIGITIMES regularly interviews leading industry executives, inviting them to talk frankly about the technology issues and the business challenges that need to be addressed in an industry that is marked by constant change. We always welcome the opportunity to discuss industry trends and issues face-to-face, via email or during a conference call, especially for companies that are targeting the Greater China market.

Please contact us if you're interested in arranging an interview.

Displaying interviews tagged IC manufacturing [back to index]

Panel semiconductor: Q&A with PanelSemi CEO Ting Chin-Lung

Friday 15 October 2021

DDI packaging and testing to continue to grow in 2022: Q&A with Chipbond CEO Wu Fei-Jain

Friday 1 October 2021

Monolithic/heterogeneous integration to drive Silicon 4.0: Q&A with Etron chairman Nicky Lu

Thursday 16 September 2021

Wire-bonding to be increasingly needed to process car-use IGBT, SiC modules, says K&S VP

Thursday 9 September 2021

Laser-as-a-service: Q&A with InPhocal CTO and co-founder Martijn Boerkamp

Tuesday 29 June 2021

US-Taiwan partnerships: Q&A with Arati Shroff, deputy chief of Economic Section at AIT

Thursday 17 June 2021

Singapore can be springboard into ASEAN, says Singaporean trade representative in Taipei

Wednesday 21 April 2021

Notebook chip overbooking concerns: Q&A with Edom chairman Wayne Tseng

Tuesday 16 March 2021

Epi-wafer key to compound semiconductor: Q&A with VPEC chairman Jian-Lian Chen

Wednesday 10 March 2021

WPG to build last mile in semiconductor supply chain at Taoyuan Aerotropolis

Wednesday 27 January 2021

Semiconductor knows no borders: Q&A with Silicon Catalyst partners

Monday 4 January 2021

Partnerships towards global leaderships: Q&A with Ashwin Pershad, Tech Mahindra country head in Taiwan

Wednesday 30 December 2020

All-round OSAT: Q&A with PTI CEO Boris Hsieh

Monday 14 December 2020

Pandemic-triggered structural changes: Q&A with ASE Technology COO Tien Wu

Friday 20 November 2020

Driver ICs tight supply: Q&A with Chipbond chairman FJ Wu

Monday 26 October 2020

5G, mini LED opportunities in 2021: Q&A with K&S executive VP CP Chong

Monday 5 October 2020

Chips R&D matters: Q&A with iST chairman Danny Yu

Tuesday 8 September 2020

Jumping on the EUV bandwagon: Q&A with Gudeng chairman Bill Chiu

Wednesday 15 July 2020

Government subsidies crucial for new TSMC fab establishment in US

Wednesday 10 June 2020

PhD shortage to challenge TSMC: Q&A with company senior VP of R&D Cliff Hou

Thursday 21 May 2020

A new chapter for UMC: Q&A with company co-presidents Jason Wang and SC Chien

Tuesday 26 November 2019

SiC MOSFET development: Q&A interview with Hestia Power CEO Lee Chwan-ying

Monday 18 November 2019

Intel expanding chip output: Q&A with company CEO Bob Swan

Wednesday 9 October 2019

Ready for SiC wafer production: An interview with GlobalWafers chairman Doris Hsu

Wednesday 9 October 2019
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