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Monday 7 September 2026
Huawei Kirin 9050 Pro revives flagship chip launches with reported LogicFolding architecture in Mate XT 2
Huawei has unveiled the Kirin 9050 Pro in its new Mate XT 2 tri-fold smartphone, marking the commercial debut of the LogicFolding architecture behind its Tau Scaling Law and Huawei's...
Monday 7 September 2026
Model fatigue, China's price pressure, and a profit horizon still years away
The AI industry's release calendar has compressed to the point where a single week can carry five frontier or near-frontier launches, but the acceleration is not a sign of confidence...
Monday 7 September 2026
DeepSeek plans to buy 160,000 Huawei chips as China aims to wean itself off Nvidia
DeepSeek is reportedly planning to purchase 160,000 Huawei chips for its large 1 GW data center currently under construction in the Chinese province of Inner Mongolia. This would make...
Monday 7 September 2026
China smart driving chips hit bottlenecks in mass production, cost, in-house auto R&D
China's intelligent driving market is advancing rapidly, but the true trial has only just begun for domestic smart driving chipmakers.
Monday 7 September 2026
China's power battery sector maintains strong growth momentum as global market presence expands
China's power battery industry has reported robust growth through the first seven months of 2026, driven by rising demand across both electric vehicles and stationary energy storage...
Monday 7 September 2026
Naura 3D DRAM etching breakthrough could give CXMT a new path beyond EUV
China's Naura Technology has demonstrated a selective etching process for 64-layer 3D DRAM structures, potentially giving domestic memory makers another route to raise transistor density...
Monday 7 September 2026
India says it cannot build electronics without China and has started easing the rules to prove it
India is selling its semiconductor build-out abroad as a hedge against an over-concentrated supply chain. The officials running it are unusually candid that the hedge cannot be built...
Monday 7 September 2026
Huawei Kirin 2026 challenges 3D chip heat limits with Tau Scaling Law
Huawei is using measured data from its upcoming Kirin 2026 processor to challenge a key concern around vertically stacked logic: that higher transistor density inevitably brings more...
Monday 7 September 2026
Every Chinese CPU maker grew in 1H26 but only one grew on processors
Revenue rose at every Chinese chip company examined in the first half of 2026 amid the domestic-substitution push, but the interim filings show three quite different businesses hiding...
Monday 7 September 2026
China's JCET seeks US$968M for AI-driven packaging expansion

JCET Group is preparing a CNY6.5 billion (approx. US$968 million) private share placement to expand advanced packaging and testing capacity...

Saturday 5 September 2026
Interview: China Tier 1 supplier Jingwei Hirain shares lessons from EV race
"Demo is not a product," Jingwei Hirain president Chengjian Fan told DIGITIMES in an interview, arguing that China's new-energy vehicle industry has learned hard lessons as fast-moving...
Saturday 5 September 2026
Samsung SDI nears solid-state battery mass production, eyes China supply chain
Reports that Samsung SDI's procurement team recently visited the Chinese production facilities of battery material maker Tinci Materials have drawn significant attention within China's...
Saturday 5 September 2026
SiPh, optical lens demand ignite laser race
Silicon photonics (SiPh) is emerging as a core theme at SEMICON Taiwan 2026, and while the sector is still in an early, fast-growing stage, production-line investments are already...
Saturday 5 September 2026
Commentary: China builds three-pronged memory strategy around CXMT, YMTC, XMC
China's memory industry is shifting from a single-champion model towards a three-pronged structure. ChangXin Memory Technologies (CXMT) is building its position in DRAM, Yangtze Memory...
Friday 4 September 2026
China interconnect chipmaker Montage enters Samsung, SK Hynix CXL 3.2 supply chains and begins DDR6 development

Montage Technology is accelerating its move beyond traditional DDR memory interfaces, with CXL 3.2, DDR6 and PCIe products positioning the...