Chinese automakers are accelerating their expansion into humanoid robotics, leveraging artificial intelligence (AI) technologies, electric drive systems, and supply chain resources...
Chinese display manufacturer BOE has made further progress in advanced semiconductor packaging, extending its panel manufacturing expertise to glass-core packaging substrates. At an...
AI-driven NAND demand is entering a supercycle, positioning Yangtze Memory Technologies Co. (YMTC) as the fastest-growing memory supplier. According to Counterpoint Technology Market...
China's semiconductor and computing hardware companies reported or forecast strong earnings growth in the first nine months of 2026, fueled by AI infrastructure investment, demand...
China's leading DRAM manufacturer CXMT has disclosed progress in its 4F² DRAM architecture and plans to introduce DDR5 registered dual in-line memory modules (RDIMMs) by the end...
China's largest chip equipment makers are buying their way into hybrid bonding, the advanced packaging step that global players from Besi to ASML are also chasing. For Chinese firms,...
As interest rates fluctuate, bond yields rise, and Chinese AI models intensify competition, market attention is shifting from technological development and infrastructure expansion...
As artificial intelligence increasingly blurs the boundary between the digital and physical worlds, complications associated with real-world deployment — particularly the extreme...
Chinese semiconductor technology start-up Langdao Silex (Shanghai) Technology has publicly unveiled an extreme ultraviolet (EUV) light source prototype with a claimed 90% localization...
As Manus, one of China's more distinctive AI startups, became entangled in the high-profile unwinding of its acquisition by Meta, the startup's failed attempt to capture opportunities...
China's Yangtze Memory Technologies (YMTC) is developing a next-generation 4F² DRAM design targeting data transfer speeds of 9,600 megatransfers per second (MT/s), expanding beyond...
SK Hynix is seeking US approval to ship additional American chipmaking equipment to its NAND flash facility in Dalian, China, linking the request to a potential investment in a new...
Chinese semiconductor equipment maker AMEC plans to develop 102 new equipment models over the next three to five years, backed by nearly CNY13 billion (≈ US$1.94 billion) in...
Samsung Electronics has reportedly completed development of next-generation 4F² DRAM technology and is aligning commercialization with customer requirements, even as China's ChangXin...
On October 13, Huawei unveiled the detailed architecture of its Kirin 9050 Pro chip for the first time at its Lianqiu Lake research center in Shanghai, outlining advances in LogicFolding...
