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Frankly speaking

DIGITIMES regularly interviews leading industry executives, inviting them to talk frankly about the technology issues and the business challenges that need to be addressed in an industry that is marked by constant change. We always welcome the opportunity to discuss industry trends and issues face-to-face, via email or during a conference call, especially for companies that are targeting the Greater China market.

Please contact us if you're interested in arranging an interview.

Displaying interviews tagged IC design, distribution [back to index]

Small sensors, big goals: Q&A with ForceN CEO Robert Brooks and VP of engineering Albert Chen

Thursday 13 May 2021

Virtual Antenna: Q&A with Ignion VP of innovation Carles Puente

Wednesday 7 April 2021

Notebook chip overbooking concerns: Q&A with Edom chairman Wayne Tseng

Tuesday 16 March 2021

WPG to build last mile in semiconductor supply chain at Taoyuan Aerotropolis

Wednesday 27 January 2021

Smart logistics vision for next 30 years: Q&A with WPG Holdings vice chairman Frank Yeh

Tuesday 26 January 2021

Semiconductor knows no borders: Q&A with Silicon Catalyst partners

Monday 4 January 2021

Partnerships towards global leaderships: Q&A with Ashwin Pershad, Tech Mahindra country head in Taiwan

Wednesday 30 December 2020

Transformation in next 30 years: Q&A with WPG Holdings CEO Frank Yeh

Friday 18 December 2020

Driver ICs tight supply: Q&A with Chipbond chairman FJ Wu

Monday 26 October 2020

Opportunities amid macro uncertainty: Q&A with Avnet Asia-Pacific president Prince Yun

Monday 21 September 2020

More choices for gamers: Q&A with Frank Soqui, GM of Intel Gaming Division

Thursday 3 September 2020

Support for startups: Q&A with Arm Taiwan president CK Tseng

Tuesday 21 July 2020

LTCC application to 5G mmWave base stations: Q&A with Brian Laughlin and Jeffrey Wang from DuPont

Thursday 2 January 2020

Concerns about tender offer by competitor: Q&A with WT Microelectronics chairman Eric Cheng

Wednesday 18 December 2019

MediaTek's role in 5G world: Q&A with TL Lee, GM of wireless communication

Wednesday 4 December 2019

SiC MOSFET development: Q&A interview with Hestia Power CEO Lee Chwan-ying

Monday 18 November 2019

Positioned as LaaS provider: Q&A with WPG CEO Frank Yeh

Wednesday 30 October 2019

Intel expanding chip output: Q&A with company CEO Bob Swan

Wednesday 9 October 2019

China foundry HSMC to push chiplet standard formulation, says CEO Shang-yi Chiang

Tuesday 20 August 2019

Arm portrays its strategy for machine learning at the edge

Wednesday 29 May 2019

Why 12-inch fabs are better for power components: Q&A with Bing Xue, AOS SVP of global sales

Friday 29 March 2019

Heterogeneous integration bringing more innovation: Q&A with Etron chairman Nicky Lu

Tuesday 19 March 2019

Industry 4.0 brings lucrative opportunities for chipmakers: Q&A with TI manager Matthieu Chervier

Monday 4 March 2019

Taiwan must run faster in IC development: Q&A with science minister Chen Liang-gee

Thursday 21 February 2019
1/15 pages

Taiwan large-size LCD panels – 1Q 2021

Taiwan small- to mid-size LCD panels – 1Q 2021

Global tablet market – 1Q 2021

Global server shipment forecast and industry analysis, 2021

China semiconductor industry: From 13th 5-year Plan to 14th 5-year Plan, 2015-2025

Global LCD panel shipment forecast, 2021 and beyond