DIGITIMES regularly interviews leading industry executives, inviting them to talk frankly about the technology issues and the business challenges that need to be addressed in an industry that is marked by constant change. We always welcome the opportunity to discuss industry trends and issues face-to-face, via email or during a conference call, especially for companies that are targeting the Greater China market.
Please contact us if you're interested in arranging an interview.
Small sensors, big goals: Q&A with ForceN CEO Robert Brooks and VP of engineering Albert Chen
The advent of Internet of Things (IoT) and Industry 4.0 has increased the demands for robots and edge computing, and the tasks are becoming more and more complex...
Virtual Antenna: Q&A with Ignion VP of innovation Carles Puente
Fractus Antennas, formed by engineers who invented the technology allowing smartphone antennas to automatically switch between different bandwidth networks and...
Notebook chip overbooking concerns: Q&A with Edom chairman Wayne Tseng
Pandemic-driven demand for notebooks supporting remote work and study has brought explosive growths in orders for CPUs, power management ICs (PMIC), display driver...
WPG to build last mile in semiconductor supply chain at Taoyuan Aerotropolis
Taiwan is the leader in many semiconductor sectors, but the "last mile" in terms of logistics and shipping centers is missing in the country - a gap that WPG Holdings...
Smart logistics vision for next 30 years: Q&A with WPG Holdings vice chairman Frank Yeh
COVID-19 and the US-China trade war have combined to accelerate a split of the global supply chain in two - namely a "G2" pattern with one serving China and the...
Semiconductor knows no borders: Q&A with Silicon Catalyst partners
While many might be deterred by the hefty costs of starting a semiconductor company, there are still many other entrepreneurs with a silicon dream knocking on...
Partnerships towards global leaderships: Q&A with Ashwin Pershad, Tech Mahindra country head in Taiwan
Taiwanese companies planning to invest in India might have second thoughts in the wake of a riot at Wistron's plant in Narasapura stemming from salary disputes...
Transformation in next 30 years: Q&A with WPG Holdings CEO Frank Yeh
Frank Yeh, CEO of WPG Holdings, is optimistic about the overall IC industry, which he expects will be driven by demand for Chromebooks, 5G handsets and others...
Driver ICs tight supply: Q&A with Chipbond chairman FJ Wu
The supply of display driver ICs has fallen short of demand, while capacities at 8-inch foundries stay tight. Backend houses are mulling raising their quotes to...
Opportunities amid macro uncertainty: Q&A with Avnet Asia-Pacific president Prince Yun
The coronavirus pandemic, coupled with the escalating US-China trade war, have prompted businesses to revise their roadmaps and goals for 2020. Disruptions brought...
More choices for gamers: Q&A with Frank Soqui, GM of Intel Gaming Division
With the gaming market expanding quickly in the wake of the coronavirus pandemic, Intel, AMD and Nvidia are all set to release their latest CPUs and GPUs in the...
Support for startups: Q&A with Arm Taiwan president CK Tseng
Following the release of Flexible Access in 2019, Arm, a subsidiary of SoftBank, is opening up the project to startups with no charge, helping newcomers to reduce...
LTCC application to 5G mmWave base stations: Q&A with Brian Laughlin and Jeffrey Wang from DuPont
While 5G mmWave-related technologies are developing rampantly, US chemical materials giant DuPont has set eyes on promoting its LTCC (low temperature co-fired...
Concerns about tender offer by competitor: Q&A with WT Microelectronics chairman Eric Cheng
Taiwan's leading IC distributor WPG has announced an open tender offer to acquire 30% of ordinary shares of its peer WT Microelectronics (WT). WPG has requested...
MediaTek's role in 5G world: Q&A with TL Lee, GM of wireless communication
MediaTek has released Dimensity 1000 featuring four Arm Cortex-A77 cores operating up to 2.6GHz with four power-efficient Arm Cortex-A55 cores operating at up...
SiC MOSFET development: Q&A interview with Hestia Power CEO Lee Chwan-ying
SiC MOSFETs sees fast development and growing demand due to needs for high-voltage and high-power operating environment, but it is quite impossible for them to...
Positioned as LaaS provider: Q&A with WPG CEO Frank Yeh
As the largest electronics distributor in Asia, WPG Holdings continues to expand and diversify its offerings particularly those for 5G, AI and automotive electronics...
Intel expanding chip output: Q&A with company CEO Bob Swan
Intel will be gradually expanding its foundry production capacity, particularly for 14nm process this year, according to company CEO Bob Swan. Swan and other Intel...
China foundry HSMC to push chiplet standard formulation, says CEO Shang-yi Chiang
While Moore's Law is approaching its physical limits, only a few could still afford the expensive game of process shrink. And when the post-Moore's Law era comes,...
Arm portrays its strategy for machine learning at the edge
With one of the strongest processor ecosystems in the industry, Arm's role to accelerate the adoption of machine learning (ML) at the edge can't be overemphasized,...
Why 12-inch fabs are better for power components: Q&A with Bing Xue, AOS SVP of global sales
Alpha & Omega Semiconductor (AOS), which designs and manufactures power semiconductors for a broad range of applications, will start production at its new...
Heterogeneous integration bringing more innovation: Q&A with Etron chairman Nicky Lu
The Taiwan semiconductor industry is gearing up to tap huge business opportunities arising from AI and IoT applications, such as machine learning, cloud to edge...
Industry 4.0 brings lucrative opportunities for chipmakers: Q&A with TI manager Matthieu Chervier
Global chipmakers have been racing to develop chip solutions associated with Industry 4.0 applications to tap huge business opportunities arising from smart manufacturing...
Taiwan must run faster in IC development: Q&A with science minister Chen Liang-gee
TSMC is likely to kick off volume production of 3nm manufacturing process in 2022-2023, when AI and 5G applications are seen to explode to drastically drive the...
