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Frankly speaking

DIGITIMES regularly interviews leading industry executives, inviting them to talk frankly about the technology issues and the business challenges that need to be addressed in an industry that is marked by constant change. We always welcome the opportunity to discuss industry trends and issues face-to-face, via email or during a conference call, especially for companies that are targeting the Greater China market.

Please contact us if you're interested in arranging an interview.

Displaying interviews tagged 5G [back to index]

Era of compound semiconductors: Q&A with Win Semi chairman Dennis Chen

Monday 20 December 2021

mmWave finds potential markets in 5G and Satcom: Q&A with MixComm and SiTune CTOs

Wednesday 22 September 2021

Monolithic/heterogeneous integration to drive Silicon 4.0: Q&A with Etron chairman Nicky Lu

Thursday 16 September 2021

High-precision QA automation in 5G era: Q&A with Relimetrics CEO Kemal Levi

Tuesday 17 August 2021

Liberalizing 5G: Q&A with Polish startup IS-Wireless CEO Slawomir Pietrzyk

Friday 5 March 2021

Contract PCB drilling service: Q&A with Key Ware CEO Chen Po-ying

Wednesday 24 February 2021

5G opportunities: Q&A with LitePoint president Brad Robbins

Thursday 14 January 2021

Customized 5G private networks: Q&A with Quanta Cloud Technology president Mike Yang

Tuesday 12 January 2021

Taiwan to head for smart digital economy, says science minister

Friday 13 November 2020

Driver ICs tight supply: Q&A with Chipbond chairman FJ Wu

Monday 26 October 2020

5G, mini LED opportunities in 2021: Q&A with K&S executive VP CP Chong

Monday 5 October 2020

IT ecosystem transformation: Q&A with Inventec chairman Tom Cho

Wednesday 16 September 2020

Chips R&D matters: Q&A with iST chairman Danny Yu

Tuesday 8 September 2020

Geared towards 5G mmWave: Q&A with Flexium chairman MC Cheng

Wednesday 26 August 2020

Support for startups: Q&A with Arm Taiwan president CK Tseng

Tuesday 21 July 2020

No peak season for consumer chips in 2H20: Q&A with WT chairman Eric Cheng

Tuesday 16 June 2020

FCCL enters tech-intensive era: Q&A with Taiflex president Zhi-ming Yen

Monday 27 April 2020

Beyond ruggedized IPCs: Q&A with Getac chairman James Hwang

Monday 6 April 2020

Materials challenges for IC substrate production: Q&A with Unimicron vice CEO CP Lee

Monday 10 February 2020

PC market still full of opportunities: Q&A with Frank Soqui, VP of Client Computing Group and GM of Gaming Division at Intel

Monday 20 January 2020

Memory-centric solutions for next 20 years: Q&A with Macronix chairman Miin Wu

Friday 3 January 2020

LTCC application to 5G mmWave base stations: Q&A with Brian Laughlin and Jeffrey Wang from DuPont

Thursday 2 January 2020

MediaTek's role in 5G world: Q&A with TL Lee, GM of wireless communication

Wednesday 4 December 2019

Synergy from acquiring Kemet: Q&A with Yageo chairman Pierre Chen

Tuesday 19 November 2019
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Taiwan notebooks - 4Q 2021

Global server revenue forecast, 2022

Global server shipment forecast, 2022

Global smartphone industry 2021 review

China records sales of 3.52 million NEVs in 2021; Nidec increases machine tool output in China; TSMC adjusts plans for Baoshan R&D center

Deployment of Japan-based automakers in Southeast Asia