EDOM Technology(TWSE: 3048), Asia's best solutions provider, celebrates its 30th anniversary this year. Since its establishment in 1996, EDOM has worked with global partners to lead innovative technologies and witnessed the growth trajectory of the electronics industry along the way. Faced with the booming trend of diversified AI applications, EDOM will focus on four major innovation areas including power technologies, cybersecurity, optical communications, and biomedicine. Through complete technical support and supply chain services, EDOM will help customers accelerate the implementation of AI, smart networking, and edge computing applications, and jointly promote the development of smart manufacturing, smart medical care, and next-generation digital infrastructure.1996 is a critical year in the history of science and technology. This year, the Internet began to fully enter public life, and the core technology, software, and hardware that laid the foundation for modern digital life were born at this time. The company encountered the Asian financial crisis in 1997 when it was first established, but the rise of the Internet from 1996 to 2000 also brought excellent development opportunities. In its early days, EDOM was optimistic about the emerging 3D graphics chips, modem chips, and radio frequency components. Using this as a starting point, EDOM gradually established a foothold in the electronic circuit market and wrote important milestones along with the changes in the industry.Since its listing in 2002, EDOM has continued to deeply explore the Asia-Pacific market. Following the trend of the Asia-Pacific region becoming an important manufacturing base for the global information industry, EDOM has actively expanded its service base and strengthened its supply chain support capabilities. With the rapid development of the technology industry, EDOM has experienced steady growth: in 2010, driven by the popularity of smartphones and tablets, annual revenue exceeded US$1 billion for the first time; in 2014, it seized the opportunity of the rise of mobile communications, with the Internet of Things and mobile payment, annual revenue exceeded US$2 billion; in 2019, benefiting from the growth in market demand for wearable devices and network communications, annual revenue exceeded the milestone of US$3 billion. Facing a new wave of industrial changes driven by AI, EDOM achieved annual revenue of US$3.7 billion in 2025, ranking among the top ten electronic component distributors in the world, and continues to move towards the revenue target of US$4 billion.Over the past thirty years, EDOM has witnessed the birth of epoch-making applications such as PCs, mobile phones, tablets, electric vehicles, data centers, robots, smart manufacturing and industrial control, and autonomous vehicles. Every new application can be transformed from concept to practice, relying on the efforts of innovators and the support and collaboration of a complete supply chain system. Today, artificial intelligence technology has once again brought new development opportunities. AI has moved from the layout of cloud giants to the enterprise and industrial manufacturing fields, and has penetrated into daily life. Under this trend, EDOM is optimistic about four major areas:Power and cooling technologies: With the rapid growth of AI computing requirements, high-efficiency power management and cooling technology will become an important foundation to support the operation of future electronic products and data centers.Cybersecurity: In the era of digitalization and the Internet of Everything, the importance of information security protection continues to increase, and cybersecurity will become an indispensable part of the stable operation of enterprises.Optical communication: Optical communication and co-packaged optics (CPO) technology are regarded as important keys to breaking through the bottleneck of AI computing transmission. They will not only improve the operational efficiency of data centers, but also accelerate the development of edge computing and high-speed transmission applications.Integration of semiconductor technology and biomedicine: By combining technology and biomedicine, the automation of testing in medical institutions and laboratories can be further promoted, the process of precision medicine can be accelerated, and key breakthroughs can be brought to life sciences.Wayne Tseng, Chairman of EDOM Technology, said: "In the torrent of technological change, our vision of making the world a better place through innovation has remained steadfast. We are deeply honored to witness and participate in the development and evolution of the electronics industry. We sincerely thank the vendors, customers, and partners who have worked side by side with us over the past thirty years, and we look forward to continuing to work together in leading the next generation of technological innovation in the future."With thirty years of evolution, EDOM resonates with the pulse of the global electronics industry. Facing the ever-changing technological wave, we always keep abreast of the latest trends, enrich the electronics industry ecosystem, and open chapters of innovation with global partners.

As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security. The rapid expansion of high-bandwidth memory (HBM) production continues to consume advanced fabrication capacity, constraining the supply of conventional memory products and creating persistent shortages across the market. This concentration of high-end production has widened the supply-demand gap, driving the average selling prices of certain premium memory products to levels eight to ten times higher than previous norms.Against this backdrop, TEAMGROUP General Manager Gerry Chen warned that the industry could face a period of unprecedented scarcity by 2027. He described the situation as one where "even customers willing to accept higher prices may still face supply risks," potentially echoing the severe chip shortages seen during 2021–2022. Chen noted that even buyers willing to pay premium prices could face significant procurement challenges if they lack long-term strategic relationships with original chip manufacturers, leaving them highly vulnerable to supply disruptions.In response, TEAMGROUP initiated a strategic transformation in 2025, redirecting 80% of its resources from the consumer segment toward long-lifecycle, high-reliability applications. The company is now focused on mission-critical sectors, including industrial automation, enterprise infrastructure, defense, and healthcare, while also expanding into military-grade storage and high-density computing applications. Leveraging three decades of partnerships with leading global suppliers and its extensive experience in IPC design-in collaboration, TEAMGROUP has strengthened supply-chain resilience and enhanced supply assurance amid ongoing market volatility, positioning itself as a trusted enabler of secure and reliable AI infrastructure.Building supply chain resilience amid persistent memory shortageChen emphasized that the exponential growth of AI-driven demand is outpacing semiconductor capacity expansion, a process that typically requires three to three-and-a-half years to complete. As a result, supply constraints in DRAM and SSD markets are becoming a structural challenge rather than a cyclical phenomenon. In this environment, competitive advantage will increasingly depend on supply assurance, allocation capabilities, and long-term supplier relationships rather than price alone.Leveraging decades-long partnerships with leading memory manufacturers and extensive IPC expertise, TEAMGROUP has established a stable supply framework for industrial PCs and other long-lifecycle applications requiring seven to ten years of product availability. The company works closely with customers to identify alternative component sources, optimize system configurations, and mitigate demand distortion and bullwhip effects across the supply chain. These capabilities have strengthened resilience for customers in mission-critical industries such as automotive, healthcare, and defense.T-CREATE EXPERT P35S & TEAMGROUP INDUSTRIAL P250Q secure data in defense & finance. Credit:TEAMGROUPTEAMGROUP's portfolio spans commercial-grade storage solutions for general confidential data protection, as well as industrial-grade products engineered for deployment in aircraft, naval vessels, unmanned systems, and other high-reliability platforms. The company has showcased these solutions at major industry events, including Embedded World and Japan IT Week.Physical destruction technology enables one-click data destructionThe T-CREATE EXPERT P35S, recipient of the 2026 COMPUTEX Best Choice Award, exemplifies TEAMGROUP's philosophy that "physical destruction is the ultimate safeguard." According to Chen, true data security lies in the complete physical destruction of storage media rather than relying solely on software-based deletion methods.When activated, the SSD's built-in boost chip instantly releases a high-voltage current that physically breaks down the insulation layer of the NAND flash ICs, permanently destroying the storage medium within 2.4 seconds and making data recovery extremely difficult. For everyday protection, AES-256 encryption provides a first line of defense, creating a comprehensive security framework that integrates both hardware- and software-based safeguards.The design is engineered to eliminate any possibility of residual data. Its proprietary circuit architecture uses a zoned sequential-conduction mechanism, enabling high-voltage current to destroy memory chips in a controlled chain reaction. TEAMGROUP's patented "power-resume destruction" technology further ensures destruction integrity by automatically completing the process when power is restored if an interruption occurs during the destruction sequence.To prevent accidental activation, the device incorporates a two-stage fail-safe button requiring deliberate user action. The technology also supports remote activation through 4G/5G networks, radio communications, or SMS commands, allowing data destruction to be triggered from several kilometers away. This capability helps prevent sensitive information from being compromised even if a device is lost, stolen, or captured.The patented technology is currently available in two products: the T-CREATE EXPERT P35S, a portable secure storage device, and the industrial-grade TEAMGROUP INDUSTRIAL P250Q-M80 M.2 high-speed SSD, designed for classified computing environments, financial institutions, and defense applications. Together, they provide a robust cybersecurity safeguard for the defense, finance, and R&D sectors.TEAMGROUP showcases a variety of enterprise-grade SSDs at COMPUTEX. Credit: TEAMGROUPAdvanced specs pave the way for agentic AILooking ahead to the convergence of AI and physical robotics, Chen noted that technology ultimately serves human needs. As AI systems continue to collect and process vast amounts of behavioral, operational, and contextual data, demand for on-premises storage is expected to grow significantly.TEAMGROUP keeps data stable in harsh settings & inspires young teams to innovate. Credit: TEAMGROUPOne example is the emerging long-term care robotics market. These systems must not only deliver healthcare-related capabilities but also retain medical records and behavioral data over extended periods. Such requirements place stringent demands on SSD endurance, reliability, and long-term stability, underscoring the importance of local data storage. Similarly, enterprises are increasingly reluctant to move highly sensitive information—including financial data, proprietary business models, and operational intelligence—to the cloud. As a result, agentic AI systems capable of autonomous decision-making within on-premises environments are gaining strategic importance.To support next-generation AI applications, TEAMGROUP has become one of the industry's early innovators in LPCAMM2 and SOCAMM2 memory technologies. LPCAMM2 enables LPDDR memory, traditionally soldered directly onto notebook motherboards, to become modular and upgradeable, while SOCAMM2 introduces a compact, low-power architecture designed for AI servers and advanced computing platforms, offering an alternative to conventional RDIMM. Together, these technologies offer greater flexibility, serviceability, and power efficiency for future AI systems.Beyond supplying low-power memory components, TEAMGROUP has evolved into a comprehensive solution provider, helping customers maintain data integrity and system stability in demanding operating environments characterized by vibration, thermal challenges, and continuous workloads. At the same time, the company encourages its young talent to pursue bold innovation while investing in next-generation DDR6 R&D, laying the groundwork for future AI infrastructure and intelligent edge computing applications.Amid the ongoing memory supercycle, TEAMGROUP has demonstrated strategic resilience and innovation beyond the role of a traditional module manufacturer. By combining supply-chain expertise, advanced physical-level security technologies, and next-generation memory architectures, the company aims to help customers safeguard critical digital assets while preparing for the next phase of AI-driven transformation.For more information, please visit.

On the opening day of COMPUTEX 2026, AIC Inc. hosted a high-level strategic panel session at its booth, focusing on overcoming the "memory wall" challenge. Industry giants and key strategic partners, including NVIDIA and VAST Data, joined AIC for a presentation on their latest platforms designed to eliminate bottlenecks in Large Language Model (LLM) inference and intensive AI workloads, marking a critical evolution in active AI storage driven by Agentic AI in 2026.In his opening remarks, Michael Liang, CEO and President of AIC, outlined the new challenges facing AI infrastructure as AI applications enter the "Long Context" era. The transition to long-context and Agentic AI has completely shifted the primary AI infrastructure bottleneck from raw computational speed to massive data movement and memory bandwidth constraints—a hurdle commonly known as the "Memory Wall."Liang emphasized that the shift toward autonomous AI agents executing task decomposition and multi-step APIs is fundamentally transforming data center demands and reshaping underlying AI infrastructure. Consequently, AIC is actively collaborating with NVIDIA and VAST Data to develop advanced, AI-native storage solutions. By integrating the NVIDIA Vera BlueField-4 STX Storage Processor into its hardware platforms, AIC is building the essential infrastructure required to eliminate bottlenecks and accelerate workloads for Agentic AI applications.NVIDIA Ecosystem Scales Agentic AI Adoption WorldwideJason Hardy, NVIDIA's Vice President of Storage Technology, highlighted the significance of "Agentic Inferencing", a key theme from the NVIDIA GTC Taipei keynote during COMPUTEX 2026. Agentic AI requires more than faster compute; it demands fast, secure access to context memory so agents can reason across long sessions, large datasets, and complex workflows.NVIDIA Vera BlueField-4 STX addresses this paradigm shift. It enables a new class of AI-native storage infrastructure for context memory, built with Vera-based BlueField-4, NVIDIA Spectrum-X Ethernet, NVIDIA DOCA, NVIDIA Dynamo, and NVIDIA AI Enterprise. This foundation provides NVIDIA's storage partners, such as AIC, with the essential building blocks to keep agent context and inference data close to the compute path, significantly improving throughput, responsiveness, and infrastructure efficiency.NVIDIA is actively building a robust partner ecosystem around the NVIDIA Vera BlueField-4 STX architecture, spanning storage, systems, cloud infrastructure, and security sectors. Key partners like AIC are collaborating closely with NVIDIA to integrate, validate, and bring this next-generation infrastructure to market. Hardy emphasized that these close alliances will help customers optimize resource utilization, reduce costs, accelerate response times, and enhance security during large-scale deployments, thereby ushering in the era of Agentic Inferencing.VAST Data and AIC Hard-Soft Integration Optimizes AI InfrastructureEchoing the new design of NVIDIA Vera BlueField-4 STX, VAST Data CTO Andy Pernsteiner emphasized that Agentic AI requires sophisticated mechanisms for managing and optimizing massive-scale KV caching to persistent memory. This avoids redundant, expensive prefill computations across multi-turn, long-context sessions, while providing new storage platforms that support confidential computing and data protection for highly sensitive information. VAST Data integrates seamlessly with NVIDIA's BlueField-4 DPU architectures and Dynamo routing frameworks to offload, share, and reuse KV cache context across wide GPU clusters.The strategic hardware-software partnership between VAST Data and AIC pairs AIC's advanced server hardware with VAST's software intelligence to build next-generation AI infrastructure and context memory storage platforms. Integrating NVIDIA Context Memory Storage (CMX) platform, featuring the NVIDIA Vera BlueField-4 STX storage processor, effectively resolves GPU KV cache bottlenecks. By utilizing fast NVMe arrays as a shared, high-bandwidth context tier, the solution significantly increases tokens-per-second throughput and energy efficiency for long-context, multi-turn AI inferencing.AIC Embraces NVIDIA Vera BlueField-4 STX for Agentic AIAs Liang stated in a post-event interview with DIGITIMES, the company has successfully built its storage server business since 2014. By continuously reinvesting 15% of its annual revenue every year into R&D and early-stage development of new architectures, AIC has positioned itself as a key player in developing next-generation, Agentic AI-native storage infrastructure.Today, AIC is established as a Solution Advisor in the NVIDIA Partner Network (NPN). AIC also is building upon a strategic partnership with VAST Data that began seven and a half years ago. To meet the surging demand for AI data centers, AIC's strategic expansion in Yangmei, Taiwan, and Haiphong, Vietnam, directly targets the skyrocketing global demand for artificial intelligence data centers. These state-of-the-art manufacturing footprints allow the company to scale production of AI servers and high-density storage while seamlessly integrating computing, networking, and security into unified infrastructure platforms.The new facilities anchor AIC's global supply chain and position the company to meet the intense deployment needs of cloud service providers and enterprise customers. This empowers customers to maintain a competitive lead and achieve greater success amidst the AI wave.