SK hynix Inc. (or "the company", www.skhynix.com) announced today that it is participating in GTC 2026, held from March 16 to 19 in San Jose, California. NVIDIA GTC is the global AI conference where business leaders and developers gather to share the latest breakthroughs and future trends in AI and accelerated computing.SK hynix memory solutions are designed to minimize data bottlenecks and maximize performance for both AI training and inference in NVIDIA AI infrastructure. Through its participation in GTC 2026, the company plans to demonstrate its competitive edge in memory technology - the core infrastructure of the AI era.Under the theme 'Spotlight on AI Memory,' SK hynix will feature an exhibition space dedicated to the AI memory technologies and solutions. The booth will consist of three main areas: the NVIDIA Collaboration Zone, the Product Portfolio Zone, and the Event Zone. The exhibition is designed around interactive content to provide visitors with an intuitive understanding of AI memory technology.The NVIDIA Collaboration Zone, located at the entrance, is the centerpiece of the exhibition, highlighting the synergy between SK hynix and NVIDIA. The company will display the memory configuration mounted on GPU-based AI accelerators through physical models and actual hardware, focusing on the actual application of SK hynix's memory products such as HBM4, HBM3E, and SOCAMM2 designed for NVIDIA AI platforms.Notably, the company will showcase a liquid-cooled eSSD developed in collaboration with NVIDIA, along with an NVIDIA DGX Spark, desktop AI supercomputer equipped with SK hynix's LPDDR5X.In the Product Portfolio Zone, visitors can view a comprehensive lineup of memory products engineered for the AI era. This includes the infrastructure-essential HBM4 and HBM3E, as well as high-capacity server DRAM modules, LPDDR6, GDDR7, eSSD, and Automotive Solutions.An interactive environment allows visitors to use joysticks to select products and view specific features and use cases on-screen, enabling them to explore and understand the technology at their own pace.The Event Zone offers a hands-on experience with an 'HBM 16-High Stacking Game.' By virtually stacking memory chips, participants can gain insight into the TSV (Through Silicon Via) process and high-stack packaging technology, fostering a deeper understanding of how high-performance AI semiconductors are manufactured.Throughout GTC 2026, SK hynix plans to explore future collaboration strategies aligned with current global AI trends. Key executives, including SK Chairman Chey Tae-won and SK hynix CEO Kwak Noh-jung, will meet with global tech giants to share insights on AI evolution and infrastructure shifts while discussing long-term strategic partnerships.The company will also host technical sessions to discuss the future of AI-driven manufacturing and the pivotal role of memory technology in achieving high-performance AI.SK hynix highlighted that as AI technology evolves, memory is transcending its role as a mere component to become a core element that determines the architecture and performance of the entire AI infrastructure. By applying its memory expertise across the entire AI spectrum - from data centers to on-device applications - the company aims to shape the future of AI alongside its global partners.HBM-GPU model shows SK hynix and NVIDIA AI collaboration. Credit: SK hynixSOCAMM2 and HBM4 on NVIDIA Vera Rubin Superchip. Credit: SK hynix

As global AI computing platforms continue to evolve toward higher density, increased power demands, and rack-scale integration, Chenbro unveiled its latest AI server chassis solutions at NVIDIA GTC 2026. The showcase features the NVIDIA MGX 1U Compute Tray for NVIDIA Vera Rubin NVL72 systems, along with a comprehensive product portfolio based on NVIDIA MGX architecture, demonstrating Chenbros integrated capabilities spanning system design, thermal optimization, and rack-level deployment.Building on its close integrations with the NVIDIA ecosystem, Chenbro presented multiple server chassis solutions designed in alignment with NVIDIA reference architectures and the NVIDIA MGX architecture. These solutions address high-density computing, liquid cooling technologies, and enterprise-grade deployment requirements, enabling cloud service providers(CSPs) and enterprise data centers to accelerate AI infrastructure deployment.NVIDIA MGX 1U Compute Tray for NVIDIA Vera Rubin NVL72- A New Standard for High-Density AI ComputingAs next-generation AI training and inference workloads continue to scale rapidly, data centers face increasing demands for space efficiency and advanced thermal design. At NVIDIA GTC 2026, Chenbro highlights the NVIDIA MGX 1U Compute Tray for Vera Rubin NVL72, engineered with optimized mechanical design and airflow management to deliver high-density computing within a 1U footprint. The solution is tailored for large-scale model training and high-performance inference applications.Chenbro also showcases:NVIDIA MGX 1U for NVIDIA GB200 NVL4, supporting high-performance inference and flexible deployment.NVIDIA MGX 2U Vera Server Chassis, offering enhanced scalability and enterprise-level integration options.Together, these solutions demonstrate Chenbro's system integration expertise under the NVIDIA MGX architecture framework.NVIDIA MGX Rack- Advancing from System Integration to Rack-Scale DeploymentAs AI infrastructure expands from individual systems to rack-scale environments, Chenbro highlights its integration capabilities based on NVIDIA MGX architecture. The company leverages its strengths in mechanical design and mass production to support the deployment of high-density AI computing environments in modern data centers.By closely aligning with NVIDIA reference architectures and the broader NVIDIA MGX ecosystem, Chenbro enables customers to extend from system-level builds to rack-level integration, accelerating scalable AI infrastructure deployment.NVIDIA MGX 6U Liquid-Cooled Server Chassis- Liquid Cooling for High-Power AI PlatformsIn response to power consumption and energy efficiency requirements for AI platforms, Chenbro presents the NVIDIA MGX 6U Liquid-Cooled Server Chassis. Designed to support high-power liquid-cooled deployment architectures, the solution enhances thermal efficiency and improves data center power usage effectiveness (PUE) through optimized mechanical and fluid management design, ensuring stable operations for next-generation AI data centers.Additional showcased solutions include:NVIDIA MGX 4U Air-Cooled Server Chassis and NVIDIA MGX 2U Short-Depth Server Chassis.These offerings provide flexible deployment options for enterprise server rooms and diverse application scenarios.Strengthening Global Footprint and AI Infrastructure CapabilitiesChenbro CEO Corona Chen stated that as AI applications continue to expand, market demand for high-density computing, liquid cooling, and rack-scale integration capabilities is rapidly increasing. Chenbro will continue deepening its collaboration within the ecosystem, strengthening its integrated R&D and manufacturing capabilities to help customers accelerate the adoption of next-generation AI platforms.                                                      With its global manufacturing footprint and localized service capabilities, Chenbro is committed to supporting diverse deployment needs across AI, HPC, and data center applications—driving sustained operational growth and industry competitiveness.At GTC 2026, Chenbro not only presents its product portfolio but is supporting NVIDIA AI platforms from system integration and thermal optimization to rack-scale deployment, enabling scalable AI infrastructure development worldwide.Chenbro supports diverse AI, HPC, and data center deployment needs. Credit: Chenbro

NEXCOM, A leading global provider of industrial computing and automation technology, is coming to Embedded World in Nuremberg (booth 3/341) with ambitious goals. With the help of European partners, the company aims to further expand its AI presence in edge applications, including automation, rugged mobile computing, safety-oriented robotics, smart cities, on-premises GPT, and industrial cybersecurity."As robots increasingly become the primary physical carriers for AI capabilities, NEXCOM is committed to accelerating their adoption across various industries," explains CEO Clement Lin, who will be attending Embedded World himself. "At Embedded World 2026, we will be presenting, among other things, a comprehensive range of safety-certified industrial robotics solutions in collaboration with the German robotics innovators. These solutions are specifically designed for smart factories, service robots, automotive manufacturing, and logistics."NEXCOM Robotic Solutions: Building a Safety-Oriented Foundation for Physical AIThe integration of physical AI into industrial environments requires rigorous and comprehensive safety certification for every component, from joint actuators and control motors to safety sensors, to ensure safe human-machine collaboration. As the central architect of the intelligent machine ecosystem, NEXCOM Robotic Solutions offers a robust motion control platform integrated with joint drive modules and safety software from European partner Synapticon. These solutions enable developers to significantly shorten development cycles while achieving the highest safety standards for robots used in manufacturing, logistics, and automated services."Over the past 34 years, NEXCOM has gradually evolved into one of the world's leading providers of robotics, IoT, and Industry 4.0 solutions. NEXCOM's extensive portfolio and long-standing experience in the global market perfectly complement the innovations developed by our team in Europe," reports Simon Fischinger, CEO at Synapticon. "Especially in the field of AI-based robotics, enormous opportunities are emerging as leading providers opt for open standards, enabling them to collaborate efficiently with partners."To further accelerate the deployment of safe and flexible robotic applications, NEXCOM is also collaborating with Botfellows, a German high-tech robotics startup specializing in safety-driven automation solutions. Botfellows focuses on enabling flexible and efficient robotic applications through software-defined safety architectures and intuitive robot programming."Physical AI will only scale if robotics becomes significantly easier and safer to deploy," says Dr. Mohamad Bdiwi, CEO of Botfellows. "Our collaboration with NEXCOM and Synapticon demonstrates how the combination of edge AI computing, advanced motion control, and software-defined safety enables a new generation of flexible robotic systems for smart factories and logistics."Embedded World 2026 Highlight: Unlocking the Potential of SD Edge ComputingUnder the motto "Unleashing the Genius of SD Edge Computing," NEXCOM's presentation is divided into two main areas: AIoT solutions and AI computing. The exhibition demonstrates the enormous potential of Software-Defined Edge Computing (SDEC) using real-world implementations of Edge AI and Physical AI in global AIoT infrastructures.Key product highlights include:NDiS B340: A rugged edge computing computer specifically designed for the demanding requirements of smart healthcare.APPC 160/210 C21: Industrial touch computers for high-performance AI applications in smart factories.IP67 AI edge telematics: Innovative, rugged solutions for challenging outdoor and vehicle environments.NEXCOM remains committed to accelerating the practical implementation of intelligent applications. From high-performance AI computing platforms and physical AI to comprehensive AIoT operating frameworks, NEXCOM delivers innovative products that empower the next generation of AI-driven businesses and improve people's lives.NEXCOM at Embedded World 2026NEXCOM invites trade show visitors to discover the future of autonomous innovation at its booth (4/341) in Nuremberg. Those interested can experience firsthand how NEXCOM's software-defined solutions are transforming the landscape of industrial automation and edge intelligence.For more information, please visit.