Tescan  announced the official opening of its upgraded Tescan Korea Demo Lab & Office in Seoul, bringing together its relocated Korea office and enhanced demo lab capabilities in one integrated site. The new platform is designed to strengthen customer engagement in Korea and support semiconductor and academic users through demonstrations, training, and workflow discussions.Korea's semiconductor ecosystem continues to advance around AI-driven memory and advanced packaging. As high-bandwidth memory (HBM) and more complex package architectures scale, teams face increasing pressure to accelerate failure analysis (FA), reliability, and validation workflows while maintaining consistent, decision-ready results."APAC remains a key growth region for Tescan, and Korea is a strategic investment focus as the ecosystem scales AI memory capacity, including HBM, and advanced packaging," said Pavel Sustek, Chief Financial Officer, Tescan. "Our upgraded Seoul site is a direct investment in strengthening Tescan's customer-facing platform in Korea and in supporting semiconductor, materials science, and academic users."The Korea Demo Lab and Office will serve as a regional hub for evaluations, training, and technical discussions , while connecting with Tescan's global Demo Lab network. "By combining office and demo lab functions in one site, we have a stronger platform for customer discussions, workflow validation, and regional engagement," said Sean Lee, Managing Director, APAC, Tescan.The opening ceremony featured a ribbon-cutting attended by H.E. Ivan Jancarek, Ambassador of the Czech Republic to the Republic of Korea, along with Tescan leadership and representatives from the microscopy community. Attendees included Jong-Seok Yeo, President of the Korea Society of Microscopy (KSM). Their participation reflects the importance of methodology standardization, talent development, and collaboration between industry and academia.

The global supply chain is currently undergoing a radical shift. The traditional model of reactive logistics is being replaced by "Next-Gen Infrastructure", a system that isn't just connected, but is inherently intelligent and verifiable. At the heart of this evolution are two technologies often discussed in isolation but increasingly deployed in tandem: Artificial Intelligence (AI) and Blockchain. These technologies allow supply chains to stay ahead of the curve.AI: The Engine of Predictive LogisticsAi serves as the cognitive layer of modern infrastructure. In the context of the global supply chain, machine learning models process massive datasets, from satellite imagery of port traffic to real-time weather patterns. This proactive stance allows for "agentic" logistics, where AI systems autonomously reroute cargo or adjust manufacturing schedules in response to a geopolitical shift or a semiconductor shortage. However, AI faces a critical vulnerability: the "garbage in, garbage out" dilemma. For an AI to make mission-critical decisions, the data it consumes must be untampered, transparent and verifiable by trusted means.Blockchain: Ensuring Data Integrity and TrustThis is where Blockchain proved the essential spine for AI's brain. By creating a decentralized, immutable ledger, blockchain ensures that every stakeholder in the supply chain, from the raw material miner to the final electronics assembler, is looking at the same single source of truth and verifiable information.Blockchain's utility extends beyond simple tracking: it facilitates the automation of trade finance through smart contracts. As these decentralized systems become standard for enterprise resource planning, the bridge between physical goods and digital assets strengthens.For instance, as firms look to settle cross-border payment instantly or hedge against currency volatility using stablecoins, understanding the logistics of digital finance such as how to get crypto on Kraken, has transitioned from a niche IT interest to a strategic treasury requirement.The Synergy of a Real World ApplicationWhen combined and used in sync, AI and Blockchain technologies create a "Digital Twin" of the global supply chain that is both smart, secure and trusted by major companies.The scenario: An AI detected an impending delay at a major shipping hub.The response: The AI proposes an alternative route.The verification: A blockchain-based smart contract automatically updates the bill of lading, triggersinsurance adjustments, and notifies all parties of the change with a cryptographic timestamp.This dual-stack approach also solves the growing demand for ESG (Environmental, Social and Governance) transparency. While Blockchain proved the "Country of Origin" for minerals, AI can simultaneously calculate the real-time carbon footprint of the journey, providing a verifiable audit trail for regulators.Building for the Future and BeyondThe convergence of AI and Blockchain is no longer a theoretical exercise, it is the prerequisite for resilience in an era of global volatility. For the semiconductor and tech industries, this means designing hardware that can handle the computational load of AI alongside the cryptographic demands of a distributed ledger. Organizations that fail to integrate these complementary forces will find themselves operating with a "blind" brain or a "brittle" spring.

iCatch Technology, a leading provider of AI imaging SoCs and vision processing solutions, today introduced PAISB (Physical AI Sensor Bridge), an HSB-aligned ASIC sensor bridge platform designed to enable scalable multi-sensor data ingest for NVIDIA Holoscan-based Physical AI systems.The first product in the platform family, PAISB-E1, will be demonstrated at GTC 2026 running on NVIDIA Thor at ApproPho Booth #3420.As Physical AI systems increasingly rely on multiple high-bandwidth sensors - including cameras, stereo vision modules, and other perception devices - efficient and deterministic data pipelines from sensors to GPU compute platforms have become critical infrastructure. PAISB addresses this challenge by providing an ASIC-based bridge optimized for time-aligned, low-latency sensor streaming into GPU computing environments.Aligned with the NVIDIA Holoscan Sensor Bridge (HSB) architecture, PAISB enables developers to ingest synchronized sensor streams directly into GPU memory, allowing real-time perception workloads to scale across a wide range of Physical AI applications.At GTC 2026, iCatch will demonstrate PAISB-E1 using FoundationStereo Depth as an application example. The system streams synchronized multi-sensor data to NVIDIA Thor, enabling real-time perception pipelines for robotics and intelligent machines."Physical AI systems demand scalable and deterministic sensor-to-GPU pipelines to process massive volumes of multimodal data in real time," said Weber Hsu, President of iCatch Technology. "With PAISB, we are introducing an ASIC-based sensor bridge platform aligned with the NVIDIA Holoscan ecosystem, enabling developers to build high-performance, time-synchronized sensor architectures for Physical AI platforms."The PAISB platform is designed to support a broad range of Physical AI applications, including robotics, industrial automation, medical imaging, broadcast infrastructure, and automotive perception systems. By enabling high-bandwidth, synchronized sensor ingestion into GPU-based computing environments, PAISB accelerates the deployment of AI systems requiring precise perception and real-time decision-making.To learn more about PAISB and explore collaboration opportunities, visit us at ApproPho Booth #3420 during GTC 2026, or schedule a meeting in advance.

EDOM Technology (TWSE: 3048), Asia's best solutions partner, will participate in NVIDIA GTC for the third consecutive year under the theme "From AI to Action: Physical AI in Motion." Together with ecosystem partners, EDOM will showcase its latest AI computing platforms, key components, and system integration capabilities. At Booth #242, EDOM will present physical AI and robotics solutions powered by NVIDIA Jetson hardware and software resources, demonstrating how AI technologies are being developed and deployed across diverse fields such as smart healthcare, vision recognition, and speech understanding. The showcase will highlight EDOM's capability to connect the AI ecosystem and accelerate industry innovation through integrated solutions.During the GTC exhibition, EDOM Technology plans to demonstrate several innovative applications that combine physical AI with edge computing. With the introduction of the NVIDIA Jetson Thor, AI inference and control architectures can now be integrated into a single system, providing a high-performance computing foundation for real-time closed-loop control and multimodal sensing, and accelerating the real-world deployment of multimodal intelligent robots.In the robot interaction showcase, EDOM collaborates with Algoltek to present "Dexterous Hand AI."Powered by 4D AI Vision technology and vision-action models, the system can recognize and predict audience hand gestures in real time and respond accordingly. This demonstration highlights low-latency AI inference and instant feedback, while also presenting a complete Sim-to-Real workflow, from virtual simulation to physical deployment. EDOM also partners with Nexuni to present "AI Workforce: Embodied Intelligence." Built on the NVIDIA Thor platform, the system enables dual-arm robot manipulation through few-shot learning. The demonstration shows a service robot performing household tasks, including object recognition, grasping, and fabric folding. Because fabric is a highly deformable material, handling it requires complex visual perception, state estimation, and coordinated dual-arm control. By leveraging Jetson Thor's edge AI inference and real-time dynamic path correction, the system continuously adjusts its movements during the folding process, improving task success rate and operational stability. This highlights the potential of physical AI in smart manufacturing, human-robot collaboration, and service robotics.In the area of enterprise AI and smart biotech applications, EDOM collaborates with Avalanche Computing to showcase the "Secure Offline Generative AI" platform. Combining enterprise-grade private LLMs with real-time speech intelligence, the platform runs on the NVIDIA Jetson edge platform, enabling low-latency offline speech recognition and semantic analysis. This allows generative AI to deliver real-time interaction within highly secure enterprise environments. EDOM is also working with CyteSi to present the "Software-Defined High-Throughput Wet Lab," an AI-driven laboratory automation platform. CyteSi's EWOD (Electrowetting-on-Dielectric) technology digitally controls micro-droplets with precision, supporting workflows such as NGS sample preparation, drug discovery, and synthetic biology research. The system uses NVIDIA Jetson as its edge computing core, integrating biochips from Japan Display Inc. (JDI) with real-time image analysis capabilities to provide an intuitive user interface and highly efficient experimental workflow, advancing AI adoption in smart biotech research and automated laboratories.In addition, EDOM will showcase the "NVIDIA Jetson Thor Peripheral Ecosystem," integrating a range of EDOM-certified peripheral components, including high-speed storage, Wi-Fi 6/6E and 5G communication modules, GMSL and MIPI cameras, 10G high-speed networking, sensors, camera modules, and high-speed I/O interfaces. This ecosystem helps developers rapidly build next-generation robotics and physical AI systems. Through comprehensive hardware integration and platform support, EDOM assists robotics developers in accelerating product design, deployment, and mass production, further expanding the physical AI and Jetson Thor ecosystem.Jeffrey Yu, CEO of EDOM Technology, stated, "The key to physical AI lies not only in computing performance, but in comprehensive hardware–software integration and ecosystem collaboration. Through NVIDIA's Three-Computer architecture and the Jetson Thor platform, we help customers build scalable, production-ready, end-to-end AI solutions - from model training and simulation validation to edge deployment." He further noted that EDOM is not just a hardware supplier, but is committed to integrating peripheral modules, AI software frameworks, and partner resources to help enterprises accelerate the adoption of AI and robotics technologies.EDOM Technology invites industry professionals, developers, and partners to visit Booth #242. Attendees are also welcome to check out the in-person session featuring Wilson Yen, Product Director at EDOM. The talk explores how EDOM leverages NVIDIA "Three Computers" architecture to help enterprises transform AI models into real-world applications, covering key domains such as computer vision, robotics, and edge AI. Participants are encouraged to add this session to their personal GTC schedule to experience firsthand the innovation of physical AI in action, and to explore the future of intelligent robotics and edge AI. Register now through EDOM's dedicated link to enjoy special GTC Conference registration offers. 

SK hynix Inc. (or "the company", www.skhynix.com) announced today that it is participating in GTC 2026, held from March 16 to 19 in San Jose, California. NVIDIA GTC is the global AI conference where business leaders and developers gather to share the latest breakthroughs and future trends in AI and accelerated computing.SK hynix memory solutions are designed to minimize data bottlenecks and maximize performance for both AI training and inference in NVIDIA AI infrastructure. Through its participation in GTC 2026, the company plans to demonstrate its competitive edge in memory technology - the core infrastructure of the AI era.Under the theme 'Spotlight on AI Memory,' SK hynix will feature an exhibition space dedicated to the AI memory technologies and solutions. The booth will consist of three main areas: the NVIDIA Collaboration Zone, the Product Portfolio Zone, and the Event Zone. The exhibition is designed around interactive content to provide visitors with an intuitive understanding of AI memory technology.The NVIDIA Collaboration Zone, located at the entrance, is the centerpiece of the exhibition, highlighting the synergy between SK hynix and NVIDIA. The company will display the memory configuration mounted on GPU-based AI accelerators through physical models and actual hardware, focusing on the actual application of SK hynix's memory products such as HBM4, HBM3E, and SOCAMM2 designed for NVIDIA AI platforms.Notably, the company will showcase a liquid-cooled eSSD developed in collaboration with NVIDIA, along with an NVIDIA DGX Spark, desktop AI supercomputer equipped with SK hynix's LPDDR5X.In the Product Portfolio Zone, visitors can view a comprehensive lineup of memory products engineered for the AI era. This includes the infrastructure-essential HBM4 and HBM3E, as well as high-capacity server DRAM modules, LPDDR6, GDDR7, eSSD, and Automotive Solutions.An interactive environment allows visitors to use joysticks to select products and view specific features and use cases on-screen, enabling them to explore and understand the technology at their own pace.The Event Zone offers a hands-on experience with an 'HBM 16-High Stacking Game.' By virtually stacking memory chips, participants can gain insight into the TSV (Through Silicon Via) process and high-stack packaging technology, fostering a deeper understanding of how high-performance AI semiconductors are manufactured.Throughout GTC 2026, SK hynix plans to explore future collaboration strategies aligned with current global AI trends. Key executives, including SK Chairman Chey Tae-won and SK hynix CEO Kwak Noh-jung, will meet with global tech giants to share insights on AI evolution and infrastructure shifts while discussing long-term strategic partnerships.The company will also host technical sessions to discuss the future of AI-driven manufacturing and the pivotal role of memory technology in achieving high-performance AI.SK hynix highlighted that as AI technology evolves, memory is transcending its role as a mere component to become a core element that determines the architecture and performance of the entire AI infrastructure. By applying its memory expertise across the entire AI spectrum - from data centers to on-device applications - the company aims to shape the future of AI alongside its global partners.HBM-GPU model shows SK hynix and NVIDIA AI collaboration. Credit: SK hynixSOCAMM2 and HBM4 on NVIDIA Vera Rubin Superchip. Credit: SK hynix

NEXCOM, A leading global provider of industrial computing and automation technology, is coming to Embedded World in Nuremberg (booth 3/341) with ambitious goals. With the help of European partners, the company aims to further expand its AI presence in edge applications, including automation, rugged mobile computing, safety-oriented robotics, smart cities, on-premises GPT, and industrial cybersecurity."As robots increasingly become the primary physical carriers for AI capabilities, NEXCOM is committed to accelerating their adoption across various industries," explains CEO Clement Lin, who will be attending Embedded World himself. "At Embedded World 2026, we will be presenting, among other things, a comprehensive range of safety-certified industrial robotics solutions in collaboration with the German robotics innovators. These solutions are specifically designed for smart factories, service robots, automotive manufacturing, and logistics."NEXCOM Robotic Solutions: Building a Safety-Oriented Foundation for Physical AIThe integration of physical AI into industrial environments requires rigorous and comprehensive safety certification for every component, from joint actuators and control motors to safety sensors, to ensure safe human-machine collaboration. As the central architect of the intelligent machine ecosystem, NEXCOM Robotic Solutions offers a robust motion control platform integrated with joint drive modules and safety software from European partner Synapticon. These solutions enable developers to significantly shorten development cycles while achieving the highest safety standards for robots used in manufacturing, logistics, and automated services."Over the past 34 years, NEXCOM has gradually evolved into one of the world's leading providers of robotics, IoT, and Industry 4.0 solutions. NEXCOM's extensive portfolio and long-standing experience in the global market perfectly complement the innovations developed by our team in Europe," reports Simon Fischinger, CEO at Synapticon. "Especially in the field of AI-based robotics, enormous opportunities are emerging as leading providers opt for open standards, enabling them to collaborate efficiently with partners."To further accelerate the deployment of safe and flexible robotic applications, NEXCOM is also collaborating with Botfellows, a German high-tech robotics startup specializing in safety-driven automation solutions. Botfellows focuses on enabling flexible and efficient robotic applications through software-defined safety architectures and intuitive robot programming."Physical AI will only scale if robotics becomes significantly easier and safer to deploy," says Dr. Mohamad Bdiwi, CEO of Botfellows. "Our collaboration with NEXCOM and Synapticon demonstrates how the combination of edge AI computing, advanced motion control, and software-defined safety enables a new generation of flexible robotic systems for smart factories and logistics."Embedded World 2026 Highlight: Unlocking the Potential of SD Edge ComputingUnder the motto "Unleashing the Genius of SD Edge Computing," NEXCOM's presentation is divided into two main areas: AIoT solutions and AI computing. The exhibition demonstrates the enormous potential of Software-Defined Edge Computing (SDEC) using real-world implementations of Edge AI and Physical AI in global AIoT infrastructures.Key product highlights include:NDiS B340: A rugged edge computing computer specifically designed for the demanding requirements of smart healthcare.APPC 160/210 C21: Industrial touch computers for high-performance AI applications in smart factories.IP67 AI edge telematics: Innovative, rugged solutions for challenging outdoor and vehicle environments.NEXCOM remains committed to accelerating the practical implementation of intelligent applications. From high-performance AI computing platforms and physical AI to comprehensive AIoT operating frameworks, NEXCOM delivers innovative products that empower the next generation of AI-driven businesses and improve people's lives.NEXCOM at Embedded World 2026NEXCOM invites trade show visitors to discover the future of autonomous innovation at its booth (4/341) in Nuremberg. Those interested can experience firsthand how NEXCOM's software-defined solutions are transforming the landscape of industrial automation and edge intelligence.For more information, please visit.

In Taiwan's older urban neighborhoods, five- or six-story walk-ups are common. For elderly residents living with chronic conditions such as diabetes, even a routine hospital visit can become a grueling physical ordeal - often requiring the assistance of family members or caregivers. This simple yet often overlooked reality became the catalyst for a major innovation in AI-powered healthcare.A group of international Ph.D. students at Taipei Medical University (TMU), known as the TSY-AI Team, set out to address this pain point. Their goal was clear: to bring diagnostics directly into people's homes. This result is a disposable, AI-integrated biosensor system capable of measuring blood glucose and pH levels with just a drop or two of blood - and delivering results in under 10 minutes, all without the need to leave the house. This groundbreaking platform recently earned the team the Bronze Medal at the 2025 Best AI Awards, hosted by Taiwan's Ministry of Economic Affairs. "We're not just building a chip. We're building a full platform," says Asaduzzaman, the team's representative and a Ph.D. candidate from Bangladesh. "Something that supports long-term chronic care while reducing unnecessary hospital visists.”At the core of the platform is the 3DISFETCHIP, a three-dimensional ion-sensitive field-effect transistor (3D ISFET) engineered to capture biochemical data from just minimal blood samples. The chip, housed in a disposable microfluidic chamber, connects to a mobile app that displays blood glucose and pH results within 10 minutes.But the innovation doesn't stop there. The system also incorporates AI-powered image recognition, enabling patients to photograph wounds - such as diabetic foot ulcers - and receive real-time analysis of healing progress. Over time, this feature allows doctors to remotely track wound recovery without requiring in-person visits."I saw the announcement for the Best AI Award in the newspaper," recalls Asaduzzaman. "We had just finished the core development work for our biosensor and thought - why not apply?""But for us, it wasn't about the competition," he adds. "It was about sharing our idea with Taiwan's AI and healthcare communities. We wanted to show students, researchers, and industry leaders that AI medical devices can be both simple and impactful."The response from the event was overwhelming. Visitors from the medical device industry expressed surprise at the product's affordability and ease of use. Some even opened conversations about future partnerships.With product development progressing, the TSY-AI Team is now evaluating Taiwan as a long-term base for commercialization."Taiwan has world-class semiconductor capabilities, and the startup ecosystem here is extremely welcoming," Asaduzzaman explains. "We've spoken with major players like Wistron, as well as smaller chip manufacturers, all of whomare very open to supporting medical AI solutions like ours."In addition to hardware partnerships, the team has also initiated collaboration with local hospitals. They have completed preliminary testing with animal models and controlled human samples, and are currently preparing to apply forInstitutional Review Board approval. Clinical trials are planned with Taipei Medical University Hospital and Shuang Ho Hospital.While the current system focuses on glucose and pH monitoring, the team is actively expanding its biomarker detection capabilities. Plans are underway to incorporate inflammation markers, HbA1c, and early indicators of infection - all from the same minimal blood sample."We want to turn this into a multi-analyte health platform that gives both patients and doctors a comprehensive view of physical conditions from home," says Asaduzzaman. "I believe the future of medical diagnostics is home-based. Patients shouldn't need to visit hospitals every week just to monitor chronic conditions. They should be able to do it easily, safely, affordably, and accurately from home."TSY-AI Team won the Broze Award  in the International Group IC Design Category at the 2025 Best AI Awards. If you have innovation would like to present, 2026 Best AI Awards with global tracks open for both AI Applications and IC Design, students and companies worldwide can compete for the grand prize of up to USD 30,000 (NTD 1,000,000). The deadline is March 16, 5:00pm (GMT+8). For more details, please follow official Linkedin for the lastest updates. 

NewPower Worldwide, a leading independent distributor of electronic components and supply chain management solutions, today announced an expansion of its committed credit facility to $500 million, strengthening the company's ability to respond quickly to evolving market dynamics and meet customers' ever changing needs.The expanded facility underscores strong lender confidence in NewPower Worldwide's operational excellence, financial discipline, and ability to move decisively in rapidly shifting global markets."This expanded credit facility gives us the financial flexibility to execute deals of any scale at the pace our customers require," said Carleton Dufoe, Chief Executive Officer of NewPower Worldwide. "Our customers need partners who can move fast, adapt to change, and deliver consistent results. This additional capacity ensures we can meet those demands every time.""Our continued partnership with NewPower reflects our confidence in their ability to support customers through dynamic market conditions," said Jason Upham, Senior Vice President at Citizens. "Our team led a new credit facility that will give NewPower the agility and resources needed to deliver solutions that align with their customer's supply goals and timing."This increased capacity provides NewPower Worldwide the financial strength and flexibility to execute deals of any size with speed and consistency. It enables the company to align seamlessly with its customers' pace, delivering tailored supply solutions that help them maintain stability, adapt quickly to market changes, and move forward with confidence.

Intelligent Asia Thailand 2026, Southeast Asia's leading B2B platform for PCB manufacturing and industrial automation, will take place from 11 to 13 March 2026 at Event Hall 98, BITEC, Bangkok. The exhibition brings together global technology providers and regional manufacturers seeking to enhance efficiency, precision, and production flexibility, offering a unique gateway to the region's rapidly evolving electronics and smart manufacturing market.Thailand's electronics and smart manufacturing sector is expanding rapidly. In 2025, foreign direct investment in the country reached 324 billion THB (approximately USD 10.5 billion), a 42% increase compared with the previous year. While the semiconductor industry remains at an early stage, the country already demonstrates strong potential due to advanced infrastructure, skilled talent, a business-friendly environment, and integrated downstream supply chains. These conditions make Intelligent Asia Thailand 2026 a timely platform for connecting with key stakeholders and exploring growth opportunities.According to the Board of Investment (BOI), between 2018 and November 2025, investment promotion applications in the electronics and electrical sector totaled 1.17 trillion THB(USD 37 billion) across 1,748 projects. This accounted for 19% of total promoted investments, making electronics the sector with the highest investment volume. Growth was driven primarily by printed circuit boards, semiconductor packaging and testing, hard disk drives and components, as well as electronic parts for automotive, medical, telecom, and smart electronics manufacturing - further underscoring the importance of this industry in Southeast Asia's economic development.Positioned at the intersection of electronics manufacturing and smart automation, Intelligent Asia Thailand 2026 features strong participation from Taiwan's semiconductor and PCB supply chain leaders expanding into Southeast Asia. Visitors can discover cutting-edge technologies, forge regional partnerships, and seize emerging business opportunities across Thailand and neighboring countries. Covering 10,000 sqm with over 310 exhibitors, the event is organized by Yorkers Trade & Marketing Service Co., Ltd., Messe Frankfurt (HK) Ltd, Taiwan Branch, and GMTX Company Limited.Dual Focus: PCB Thailand and Automation ThailandThe exhibition is structured around two core pillars - PCB Thailand and Automation Thailand - providing a comprehensive platform where electronics manufacturing and smart automation converge. Exhibitors showcase end-to-end solutions spanning advanced PCB materials, precision processing, surface treatment, inspection systems, robotics, motion control, factory automation, and digital management. These technologies enable manufacturers to optimize production efficiency, enhance quality control, and respond flexibly to evolving market demands. FeaturedExhibitors and Technologies:PCB & Advanced Electronics Manufacturing Atotech(Thailand) – Surface treatment, plating, and finishing solutions for electronics and industrial applications.Hunson – Industrial cameras, AOI inspection systems, sensors, and machine vision solutions. Jiangsu Ysphotech – High-performance integrated circuit equipment and solutions. Nano Electronics & Micro System Technologies – Plasma etching, drilling, and cleaning machines for HDI/ABF PCBs.PATA Chemicals & Machinery – Tailored chemicals and process support for plating and surface treatment. Qnity – Advanced connectivity materials for flexible, rigid-flex, and rigid PCBs. SCREEN GP Thailand – PCB production systems: imaging, miniaturization, energy-efficient solutions. Schlötter Asia – Specialty electroplating chemicals and surface finishing solutions.Automation, Robotics & Industrial ControlAuer Signal – Smart signaling devices for industrial automation, real-time status visualization, predictive maintenance. DEEP Robotics – Quadruped robots for inspection, rescue, and industrial applications. FINERN – Automation and intelligent measurement systems for automotive, electronics, and healthcare. MRDVS Technology – AI-powered 3D robot cameras and navigation modules for AMRs and AGVs. Smart Motion Control – Motion control products: servo motors, drivers, amplifiers, PC-based controllers. TJ Solutions – Automation and QC measurement solutions with application-based consulting. Weldex – High-efficiency welding and cutting solutions with German/US technology support. Wieland Electric Singapore Pte. Ltd. – Scalable industrial safety solutions: sensors, relays, safety controllers.Manufacturing Infrastructure & Supporting TechnologiesEVERBIZ Industrial – Customized wiring solutions for automotive, electronics, and industrial applications. Long Long Clean Room Technology – Dust-free and sterile cleanrooms for semiconductor, medical, and precision industries. Molding Innovation Technology （Minnotec） – Smart mold and plastic injection solutions for Southeast Asia. Taiwan Grace – High-efficiency industrial filter cartridges, media, and housings. Thai Murata – Ceramic passive components, wireless modules, and power conversion technologies. Factory Max – 3D scanning, motor spindles, and advanced manufacturing solutions. Software & Digital Manufacturing SolutionsData Systems – Digiwin ERP and sMES for manufacturing management, IoT integration, and production optimization. Xian Jin Trading – CAD/CAM/CAE software solutions for design, engineering, and manufacturing.Technical Forums and Industry SeminarsIn parallel with the exhibition, a three-day seminar and management forum program offers actionable insights and practical guidance for manufacturing transformation:Day 1(11 March 2026): Opening Ceremony and Management Forum on Thailand's manufacturing strategy in Southeast Asia, with sessions on AI-driven quality improvement and smart factory maintenance systems.Day 2 (12 March 2026): AIoT and EDGE technologies in modern manufacturing, smart factory integration, and next-generation PCB processes.Day 3(13 March 2026): Dedicated PCB Seminar, KAIZEN-based manufacturing excellence, and strategies for high-value electronic component production.These sessions are designed for engineers, plant managers, system integrators, and business decision-makers seeking practical strategies to optimize production efficiency, quality control, and smart manufacturing capabilities. Coupled with the country's growing electronics investment, participants can gain insights aligned with Southeast Asia's dynamic industry trends.Why Attend Intelligent Asia Thailand 2026Gain first-hand access to the latest PCB and automation technologies, connect directly with industry-leading suppliers, and acquire actionable knowledge to enhance efficiency, quality, and production flexibility. Don't miss the opportunity to explore business potential in Thailand's expanding electronics sector. Register now for free visitor access: website.Credit: Intelligent Asia ThailandCredit: Intelligent Asia ThailandCredit: Intelligent Asia Thailand

Today, an increasing number of scientific papers, media repoerts, and television health programs - highlighting the increasing incidence of heart attacks and strokes. What is often overlooked is that a large portion of these cases are linked to atrial fibrillation (AF). In fact, AF is associated with more than 80% of strokes and heart attacks, and it significantly increases both the risk of having a stroke and the risk of dying from it.Even more alarming is the fact that most people with AF are unaware they have it. Current statistics indicate that only around 30% of individuals with AF know about  their condition, meaning millions of people worldwide are living with an undiagnosed, potentially life-threatening heart rhythm disorder.That is the reality that EDABK from Vietnam set out to change. Rather than relying on bulky ECG monitors or expensive medical devices, the team developed a low-power edge AI chip that could be embedded into the smartwatches and other wearables devices already used in daily life.  Their innovation, which won a Silver Medal at Taiwan's 2025 Best AI Awards, is a signal of where healthcare is headed: real-time, always-on, and hyper-personalized. "We chose to focus on atrial fibrillation detection because we saw a real, unmet need - one that current solutions haven't adequately addressed," said Nguyen Duc Minh, representative of Team EDABK. "We wanted to make AF monitoring accessible, low-cost, and capable of running entirely on a chip, without relying on the cloud."AF is typically detected through electrocardiograms (ECGs), which requires hospital visits and professional equipment. EDABK's idea was to use photoplethysmography (PPG) - the same light-based technology found in off-the-shelf wearables. While PPG data is noisier than ECG, the team developed a processing pipeline that enables reliable AF detection.They began with preprocessing and quantization of the raw PPG signal, followed by a novel Pi-K Plot technique to extract irregularities in heart rhythm. These signal is transformed into spikes and fed into a Spiking Neural Network (SNN) - a brain-inspired AI architecture optimized for low power consumption and low latency.SNNs represent a fundamental shift in how AI operates. Instead of running continuous computations, they activate only "spike" when meaningful data appears, mimicking the behavipr of biological neurons.  This event-driven architecture allows AI to run in real-time on small chips, using a fraction of the energy required by traditional neural networks. "Our model reduces RAM usage by more than 80%, while still detecting early warning signs of AF in real time," Minh explained. "It's built for wearables - devices with tight constraints on battery life, processing power, and form factor."The improvement is enormous, with no reliance on cloud services, users receive faster feedback, enhance privacy, and a more seamless user experience. And because the chip behaves like standard memory, it can also be easily integrate into commercial hardware.While still based at a university, EDABK is actively working with local partners to collect clinical data and validate the model beyond the laboratory. The team is already planning a smart ring prototype, complete with PPG sensors and wireless connectivity to deliver alerts directly to a smartphone.Beyond AF, the system's architecture is modular and generalizable. The SNN core and its toolchain can be retrained to detect other heart rhythm disorders or physiological abnormalities - simply by introducing new datasets and adjusting design goals."Our roadmap includes expanding detection to multiple arrhythmias, not just AF," Minh said. "The goal is to build a scalable platform that enables proactive health monitoring in daily life."For Team EDABK, the Best AI Awards did more than validate their work - it opened a new chapter. "We were amazed by how advanced Taiwan is - not just in chip design, but in edge AI innovation at the silicon level," Minh noted. "Some of our members are now considering graduate studies in Taiwan to take our work even further."This experience has also sparked early discussions around potential commercialization in Taiwan, where the supply chain for AI chips and medical wearables is already world-class.As wearable adoption continues to accelerate globally - forecasted to exceed 1.2 billion devices in use by 2028 - solutions like EDAB's EADK's point to a future where AI does not simply reside in the cloud, but operated quietly in the background of everyday life, watching for the warning signs users may not feel."We're not just building a device," Minh said. "We're building a safety net - one that helps users become aware of silent health threats before they become emergencies." In a world where heart disease remains the leading cause of death, that safety net cannot arrive soon enough.EDABK won the Silver Medal in the International Group IC Design Category at the 2025 Best AI Awards. Now it's your chance to shine - bring your innovation to the world and apply for the 2026 Best AI Awards! With global tracks open for both AI Applications and IC Design, students and companies worldwide can compete for the grand prize of up to USD 30,000 (NTD1,000,000). The deadline is March 16, 5pm (GMT+8), follow offcial Linkedin for the latest updates.