As energy consumption in AI servers and data centers rapidly increases, High Voltage Direct Current (HVDC) has emerged as a key direction for next-generation power system. Traditional AC/DC multi-stage architectures suffer significant conversion losses, limiting overall efficiency to around 85%, prompting the industry to accelerate its transition toward 800V (or ±400V) HVDC systems.In response, GaNrich Semiconductor Corporation (GaNrich) announced it will launch its 1200V High-Voltage GaN (HV GaN) product series by the end of 2025. Built on GaNrich's proprietary GaN on Sapphire platform, the series features low Rds(on), high breakdown voltage, and outstanding efficiency. It is designed for data-center power management, AI server power modules, and emerging HVDC systems.As the first global supplier offering pin-to-pin GaN replacement solutions, GaNrich enables its 1200V GaN FETs to directly replace SiC devices. Under high-frequency HVDC input operation, switching loss is reduced by 30%, gate-drive loss by 90%, and auxiliary power size by 50%. On the output side, GaNrich's 100V GaN offers more than 50% lower on-resistance compared with equivalent Si MOSFETs, offering a clear efficiency advantage.In the medium-voltage sector, GaNrich started mass production in Q3 of its 100–200V, 1–10 mΩ MV GaN product line-up, available in multiple double-sided-cooling RQFN and DFN packages. The newly launched RQFN 5×6 device achieves leading TCR (temperature coefficient resistance) performance, delivering superior high-temperature current capability versus competing GaN and SGT MOSFET devices. Applications include HVDC power supplies, power bricks, drones, industrial automation, and robotics.According to NVIDIA's published 800V HVDC white paper, GaN/SiC device typically follow three topologies combinations in HVDC system: 1200V+100/40V, 650V + 100/40V, and 200/150V+40V. GaNrich is currently the world's only supplier capable of delivering all device combinations through a unified product portfolio. Building on extensive expertise in GaN chip design, packaging, and system module integration, GaNrich provides a comprehensive voltage range from medium to high voltage, offering high-efficiency and miniaturized power-conversion solutions that accelerate the real-world adoption of GaN in HVDC and power system applications.

The manufacturing industry is facing major changes with the rapid development of artificial intelligence (AI) technology, which has made computing power and AI application services the "new oil" that fuels the competitiveness of enterprises. However, simply stacking hardware is not enough to run AI models, which are highly dependent on a stable and secure computing environment with low latency. The only way to ensure enterprise-level power, cooling, network bandwidth, and cybersecurity for the deployment of AI applications at scale is to set up the AI model in a professional Internet data center (IDC).Founded in 2009, Global Instrument Technology (GIT) initially provided instrument rental and automation solutions. However, its business expanded along with the upgrading of Taiwan's manufacturing industry, as it focused on optimizing networking, semiconductors, automotive electronics, and EMS production lines. It even expanded into surface defect detection for popular products, such as e-readers and Apple Watches. The company subsequently expanded to smart manufacturing solutions, such as the Industrial Internet of Things (IIoT) and early warning of anomalies, under Industry 4.0, expanding from single-point improvement to system-level optimization.GIT saw that the clearest trend in the manufacturing industry in recent years has been the rapid adoption of AI by factories. Its application scenarios include image inspection and IIoT. However, in addition to software capabilities, the support of a stable and high performance computing environment and network architecture are also needed to actually run AI models in production lines.To help customers in the manufacturing industry adopt AI more quickly, GIT partnered with Chunghwa Telecom to provide enterprises with an "AI application verification platform" and integration services in a secure and high performance professional IDC environment. This architecture allows enterprises to verify AI image inspection models and analyze the quality of AI models without increasing the burden of hardware, thus shortening the time from proof of concept to implementation.Professional IDC has become the foundation for stably running AI models with cooling, power, network, and cybersecurity all in placeTsai noted GIT chose a professional IDC to deliver stable AI services and trusted commitment. Credit:GITThe biggest difference between AI servers and regular servers is their power consumption, heat generation, and bandwidth requirements. "It would be very hard to let corporate customers feel at ease if we kept our servers at the company and managed them ourselves." Tsai Pei-Ying, IT Manager at the Head Office of GIT, got straight to the point: AI requires a trustworthy environment to ensure stable, high-performance, and secure processing.Therefore, GIT set the goal to relocate into a professional IDC, and evaluated five key criteria: Is the power supply stable? Is the temperature under control? Is the bandwidth adequate and is the latency acceptable? Is cybersecurity good enough? Is the quality of professional services reliable? GIT evaluated numerous service providers, focusing on their ability to operate at full capacity for extended periods of time without interruption, as well as their scalability, so that new businesses would not be slowed down by infrastructure limitations once launched."From our perspective, IDC is not just a place to house servers, it is the foundation that enables AI applications to run stably," said Tsai Pei-Ying. GIT delivers more than just AI, it delivers a comprehensive system integration service that encompasses equipment, data transmission, security, and maintenance, offering a total solution for AI implementation.From cold aisles to high bandwidth, the guardian safeguarding the stability of AI serversIn the end, GIT chose Chunghwa Telecom's IDC. "Chunghwa Telecom is able to fully meet all five of our requirements!" Tsai Pei-Ying pointed out that the instantaneous power consumption of a single AI server can reach up to 10 kW, so it has extremely high requirements on the stability of power supply.Chunghwa Telecom's IDC has a complete power and temperature control plan in place to ensure that servers can operate safely for extended periods of time. Using environmental control as an example, AI servers need to operate between 10 and 35 degrees Celsius, so Chunghwa Telecom specially designed "cold aisles" for faster heat dissipation and cooling to maintain optimal conditions for equipment.AI applications impose equally astonishing demands not only on power and cooling, but also on bandwidth. Using AI image inspection as an example, the size of a high-resolution image can reach several hundred megabytes, so high network latency can greatly lower the efficiency of training and inference. Chunghwa Telecom's IDC provides high bandwidth capable of instantly meeting massive data transmission demands, ensuring that customer services are not interrupted.In terms of cybersecurity, Chunghwa Telecom has worked closely with GIT to tailor cybersecurity solutions. From hardware firewalls to "cybersecurity fleet" solutions, the comprehensive protection mechanisms not only allow GIT to provide AI services without any concerns, but also lay the foundation for future expansion."Chunghwa Telecom offers highly competitive one-stop services that have saved us great effort in resource integration." Manager Tsai Pei-Ying was straightforward when explaining the main reason why the company made the decision: They have never had to worry about the quality of Chunghwa Telecom's operation and maintenance. The value of providing one-stop services has been proven again and again in actual operations: All requests, no matter the scale, can be handled at a single window.The top-tier quality of the IDC's operation and maintenance has made GIT more confident in its future developmentThe services of Chunghwa Telecom's IDC have gained the trust and confidence of GIT ever since it became a tenant. Stability is the top priority. In addition, the density of Chunghwa Telecom's resources across multiple locations throughout Taiwan and its backbone network allows service nodes to be located closer to demand, achieving lower latency and greater stability.GIT is currently focused on assisting the manufacturing industry in developing scenarios for implementing AI, such as image defect detection, automated quality monitoring, and digital twin systems. With the support of stable computing capacity provided by the IDC, these AI applications will be able to move on from proof of concept to become a part of routine operations, gradually becoming the new normal for smart manufacturing.Trust is key: Let a professional IDC handle strategic infrastructureWang Sin-Siang, Vice General Manager of GIT (right), and Tsai Pei-Ying, IT Manager of GIT (left).Credit:GITFrom the perspective of GIT, the AI application verification platform is not a short-term project. It is a long-term strategic direction to be simultaneously carried out by the manufacturing industry. Stable, flexible, and secure infrastructure is the key to letting enterprises experiment with AI and not be priced out by the initial cost."Trust" is the key that makes all of this possible. As mentioned by Manager Tsai Pei-Ying, moving into a professional IDC is a necessary condition. Letting a team that understands data centers, networks, and operation and maintenance provide capital-intensive infrastructure is the only way AI will have a chance to move forward from technical projects to a stable part of routine operations. Chunghwa Telecom's one-stop, single window is a catalyst for reducing friction and accelerating development. Stability, predictability, and scalability are what give customers peace of mind.With the strong support of Chunghwa Telecom's IDC, GIT is driving the rapid adoption of AI in the manufacturing industry. When AI is no longer an experiment and is fully embedded into production processes, Taiwan's AI-enabled manufacturing industry will be able to move towards a replicable and sustainable future.Learn more about Chunghwa Telecom's IDC solutions.

As digital technology becomes more prevalent and customer expectations rise, digital menu boards have emerged as crucial tools for chain restaurants looking to boost branding and operational efficiency. Nonetheless, several businesses continue to encounter difficulties during the deployment process, such as asynchronous content updates, frequent equipment failures, and insufficient remote maintenance. This limits headquarters' ability to update menu information nationwide, while fan failures and extensive maintenance of standard display systems raise expenses.Smart solutions for smoother operationsA notable Taiwanese restaurant chain has implemented ASUS IoT's advanced Internet of Retail Things (IoRT) solutions to tackle these operational issues. ASUS IoT Cloud Console (AICC), along with its PE1000S industrial computer, facilitates a dependable, efficient, and intelligent operational transformation throughout the chain's multiple locations in Taiwan.Given that digital technology has become the foundation for modern chain restaurants, Clark Chang, Sales Manager at ASUS, underscored the importance of maintaining high operational stability, maintenance efficiency, and management effectiveness. ASUS IoT's solutions, which focused on the PE1000S industrial computer, demonstrated exceptional performance in terms of system stability, maintenance simplicity, and hardware-software integration, earning the endorsement of the restaurant chain client and becoming standard equipment in the customer's stores.Compact, fanless design built for reliabilityThe ASUS IoT PE1000S industrial computer, tailored for the food and beverage sector, features a compact, fanless design. It is tiny and may be mounted directly behind a digital display, maximizing space while maintaining the store's aesthetic consistency. The fanless heat-dissipation design is an essential feature, effectively averting disruptions caused by dust accumulation or fan failure in traditional equipment. It ensures reliable operation even under harsh conditions, such as high temperatures and oil vapor.Additionally, ASUS offers a three-year warranty, one year longer than comparable products-helping reduce maintenance costs and extend equipment lifespan. The solution is built on a Windows-based architecture, enabling system integrators to accelerate implementation and shorten deployment time, thereby advancing store digitalization. This architecture also ensures broad compatibility and seamless connectivity.Intelligent maintenance through centralized controlBy integrating its in-house developed AICC management platform and leveraging a robust hardware foundation, ASUS IoT is able to improve e-menu systems, thereby incorporating intelligent maintenance features. The integration of the PE1000S and AICC enables chain restaurant operators to guarantee the sustained operation of front-end equipment while simultaneously monitoring the state of each location in real time.Chang said that AICC consistently monitors equipment performance and automatically issues notifications if any irregularities occur. IT specialists can remotely access systems to diagnose, reboot, or modify parameters, thereby substantially reducing the need for on-site maintenance and alleviating the workload on personnel. A consolidated cloud backend enables headquarters to centrally oversee equipment throughout Taiwan, decreasing the average maintenance response time from 24 hours to under two hours. The comprehensive solution emphasizes stability, a lightweight construction, and intelligent maintenance, allowing e-menu systems to function dependably for prolonged durations in high-temperature, high-frequency settings.Proven results and a path toward AI-driven retailThe restaurant chain client has maintained consistent operations across thousands of stores in Taiwan for more than two years since the system's implementation. The incidence of equipment failure has diminished by more than 80% relative to the pre-implementation phase. IT staff can resolve over 90% of software anomalies or system restart requests in real time, decreasing the average repair time from eight hours to 30 minutes, thanks to the centralized monitoring and remote maintenance capabilities of the AICC platform.This greatly improves operating stability and maintenance efficacy. The headquarters may centrally oversee menu material throughout Taiwan, guaranteeing uniform brand messaging, while empowering store managers to modify individual store menus in real time through a mobile application, thereby adeptly accommodating local promotions or festive occasions. Customer feedback indicates that following enhancements in system stability, promotional activities resulted in an average sales increase of approximately 15%, evidencing a definitive return on investment.The digital dining technology and its applications have attained a substantial level of maturity, resulting in a saturated market of competing products, according to Chang. The customer ultimately selected the ASUS group, and ASUS IoT in particular, thanks to the quality of its products, with information security and local trust serving as critical factors in their decision-making process.ASUS, a Taiwanese company, ensures the security and transparency of its entire supply chain by providing dependable hardware, as well as extensive software development and technical support. Moreover, the ASUS IoT technical team is capable of promptly addressing customer needs by providing localized maintenance and support services, thereby bolstering the confidence of businesses in their digital transformation initiatives.From devices to AI-driven insightsASUS IoT is advancing retail applications from "device implementation" to a new phase of "AI-driven decision-making," according to Chang. ASUS IoT intends to provide kitchen display systems (KDS), self-checkout (SCO) systems, and AI-driven customer behavior analysis modules to aid businesses in enhancing operations and acquiring insights into consumer behavior. The restaurant chain client has utilized the data analysis capabilities of the ASUS AICC platform to amalgamate interactive data from e-menus with POS sales data. This has been executed to inform operational strategy and product development.ASUS IoT will also collaborate with system integrators and startup partners to establish a 'co-growth ecosystem' that enables the implementation of smart retail solutions through a standardized interface and open architecture. This ecosystem will evolve from ensuring hardware stability to enabling intelligent operations, serving as a catalyst for the digital transformation of Taiwan's food and beverage retail industry.Credit: ASUS

The semiconductor sector demands stringent security and cybersecurity standards; any lapse may compromise brand reputation and operational integrity. Conventional surveillance still encounters challenges, such as the inability to analyze extensive camera footage in real time, reliance on manual risk inspections, and the tendency for most incidents to be investigated retrospectively, despite the establishment of stringent management systems.From passive monitoring to proactive protectionASUS IoT's AISEHS intelligent image-detection platform employs AI technology to convert image data into actionable insights, assisting prominent Taiwanese semiconductor manufacturers in transitioning from passive security management to proactive prevention, thereby initiating a new era of intelligent security in the manufacturing sector.Delfina Shih, Product Manager of ASUS AI Solution Business Unit, stated that semiconductor facility safety management is primarily passive, with current operations dependent on post-event verification procedures. The widespread deployment of CCTV cameras at every site usually impedes the attainment of comprehensive and real-time surveillance, resulting in human fatigue-related errors. The absence of data-driven management tools makes it impossible for employees to undertake trend analysis or optimize SOPs.Secure, compliant, and seamlessly integratedThe AISEHS platform adheres to the rigorous standards and operating requirements of the semiconductor sector. AISEHS employs a multi-tiered access control system to ensure that each department can access only relevant data, hence preventing interdepartmental information breaches. Deployment architecture includes pure cloud, hybrid cloud, and pure on-premises to fulfill the security compliance requirements of various companies. Furthermore, automated deployment procedures and quick model iteration approaches ensure that system updates do not disrupt on-site operations. The platform simplifies integration with existing client's video-management system (VMS), incident management, and internal communication systems This significantly improves management efficiency by enabling the detection, reporting, and resolution of security issues within a unified environment.AI-driven detection and instant responseThe AISEHS platform provides critical detection capabilities, such as the identification of personal protective equipment (PPE), which speeds up the assessment of an employee's proper use of safety equipment. Virtual fencing detection effectively prevents unauthorized entry into risky areas, whereas hazardous behavior detection monitors high-risk operations, such as maintenance or climbing, and automatically checks compliance with safety procedures. The system also includes a real-time notification mechanism that immediately alerts relevant personnel when abnormalities are detected and provides video clips to help quickly locate and address issues. In order to facilitate management decision-making, the data dashboard presents contractor performance assessments, risk locations, and event patterns. In addition, the platform enables clients to integrate their own models to enhance applications and fully capitalize on their current AI investments, thereby facilitating the incorporation of third-party AI models.AISEHS facilitates global deployment by leveraging four important technologies to address the transnational operating needs of semiconductor businesses. Firstly, the RTSP streaming protocol facilitates the quick integration of surveillance devices from many manufacturers,  achieving real-time image acquisition and AI identification. Secondly, multi-tenant management makes it easier to construct autonomous tenants based on factory zones or companies, as it ensures unique data permissions and reduces interference. Thirdly, the AI task-scheduling method allows for the definition of detection intervals, with models activated only when necessary to maximize computational resources. Lastly, custom detection logic can run multiple AI models simultaneously, such as personnel counting and helmet detection, which improves implementation efficiency and lowers customization costs. Empowered by a software-defined surveillance approach,  firms will be able to balance centralized administration with localized flexibility in global operations, resulting in a consistent level of safety regulation.Delfina stated that a key advantage of AISEHS is the thorough use of existing infrastructure. The platform may be integrated easily into existing CCTV systems and network infrastructures, eliminating the need for rewiring or the purchase of new equipment. The installation process does not disrupt ongoing surveillance operations. Compared with traditional system overhauls that may take months, AISEHS requires only a security assessment of the existing platform, thereby shortening the deployment time to 2-3 weeks and enabling the transformation of conventional surveillance systems into AI-enhanced smart security frameworks.Proven performance and measurable gainsA semiconductor leader has reported positive outcomes one year after deploying the ASUS AISEHS platform. On-site worker self-discipline has increased significantly, resulting in an 82% reduction in risk occurrences thanks to AI-powered real-time monitoring and event retrospective capabilities. The AI electronic fencing provides automatic nighttime surveillance, resulting in an annual labor cost savings of about US$400,000 per sentry. Scheduling approaches and computational resource monitoring enabled more accurate allocation of GPU/CPU computing capability, resulting in a 83%  reduction in resource consumption. Operational efficiency has increased dramatically, with event processing time reduced from 30-60 minutes of cross-system manual confirmation to less than five minutes for confirmation and response. The AI model's accuracy exceeds 90%, while the actual operating error rate is less than 1%.Expanding toward intelligent, industry-wide protectionASUS IoT is making a concerted effort to enhance the functionality and scope of its AISEHS platform in order to align with its future objectives. New modules, including behavioral-anomaly detection and SOP execution analysis, will be incorporated in the future, transforming it from a security management system to a comprehensive intelligent platform for operational security and production stability. The platform will include an MLOps module to comply with cybersecurity and data sovereignty regulations. This module will enable customers to complete the entire lifecycle of data annotation and model training on-site, thereby accomplishing the objective of data remaining at the factory, and models autonomously upgrading.ASUS IoT has also initiated discussions with industries such as energy, metal refining, and petrochemicals to assess the potential for extended use of the technology in field applications.  Delfina noted that ASUS IoT intends to build AI as a basic technology for operational protection and risk prevention, strengthening security management mechanisms with a smart and efficient system.Credit: ASUS

Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced a collaboration with VSORA to deliver turnkey ASIC design services supporting the onschedule tapeout of the Jotunn8 datacenter AI inference processor. Through this partnership, GUC showcased deep capability in complex chiplet architectures and HBM3E integration using 2.5D advanced packaging technology, reinforcing the company's strength in accelerating customer innovation with optimized performance and efficiency.Jotunn8 is VSORA's flagship AI-inference chip, engineered exclusively for inference workloads rather than training. It delivers ultra-low latency and very high throughput by overcoming the memory wall bottleneck, making large-scale, cost-efficient AI deployment viable.GUC delivered comprehensive design services for Jotunn8, managing the entire process from  netlistin through manufacturing. The solution integrates GUC's Advanced Packaging Technology (APT) IP portfolio, including 17.2 Gbps GLink-2.5D die-to-die interconnect and 8.4 Gbps HBM3E PHY & Controller, leveraging 3x-reticle 2.5D advanced packaging and 5nm process technology.GUC's contributions included complex physical design, chiplet partitioning and integration, as well as cooptimization of signal, power, and thermal integrity (SI/PI/TI). The team also achieved considerable IR and power optimization, enabling superior power efficiency and overall system performance. This collaboration positions VSORA to meet the demanding compute and bandwidth requirements of hyperscale datacenter inference workloads and underscores GUC's leadership as a trusted partner for AI and HPC ASIC development."Jotunn8 is Europe's first HBM-equipped datacenter inference processor, delivering unprecedentedoptimization across speed, efficiency, and scalability," said Khaled Maalej, Founder and CEO of VSORA. "GUC's excellence in physical design, die-to-die and HBM IP performance, and advanced packaging expertise played a pivotal role in achieving this milestone tape-out. Their rigorous engineering discipline and collaborative mindset have been instrumental in turning our ambitious vision into silicon reality.""GUC is honored to help bring VSORA's advanced AI processor to market," said Patrick Wang,Vice President and Chief Sales Officer at GUC. "VSORA's 2.5D design presented significant technical complexity. By combining their groundbreaking innovations with GUC's engineering excellence in advanced process and packaging technologies, we successfully enabled the Jotunn8 tape-out milestone. We look forward to supporting VSORA's vision for high- performance inference at scale and partnering on future generations of AI processors."Building on this success, VSORA and GUC are advancing the frontiers of AI compute. By combining deep innovation with execution excellence, the partnership paves the way for a new era of scalable, energy-efficient AI solutions for global data centers.For more information about GUC, please visit.For more information about VSORA, please visit.

Global computing power is growing aggressively and pushing high-density chip power consumption. As this power density increases, traditional air cooling is reaching its physical limits, and once-fringe liquid cooling technology, boasting thermal efficiency hundreds of times greater than air cooling, is rapidly becoming core infrastructure.Driven by global sustainability targets and the need for high-performance, energy-efficient infrastructures, new large data centers must achieve their targeted PUE values, accelerating the industry towards large-scale liquid cooling. However, reliability issues stemming from insufficient mechanical tolerances at the connection points of liquid cooling systems are becoming a critical bottleneck for energy efficiency upgrades and stable operation. Southco recognizes the severity of this challenge and is committed to providing breakthrough solutions.Minor Deviations, Major CostsDuring the large-scale deployment of liquid cooling technology, the reliability of connection interfaces is vital. According to key data from the Open Compute Project (OCP) "Rack-Mounted Manifold Requirements and Verification Guidelines," a mere 1mm increase in mechanical deviation at liquid cooling interfaces can significantly raise system flow resistance by 15%, leading to a 7% increase in pump energy consumption!This is no trivial amount; in a hyperscale data center with thousands of interfaces, it translates to millions of kilowatt-hours of additional energy consumption and substantial operational costs each year. More concerning is that traditional rigid connection solutions typically offer only ±0.5mm of static tolerance, which proves inadequate in complex real-world environments like these:1. Accumulation of Multi-Dimensional Installation Deviations: In mixed deployment scenarios of widely used EIA-310-D standard racks and advanced ORV3 open architectures, rack installation tolerances can accumulate up to ±3.2mm, far exceeding the limits of traditional solutions.2. Dynamic Vibration Impacts: In ISTA 3-E vibration tests simulating real transportation and operating environments, interface displacement often exceeds 2.8mm, posing significant risks of leaks or connection failures.3. Material Thermal Expansion Effects: Under a typical temperature change of 55°C, copper alloy manifolds can expand approximately 1.2mm per meter, continuously challenging fixed interfaces.These dynamic, multi-dimensional deviations underline the urgent need for an intelligent, reliable sealing connection solution to ensure the long-term, efficient, and safe operation of liquid cooling systems.Blind Mate Quick Disconnect: A Connection for a Dynamic WorldAs a century-old expert in precision engineering, Southco confronts this challenge head-on with the launch of the revolutionary new "Blind Mate Floating Mechanism" liquid cooling connection solution. This innovation is not just a new product; it is a systematic response to profound insight into industry pain points.Current Status and Trends of Blind Mate Floating TechnologyLiquid cooling technology is rapidly gaining traction in high-performance computing (HPC), AI training clusters, and hyperscale data centers. Blind mate technology allows devices to connect without precise visual alignment, making it a core interface solution for rapid deployment and efficient maintenance in liquid cooling systems (especially cold plate systems). The development trends are clear:1. Higher Tolerance Capacity: Adapting to more complex rack environments and dynamic changes is essential.2. Increased Reliability: Zero leakage, long lifespan, and resistance to extreme conditions are basic requirements.3. Intelligent Integration: Integrating sensors for flow, temperature, pressure, etc., for real-time monitoring and predictive maintenance is a future direction.4. Standardization and Compatibility: Supporting OCP ORV3 and other open standards for seamless integration across platforms and manufacturers.Standard ISO 11926-1 threaded interface design, compatible with OCP UQD/UQDB connectors, and custom designs are available.5. Lightweight and Compact Design: Meeting the demands of higher density deployments.Southco's Blind Mate Floating Mechanism exemplifies innovative design centered around these core trends.Advantages Over Traditional SolutionsCompared to traditional fixed or simple floating heat transfer connection solutions, Southco's "Blind Mate Floating Mechanism" offers a qualitative leap with advantages evident across multiple dimensions.1. Three-Dimensional Dynamic Tolerance Control: Southco’s innovative design features a groundbreaking three-dimensional dynamic compensation mechanism: ±4mm of floating tolerance in the radial direction (2° tilt compensation) and 6mm of displacement absorption capacity in the axial direction. This far exceeds common static tolerances in the industry, effectively absorbing and adapting to all previously mentioned installation tolerances, vibration displacements, and thermal expansion deformations.2. Self-Centering Mechanism: When the liquid-cooled blind-plug connector is unplugged, the floating structure automatically resets to the center position, ensuring sufficient floating space for plugging and unplugging operations, fully meeting the strict tolerance requirements of OCP and ORV3 standards.3. Outstanding Sealing Performance for Long-Term Operation: Products endure rigorous ASME B31.3 standard 300psig burst pressure tests, ensuring over 10 years of service life, providing long-term stability for data centers, an achievement traditional solutions cannot match.4. Efficient Maintenance and Significant Cost Reduction: Featuring the Universal Quick Disconnect Blind (UQDB) interface, the design enables genuine "blind operations," allowing server maintenance without precise alignment or specialized tools. Quick disconnect capabilities make server replacement or upgrades as convenient as "hot plugging," reducing downtime and related losses by over 90%.Blind Mate Floating Mechanism. Credit: SouthcoThe Necessity of Blind Mate Floating MechanismIn AI computing clusters and next-generation data centers, adopting advanced connection solutions like Southco's "Blind Mate Floating Mechanism" is no longer optional, but essential.1. Key to Overcoming Cooling Bottlenecks: High power density is an inevitable trend; traditional cooling and rigid connections can no longer meet the demand. The Blind Mate Floating Mechanism is foundational for unleashing the full potential of liquid cooling and ensuring efficient, stable operation of cooling systems.2. Cornerstone of Business Continuity: The costs of data center downtime are immense. The rapid, reliable thermal maintenance supported by the Blind Mate Floating Mechanism is vital for ensuring uninterrupted operation of critical business activities 24/7.3. Core to Achieving Green and Low-Carbon Goals: Minor deviations in connectors leading to increased flow resistance can significantly elevate pump energy consumption. Its high-tolerance, low-flow resistance design directly contributes to lowering data center PUE values, making it an important element in energy conservation and emissions reduction goals.4. Flexibility for Future Expansion and Upgrading: Modular and standardized design enables data centers to expand capacity and upgrade equipment more flexibly, easily accommodating future increases in computing power demand and technological iterations.Continuous Innovation, Intelligent Cooling AheadAccording to the "Open Rack V3" white paper, liquid cooling penetration in hyperscale data centers is expected to exceed 40% by 2025. Southco continues to invest in R&D to iterate floating mechanism technology:1. Exploring lightweight high-performance materials (like PPSU thermoplastic) to reduce weight while maintaining strength.2. Advancing intelligent sensor integration for real-time monitoring of key parameters like flow and temperature, providing data for predictive maintenance and energy efficiency optimization.3. Deepening ecosystem collaboration and standardization to promote liquid cooling interfaces in higher density, lower TCO, and broader applications.As liquid cooling technology transitions from optional to essential, Southco's "Blind Mate" represents a precision engineering product innovation, and a profound understanding of cooling challenges in the data center industry. By integrating over a century of precision mechanical design expertise with innovative three-dimensional dynamic tolerance control technology, Southco strives to help global data centers break through cooling bottlenecks, building a more efficient, reliable, and greener foundation for computing power, empowering infinite possibilities in the digital age.For more information, please click here for more details.

HOLTEK Semiconductor, a leading professional microcontroller IC design company, will host its 2025 Online New Product Presentation on December 4th. This year's event will center on the theme of "Empowering Intelligence for Sustainable Development," integrating smart control and edge computing to build a comprehensive smart living application ecosystem. The thematic application areas cover: smart living and IoT, green energy, Edge AI, Arm Cortex MCUs and peripheral ICs, HT32 development tools, and other cutting-edge technologies and products.HOLTEK Semiconductor provides customers with highly integrated, competitive products and solutions that offer enhanced user experiences, enabling rapid design implementation and mass production. We continue to deliver leading-edge advantages to our customers and partners. We warmly invite both existing and new clients to attend and provide valuable feedback.Register now by visiting the link or scanning the QR code.

As the demand for high-performance power semiconductors continues to escalate across automotive and industrial sectors, Henkel is addressing one of the industry's most pressing challenges: thermal management in next-generation power devices.Henkel will host a technical webinar introducing its patented Polymerization-Induced Phase Separation technology platform-an advanced solution engineered to meet the evolving requirements of power device performance, reliability, and cost-efficiency.Thermal Control as a Critical EnablerWith rising operational temperatures directly impacting device reliability and efficiency, effective heat dissipation has become essential. The industry's transition to bare copper (Cu) designs-driven by cost and reliability considerations-further underscores the need for die attach materials that combine high thermal conductivity with Cu compatibility.Henkel's innovative technology enables die attach formulations that could meet automotive Grade 0 thermal cycling and MSL1 reliability standards; provide high bulk thermal conductivity for metallized or bare silicon die; ensure compatibility with a wide range of die finish and lead frame combinations, including bare copper; deliver improved RDS(on) performance compared to conventional die attach materials; support copper wire bonding processes. This event marks the first installment in Henkel's Power Device Webinar Series, designed to provide engineers, designers, and industry stakeholders with insights into materials innovations that address the increasing demands of power semiconductor applications.To particiapting in this webinar titled :"What's Powering the Next-Gen Power Device Performance" on 2025/11/28 10:00-10:45 am (Singaporean Time GMT+8), please register, click here to register.Participants will gain exclusive access to Henkel's technical experts and learn how this proprietary platform is setting new benchmarks in thermal performance and reliability for power devices.

When you walk the halls of the TPCA Show Taipei 2025, one theme is impossible to miss: AI is no longer the future-it's the engine driving the next great wave of electronics manufacturing. From cloud data centers to handheld devices, Artificial Intelligence is reshaping how the world processes information. And behind every AI-driven device is an intricate network of high-performance PCBs, advanced substrates, and precision manufacturing technologies.Reporter Gary with the MKS-Atotech leadership team, including the CEO. Credit: MKS-AtotechAt the center of this transformation stands MKS Instruments, whose strategic brands Atotech and ESI are powering the next chapter of Asia's semiconductor and advanced electronics industries.The New Frontier: AI and the Rise of Advanced PackagingAI's explosive growth has created a new set of demands: faster computing, higher data throughput, and unprecedented integration of components. The era of simple, monolithic chips is long gone. Today's AI processors rely on heterogeneous integration, where multiple chiplets are packaged together on complex organic substrates."It's a materials revolution," explains Dave Henry, Executive Vice President Global Strategic Marketing and GM, Materials Solutions Division. "Our technologies touch more than 70% of the critical steps in PCB and substrate manufacturing-and over 85% of semiconductor front-end processes. MKS is deeply embedded in the future of electronics."This new generation of packaging requires ultra-fine features, tighter interconnects, advanced metallization, and laser-drilled structures at microscopic scale. The PCB industry-particularly in Taiwan-is experiencing a surge in demand, driven by applications in AI, HPC, satellite communications, automotive electronics, and beyond.Inside the MKS Booth: Where Chemistry Meets Systems Technology: From Via Drilling Lasers to horizontal and vertical chemical process equipmentOne of the busiest destinations at TPCA 2025 was the MKS booth, where crowds gathered to explore a unique, fully integrated portfolio: lasers, chemistry, plating systems, motion control, optics, software, and more.MKS is one of the few companies in the world capable of delivering this level of end-to-end process integration. Its Atotech and ESI brands showcased side-by-side how laser drilling, surface treatment chemistry, plating systems, and advanced software work together to Optimize the InterconnectSM—a strategic approach to enabling next-generation electronics.This unified offering is more than convenient-it's transformational"AI chips require high-speed interconnects, smaller geometries, and new substrate materials," says Harald Ahnert, Vice President and GM of Chemistry. "Our solutions bring together decades of expertise to help customers manufacture these advanced products at scale."Spotlight on Innovation: The Technologies Everyone Was Talking AboutA walk through the MKS booth was a look into the future of electronics manufacturing, with several standout technologies drawing sustained attention from visitors.One major area of focus was breakthrough chemistry for advanced substrates. MKS highlighted InPro Pulse TGV, designed for high-aspect-ratio through-glass vias, alongside Cuprapulse IN, a reverse-pulse plating solution developed for HDI and package substrates. For reliable final finishing, the company showcased Aurotech G-Bond 3, Stannatech 2100, and PD Core, complemented by EcoFlash S300U, Bondfilm EX, and Novabond PX-S2, which support high-speed, low-loss signal integrity. Taken together, these chemistry solutions cover a broad spectrum of manufacturing needs, from SAP and SLP production to ultra-fine line formation down to 2/2 μm.Another highlight was the portfolio of next-generation equipment systems. G-Plate was presented as a solution for high-volume PTH processing with capability below 5/5 μm, while vPlate offered continuous vertical plating with industry-leading uniformity. Uniplate platforms were positioned as robust systems for mass production of HDI PCBs, and the PLB Line was specifically engineered to meet the demanding requirements of AI server boards. Combined, these systems form a core platform for the future of PCB and substrate fabrication.The ESI brand further elevated the booth with cutting-edge laser systems. Capstone was featured for high-throughput UV flex drilling, Geode A demonstrated precision CO？ processing of ABF laminates, and Geode G2 showcased ultra-fast via drilling for HDI and mSAP applications. "The industry is facing growing complexity: more I/O, more drilling, more layers," says Michael Stubelt, VP and GM of Equipment Solutions. "Our laser systems give manufacturers the flexibility and productivity advantage they need."Why Glass Substrates Are the Next Big ThingOne of the most talked-about highlights at the show was a striking, panel-scale processed glass substrate sample on display at the MKS booth. Glass, once considered exotic, is fast gaining traction as the next major substrate material in heterogeneous integration.MKS is developing complete process flows for glass—including surface preparation, seed-layer formation, metallization, and via filling—combining Atotech chemistry with ESI's high-speed laser drilling. This collaboration reflects a broader theme: MKS doesn't just deliver tools; it builds ecosystems.Scaling Up: New Investments Across Southeast AsiaWhile the spotlight was on technology, MKS also shared details of its expanding regional footprint. "Competition in APAC and Greater China is intense," says George Yang, VP and GM for MKS Greater China. "Our strategy is to be local—local manufacturing, local tech support, local expertise." Today, MKS operates 14 manufacturing sites across the APAC region and is investing aggressively in Southeast Asia.One of the major new investments is a Super Center for wafer fabrication equipment in Penang, Malaysia, which has been under construction since 2024. In Samut Prakan, Thailand, the company has recently opened a Tech Center and manufacturing site dedicated to PCB and substrate development, further strengthening its presence in advanced electronics manufacturing.MKS is also moving ahead with a flagship expansion in Thailand. In May 2025, the company broke ground on a new Atotech chemical manufacturing facility and Tech Center near Bangkok, representing an investment of more than US$40 million. The site is designed for an annual capacity of 18,500 tons and is scheduled to begin operations in the second half of 2027. As Thailand rapidly emerges as a major PCB manufacturing hub and attracts investments from China, Korea, Taiwan, and Japan, MKS aims to be a pillar in this fast-growing ecosystem.The Road Ahead: Enabling the Electronics of TomorrowFrom semiconductors and substrates to optical systems and laser drilling, MKS Instruments touches nearly every step in the electronics manufacturing chain. Its integrated approach—rooted in deep expertise across materials science and precision engineering—provides customers with the tools needed to build faster, more compact, more efficient AI hardware."MKS is proud to contribute to the industry's move toward advanced and eco-friendly manufacturing," says Wayne Cole, Senior Vice President of Global Sales and Service. "Our mission is to help customers stay competitive in a world that is evolving faster than ever."With major investments across Southeast Asia, a powerful portfolio of technologies, and a unified vision MKS is not just participating in the AI revolution-it is helping to build the foundation on which the future of electronics is being created.MKS is enabling the shift from transistor scaling to advanced integration - merging logic, memory, and photonics. The company's APAC Tech Centers act as co-innovation hubs for customers, encompassing: supporting R&D, process training, and sub-5/5 µm SAP prototyping.These centers are not just service nodes - they're bridges between customer vision and manufacturing reality.MKS has a proud history of innovations and inventions that have shaped the evolution of the key industries we serve. As a global leader in providing equipment, processes, and production solutions that power the most advanced electronic devices, our expansion in Asia reflects our commitment to supporting the growth of the semiconductor, PCB, and package substrate markets in this region. We are excited to be a key player in the future of technology and look forward to continuing to invest in Asia's bright future.  Reporter Gary interviewed the MKS-Atotech leadership team at TPCA Show 2025. Credit: MKS-Atotech

Robust computational capabilities are fueling the rapid evolution of artificial intelligence (AI) applications. The rise of large language models (LLMs) such as ChatGPT-5 has triggered a surge in global data center investments, accelerating the expansion of Taiwan's semiconductor and server industries. Today, the production, assembly, and outsourcing of AI servers have become key benchmarks for industry and technology leaders aiming to lead in global AI innovation. As high-density CPU and GPU architectures continue to advance, the demand for next-generation cooling technologies has intensified dramatically.In an exclusive interview on "Thermal Solutions Powering the AI Era" with host Ashley Chu on IC Radio Broadcasting, Ricky Yu, Deputy Manager at T-Global Technology, and Director Chris Chuang discussed how rapid advancements in AI-integrated electronic devices are reshaping thermal design. They emphasized that thermal management-critical for improving heat dissipation efficiency-has emerged as one of the most pressing engineering challenges in the AI era. Currently, the industry is witnessing a significant transition from traditional air-cooling approaches to liquid-cooling systems in the design of thermal modules for advanced processors.The thermal design power (TDP) of processor cooling modules initially started at around 800 W and rose to 1,200 W by 2024, following updated thermal specifications. Today, TDP levels have reached 2,300 W, marking a steep upward trend. The cooling module market is thriving, and Chuang predicts that specifications may soon exceed 5,000 W, and could potentially approach 10,000 W in the near future - an unprecedented leap in thermal design requirements.Currently, three primary cooling methods dominate thermal management: air cooling, liquid cooling, and immersion cooling. Among these, air and liquid cooling remain the mainstream technologies, utilizing a variety of materials to absorb and dissipate heat efficiently.Immersion cooling, on the other hand, represents a promising frontier in heat dissipation. This approach submerges entire servers in electrically insulating fluids to achieve maximum thermal efficiency. While it delivers superior performance, its high cost and complex system integration continue to pose challenges, and the technology remains under active development and validation.As AI computing power continues its exponential growth, the demand for high-performance, reliable, and sustainable thermal solutions will only intensify. Companies like T-Global Technology are at the forefront of this transformation-bridging the gap between innovation and practicality, and empowering the world’s transition into the high-efficiency, high-density era of intelligent computing.PCM Development Exacerbates Heat Dissipation Challenges in AI EraYu notes that only a handful of technology giants - particularly those engaged in large language model (LLM) training - exhibit such extraordinary energy consumption in the development of advanced AI technologies. In contrast, small and medium-sized enterprises, as well as general consumers, tend to prioritize thermal solutions that balance performance and cost for their specific applications. Recognizing this market need, T-Global Technology is actively expanding its presence in this growing segment.To meet evolving thermal challenges, T-Global continues to invest in cutting-edge materials and technologies for product research and development. These include liquid metal, metal heat sinks, aluminum silicon carbide (AlSiC), and indium sheets - materials engineered to enhance heat dissipation and conductivity. The company is also advancing the design and manufacturing of solid-state heat sinks, metal modules, and cooling fans, ensuring customers receive more comprehensive and efficient thermal solutions across diverse applications.In recent years, T-Global has also integrated phase-change materials (PCMs) into new product lines. These materials, initially solid and easy to assemble, transition to a liquid state when exposed to heat, enabling efficient heat absorption and transfer. This liquid-metal-based cooling approach, already adopted in high-end gaming PCs and consoles, has emerged as a new technological highlight in advanced thermal design.To address the common issues of material overflow and cost associated with liquid metal, T-Global has developed an innovative containment design that effectively prevents leakage and corrosion - two factors that could otherwise compromise system stability and longevity. This advancement underscores the company's ongoing commitment to developing safer, more reliable, and performance-driven thermal technologies for the AI generation.Actively Enhance Global Synchronous Service Operations and Customer CollaborationIn parallel with the advancement of emerging technologies, Ricky Yu analyzed real-world customer use cases to identify their most pressing challenges. One key issue arises when clients face space constraints in computer rooms or data centers. To accommodate greater cooling demands, they often seek to upgrade thermal performance using existing equipment and infrastructure, rather than complete system overhauls.For instance, when power consumption requirements rise from 200W to 500W and even 1,000W, customers look for solutions that enhance cooling efficiency without disrupting the surrounding environment. This shift has redefined T-Global's role - transforming the company from a traditional supplier of complete cooling modules into a consultative partner that collaborates closely with clients to develop tailored, high-efficiency solutions.Global Expansion and Manufacturing ExcellenceTo meet growing international demand and the globalization of supply chains, T-Global Technology has intensified its manufacturing and operational investments. The company has established a network of zero-time consultants in China, Japan, and other overseas markets, ensuring 24/7, 365-day global support and synchronized operations.At the same time, T-Global continues to expand its overseas manufacturing base in Vietnam while scaling up production capabilities at its Taiwan headquarters. By leveraging its vertically integrated strengths in research, design, and manufacturing, T-Global is well-positioned to seize the opportunities emerging from the AI era's rapid growth - delivering agile, high-performance, and globally supported thermal solutions to customers worldwide.